CN109192510B - Manufacturing method of solid capacitor - Google Patents
Manufacturing method of solid capacitor Download PDFInfo
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- CN109192510B CN109192510B CN201810936607.9A CN201810936607A CN109192510B CN 109192510 B CN109192510 B CN 109192510B CN 201810936607 A CN201810936607 A CN 201810936607A CN 109192510 B CN109192510 B CN 109192510B
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- 239000003990 capacitor Substances 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000007787 solid Substances 0.000 title claims abstract description 14
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 51
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 33
- 239000007800 oxidant agent Substances 0.000 claims abstract description 26
- 238000005470 impregnation Methods 0.000 claims abstract description 24
- 238000001035 drying Methods 0.000 claims abstract description 23
- 230000001590 oxidative effect Effects 0.000 claims abstract description 23
- 230000032683 aging Effects 0.000 claims abstract description 21
- 230000008439 repair process Effects 0.000 claims abstract description 21
- 239000000178 monomer Substances 0.000 claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 238000001514 detection method Methods 0.000 claims abstract description 9
- 238000007598 dipping method Methods 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 238000004804 winding Methods 0.000 claims abstract description 4
- 239000011888 foil Substances 0.000 claims description 41
- 239000002390 adhesive tape Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 238000007648 laser printing Methods 0.000 claims description 4
- 230000002431 foraging effect Effects 0.000 claims 1
- 229920001940 conductive polymer Polymers 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 230000002950 deficient Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 51
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 229910052742 iron Inorganic materials 0.000 description 7
- 238000003466 welding Methods 0.000 description 5
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical group C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- -1 iron ions Chemical class 0.000 description 2
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229930192474 thiophene Natural products 0.000 description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical group O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 1
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- FLDCSPABIQBYKP-UHFFFAOYSA-N 5-chloro-1,2-dimethylbenzimidazole Chemical compound ClC1=CC=C2N(C)C(C)=NC2=C1 FLDCSPABIQBYKP-UHFFFAOYSA-N 0.000 description 1
- 239000001741 Ammonium adipate Substances 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000019293 ammonium adipate Nutrition 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 229940077388 benzenesulfonate Drugs 0.000 description 1
- FDOCOSUCHDHMCW-UHFFFAOYSA-K benzenesulfonate iron(3+) Chemical compound [Fe+3].[O-]S(=O)(=O)c1ccccc1.[O-]S(=O)(=O)c1ccccc1.[O-]S(=O)(=O)c1ccccc1 FDOCOSUCHDHMCW-UHFFFAOYSA-K 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000010000 carbonizing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- LHOWRPZTCLUDOI-UHFFFAOYSA-K iron(3+);triperchlorate Chemical compound [Fe+3].[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O.[O-]Cl(=O)(=O)=O LHOWRPZTCLUDOI-UHFFFAOYSA-K 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a manufacturing method of a solid capacitor, which comprises the following steps of: s1, winding into a core package; numbering each core package; s2, detecting whether the core packages are short-circuited one by one, and immersing the core packages qualified in detection into formation liquid for formation repair treatment; during the formation repair treatment, the positive electrode guide pin and the negative electrode guide pin of the core package are respectively and electrically connected with the positive electrode and the negative electrode of the power supply; detecting residual currents of the core packages one by one after formation repair treatment; s3, drying the core bag; s4, dipping the core wrap in a monomer solution for impregnation treatment; s5, after the impregnation treatment is finished, drying the core wrap; s6, injecting a quantitative oxidant into the core bag; s7, heating to carry out polymerization reaction, and generating a conductive polymer in the core bag; s8, assembling and sealing; and S9, aging. In the invention, the core packages are charged one by one in the formation process, so that the defective products are prevented from influencing the formation effect of other adjacent core packages, the equivalent resistance of ESR series connection is reduced, and the consistency of products is improved.
Description
Technical Field
The invention relates to the technical field of capacitor manufacturing processes, in particular to a manufacturing method of a solid capacitor.
