CN109181425A - A kind of LED lamp of cold-resistant thermal cycle - Google Patents

A kind of LED lamp of cold-resistant thermal cycle Download PDF

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Publication number
CN109181425A
CN109181425A CN201811377080.7A CN201811377080A CN109181425A CN 109181425 A CN109181425 A CN 109181425A CN 201811377080 A CN201811377080 A CN 201811377080A CN 109181425 A CN109181425 A CN 109181425A
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cold
parts
thermal cycle
resistant thermal
led
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胡广
储昭学
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ANHUI LANRUI ELECTRONICS TECHNOLOGY Co Ltd
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ANHUI LANRUI ELECTRONICS TECHNOLOGY Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C09D127/16Homopolymers or copolymers of vinylidene fluoride
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/65Additives macromolecular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • C08K2003/2241Titanium dioxide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/32Phosphorus-containing compounds
    • C08K2003/321Phosphates
    • C08K2003/328Phosphates of heavy metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/014Additives containing two or more different additives of the same subgroup in C08K
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Luminescent Compositions (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention discloses a kind of LED backplane heat-conductive coating of cold-resistant thermal cycle, raw material includes: 40-70 parts of PVDF fluorocarbon resin, 25-43 parts of Waterborne Polyurethane Prepolymer by weight, 1-4 parts of liquid nitrile rubber, 0.4-1 parts of epoxidized soybean oil, N, 1-2 parts of N- dimethylethanolamine, 1.2-1.8 parts of dimethyl benzylamine, 40-60 parts of packing strengthening agent, 0.1-0.5 parts of anti-flash rusting agent, 0.2-1 parts of dispersing agent, 1-2 parts of defoaming agent, 1-2 parts of levelling agent, 1-2 parts of thickener.The invention discloses a kind of LED backplanes of cold-resistant thermal cycle, comprising: the heat-conductive coating of aluminum alloy base material and the cold-resistant thermal cycle of above-mentioned LED backplane coated in aluminum alloy base material surface.The invention discloses a kind of LED lamps of cold-resistant thermal cycle, comprising: the LED backplane of above-mentioned cold-resistant thermal cycle and the LED chip being encapsulated in the LED backplane of above-mentioned cold-resistant thermal cycle.

