CN109166717A - Integrated inductance forming method - Google Patents
Integrated inductance forming method Download PDFInfo
- Publication number
- CN109166717A CN109166717A CN201811022929.9A CN201811022929A CN109166717A CN 109166717 A CN109166717 A CN 109166717A CN 201811022929 A CN201811022929 A CN 201811022929A CN 109166717 A CN109166717 A CN 109166717A
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- China
- Prior art keywords
- inductance
- accommodating hole
- pressure
- iron powder
- thermosetting adhesive
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/005—Impregnating or encapsulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/127—Encapsulating or impregnating
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulating Of Coils (AREA)
Abstract
The present invention relates to a kind of integrated inductance forming methods, step 1, coil, SMD pin, the iron powder material for being mixed with thermosetting adhesive and couplant are placed in the die cavity of cold forming mould, preforming cold pressing is carried out with the pressure of 1.8 ~ 2.5T/cm2, coil, which is fixed in iron powder material, is pressed into semi-finished product；Step 2, thermoforming mould are heated to preheating temperature, and preheating temperature is higher than the softening temperature for becoming easy thermosetting adhesive softening, iron powder grain relative displacement；Step 3, semi-finished product are placed on the inductance accommodating hole that thermoforming mould is equipped with, are heated to softening temperature in SMD pin accommodating hole；Step 3, to be placed on inductance accommodating hole, the semi-finished product in SMD pin accommodating hole with heat curable pressure carry out hot pressing, and the heat curing temperature for being warming up to thermosetting adhesive makes thermosetting adhesive solidification and pressure maintaining, completes the molding of integral molding inductance.The integrated inductance forming method briquetting pressure is lower, and coil interlayer insulation is good.
Description
Technical field
The present invention relates to Electronic Components Manufacturing field, especially a kind of integrated inductance forming method.
Background technique
Integral molding inductance (molding inductance) is compared to traditional assembly type inductance, because of its Low ESR, low parasitic capacitance, corpusculum
Product, high current, the characteristics such as excellent temperature-rise current and saturation current are still able to maintain under high frequency and hot environment, are widely used
In in consumer, industrial class, automobile class of electronic devices；Integrated inductance includes pedestal and winding ontology, and the pedestal system will
Die casting forms inside winding ontology embedment iron powder material, and SMD pin is the leading foot direct forming of winding ontology in seat surface；It mentions
The density of iron powder material in high integral molding inductance, the performance of integral molding inductance can be improved by reaching 5.7g/cm2；Traditional
Integrated inductance reheats cured technique after using a cold moudling, due to epoxy resin and magnetism powder mixed process
In, the epoxy resin for being coated on iron powder material completes the solidification of first stage, has certain hardness, there are cold moudling pressure very
High (6 ~ 7t/cm2) causes press costly, and the coil being coated in powder is easily crushed out of shape or is punctured by iron powder material, causes
Therefore the deficiency of coil interlayer defective insulation designs a kind of lower reduction press expense of briquetting pressure, the line being coated in powder
Circle will not be crushed out of shape or be punctured by iron powder material, and the good integrated inductance forming method of coil interlayer insulation becomes urgently
It solves the problems, such as.
Summary of the invention
The purpose of the invention is to overcome current integrated inductance using reheating solidification after a cold moudling
Technique, the epoxy resin due in epoxy resin and magnetism powder mixed process, being coated on magnetic powder processed completes the first stage
Solidification, have certain hardness, there are cold moudling pressure very high (6 ~ 7t/cm2) to cause press costly, is coated on powder
Coil in material is easily crushed out of shape or is punctured by iron powder material, causes the deficiency of coil interlayer defective insulation, provides a kind of molding pressure
The lower reduction press expense of power, the coil being coated in powder will not be crushed out of shape or be punctured by iron powder material, coil interlayer insulation
Good integrated inductance forming method.
The specific technical solution of the present invention is:
A kind of integrated inductance forming method, step 1 by coil, SMD pin, are mixed with thermosetting adhesive and couplant
Iron powder material be placed in the die cavity of cold forming mould, preforming cold pressing is carried out with the pressure of 1.8 ~ 2.5T/cm2, coil is fixed on
Semi-finished product are pressed into iron powder material；Step 2, thermoforming mould are heated to preheating temperature, and preheating temperature, which is higher than, makes thermosetting adhesive
The softening temperature that softening, iron powder grain relative displacement become easy；Step 3, semi-finished product, which are placed on the inductance that thermoforming mould is equipped with, to be held
It sets hole, be heated to softening temperature in SMD pin accommodating hole；Step 3, to being placed on inductance accommodating hole, in SMD pin accommodating hole
Semi-finished product hot pressing is carried out with heat curable pressure, and the heat curing temperature for being warming up to thermosetting adhesive consolidates thermosetting adhesive
Change and pressure maintaining, completion integral molding inductance form.