Background
Compared with a common liquid electrolytic capacitor, the solid-state capacitor has the advantages of outstanding electrical performance, low Equivalent Series Resistance (ESR), high ripple current resistance, long service life, stable performance and the like.
The production process of the existing solid capacitor comprises the following steps: nail coiling → welding → first time of formation → carbonization → second time of formation → drying → impregnation monomer → drying → impregnation oxidant → polymerization → assembly → cleaning → aging → printing, the above process has the following defects:
firstly, in order to facilitate subsequent formation and impregnation operation, the wound core package is fed on a welding machine through a vibration disc, the anode guide pin of the core package is welded on an iron bar, then the defect part of an oxide film generated in the nail roll process is repaired through a formation process by utilizing a whole tray of a carrier, and then the whole tray is impregnated with a monomer and an oxidant. By adopting the working procedures, the lead wire is warped and the core bag is damaged due to the concentrated placement of a large number of core bags and the vibration disc process, the core bags welded on the iron bar are not in a straight line easily due to poor warping, the welding heights of the core bags are different, the liquid level of the monomer and the liquid level of the oxidant during impregnation are difficult to accurately control, and the consistency of the product is poor.
In the formation procedure, the anode of a power supply is electrically connected with the iron bar, the cathode of the power supply is electrically connected with the formation liquid, and the first formation treatment is carried out after voltage is applied; then carbonizing the core cladding after the first formation treatment; immersing the core bag into the formation liquid again for second formation treatment; in actual practice it was found that: after the positive electrode foil is connected with voltage, although the electrolytic paper is arranged between the positive electrode foil and the negative electrode foil, the formation liquid has a certain resistance value and a certain voltage drop in the liquid, so that the negative electrode foil is easy to be formed, the negative electrode foil can bear a certain voltage value, and after the negative electrode foil bears the voltage, the functional layer on the surface can be damaged to a certain extent due to low voltage resistance of the negative electrode, the carbon layer falls off, the ESR series equivalent resistance is increased, the ESR value fluctuates greatly, the product uniformity is poor, and the reject ratio is high; meanwhile, the defective product may affect the formation effect of the whole disc.
And thirdly, drying and polymerizing are usually carried out by adopting an oven, on one hand, the temperature consistency in the oven is not good, on the other hand, a batch of products can be put into the oven again for drying after a drying procedure is finished, and a polymerization procedure is usually carried out after a certain amount of core packages are impregnated, the time of exposing the wet core packages in the air is long, the time of exposing the wet core packages in the air is also not consistent, the wet core packages absorb moisture in the air and other impurities in the air, the service life of the products is greatly influenced, and the consistency of the products is influenced.
Thirdly, the capacitor core package is firstly put into a monomer solution for monomer impregnation, then is dried, and is then put into an oxidant solution for oxidant impregnation, the oxidant solution is often reused, and because the oxidant solution is very acidic, part of aluminum is dissolved by repeated use, and furthermore, other impurities such as paper scraps can influence the quality of the oxidant, thereby influencing the consistency and the quality of products.
Fourthly, the important working procedures can not realize the real-time monitoring of each product and can not keep the production data of each product.
Fifthly, temperature and humidity control is needed in the impregnation assembly workshop, and the additional cost is high.
Sixthly, the production process has multiple working procedures, the circulation is complicated, and the production period of the product is long.
Disclosure of Invention
In order to remedy the drawbacks of the prior art, the present invention provides a method for manufacturing a solid state capacitor.
The technical problem to be solved by the invention is realized by the following technical scheme:
a method of manufacturing a solid state capacitor comprising the steps of, in order:
s1, nailing a positive guide pin with a positive foil, nailing a negative guide pin with a negative foil, laminating electrolytic paper with the positive foil and the negative foil, and winding the electrolytic paper, the positive foil and the negative foil together into a core package; numbering each core package;
s2, detecting whether the core packages are short-circuited one by one, and immersing the core packages qualified in detection into formation liquid for formation repair treatment; during formation repair treatment, the positive electrode guide pin and the negative electrode guide pin of the core bag are respectively electrically connected with the positive electrode and the negative electrode of a power supply, and the positive electrode foil is repaired in formation liquid after power is applied; detecting residual currents of the core packages one by one after formation repair processing, reserving detection data according to the number of the core packages, and eliminating the core packages with the residual currents exceeding the standard;
s3, drying the core bag;
s4, dipping the core wrap in a monomer solution for impregnation treatment;
s5, after the impregnation treatment is finished, drying the core wrap;
s6, injecting a quantitative oxidant into the core bag;
s7, heating to carry out polymerization reaction, and generating a conductive polymer in the core bag;
s8, assembling and sealing;
and S9, aging.
