CN109192850B - Heat radiation structure of COB type LED packaging unit - Google Patents
Heat radiation structure of COB type LED packaging unit Download PDFInfo
- Publication number
- CN109192850B CN109192850B CN201811076012.7A CN201811076012A CN109192850B CN 109192850 B CN109192850 B CN 109192850B CN 201811076012 A CN201811076012 A CN 201811076012A CN 109192850 B CN109192850 B CN 109192850B
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- CN
- China
- Prior art keywords
- wall
- fixedly connected
- side wall
- shell
- pressing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 27
- 230000005855 radiation Effects 0.000 title claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 238000005538 encapsulation Methods 0.000 claims description 14
- 239000000084 colloidal system Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 7
- 239000000428 dust Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 208000033999 Device damage Diseases 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Package Closures (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811076012.7A CN109192850B (en) | 2018-09-14 | 2018-09-14 | Heat radiation structure of COB type LED packaging unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811076012.7A CN109192850B (en) | 2018-09-14 | 2018-09-14 | Heat radiation structure of COB type LED packaging unit |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109192850A CN109192850A (en) | 2019-01-11 |
CN109192850B true CN109192850B (en) | 2024-03-05 |
Family
ID=64911459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811076012.7A Active CN109192850B (en) | 2018-09-14 | 2018-09-14 | Heat radiation structure of COB type LED packaging unit |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109192850B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110102543B (en) * | 2019-05-09 | 2022-08-19 | 宿州学院 | Cleaning device of computer artificial intelligent information screening system |
CN112165046A (en) * | 2020-09-15 | 2021-01-01 | 徐玲 | Sunlight-proof self-heat-dissipation bridge |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108471508A (en) * | 2018-05-28 | 2018-08-31 | 合肥盛尔威工业设备股份有限公司 | A kind of tv shell with heat sinking function |
CN208873765U (en) * | 2018-09-14 | 2019-05-17 | 盐城东紫光电科技有限公司 | A kind of radiator structure of COB type LED package unit |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI338830B (en) * | 2008-01-11 | 2011-03-11 | Wistron Corp | Heat-dissipating module having a dust-removing mechanism and assembly of an electronic device and the heat-dissipating module |
-
2018
- 2018-09-14 CN CN201811076012.7A patent/CN109192850B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108471508A (en) * | 2018-05-28 | 2018-08-31 | 合肥盛尔威工业设备股份有限公司 | A kind of tv shell with heat sinking function |
CN208873765U (en) * | 2018-09-14 | 2019-05-17 | 盐城东紫光电科技有限公司 | A kind of radiator structure of COB type LED package unit |
Also Published As
Publication number | Publication date |
---|---|
CN109192850A (en) | 2019-01-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240202 Address after: Room 206, Building 5, No. 128 Jingyuan Road, Ningbo High tech Zone, Ningbo City, Zhejiang Province, 315100 Applicant after: Jingshi Energy Conservation and Environmental Protection Technology (Zhejiang) Co.,Ltd. Country or region after: China Address before: 224000 Photoelectric Industrial Park, No. 66 Lijiang Road, Yancheng Economic and Technological Development Zone, Jiangsu Province Applicant before: YANCHENG DONGZI OPTOELECTRONICS TECHNOLOGY CO.,LTD. Country or region before: China |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A heat dissipation structure for COB type LED packaging units Granted publication date: 20240305 Pledgee: Zhejiang Tailong Commercial Bank Co.,Ltd. Ningbo High tech Zone Branch Pledgor: Jingshi Energy Conservation and Environmental Protection Technology (Zhejiang) Co.,Ltd. Registration number: Y2024980016952 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |