CN109166844A - A kind of microelectronic core - Google Patents
A kind of microelectronic core Download PDFInfo
- Publication number
- CN109166844A CN109166844A CN201810989195.5A CN201810989195A CN109166844A CN 109166844 A CN109166844 A CN 109166844A CN 201810989195 A CN201810989195 A CN 201810989195A CN 109166844 A CN109166844 A CN 109166844A
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- Prior art keywords
- magnetic
- substrate
- shielding cover
- magnet
- active face
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of microelectronic cores, including tube core main body, the tube core main body is made of active face and substrate, the top of the substrate is arranged in the active face, and the middle position of the active face and substrate is equipped with magnetic shielding cover, the active face and substrate are fixedly connected with the magnetic shielding cover, and the lateral surface of the magnetic shielding cover is filled with packing material, and the inside of the magnetic shielding cover is respectively equipped with the first magnet, the second magnet and third magnet in " one " word arrangement.This kind of microelectronic core, opposite polarity multiple magnetic induction line magnetic fields are generated using muti-piece magnetite, according to the difference of these magnetic field magnetic conductivities, the magnetic induction line of external magnetic disturbance is reflected in cross surface between them, this makes it possible to the magnetic disturbances reduced between die arrangement, with significant practical sexual clorminance, have vast market prospect and application prospect.
Description
Technical field
The present invention relates to die technique field, specially a kind of microelectronic core.
Background technique
So-called tube core refers to that tube core refers to and manufactures chip used in integrated package in integrated circuits, herein above by tens
It is known as integrated circuit to circuit composed by ten hundreds of electronic components to N number of number, and the chip of this integrated component is just
It is the tube core of integrated circuit.
Through retrieving, the patent of Patent No. CN104465568B discloses a kind of stack being embedded in microelectronic substation
Microelectronic core is achieved in that and is attached to the second microelectronic core including at least one the first microelectronic core, wherein
Underfill is provided between second microelectronic core and at least one described first microelectronic core.Then by substrate
The first microelectronic core and the second microelectronic core are laminated in material to form microelectronic substation.
Analysis finds that there are magnetic disturbances in the microelectronic core of arranged adjacent, and simple packing material is for magnetic disturbance
Treatment effect it is limited, there are aspects to be modified.
So how to design a kind of microelectronic core, becoming us will currently be solved the problems, such as.
Summary of the invention
The purpose of the present invention is to provide a kind of microelectronic cores, to solve the problems mentioned in the above background technology.
To achieve the above object, the invention provides the following technical scheme: a kind of microelectronic core, including tube core main body, institute
It states tube core main body to be made of active face and substrate, the top of the substrate, and the active face and lining is arranged in the active face
The middle position at bottom is equipped with magnetic shielding cover, and the active face and substrate are fixedly connected with the magnetic shielding cover, the magnetic screen
The lateral surface of cover is filled with packing material, and the inside of the magnetic shielding cover is respectively equipped with the first magnet in " one " word arrangement, the
Two magnet and third magnet.
Further, the side in the active face and substrate middle position is equipped with fitting in symmetrical, and the interior fitting is embedding
Enter to be arranged in the packing material, and the active face is fixedly connected with substrate by the interior fitting.
Further, the diagonal positions of the active face and substrate lateral surface are equipped with obtuse angle chamfering.
It further, is in homopolarity magnetic pole arranged opposite between first magnet, the second magnet and third magnet.
Further, the side of the magnetic shielding cover is equipped with symmetrical inner bushing ring, and the inner bushing ring insertion is arranged described
In magnetic shielding cover, and fixation is bonded with the magnetic shielding cover.
Further, the packing material includes but is not limited to epoxy resin, benzoic ether, silicone resin, siloxanes and phenol
Formaldehyde-based resin.