Further, in step S2, the positive electrode guide pin and the negative electrode guide pin of the core package are electrically connected to the positive electrode and the negative electrode of the power supply through a clamp, the clamp includes a positive electrode conductive plate and a negative electrode conductive plate which are arranged in parallel, and the positive electrode conductive plate and the negative electrode conductive plate are connected to the positive electrode and the negative electrode of the power supply respectively; the positive conductive plate comprises a paper tape layer and an adhesive tape layer, a metal conductive layer is arranged between the paper tape layer and the adhesive tape layer, the adhesive tape layer fixes a positive guide pin of the core package on the paper tape layer, and the metal conductive layer is in contact with the positive guide pin of the core package; the positive conductive plate comprises a paper tape layer and an adhesive tape layer, a metal conductive layer is arranged between the paper tape layer and the adhesive tape layer, a negative guide pin of the core package is fixed on the paper tape layer by the adhesive tape layer, and the metal conductive layer is in contact with the negative guide pin of the core package.
Further, the formation repair process is performed only once.
Further, the drying process in step S3, the drying process in step S5, and the polymerization reaction in step S7 are all performed in a tunnel furnace.
Further, in step S1, each core pack is numbered by laser printing.
And further, electrifying the anode guide pin and the cathode guide pin of the core package at the end section of the polymerization reaction, simultaneously carrying out basic characteristic test on each core package, storing test data according to the number of the core package, and removing the core package unqualified in the basic characteristic test.
Further, the polymerization reaction is multi-temperature section polymerization with low temperature and high temperature, and the anode guide pin and the cathode guide pin of the core package are electrified in the temperature section with the highest polymerization temperature.
In the invention, voltage is applied only at the end of polymerization reaction, so that on one hand, the subsequent aging charging time can be saved, on the other hand, when the core package is not subjected to assembly sealing, gas generated by polymer decomposition in the aging process is discharged, the accumulation of gas in the capacitor is reduced, the probability of steam drum generation of the capacitor at overhigh temperature during assembly sealing can be reduced, the product quality is improved, and the qualified rate of the prepared solid capacitor finished product is high.
Further, the basic characteristic test comprises a capacity test, an internal resistance test, a leakage current test and a loss angle test.
Further, the applied voltage is 1-1.15 times of the aged operating voltage during aging, and not more than 1.25 times of the aged operating voltage at the maximum.
Further, steps S1-S9 are all performed in a closed container.
The invention has the following beneficial effects:
in the invention, the core packages are charged one by one in the formation process, so that the positive and negative electrodes of each capacitor are electrically connected with the positive and negative electrodes of the power supply, the defect product is prevented from influencing the formation effect of other adjacent core packages, the probability of negative foil formation and carbon layer falling is greatly reduced, the ESR series equivalent resistance is reduced, and the consistency of products is improved.
The method changes the process that the traditional core packet is firstly put into the monomer solution for monomer impregnation, then dried and then put into the oxidant solution for oxidant impregnation, adopts the mode that the core packet is firstly put into the monomer solution for monomer impregnation, then dried and then injected with the oxidant, not only can ensure the impregnation effect, but also can accurately inject the required oxidant amount according to the required oxidant amount of each specification product, can ensure that the oxidant of each product is a new oxidant solution and cannot be the oxidant recycled, thereby ensuring the quality of each product, and simultaneously ensuring the consistency of the injected oxidant amount of each product, thereby ensuring the consistency of each product.
The invention changes the traditional drying of the oven, in the preparation of the solid capacitor, in the drying and polymerization processes, a tunnel oven is creatively adopted, the impregnated plate can immediately enter the tunnel oven for polymerization process after being impregnated, the polymerization process is not required to be carried out together after a certain amount of impregnation is finished like the traditional process, and the product just impregnated can be put into the oven again after a program is finished, so the aging is fast, the time of exposing the core package after impregnation in the air is greatly reduced, the possibility that the wet core package is polluted by moisture absorbed in the air and impurities is reduced, the product quality is good, the temperature consistency of the tunnel oven is higher than the temperature consistency of the oven, and the performance consistency among individual products is obviously improved.
The invention can monitor the characteristics and the process data of each product in important processes in real time, and ensure that the products with hidden troubles are eliminated in advance, thereby ensuring the quality of each product.
In the invention, all the processes of manufacturing the capacitor are carried out in a closed container, the requirement on the temperature and the humidity of the environment is low, meanwhile, the waste gas can be treated in a centralized way, and the workshop basically has no peculiar smell.
The invention improves the traditional manufacturing method of the aluminum solid capacitor, the process steps in the whole manufacturing method are integrated and correlated, and the performance consistency among individual products is greatly improved by controlling specific process routes, process parameters and indexes.
Detailed Description
The present invention will be described in detail with reference to examples, which are only preferred embodiments of the present invention and are not intended to limit the present invention.
A method of manufacturing a solid state capacitor comprising the steps of, in order:
s1, nailing a positive guide pin with a positive foil, nailing a negative guide pin with a negative foil, laminating electrolytic paper with the positive foil and the negative foil, and winding the electrolytic paper, the positive foil and the negative foil together into a core package; numbering each core package;
s2, detecting whether the core packages are short-circuited one by one, and immersing the core packages qualified in detection into formation liquid for formation repair treatment; during formation repair treatment, the positive electrode guide pin and the negative electrode guide pin of the core bag are respectively electrically connected with the positive electrode and the negative electrode of a power supply, and the positive electrode foil is repaired in formation liquid after power is applied; detecting residual currents of the core packages one by one after formation repair processing, reserving detection data according to the number of the core packages, and eliminating the core packages with the residual currents exceeding the standard;
s3, drying the core bag;
s4, dipping the core wrap in a monomer solution for impregnation treatment;
s5, after the impregnation treatment is finished, drying the core wrap;
s6, injecting a quantitative oxidant into the core bag;
s7, heating to carry out polymerization reaction, and generating a conductive polymer in the core bag;
s8, assembling and sealing;
and S9, aging.
In step S2, the positive electrode guide pin of the core package is electrically connected to the positive electrode of the power supply, and the negative electrode guide pin of the core package is electrically connected to the negative electrode of the power supply.
In step S2, the positive electrode guide pins and the negative electrode guide pins of the plurality of core packages are electrically connected to the positive electrode and the negative electrode of the power supply through a clamp, the clamp includes a positive electrode conductive plate and a negative electrode conductive plate which are arranged in parallel, and the positive electrode conductive plate and the negative electrode conductive plate are respectively connected to the positive electrode and the negative electrode of the power supply; the positive conductive plate comprises a paper tape layer and an adhesive tape layer, a metal conductive layer is arranged between the paper tape layer and the adhesive tape layer, the adhesive tape layer fixes a positive guide pin of the core package on the paper tape layer, and the metal conductive layer is in contact with the positive guide pin of the core package; the positive conductive plate comprises a paper tape layer and an adhesive tape layer, a metal conductive layer is arranged between the paper tape layer and the adhesive tape layer, a negative guide pin of the core package is fixed on the paper tape layer by the adhesive tape layer, and the metal conductive layer is in contact with the negative guide pin of the core package.
