CN109192716A - A kind of IGBT module braze-welded structure - Google Patents
A kind of IGBT module braze-welded structure Download PDFInfo
- Publication number
- CN109192716A CN109192716A CN201811094460.XA CN201811094460A CN109192716A CN 109192716 A CN109192716 A CN 109192716A CN 201811094460 A CN201811094460 A CN 201811094460A CN 109192716 A CN109192716 A CN 109192716A
- Authority
- CN
- China
- Prior art keywords
- ceramic copper
- braze
- igbt module
- welded structure
- clad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- 238000003466 welding Methods 0.000 claims abstract description 4
- 238000002955 isolation Methods 0.000 claims description 32
- 229910052573 porcelain Inorganic materials 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
A kind of IGBT module braze-welded structure provided by the invention, including metal plate, ceramic copper-clad plate；The metal-sheet edges are machined with mounting hole, and the ceramic copper-clad plate is fixed on a metal plate by welding, and the ceramic copper-clad plate has at regular intervals between several and adjacent ceramic copper-clad plates.The present invention can get the brazed products of registration, provide size guarantee for subsequent automated aluminum wire bonding.Its innovative point is not only to have limited ceramic copper-clad plate displacement using the line way of contact, but also overcomes positioning device that cannot take out caused scrap by ceramic copper-clad board clamping.
Description
Technical field
The present invention relates to a kind of IGBT module braze-welded structures.
Background technique
The main structure of IGBT module soldering is to weld chip and ceramic copper-clad plate on metallic substrates, is then followed by certainly
Motivation is bonded the subsequent handlings such as aluminum steel.Automatic machine bonding requires the chip of batch brazing product and ceramic copper-clad plate pad locations to protect
Higher consistency is held, due to the effect of solder tension and metal substrate special construction after traditional handicraft soldering, ceramic copper-clad plate is deposited
Cause position degree overproof in irregular displacement, yield rate is difficult to improve.Traditional handicraft as shown in Figure 4 and Figure 5 has no that positioning is set
Meter.And metal substrate is solution and concave defect (Fig. 4) on mounting surface B relative datum face XX ' after ceramic copper-clad plate high temperature brazing, is made
At product, there are harmful installation gap a with external radiator；Therefore the face is designed to lower convex special construction (figure intentionally
5).The face B is resiliently extremely close to datum level after soldering.Due to the effect of solder tension and metal substrate special construction after soldering, 4 pieces
Ceramic copper-clad plate can occur to converge offset phenomena to metal substrate core, and ceramic copper-clad plate can be adjacent to when serious, between counteracting 0.7mm
Away from.Although also designing bar shaped thin slice, the location measures such as pencil-lead all exist in test and pick and place difficulty, do not have technique
Operability, defect: there are irregular displacements to cause position degree overproof for ceramic copper-clad plate, and yield rate is difficult to improve.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of IGBT module braze-welded structures.
The present invention is achieved by the following technical programs.
A kind of IGBT module braze-welded structure provided by the invention, including metal plate, ceramic copper-clad plate；The metal-sheet edges
It is machined with mounting hole, the ceramic copper-clad plate is fixed on a metal plate by welding, and the ceramic copper-clad plate is several
And have between adjacent ceramic copper-clad plate at regular intervals.
Isolating device is provided between adjacent four of several ceramic copper-clad plates.
Isolating device includes isolation board and insulated column.
The insulated column is mounted on the both ends of isolation board, and the isolation board is two pieces, two pieces of isolation boards be mutually perpendicular to and in
Heart interconnection.
The infall of two pieces of isolation boards is provided with fixed pin.
The isolation board setting separates two-by-two by four pieces of ceramic copper-clad plates.
The fixed pin is fixed in the infall of isolation board, and isolation board is fixed on a metal plate by fixed pin.
The height of the isolation board is greater than the height of ceramic copper-clad plate.
The width of the isolation board is less than the diameter of insulated column.
The beneficial effects of the present invention are: it can get the brazed products of registration, mentioned for subsequent automated aluminum wire bonding
For size guarantee.Its innovative point is not only to have limited ceramic copper-clad plate displacement, but also positioning device is overcome to be made pottery using the line way of contact
Porcelain copper-clad plate clamps scrapping caused by cannot taking out.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is the overlooking structure diagram of isolation board of the invention；
Fig. 3 is side structure schematic view of the invention；
Fig. 4 is conventional brazing structural schematic diagram；
Fig. 5 is conventional brazing structural schematic diagram；
In figure: 1- metal plate, 11- mounting hole, 2- ceramic copper-clad plate, 21- chip, 3- isolation board, 4- insulated column, 5- are solid
Determine needle.
Specific embodiment
Be described further below technical solution of the present invention, but claimed range be not limited to it is described.