The integrated inductance forming method, the lower reduction press expense of briquetting pressure, the line being coated in powder
Circle will not be crushed out of shape or be punctured by iron powder material, and coil interlayer insulation is good；Preforming cold pressing is first carried out with smaller pressure, then
Semi-finished product are placed on the inductance accommodating hole of thermoforming mould, are heated to softening temperature in SMD pin accommodating hole, then with heat cure
Pressure carries out hot pressing, and the heat curing temperature for being warming up to thermosetting adhesive makes thermosetting adhesive solidification and pressure maintaining, completes one
The molding of body formula moulding inductor；Heat curable pressure uses the cold pressing of a cold pressing forming process much smaller than traditional integrated inductance
Briquetting pressure；The lower reduction press expense of the integrated inductance forming method briquetting pressure, the line being coated in powder
Circle will not be crushed out of shape or be punctured by iron powder material, and coil interlayer insulation is good；Thermoforming mould is heated to preheating temperature, is conducive to shorten
The heating and softening time and hot-press solidifying time of thermosetting adhesive in semi-finished product improve production efficiency；Couplant can exclude sky
Gas keeps iron powder material cladding coil contact good.
Preferably, the thermosetting adhesive is phenolic resin；Iron powder material, phenolic resin, couplant weight match
Than are as follows: iron powder material 100: phenolic resin 3 ~ 5: couplant 0.1 ~ 0.3.Phenolic resin performance is stablized easy to use；Iron powder material, phenolic aldehyde
The weight proportion of resin, couplant are as follows: iron powder material 100: phenolic resin 3 ~ 5: couplant 0.1 ~ 0.3 is conducive to further shorten half
The heating and softening time and hot-press solidifying time of thermosetting adhesive in finished product, improve integral molding inductance in iron powder material it is close
Degree, and then improve the performance of integral molding inductance.
Preferably, the preheating temperature is 160 ~ 180 DEG C；Softening temperature be 130 ~ 150 DEG C, softening the time be 30 ~
60s；Heat curing temperature is 155 DEG C ~ 180 DEG C, and heat curable pressure is 2 ~ 3.5T/cm2,50 ~ 120 s of dwell time.Soften the time
Short and heat cure works well with the hot-press solidifying time.
Preferably, the thermoforming mould includes: the lower die equipped with hold-down devices, heating device and temperature controller, it is equipped with
The upper mold of upper pressure device；Hold-down devices include: lower platen, several push component；Pushing component includes: set on lower die lower end
Post holes is pushed, set on lower die upper end and lower end and the inductance accommodating hole for pushing post holes and be connected to, two are corresponded set on inductance appearance
The SMD pin accommodating hole for setting hole opposite sides end is arranged in the lower compression leg pushed in post holes, and lower end is connect with lower compression leg upper end
Push-down head；Inductance accommodating hole lower end is protruded into the upper end of push-down head；The lower end of lower compression leg is connect with lower platen；Upper pressure device includes:
Top board, number is identical as number of components is pushed and above presses component correspondingly；Upper pressure component include: set on upper mold upper end and
With the seaming chuck hole of upper mold lower end perforation, in seaming chuck hole and the seaming chuck of seaming chuck hole upper end is stretched out in upper end；Seaming chuck
Upper end connect with top board.The thermoforming mould by be set to lower die in heating devices heat and temperature controller temperature control,
The top board that the lower platen that connect with the driving device of press pushes push-down head to move upwards, connect with the driving device of press pushes away
Dynamic seaming chuck moves downward, and carries out hot pressing to the semi-finished product being placed in inductance accommodating hole, is able to satisfy integrated inductance molding
The needs of method hot-press solidifying, and hot-press solidifying efficiency is higher.
Preferably, the distance between the pin accommodating hole lower end SMD and inductance accommodating hole side are greater than SMD pin
The distance between accommodating hole upper end and inductance accommodating hole side.Conducive to SMD pin, bending forming is improved while carrying out hot pressing
Production efficiency.