Description

A kind of LED lamp of cold-resistant thermal cycle
Technical field
The present invention relates to LED lamp technical field more particularly to a kind of LED lamps of cold-resistant thermal cycle.
Background technique
LED (light emitting diode) is a kind of solid state semiconductor devices that can convert electrical energy into visible light.LED has The features such as energy-saving and environmental protection, service life long, small in size, can be widely applied to various instructions, display, decoration, backlight, common photograph The fields such as bright and urban landscape.But the sustainable development of current LED industry still faces technological challenge, wherein LED heat dissipation be one urgently Problem to be solved, generally on the aluminium base surface of LED, coating heat radiation coating is a very good solution method, but due to LED For lamp to cooling requirements height, 50% LED light failure is to cause thermal diffusivity to become intolerant to cold cycling because of coating under the condition of high temperature Difference, under the premise of guaranteeing the thermal conductivity effect of coating, how to improve the cold-resistant thermal circulation performance of its surface coating paint is urgently Problem to be solved.
Summary of the invention
Technical problems based on background technology, the invention proposes a kind of the thermally conductive of the cold-resistant thermal cycle of LED backplane Coating, thermally conductive and cold-resistant thermal circulation performance are excellent;The invention also provides a kind of LED lamps of cold-resistant thermal cycle, radiate and resistance to Cold cycling is had excellent performance, long service life.
A kind of heat-conductive coating of the cold-resistant thermal cycle of LED backplane proposed by the present invention, raw material includes: PVDF by weight 40-70 parts of fluorocarbon resin, 25-43 parts of Waterborne Polyurethane Prepolymer, 1-4 parts of liquid nitrile rubber, 0.4-1 parts of epoxidized soybean oil, 1-2 parts of N, N- dimethylethanolamine, 1.2-1.8 parts of dimethyl benzylamine, 40-60 parts of packing strengthening agent, anti-flash rusting agent 0.1-0.5 Part, 0.2-1 parts of dispersing agent, 1-2 parts of defoaming agent, 1-2 parts of levelling agent, 1-2 parts of thickener.
Preferably, packing strengthening agent includes: compound microcrystalline cellulose, talcum powder, gangue, nano-titanium dioxide, phosphoric acid Zinc, mica powder, blanc fixe.
Preferably, compound microcrystalline cellulose, talcum powder, gangue, nano-titanium dioxide, trbasic zinc phosphate, mica powder, precipitated sulfur The weight ratio of sour barium is 20-40:1-6:3-8:1-3:1.2-2:4-10:2-11.
Preferably, compound microcrystalline cellulose is prepared using following technique: microcrystalline cellulose, urea are mixed, ground, stirring Sodium hydroxide is added under state, then heating stirring, nano silica is added and continues to stir, hydrochloric acid is added dropwise under stirring, Continue to stir, filter, washing, vacuum drying obtains compound microcrystalline cellulose.
Preferably, in the preparation process of compound microcrystalline cellulose, milling time 10-16min, grinding pressure 0.8- 1.4MPa, grinding rate 600-800r/min.
Preferably, in the preparation process of compound microcrystalline cellulose, after sodium hydroxide is added, it is warming up to 100-115 DEG C, stirring 4-12min。
Preferably, in the preparation process of compound microcrystalline cellulose, naoh concentration 0.4-0.8mol/L, concentration of hydrochloric acid For 1.2-1.8mol/L.
Preferably, in the preparation process of compound microcrystalline cellulose, microcrystalline cellulose, urea, sodium hydroxide, nanometer titanium dioxide Silicon, hydrochloric acid weight ratio be 30-60:4-12:100-200:4-12:1-5.
A kind of LED backplane of cold-resistant thermal cycle proposed by the present invention, comprising: aluminum alloy base material and be coated in aluminum alloy base material The heat-conductive coating of the cold-resistant thermal cycle of above-mentioned LED backplane on surface.
The LED lamp of a kind of cold-resistant thermal cycle proposed by the present invention, comprising: the LED backplane and envelope of above-mentioned cold-resistant thermal cycle LED chip in the LED backplane of above-mentioned cold-resistant thermal cycle.
The present invention, as film forming matter, cooperates compound microcrystalline cellulose using PVDF fluorocarbon resin, Waterborne Polyurethane Prepolymer Element dispersion wherein, internal forms a large amount of height connections and stable passage of heat, and synergistic effect not only has after solidification There is excellent adhesive strength, and resilience is good after impact resistance, is coated in not easily to fall off, raising indirectly behind aluminum alloy base material surface Thermally conductive and cold-resistant thermal circulation performance of the invention.
In compound microcrystalline cellulose of the invention, microcrystalline cellulose is the cellulose of a kind of purifying, part depolymerization, mainly Ingredient is the straight chain formula polysaccharose substance combined with β-Isosorbide-5-Nitrae-glucoside bond, and the crystalline powder being made of small porous particle leads to It crosses and is fully ground dispersion with urea, it is fully dispersed each other, it is logical since microcrystalline cellulose can dissolve in dilute alkaline soln, moisten and rise Cross for microcrystalline cellulose to be dissolved in sodium hydroxide and be swollen, and urea reacted with sodium hydroxide generate ammonia can promote crystallite The abundant swelling of cellulose, cooperating the micro-structure of addition is nanometer titanium dioxide that is spherical and being in cotton-shaped and netted nanostructure Silicon, huge specific surface area, the more meso-hole structures in surface are adsorbed on the microcrystalline cellulose molecular structure surface being sufficiently swollen, in conjunction with Intensity is high, and the channel of the height connection of formation, on the basis of meeting excellent thermal conductivity, structural stability is high, and cold-hot is handed over For well, compound microcrystalline cellulose and trbasic zinc phosphate is fully dispersed under the assistance of epoxidized soybean oil, is coated in alfer substrate When surface, the phosphate anion in trbasic zinc phosphate is reacted with iron anode, is sufficiently fitted in ferro-aluminum with merging with compound microcrystalline cellulose Alloy substrate surface and as firm protective film, adhesive strength is high, can quickly pass to the heat of LED generation, significantly improve Heating conduction of the invention.
Specific embodiment
In the following, technical solution of the present invention is described in detail by specific embodiment.
Embodiment 1
A kind of heat-conductive coating of the cold-resistant thermal cycle of LED backplane, raw material include: PVDF fluorocarbon resin 40kg, aqueous poly- Urethane performed polymer 43kg, liquid nitrile rubber 1kg, epoxidized soybean oil 1kg, N, N- dimethylethanolamine 1kg, dimethyl benzylamine 1.8kg, packing strengthening agent 40kg, anti-flash rusting agent 0.5kg, dispersing agent 0.2kg, defoaming agent 2kg, levelling agent 1kg, thickener 2kg.
Packing strengthening agent by compound microcrystalline cellulose, talcum powder, gangue, nano-titanium dioxide, trbasic zinc phosphate, mica powder, Blanc fixe is 20:6:3:3:1.2:10:2 composition by weight.Compound microcrystalline cellulose is prepared using following technique: will 60kg microcrystalline cellulose, the mixing of 4kg urea, grind 16min, grinding pressure 0.8MPa, grinding rate 800r/min, stirring It is 0.8mol/L sodium hydroxide that 100kg concentration is added under state, then heats to 100 DEG C, stirs 12min, and 4kg nanometer two is added Silica continues to stir 2min, and it is 1.8mol/L hydrochloric acid that 1kg concentration is added dropwise under stirring, continues to stir 30min, filtering is washed It washs, vacuum drying obtains compound microcrystalline cellulose.
A kind of LED backplane of cold-resistant thermal cycle, comprising: aluminum alloy base material and coated in the above-mentioned of aluminum alloy base material surface The heat-conductive coating of the cold-resistant thermal cycle of LED backplane.
A kind of LED lamp of cold-resistant thermal cycle, comprising: the LED backplane of above-mentioned cold-resistant thermal cycle and be encapsulated in it is above-mentioned cold-resistant LED chip in the LED backplane of thermal cycle.
Embodiment 2
A kind of heat-conductive coating of the cold-resistant thermal cycle of LED backplane, raw material include: PVDF fluorocarbon resin 70kg, aqueous poly- Urethane performed polymer 25kg, liquid nitrile rubber 4kg, epoxidized soybean oil 0.4kg, N, N- dimethylethanolamine 2kg, dimethyl benzylamine 1.2kg, packing strengthening agent 60kg, anti-flash rusting agent 0.1kg, dispersing agent 1kg, defoaming agent 1kg, levelling agent 2kg, thickener 1kg.
Packing strengthening agent by compound microcrystalline cellulose, talcum powder, gangue, nano-titanium dioxide, trbasic zinc phosphate, mica powder, Blanc fixe is 40:1:8:1:2:4:11 composition by weight.Compound microcrystalline cellulose is prepared using following technique: by 30kg Microcrystalline cellulose, the mixing of 12kg urea, grind 10min, grinding pressure 1.4MPa, grinding rate 600r/min, stir shape It is 0.4mol/L sodium hydroxide that 200kg concentration is added under state, then heats to 115 DEG C, stirs 4min, and 12kg nano-silica is added SiClx continues to stir 1min, and it is 1.2mol/L hydrochloric acid that 5kg concentration is added dropwise under stirring, continues to stir 60min, filter, washing, Vacuum drying obtains compound microcrystalline cellulose.
A kind of LED backplane of cold-resistant thermal cycle, comprising: aluminum alloy base material and coated in the above-mentioned of aluminum alloy base material surface The heat-conductive coating of the cold-resistant thermal cycle of LED backplane.
A kind of LED lamp of cold-resistant thermal cycle, comprising: the LED backplane of above-mentioned cold-resistant thermal cycle and be encapsulated in it is above-mentioned cold-resistant LED chip in the LED backplane of thermal cycle.
Embodiment 3
A kind of heat-conductive coating of the cold-resistant thermal cycle of LED backplane, raw material include: PVDF fluorocarbon resin 50kg, aqueous poly- Urethane performed polymer 40kg, liquid nitrile rubber 2kg, epoxidized soybean oil 0.8kg, N, N- dimethylethanolamine 1.2kg, dimethylbenzyl Amine 1.6kg, packing strengthening agent 45kg, anti-flash rusting agent 0.4kg, dispersing agent 0.4kg, defoaming agent 1.7kg, levelling agent 1.4kg are thickened Agent 1.6kg.
Packing strengthening agent by compound microcrystalline cellulose, talcum powder, gangue, nano-titanium dioxide, trbasic zinc phosphate, mica powder, Blanc fixe is 25:4:5:2.5:1.4:8:4 composition by weight.Compound microcrystalline cellulose is prepared using following technique: will 50kg microcrystalline cellulose, the mixing of 6kg urea, grind 14min, grinding pressure 1MPa, grinding rate 750r/min, stir shape It is 0.7mol/L sodium hydroxide that 130kg concentration is added under state, then heats to 105 DEG C, stirs 10min, and 6kg nano-silica is added SiClx continues to stir 1.7min, and it is 1.6mol/L hydrochloric acid that 2kg concentration is added dropwise under stirring, continues to stir 40min, filtering is washed It washs, vacuum drying obtains compound microcrystalline cellulose.
A kind of LED backplane of cold-resistant thermal cycle, comprising: aluminum alloy base material and coated in the above-mentioned of aluminum alloy base material surface The heat-conductive coating of the cold-resistant thermal cycle of LED backplane.
A kind of LED lamp of cold-resistant thermal cycle, comprising: the LED backplane of above-mentioned cold-resistant thermal cycle and be encapsulated in it is above-mentioned cold-resistant LED chip in the LED backplane of thermal cycle.
Embodiment 4
A kind of heat-conductive coating of the cold-resistant thermal cycle of LED backplane, raw material include: PVDF fluorocarbon resin 60kg, aqueous poly- Urethane performed polymer 30kg, liquid nitrile rubber 3kg, epoxidized soybean oil 0.6kg, N, N- dimethylethanolamine 1.8kg, dimethylbenzyl Amine 1.4kg, packing strengthening agent 55kg, anti-flash rusting agent 0.2kg, dispersing agent 0.8kg, defoaming agent 1.3kg, levelling agent 1.8kg are thickened Agent 1.2kg.
Packing strengthening agent by compound microcrystalline cellulose, talcum powder, gangue, nano-titanium dioxide, trbasic zinc phosphate, mica powder, Blanc fixe is 35:2:7:1.5:1.8:6:10 composition by weight.Compound microcrystalline cellulose is prepared using following technique: will 40kg microcrystalline cellulose, the mixing of 10kg urea, grind 12min, grinding pressure 1.2MPa, grinding rate 650r/min are stirred Mixing and 170kg concentration is added under state is 0.5mol/L sodium hydroxide, then heats to 110 DEG C, stirs 6min, is added 10kg nanometers Silica continues to stir 1.3min, and it is 1.4mol/L hydrochloric acid that 4kg concentration is added dropwise under stirring, continues to stir 50min, mistake Filter, washing, vacuum drying obtain compound microcrystalline cellulose.
A kind of LED backplane of cold-resistant thermal cycle, comprising: aluminum alloy base material and coated in the above-mentioned of aluminum alloy base material surface The heat-conductive coating of the cold-resistant thermal cycle of LED backplane.
A kind of LED lamp of cold-resistant thermal cycle, comprising: the LED backplane of above-mentioned cold-resistant thermal cycle and be encapsulated in it is above-mentioned cold-resistant LED chip in the LED backplane of thermal cycle.
Embodiment 5
A kind of heat-conductive coating of the cold-resistant thermal cycle of LED backplane, raw material include: PVDF fluorocarbon resin 55kg, aqueous poly- Urethane performed polymer 35kg, liquid nitrile rubber 2.5kg, epoxidized soybean oil 0.7kg, N, N- dimethylethanolamine 1.5kg, dimethyl Benzylamine 1.5kg, packing strengthening agent 50kg, anti-flash rusting agent 0.3kg, dispersing agent 0.6kg, defoaming agent 1.5kg, levelling agent 1.6kg increase Thick dose of 1.4kg.
Packing strengthening agent by compound microcrystalline cellulose, talcum powder, gangue, nano-titanium dioxide, trbasic zinc phosphate, mica powder, Blanc fixe is 30:3:6:2:1.6:7:7 composition by weight.Compound microcrystalline cellulose is prepared using following technique: will 45kg microcrystalline cellulose, the mixing of 8kg urea, grind 16min, grinding pressure 1.1MPa, grinding rate 700r/min, stirring It is 0.6mol/L sodium hydroxide that 150kg concentration is added under state, then heats to 108 DEG C, stirs 8min, and 8kg nanometer two is added Silica continues to stir 1.5min, and it is 1.5mol/L hydrochloric acid that 6kg concentration is added dropwise under stirring, continues to stir 45min, filter, Washing, vacuum drying obtain compound microcrystalline cellulose.
A kind of LED backplane of cold-resistant thermal cycle, comprising: aluminum alloy base material and coated in the above-mentioned of aluminum alloy base material surface The heat-conductive coating of the cold-resistant thermal cycle of LED backplane.
A kind of LED lamp of cold-resistant thermal cycle, comprising: the LED backplane of above-mentioned cold-resistant thermal cycle and be encapsulated in it is above-mentioned cold-resistant LED chip in the LED backplane of thermal cycle.
5 gained LED backplane of embodiment is detected with the heat-conductive coating of cold-resistant thermal cycle, 1 grade of paint film adhesion, lead Hardness is up to 3H, and for resistance to 220 DEG C of high temperature 6h without obvious xanthochromia, and after testing cold cycling and high temperature, salt spray resistance is still reachable 400h。
The LED backplane of the 5 cold-resistant thermal cycle of gained of embodiment is detected, at 25 DEG C, thermal conductivity is 241-246W/ (m·K);Under same test conditions (experimental enviroment, electrical power, electric current etc.), relative to AZ91 magnesium alloy, junction temperature decline 2.25-2.45 DEG C, 10000h light decay has dropped 2.02-2.14%, and service life extends 20-40%, show good Heat dissipation performance.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto, Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.

Claims (10)

1. a kind of LED backplane heat-conductive coating of cold-resistant thermal cycle, which is characterized in that its raw material includes: PVDF fluorine by weight 40-70 parts of carbon resin, 25-43 parts of Waterborne Polyurethane Prepolymer, 1-4 parts of liquid nitrile rubber, 0.4-1 parts of epoxidized soybean oil, N, 1-2 parts of N- dimethylethanolamine, 1.2-1.8 parts of dimethyl benzylamine, 40-60 parts of packing strengthening agent, 0.1-0.5 parts of anti-flash rusting agent, 0.2-1 parts of dispersing agent, 1-2 parts of defoaming agent, 1-2 parts of levelling agent, 1-2 parts of thickener.
2. the heat-conductive coating of the cold-resistant thermal cycle of LED backplane according to claim 1, which is characterized in that packing strengthening agent packet It includes: compound microcrystalline cellulose, talcum powder, gangue, nano-titanium dioxide, trbasic zinc phosphate, mica powder, blanc fixe.
3. the heat-conductive coating of the cold-resistant thermal cycle of LED backplane according to claim 2, which is characterized in that compound microcrystalline cellulose Element, talcum powder, gangue, nano-titanium dioxide, trbasic zinc phosphate, mica powder, blanc fixe weight ratio be 20-40:1-6:3- 8:1-3:1.2-2:4-10:2-11.
4. the heat-conductive coating of cold-resistant thermal cycle of the LED backplane according to Claims 2 or 3, which is characterized in that compound crystallite is fine Dimension element is prepared using following technique: microcrystalline cellulose, urea being mixed, grinding, sodium hydroxide is added under stirring, then rises Temperature stirring is added nano silica and continues to stir, hydrochloric acid is added dropwise under stirring, continues to stir, filters, washing, and vacuum is dry It is dry to obtain compound microcrystalline cellulose.
5. the heat-conductive coating of the cold-resistant thermal cycle of LED backplane according to claim 4, which is characterized in that compound microcrystalline cellulose In the preparation process of element, milling time 10-16min, grinding pressure 0.8-1.4MPa, grinding rate 600-800r/ min。
6. the LED backplane according to claim 4 or 5 heat-conductive coating of cold-resistant thermal cycle, which is characterized in that compound crystallite is fine In the preparation process for tieing up element, after sodium hydroxide is added, it is warming up to 100-115 DEG C, stirs 4-12min.
7. according to the heat-conductive coating of the cold-resistant thermal cycle of any one of the claim 4-6 LED backplane, which is characterized in that compound In the preparation process of microcrystalline cellulose, naoh concentration 0.4-0.8mol/L, concentration of hydrochloric acid 1.2-1.8mol/L.
8. according to the heat-conductive coating of the cold-resistant thermal cycle of any one of the claim 4-7 LED backplane, which is characterized in that compound In the preparation process of microcrystalline cellulose, microcrystalline cellulose, urea, sodium hydroxide, nano silica, the weight ratio of hydrochloric acid are 30-60:4-12:100-200:4-12:1-5.
9. a kind of LED backplane of cold-resistant thermal cycle characterized by comprising aluminum alloy base material and be coated in aluminum alloy base material table The heat-conductive coating of the cold-resistant thermal cycle of LED backplane as described in claim any one of 1-8 in face.
10. a kind of LED lamp of cold-resistant thermal cycle characterized by comprising the LED of cold-resistant thermal cycle as claimed in claim 9 Backboard and the LED chip being encapsulated in the LED backplane of cold-resistant thermal cycle as claimed in claim 9.
CN201811377080.7A 2018-11-19 2018-11-19 A kind of LED lamp of cold-resistant thermal cycle Pending CN109181425A (en)

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CN108192439A (en) * 2017-12-26 2018-06-22 天长市金陵电子有限责任公司 A kind of high LED light coating of high temperature adhesive strength

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CN108192439A (en) * 2017-12-26 2018-06-22 天长市金陵电子有限责任公司 A kind of high LED light coating of high temperature adhesive strength

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