A kind of IGBT module braze-welded structure, including metal plate 1, ceramic copper-clad plate 2；1 edge of metal plate is machined with peace
Hole 11 is filled, the ceramic copper-clad plate 2 is fixed on by welding on metal plate 1, and the ceramic copper-clad plate 2 is several and phase
Have between adjacent ceramic copper-clad plate 2 at regular intervals.
Isolating device is provided between adjacent four of several ceramic copper-clad plates 2.
Isolating device includes isolation board 3 and insulated column 4.
The insulated column 4 is mounted on the both ends of isolation board 3, and the isolation board 3 is two pieces, and two pieces of isolation boards 3 are mutually perpendicular to
And central crossbar connects.
The infall of two pieces of isolation boards 3 is provided with fixed pin 5.
The setting of isolation board 3 separates two-by-two by four pieces of ceramic copper-clad plates 2.
The fixed pin 5 is fixed in the infall of isolation board 3, and isolation board 3 is fixed on metal plate 1 by fixed pin 5.
The height of the isolation board 3 is greater than the height of ceramic copper-clad plate 2.
The width of the isolation board 3 is less than the diameter of insulated column 4.
Claims (9)
1. a kind of IGBT module braze-welded structure, including metal plate (1), ceramic copper-clad plate (2), it is characterised in that: the metal plate
(1) edge is machined with mounting hole (11), and the ceramic copper-clad plate (2) is fixed on by welding on metal plate (1), described
Ceramic copper-clad plate (2) has at regular intervals between several and adjacent ceramic copper-clad plates (2).
2. IGBT module braze-welded structure as described in claim 1, it is characterised in that: several ceramic copper-clad plates (2) it is adjacent four
Isolating device is provided between a.
3. IGBT module braze-welded structure as claimed in claim 2, it is characterised in that: isolating device include isolation board (3) and every
From column (4).
4. IGBT module braze-welded structure as claimed in claim 3, it is characterised in that: the insulated column (4) is mounted on isolation board
(3) both ends, the isolation board (3) are two pieces, and two pieces of isolation boards (3) are mutually perpendicular to and central crossbar connects.
5. IGBT module braze-welded structure as claimed in claim 4, it is characterised in that: the infall setting of two pieces of isolation boards (3)
There are fixed pin (5).
6. IGBT module braze-welded structure as claimed in claim 3, it is characterised in that: the isolation board (3) is arranged by four pieces
Ceramic copper-clad plate (2) separates two-by-two.
7. IGBT module braze-welded structure as claimed in claim 5, it is characterised in that: the fixed pin (5) is fixed in isolation board
(3) infall, isolation board (3) are fixed on metal plate (1) by fixed pin (5).
8. IGBT module braze-welded structure as claimed in claim 3, it is characterised in that: the height of the isolation board (3) is greater than pottery
The height of porcelain copper-clad plate (2).
9. IGBT module braze-welded structure as claimed in claim 3, it is characterised in that: the width of the isolation board (3) be less than every
Diameter from column (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811094460.XA CN109192716A (en) | 2018-09-19 | 2018-09-19 | A kind of IGBT module braze-welded structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811094460.XA CN109192716A (en) | 2018-09-19 | 2018-09-19 | A kind of IGBT module braze-welded structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109192716A true CN109192716A (en) | 2019-01-11 |
Family
ID=64908532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811094460.XA Pending CN109192716A (en) | 2018-09-19 | 2018-09-19 | A kind of IGBT module braze-welded structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109192716A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1819161A (en) * | 2005-02-03 | 2006-08-16 | 富士电机电子设备技术株式会社 | Semiconductor device and manufacturing method thereof |
| CN102881616A (en) * | 2011-07-12 | 2013-01-16 | 富士电机株式会社 | Semiconductor device assembly fixture and the use of the semiconductor device manufacturing method |
| CN103299421A (en) * | 2011-07-28 | 2013-09-11 | 富士电机株式会社 | Semiconductor device and method for producing a semiconductor device |
| CN105304578A (en) * | 2014-07-15 | 2016-02-03 | 富士电机株式会社 | Semiconductor device and semiconductor device manufacturing method |
-
2018
- 2018-09-19 CN CN201811094460.XA patent/CN109192716A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1819161A (en) * | 2005-02-03 | 2006-08-16 | 富士电机电子设备技术株式会社 | Semiconductor device and manufacturing method thereof |
| CN102881616A (en) * | 2011-07-12 | 2013-01-16 | 富士电机株式会社 | Semiconductor device assembly fixture and the use of the semiconductor device manufacturing method |
| CN103299421A (en) * | 2011-07-28 | 2013-09-11 | 富士电机株式会社 | Semiconductor device and method for producing a semiconductor device |
| CN105304578A (en) * | 2014-07-15 | 2016-02-03 | 富士电机株式会社 | Semiconductor device and semiconductor device manufacturing method |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |