CN109195432A - 一种电磁屏蔽用层状金属复合材料 - Google Patents

一种电磁屏蔽用层状金属复合材料 Download PDF

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CN109195432A
CN109195432A CN201811253584.8A CN201811253584A CN109195432A CN 109195432 A CN109195432 A CN 109195432A CN 201811253584 A CN201811253584 A CN 201811253584A CN 109195432 A CN109195432 A CN 109195432A
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electromagnetic shielding
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CN109195432B (zh
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徐明舟
杨帆
李西铭
张乐
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BEIJING BEIYE FUNCTIONAL MATERIALS Corp
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0036Heat treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0036Heat treatment
    • B32B2038/0048Annealing, relaxing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212Electromagnetic interference shielding

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种电磁屏蔽用层状金属复合材料,属于电磁屏蔽材料技术领域。其层状结构组成为:层状结构为两层结构形式,包括一层高导电性金属组元层和一层高磁导率或高磁感应强度软磁合金组元层。其中高导电性金属组元层厚度为0.05‑0.2mm,高磁导率或高饱和磁感应强度软磁合金组元层厚度为0.05‑0.3mm。优点在于,层状金属复合材料在低频和高频电磁环境下均拥有良好的屏蔽效果;加工方式简单,对周围环境以及操作人员危害小,获得的层状结构层间结合力强,且热处理工艺简单,成本低廉,适合工业化生产。

Description

一种电磁屏蔽用层状金属复合材料
技术领域
本发明属于电磁屏蔽材料技术领域,特别是涉及一种电磁屏蔽用层状金属复合材料。
背景技术
随着电子技术的飞速发展,人们开发与利用的电磁波频率资源越来越宽。手机、电磁炉、网络电视、宽带上网、家用电器等电子设备应用频率范围涵盖从极低频、射频一直到微波频率段。然而,电磁技术在给人类生活提供方便的同时,也给我们带来了一些不利因素,例如电磁波辐射造成的电磁干扰不仅会影响各种电子设备的正常运转,而且对身体健康也有危害。目前,电磁波泄漏已被世界公认继大气污染、水质污染、噪音污染后的第四大公害。科学研究证实,人长期处于电磁波辐射环境中将严重损害身心健康。世界上一些发达国家先后制定了电磁辐射的标准和规定。电磁波泄漏不但严重危害人的身体健康,而且会造成严重的泄密,特别是在通讯、计算机、网络技术高速发展的今天,如果没有强有力的电磁波屏蔽能力,那么一旦受到强大的电磁波干扰,将使通讯中断,计算工作失灵,各种工作将处于瘫痪状态。因此,电磁屏蔽材料现已成为了许多电子产品生产厂商的必选材料。
电磁屏蔽是屏蔽材料对电磁波的反射与吸收。吸收是利用材料的导磁性,对低频和较高频磁场具有很好的屏蔽效果:低频时通过对磁力线进行疏导,将干扰磁炉进行分路,起到对低频磁场屏蔽效果;较高频时则利用涡电流原理,通过导体中形成的反向磁通来抑制入射磁场,消耗干扰磁场的能量。反射是利用材料的高导电性,对于电场具有很好的屏蔽效果。反射型屏蔽材料的机理是电磁波入射到屏蔽材料的表面,电磁波对材料的分子或原子产生极化作用,使其做受迫振动而成为一个个电磁波发射的点源,这些点源发射的电磁波相互干涉,干涉结果形成反射波。
然而,传统的电磁屏蔽材料一般都只在某一频率段具有很好的屏蔽效果,例如软磁合金一般对低频磁场具有很好的屏蔽效果,而高导电性材料往往对高频率电磁波或电场具有很好的屏蔽效果。而随着目前电磁波辐射强度的增加和电气设备趋于多样化,传统电磁屏蔽材料不具备同时对低频和高频电磁波均有较好屏蔽性能的特点,无法满足复杂电磁波环境下的电磁屏蔽要求。
目前,已有学者通过在基层金属上通过电镀、化学镀、溅射或喷涂工艺,或利用非金属材料如高分子材料制备多层状电磁屏蔽用复合材料。这些方式制备层状复合材料所存在的问题有:(1)所制得的材料层间结合力低,易剥离,且二次加工性能较差;(2)生产过程中涉及到的无机溶剂和有机溶剂给环境造成极大的污染,破坏了生态环境。(3)目前大部分电磁屏蔽用层状复合材料往往具有很强的导电性能,这些被反射的电磁波往往造成二次污染,对人以及机器运转会产生不良影响。
因此,为了克服以上电磁屏蔽用层状复合材料所存在的问题,急需开发一种具有“高吸收、低反射”的电磁屏蔽用材料。
发明内容
本发明的目的一种电磁屏蔽用层状金属复合材料,可以在较宽频段范围对电磁波都具有较好的屏蔽效果,是一种具有“高吸收、低反射”的电磁屏蔽用材料。
本发明的设计指导思想:层状金属复合材料以中镍或高镍坡莫合金软磁材料作为高磁导率或高饱和磁感应强度材料,对低频率磁场吸收;以金属铜作为高导电性材料,对高频率电磁波进行反射。
本发明层状结构为两层结构形式,包括一层高导电性金属组元层和一层高磁导率或高磁感应强度软磁合金组元层;
本发明涉及层状金属结构(厚度mm)设计方案为:层状结构复合材料总厚度为0.1-0.5mm,将高导电性金属组元层厚度控制在0.05-0.2,高磁导率或高饱和磁感应强度软磁合金组元层厚度控制在0.05-0.3。
本发明所采用层状金属对本发明电磁屏蔽用层状金属复合材料的影响作用:
高饱和磁感软磁合金:主要为中镍坡莫合金,具有较高的饱和磁感应强度和磁导率,适用于在中等磁场中工作的各种设备的磁屏蔽;
高磁导率软磁合金:主要为高镍坡莫合金,具有高的磁导率,适用于在弱磁场中工作的各种设备的磁屏蔽;
高导电性金属:主要为铜,具有较高的导电性,以及较好的加工延展性;
本发明合金的制造方法为:
加工流程:原材料表面修磨→固相复合→扩散退火→半成品轧制→冷加工热处理→成品轧制→拉矫→去应力退火。
本发明电磁屏蔽用层状金属复合材料与现有技术相比所具有的优点为:层状金属复合材料在低频和高频电磁环境下均拥有良好的屏蔽效果;加工方式简单,对周围环境以及操作人员危害小,获得的层状结构层间结合力强,且热处理工艺简单,成本低廉,适合工业化生产。
具体实施方式
下面通过具体实施例进一步说明本发明的技术方案。
实施例1:软磁合金组元层为中镍高饱和磁感应强度坡莫合金1J50,导电组元层为金属铜。厚度分别为5.25mm的1J50带材和1.75mm的铜带经表面修磨后,采用固相复合将其轧制成2.0mm厚复合带材,复合带材经950℃扩散退火后轧至0.2mm,然后采用拉矫、去应力退火使复合带材具有良好的平整度。此时成品带材中高导电性金属组元层厚度为0.05mm,高饱和磁感应强度软磁合金组元层厚度为0.15mm。将复合带材在950℃保温3h后,测试其40GHz、0.15Oe时的屏蔽效能为60dB。
实施例2:软磁合金组元层为高磁导率坡莫合金1J85,导电组元层为金属铜。厚度分别为4.5mm的1J85合金带材和2.5mm的铜带经表面修磨后,采用固相复合将其轧制成2.0mm厚复合带材,复合带材经950℃扩散退火后轧至0.5mm,然后采用拉矫、去应力退火使复合带材具有良好的平整度。此时成品带材中高导电性金属组元层厚度为0.18mm,高磁导率软磁合金组元层厚度为0.32mm。将复合带材在950℃保温3h后,测试其10KHz、0.5Oe时的屏蔽效能为40dB。
实施例3:软磁合金组元层为高磁导率坡莫合金1J85,导电组元层为金属铜。厚度均为3.5mm的1J85合金带材和铜带经表面修磨后,采用固相复合将其轧制成2.0mm厚复合带材,复合带材经950℃扩散退火后轧至0.1mm,然后采用拉矫、去应力退火使复合带材具有良好的平整度。此时成品带材中高导电性金属组元层厚度为0.05mm,高磁导率软磁合金组元层厚度为0.05mm。将复合带材在950℃保温3h后,测试其40GHz、0.1Oe时的屏蔽效能为80dB。

Claims (3)

1.一种电磁屏蔽用层状金属复合材料,其特征在于:其层状结构为两层结构形式,包括一层高导电性金属组元层和一层高磁导率或高磁感应强度软磁合金组元层;
层状结构复合材料总厚度为0.1-0.5mm,高导电性金属组元层厚度为0.05-0.2mm,高磁导率或高磁感应强度软磁合金组元层厚度为0.05-0.3mm。
2.根据权利要求1所述的电磁屏蔽用层状金属复合材料,其特征在于:高磁导率或高磁感应强度软磁合金组元层是中镍或高镍坡莫合金软磁材料制成,对低频率磁场吸收;以金属铜作为高导电性材料,对高频率电磁波进行反射。
3.根据权利要求1所述的电磁屏蔽用层状金属复合材料,其特征在于:该层状复合材料通过原材料表面修磨、固相复合轧制、扩散退火、半成品轧制、中间退火、成品轧制、拉矫、去应力退火加工而成。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4474676A (en) * 1983-02-28 1984-10-02 Tdk Corporation Electromagnetic interference shielding material
CN1787114A (zh) * 2005-12-06 2006-06-14 安泰科技股份有限公司 一种复合电磁屏蔽薄膜材料及其制造方法
CN1852653A (zh) * 2006-05-26 2006-10-25 安泰科技股份有限公司 一种复合电磁屏蔽材料及其制造方法
CN103155737A (zh) * 2010-09-30 2013-06-12 日东电工株式会社 无线电力传输用电磁波屏蔽片
CN105074487A (zh) * 2013-03-08 2015-11-18 韩国标准科学研究院 用于测量磁场的屏蔽装置、屏蔽方法及消磁

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4474676A (en) * 1983-02-28 1984-10-02 Tdk Corporation Electromagnetic interference shielding material
CN1787114A (zh) * 2005-12-06 2006-06-14 安泰科技股份有限公司 一种复合电磁屏蔽薄膜材料及其制造方法
CN1852653A (zh) * 2006-05-26 2006-10-25 安泰科技股份有限公司 一种复合电磁屏蔽材料及其制造方法
CN103155737A (zh) * 2010-09-30 2013-06-12 日东电工株式会社 无线电力传输用电磁波屏蔽片
CN105074487A (zh) * 2013-03-08 2015-11-18 韩国标准科学研究院 用于测量磁场的屏蔽装置、屏蔽方法及消磁

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