Compared with prior art, the beneficial effects of the present invention are: this kind of microelectronic core, relative to existing microelectronic core
It has been embedded in magnetic shielding cover on the basis of active face and substrate, has generated opposite polarity multiple magnetic induction line magnetic using muti-piece magnetite
, according to the difference of these magnetic field magnetic conductivities, the magnetic induction line of external magnetic disturbance is reflected in cross surface between them,
This makes it possible to the magnetic disturbance reduced between die arrangement, there is significant practical sexual clorminance, have vast market prospect and
Application prospect.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention；
Fig. 2 is enlarged partial sectional view of the invention；
Fig. 3 is magnetic shielding cover partial structural diagram of the invention；
In figure: 1- tube core main body；2- packing material；The obtuse angle 3- chamfering；4- active face；5- substrate；Fitting in 6-；7- magnetic cup
Cover cover；The first magnet of 8-；The second magnet of 9-；10- third magnet；11- inner bushing ring.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-3 is please referred to, the present invention provides a kind of technical solution: a kind of microelectronic core, including tube core main body 1, it is described
Tube core main body 1 is made of active face 4 and substrate 5, and the top of the substrate 5, and the active face 4 is arranged in the active face 4
It is equipped with magnetic shielding cover 7 with the middle position of substrate 5, the active face 4 and substrate 5 are fixedly connected with the magnetic shielding cover 7, institute
The lateral surface of magnetic shielding cover 7 is stated filled with packing material 2, the inside of the magnetic shielding cover 7 is respectively equipped in " one " word arrangement
First magnet 8, the second magnet 9 and third magnet 10.
Further, the side in 5 middle position of the active face 4 and substrate is equipped with fitting 6 in symmetrical, the interior fitting
6 insertions are arranged in the packing material 2, and the active face 4 is fixedly connected with substrate 5 by the interior fitting 6.Pass through
The interior fitting 6 being arranged carries out the connection between active face 4 and substrate 5.
Further, the diagonal positions of 5 lateral surface of the active face 4 and substrate are equipped with obtuse angle chamfering 3.The obtuse angle
Chamfering 3 is opposite more smooth with general right angle chamfering, can reduce point that may cause in die package to a certain extent
The stress of layer and fracture defect.
It further, is in homopolarity magnetic pole arranged opposite between first magnet 8, the second magnet 9 and third magnet 10.Institute
State the first magnet 8, the second magnet 9 and third magnet 10 relative to single magnetite magnetic induction line from positive best negative electrode side to single magnetic
, homopolarity magnetic pole arranged opposite forms multiple magnetic fields, right in cross surface between them according to the difference of these magnetic field magnetic conductivities
The magnetic induction line of external magnetic disturbance is reflected, and magnetic shielding cover 7 is made to have magnetic screen condition.
Further, the side of the magnetic shielding cover 7 is equipped with symmetrical inner bushing ring 11, and the insertion of inner bushing ring 11 setting exists
In the magnetic shielding cover 7, and fixation is bonded with the magnetic shielding cover 7.It is conscientious to magnetic shielding cover 7 by the inner bushing ring 11 of setting
It is fixed.
Further, the packing material 2 includes but is not limited to epoxy resin, benzoic ether, silicone resin, siloxanes and phenol
Formaldehyde-based resin.The packing material 2 is for absorbing magnetic disturbance.
Working principle: this kind of microelectronic core includes active face 4, substrate 5 and magnetic shielding cover 7, firstly, source face 4 and lining
The diagonal positions of 5 lateral surface of bottom are equipped with obtuse angle chamfering 3, opposite more smooth, the energy with general right angle chamfering of obtuse angle chamfering 3
The enough stress for reducing the layering that may cause in die package to a certain extent and being broken defect, in active face 4 and substrate 5
Between the lateral surface of position have packing material 2, play the role of absorbing magnetic disturbance, meanwhile, be arranged between active face 4 and substrate 5
Magnetic shielding cover 7, be respectively provided with the first magnet 8, the second magnet 9 and third magnet of homopolarity magnetic pole arranged opposite inside it
10, relative to single magnetite magnetic induction line from positive best negative electrode side to single magnetic field, homopolarity magnetic pole arranged opposite forms multiple magnetic
, according to the difference of these magnetic field magnetic conductivities, the magnetic induction line of external magnetic disturbance is reflected in cross surface between them,
This makes it possible to the magnetic disturbances reduced between die arrangement.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (6)
1. a kind of microelectronic core, including tube core main body (1), it is characterised in that: the tube core main body (1) by active face (4) and
Substrate (5) is constituted, and the active face (4) is arranged at the top of the substrate (5), and in the active face (4) and substrate (5)
Meta position has installed magnetic shielding cover (7), and the active face (4) and substrate (5) are fixedly connected with the magnetic shielding cover (7), described
The lateral surface of magnetic shielding cover (7) is filled with packing material (2), and the inside of the magnetic shielding cover (7) is respectively equipped with arranges in " one " word
The first magnet (8), the second magnet (9) and the third magnet (10) of column.
2. a kind of microelectronic core according to claim 1, it is characterised in that: the active face (4) and substrate (5) are intermediate
The side of position is equipped with fitting (6) in symmetrical, and interior fitting (6) insertion is arranged in the packing material (2), and institute
It states active face (4) and is fixedly connected with substrate (5) by the interior fitting (6).
3. a kind of microelectronic core according to claim 1, it is characterised in that: on the outside of the active face (4) and substrate (5)
The diagonal positions in face are equipped with obtuse angle chamfering (3).
4. a kind of microelectronic core according to claim 1, it is characterised in that: first magnet (8), the second magnet
It (9) is in homopolarity magnetic pole arranged opposite between third magnet (10).
5. a kind of microelectronic core according to claim 1, it is characterised in that: the side of the magnetic shielding cover (7) is equipped with
Symmetrical inner bushing ring (11), inner bushing ring (11) insertion are arranged in the magnetic shielding cover (7), and with the magnetic shielding cover
(7) fitting is fixed.
6. a kind of microelectronic core according to claim 1, it is characterised in that: the packing material (2) includes but unlimited
In epoxy resin, benzoic ether, silicone resin, siloxanes and phenolic group resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810989195.5A CN109166844A (en) | 2018-08-28 | 2018-08-28 | A kind of microelectronic core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810989195.5A CN109166844A (en) | 2018-08-28 | 2018-08-28 | A kind of microelectronic core |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109166844A true CN109166844A (en) | 2019-01-08 |
Family
ID=64893204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810989195.5A Withdrawn CN109166844A (en) | 2018-08-28 | 2018-08-28 | A kind of microelectronic core |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109166844A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1168081A (en) * | 1996-06-10 | 1997-12-17 | 株式会社村田制作所 | Noiseproof electronic elements and devices |
| GB0120278D0 (en) * | 2001-08-20 | 2001-10-17 | Wolfe Richard | Magnetic device |
| CN1729541A (en) * | 2002-12-18 | 2006-02-01 | 皇家飞利浦电子股份有限公司 | Tamper-resistant packaging and approach |
| CN101180685A (en) * | 2005-05-19 | 2008-05-14 | 裴秉根 | Apparatus for shielding harmful radiation and manufacturing method thereof |
| CN101632140A (en) * | 2007-01-03 | 2010-01-20 | 监测仪器有限责任公司 | Have the permanent magnet of improved field quality and the device of this permanent magnet of employing |
| DE102009011921A1 (en) * | 2009-03-10 | 2010-09-16 | Frank Vogelsang | Device for reducing signal noise in an electric component transmitting electric signals, comprises a generator for generating a substantially static magnetic field, where the electric component is arranged in a rigid manner |
| GB2493164A (en) * | 2011-07-26 | 2013-01-30 | Mervyn Stanley Curtis | Apparatus for applying static or varying magnetic fields across electronic equipment |
| CN105858589A (en) * | 2015-02-10 | 2016-08-17 | 英特尔公司 | Microelectronic die having chamfered corners |
-
2018
- 2018-08-28 CN CN201810989195.5A patent/CN109166844A/en not_active Withdrawn
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1168081A (en) * | 1996-06-10 | 1997-12-17 | 株式会社村田制作所 | Noiseproof electronic elements and devices |
| GB0120278D0 (en) * | 2001-08-20 | 2001-10-17 | Wolfe Richard | Magnetic device |
| GB2380309B (en) * | 2001-08-20 | 2005-04-06 | Richard Wolfe | Magnetic device for reduction of electromagnetic interference (EMI) in audio circuitry |
| CN1729541A (en) * | 2002-12-18 | 2006-02-01 | 皇家飞利浦电子股份有限公司 | Tamper-resistant packaging and approach |
| CN101180685A (en) * | 2005-05-19 | 2008-05-14 | 裴秉根 | Apparatus for shielding harmful radiation and manufacturing method thereof |
| CN101632140A (en) * | 2007-01-03 | 2010-01-20 | 监测仪器有限责任公司 | Have the permanent magnet of improved field quality and the device of this permanent magnet of employing |
| DE102009011921A1 (en) * | 2009-03-10 | 2010-09-16 | Frank Vogelsang | Device for reducing signal noise in an electric component transmitting electric signals, comprises a generator for generating a substantially static magnetic field, where the electric component is arranged in a rigid manner |
| GB2493164A (en) * | 2011-07-26 | 2013-01-30 | Mervyn Stanley Curtis | Apparatus for applying static or varying magnetic fields across electronic equipment |
| CN105858589A (en) * | 2015-02-10 | 2016-08-17 | 英特尔公司 | Microelectronic die having chamfered corners |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20190108 |