In the invention, the positive conductive plate is used for communicating the positive guide pin of the core bag with the positive electrode of the power supply, and the negative conductive plate is used for communicating the negative guide pin of the core bag with the negative electrode of the power supply. According to the invention, the traditional operation that the wound core package is fed on a welding machine through a vibration disc, the anode guide pin of the core package is welded on an iron strip is changed, the anode guide pin and the cathode guide pin of the wound core package are respectively adhered on a paper tape layer, so that the anode guide pin and the cathode guide pin of the core package are respectively and electrically connected with the anode and the cathode of a power supply, and during formation, the anode foil and the cathode foil of the core package are electrified simultaneously, so that the problems that in the traditional operation, the core package welded on the iron strip is not in a straight line, the welding heights of the core packages are different, the liquid level of a monomer and an oxidant during impregnation is difficult to accurately control, and the product consistency is poor due to the fact that a large amount of core packages are intensively placed and the core packages are damaged through the vibration disc process are solved.
In the invention, whether the core package is short-circuited or not is detected before the formation and repair treatment in order to enable the voltage during the formation and repair treatment to meet the set requirement. The specific method for detecting whether the core package is short-circuited is not particularly limited, and can be implemented by adopting the prior art, and the method is easy to select according to actual needs, which is a conventional means for those skilled in the art and is not described herein again.
The method for detecting the residual current of the core package in the invention is not particularly limited, and can be implemented by adopting the prior art, and the method is easy to select according to the actual needs, which is a conventional means for those skilled in the art, and is not described herein again.
At present, the residual current of a whole core package tray (hundreds to thousands of core packages) is detected in the industry, and the core packages with the residual current exceeding the standard cannot be rejected.
In the present invention, the formation repair process is performed only once.
The type of the chemical conversion solution in the present invention is not particularly limited, and chemical conversion solutions conventionally used in the art can be used, and examples thereof include phosphoric acid-based chemical conversion solutions, boric acid-based chemical conversion solutions, and ammonium adipate-based chemical conversion solutions.
In the present invention, the drying process in step S3, the drying process in step S5, and the polymerization reaction in step S7 are all performed in a tunnel furnace.
The invention does not specially limit the concrete process parameters of the tunnel furnace, such as the temperature and the baking speed of the tunnel furnace, and the technical personnel can set the parameters according to the actual requirements.
In the present invention, it is preferable to number each core pack by laser printing in step S1, but the present invention is not limited thereto. The invention is beneficial to the control of the product quality by numbering and managing the products.
In the invention, the anode guide pin and the cathode guide pin of the core package are electrified at the end of the polymerization reaction, and meanwhile, the basic characteristic test is carried out on each core package, test data are stored according to the number of the core package, and the core packages which are unqualified in the basic characteristic test are removed. Specifically, the polymerization reaction is multi-temperature section polymerization with low temperature and high temperature, and the positive electrode guide pin and the negative electrode guide pin of the core package are electrified in the temperature section with the highest polymerization temperature.
The specific process parameters of the multi-temperature stage polymerization are not particularly limited, and can be set by a person skilled in the art according to actual needs. As an example, the multiple temperature block polymerization may be a two-stage polymerization: the polymerization temperature of the first stage polymerization is 20-60 ℃, and the polymerization time is 2-24 hours; the polymerization temperature of the second-stage polymerization is 120-250 ℃, and the polymerization time is 0.5-4 hours; the multiple temperature stage polymerization may be a four stage polymerization: wherein the first-stage polymerization temperature is 35-45 ℃, and the polymerization time is 4-6 hours; the second-stage polymerization temperature is 55-70 ℃, and the polymerization time is 1-3 hours; the polymerization temperature of the third stage is 80-90 ℃, and the polymerization time is 2-5 hours; the fourth stage polymerization temperature is 130-150 deg.c and the polymerization time is 1-3 hr.
In the invention, voltage is applied only at the end of polymerization reaction, so that on one hand, the subsequent aging charging time can be saved, on the other hand, when the core package is not subjected to assembly sealing, gas generated by polymer decomposition in the aging process is discharged, the accumulation of gas in the capacitor is reduced, the probability of steam drum generation of the capacitor at overhigh temperature during assembly sealing can be reduced, the product quality is improved, and the qualified rate of the prepared solid capacitor finished product is high.
The basic characteristic test comprises a capacity test, an internal resistance test, a leakage current test and a loss angle test.
The voltage applied at the end of the polymerization reaction is 1-1.15 times of the aging working voltage during aging, and the maximum voltage is not more than 1.25 times of the aging working voltage.
In the traditional process, the characteristic test is usually carried out after aging, the traditional operation is changed, the characteristic test is carried out before aging, and products with capacity and loss angle less than ESR unqualified and products with particularly large LC or short circuit are removed according to the test result, so that the defective products are prevented from flowing into the next procedure, and the possibility of reducing time or temperature in subsequent aging is further achieved.
In the present invention, the kind of the monomer is not particularly limited, and a monomer known in the art can be used. Preferably, the monomer is selected from thiophene, pyrrole, phenyl ethylene, aniline, or derivatives of the above high molecular monomers, or any combination thereof; more preferably, the thiophene is 3, 4-ethylenedioxythiophene.
In the present invention, the type of the oxidizing agent is not particularly limited, and any oxidizing agent known in the art can be used. By way of example, the oxidizing agent includes salts containing iron ions, salts containing copper ions, or persulfates. Wherein the salts containing iron ions comprise ferric benzene sulfonate, ferric p-methyl benzene sulfonate, ferric chloride, ferric nitrate, ferric perchlorate or combination thereof. Wherein the persulfate-containing salt comprises sodium persulfate, ammonium persulfate, or a combination thereof.
In the invention, the steps S1-S9 are all carried out in a closed container, so the requirements on the temperature and the humidity of the environment of a production workshop are relaxed.
Example 1
A manufacturing method of a solid capacitor comprises the following steps:
s1, cutting, namely cutting the positive electrode foil, the negative electrode foil and the electrolytic paper into preset widths; nailing the anode guide pin with an anode foil, nailing the cathode guide pin with a cathode foil, laminating the electrolytic paper with the anode foil and the cathode foil, wherein the electrolytic paper is arranged between the anode foil and the cathode foil, and the anode foil, the cathode foil and the electrolytic paper are wound into a core package together; numbering each core package in a laser printing mode;
s2, detecting whether the core packages are short-circuited one by one, and immersing the core packages qualified in detection into formation liquid for formation repair treatment; during formation repair treatment, the positive electrode guide pin and the negative electrode guide pin of the core package are respectively and electrically connected with the positive electrode and the negative electrode of a power supply through clamps, and after power is applied, the positive electrode foil is repaired in formation liquid; detecting residual currents of the core packages one by one after formation repair processing, reserving detection data according to the number of the core packages, and eliminating the core packages with the residual currents exceeding the standard; the clamp comprises a positive conductive plate and a negative conductive plate which are arranged in parallel, and the positive conductive plate and the negative conductive plate are respectively connected with the positive electrode and the negative electrode of the power supply; the positive conductive plate comprises a paper tape layer and an adhesive tape layer, a metal conductive layer is arranged between the paper tape layer and the adhesive tape layer, the adhesive tape layer fixes a positive guide pin of the core package on the paper tape layer, and the metal conductive layer is in contact with the positive guide pin of the core package; the positive conductive plate comprises a paper tape layer and an adhesive tape layer, a metal conductive layer is arranged between the paper tape layer and the adhesive tape layer, a negative guide pin of the core package is fixed on the paper tape layer by the adhesive tape layer, and the metal conductive layer is in contact with the negative guide pin of the core package.
S3, drying the core bag in a tunnel furnace;
s4, dipping the core wrap in a monomer solution for impregnation treatment;
s5, after the impregnation treatment is finished, drying the core cladding in a tunnel furnace;
s6, injecting a quantitative oxidant into the core bag;
s7, heating in a tunnel furnace to carry out polymerization reaction, and generating conducting polymer in the core bag; the polymerization reaction is multi-temperature section type polymerization with low temperature and high temperature, the anode guide pin and the cathode guide pin of the core package are electrified in the temperature section with the highest polymerization temperature, meanwhile, the basic characteristic test is carried out on each core package, test data are stored according to the core package number, and the core packages which are unqualified in the basic characteristic test are removed; the basic characteristic test comprises a capacity test, an internal resistance test, a leakage current test and a loss angle test; the applied voltage is 1-1.15 times of the aging working voltage during aging, and the maximum voltage is not more than 1.25 times of the aging working voltage;
s8, assembling and sealing: sealing the prepared core bag by using a rubber plug and an aluminum shell through an automatic assembling machine;
s9, aging the assembled product;
s10, stamping, processing and packaging.
Wherein the formation repair treatment is performed only once.
Steps S1 to S9 are all performed in a closed vessel.
The above-mentioned embodiments only express the embodiments of the present invention, and the description is more specific and detailed, but not understood as the limitation of the patent scope of the present invention, but all the technical solutions obtained by using the equivalent substitution or the equivalent transformation should fall within the protection scope of the present invention.
Claims (8)
1. A method of manufacturing a solid state capacitor comprising the steps of:
s1, nailing a positive guide pin with a positive foil, nailing a negative guide pin with a negative foil, laminating electrolytic paper with the positive foil and the negative foil, and winding the electrolytic paper, the positive foil and the negative foil together into a core package; numbering each core package;
s2, detecting whether the core packages are short-circuited one by one, and immersing the core packages qualified in detection into formation liquid for formation repair treatment; during formation repair treatment, the positive electrode guide pin and the negative electrode guide pin of the core bag are respectively electrically connected with the positive electrode and the negative electrode of a power supply, and the positive electrode foil is repaired in formation liquid after power is applied; detecting residual currents of the core packages one by one after formation repair processing, reserving detection data according to the number of the core packages, and eliminating the core packages with the residual currents exceeding the standard;
s3, drying the core bag;
s4, dipping the core wrap in a monomer solution for impregnation treatment;
s5, after the impregnation treatment is finished, drying the core wrap;
s6, injecting a quantitative oxidant into the core bag;
s7, heating for polymerization reaction;
s8, assembling and sealing;
s9, aging;
the drying treatment in step S3, the drying treatment in step S5, and the polymerization reaction in step S7 are all performed in a tunnel furnace; in the step S2, the positive electrode guide pin and the negative electrode guide pin of the core bag are respectively electrically connected with the positive electrode and the negative electrode of the power supply through a clamp, the clamp comprises a positive electrode conductive plate and a negative electrode conductive plate which are arranged in parallel, and the positive electrode conductive plate and the negative electrode conductive plate are respectively connected with the positive electrode and the negative electrode of the power supply; the positive conductive plate comprises a paper tape layer and an adhesive tape layer, a metal conductive layer is arranged between the paper tape layer and the adhesive tape layer, the adhesive tape layer fixes a positive guide pin of the core package on the paper tape layer, and the metal conductive layer is in contact with the positive guide pin of the core package; the negative conductive plate comprises a paper tape layer and an adhesive tape layer, a metal conductive layer is arranged between the paper tape layer and the adhesive tape layer, the adhesive tape layer fixes a negative guide pin of the core package on the paper tape layer, and the metal conductive layer is in contact with the negative guide pin of the core package.
2. The manufacturing method according to claim 1, wherein the chemical conversion repair process is performed only once.
3. The method of manufacturing of claim 1, wherein each core pack is numbered by laser printing in step S1.
4. The manufacturing method according to claim 1, wherein the positive electrode guide pin and the negative electrode guide pin of the core package are electrified at the end of the polymerization reaction, and meanwhile, a basic characteristic test is performed on each core package, test data is stored according to the number of the core package, and the core package which is unqualified in the basic characteristic test is removed.
5. The method according to claim 4, wherein the polymerization reaction is a multi-temperature block polymerization with low temperature and high temperature, and the positive electrode lead and the negative electrode lead of the core package are powered on at a temperature block with the highest polymerization temperature.
6. The manufacturing method according to claim 4, wherein the basic characteristic test includes a capacity test, an internal resistance test, a leakage current test, and a loss angle test.
7. The method of claim 4, wherein the voltage applied at the end of the polymerization reaction is 1 to 1.15 times the operating voltage for aging.
8. The method of claim 1, wherein steps S1-S9 are performed in a closed container.
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