Compared with prior art, the beneficial effects of the present invention are: the integrated inductance forming method briquetting pressure
Lower reduction press expense, the coil being coated in powder will not be crushed out of shape or be punctured by iron powder material, and coil interlayer insulation is good
It is good；Thermoforming mould is heated to preheating temperature, and conducive to shortening, the heating and softening time of thermosetting adhesive and hot pressing in semi-finished product are solid
Change the time, improves production efficiency；Couplant, which can exclude air, keeps iron powder material cladding coil contact good.Phenolic resin performance is stablized
It is easy to use；Iron powder material, phenolic resin, couplant weight proportion are as follows: iron powder material 100: phenolic resin 3 ~ 5: couplant 0.1 ~
0.3, conducive to the further heating and softening time and hot-press solidifying time for shortening thermosetting adhesive in semi-finished product, improve integral type
The density of iron powder material in moulding inductor, and then improve the performance of integral molding inductance.Preheating temperature is 160 ~ 180 DEG C；Softening
Temperature is 130 ~ 150 DEG C, and the softening time is 30 ~ 60s；Heat curing temperature is 155 DEG C ~ 180 DEG C, and heat curable pressure is 2 ~ 3.5T/
Cm2,50 ~ 120 s of dwell time.Soften the time and the hot-press solidifying time is short and heat cure works well.The thermoforming mould
By the heating devices heat that is set in lower die and temperature controller temperature control, under the promotion of the lower platen that is connect with the driving device of press
The top board that pressure head moves upwards, connect with the driving device of press pushes seaming chuck to move downward, to being placed in inductance accommodating
Semi-finished product in hole carry out hot pressing, are able to satisfy the needs of integrated inductance forming method hot-press solidifying, and hot-press solidifying efficiency
It is higher.The distance between the pin accommodating hole lower end SMD and inductance accommodating hole side are greater than SMD pin accommodating hole upper end and inductance holds
The distance between hole side is set, is conducive to SMD pin bending forming while carrying out hot pressing and improves production efficiency.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of thermoforming mould lower die of the present invention;
Fig. 2 is the structural schematic diagram of lower die.
In figure: heating device 1, lower die 3, upper mold 4, lower platen 5, pushes post holes 6, inductance accommodating hole 7, SMD at temperature controller 2
Pin accommodating hole 8, lower compression leg 9, push-down head 10, top board 11, seaming chuck hole 12, seaming chuck 13, SMD pin 14, semi-finished product 15.
Specific embodiment
The present invention is described further shown in reference to the accompanying drawing.
A kind of integrated inductance forming method, step 1, by coil, SMD pin 14, be mixed with thermosetting adhesive and
The iron powder material of couplant is placed in the die cavity of cold forming mould, carries out preforming cold pressing, coil with the pressure of 1.8 ~ 2.5T/cm2
It is fixed in iron powder material and is pressed into semi-finished product 15；Step 2, thermoforming mould are heated to preheating temperature, and preheating temperature, which is higher than, makes thermosetting
Property binder softening, the softening temperature that becomes easy of iron powder grain relative displacement；Step 3, semi-finished product are placed on thermoforming mould and are equipped with
Inductance accommodating hole 7, be heated to softening temperature in SMD pin accommodating hole 8；Step 3, to be placed on inductance accommodating hole, SMD draws
Semi-finished product in foot accommodating hole carry out hot pressing with heat curable pressure, and the heat curing temperature for being warming up to thermosetting adhesive makes thermosetting
Property binder solidification and pressure maintaining, complete integral molding inductance molding.
The thermosetting adhesive is phenolic resin；Iron powder material, phenolic resin, couplant weight proportion are as follows: iron powder
Material 100: phenolic resin 4: couplant 0.2.
The preheating temperature is 170 DEG C；Softening temperature is 145 DEG C, and the softening time is 50s；Heat curing temperature is 170
DEG C, heat curable pressure 3T/cm2, dwell time 100s.
As attached drawing 1, attached drawing 2 show: the thermoforming mould includes: equipped with hold-down devices, heating device 1 and temperature controller 2
Lower die 3, the upper mold 4 equipped with upper pressure device；Hold-down devices include: 5,21 pushing components of lower platen；Pushing component includes:
Pushing post holes 6 set on lower die lower end, set on lower die upper end and lower end and the inductance accommodating hole 7 that pushes post holes and be connected to, two one
One is correspondingly arranged at the SMD pin accommodating hole 8 at inductance accommodating hole opposite sides end, is arranged in the lower compression leg 9 pushed in post holes, lower end
The push-down head 10 of connection is integrally formed with lower compression leg upper end；Inductance accommodating hole lower end is protruded into the upper end of push-down head；Under lower compression leg
End is connect with lower platen；Upper pressure device includes: top board 11, and number is identical as number of components is pushed and goes up pressure group correspondingly
Part；It is upper pressure component include: set on upper mold upper end and with upper mold lower end perforation seaming chuck hole 12, be set to seaming chuck hole in and upper end
Stretch out the seaming chuck 13 of seaming chuck hole upper end；The upper end of seaming chuck is connect with top board.21 pushing components are arranged at three rows
Column.
The distance between described the pin accommodating hole lower end SMD and inductance accommodating hole side are greater than on SMD pin accommodating hole
The distance between end and inductance accommodating hole side.
The beneficial effects of the present invention are: the lower reduction press of integrated inductance forming method briquetting pressure takes
With the coil being coated in powder will not be crushed out of shape or be punctured by iron powder material, and coil interlayer insulation is good；Thermoforming mould heating
Production is improved to preheating temperature conducive to the heating and softening time and hot-press solidifying time for shortening thermosetting adhesive in semi-finished product
Efficiency；Couplant, which can exclude air, keeps iron powder material cladding coil contact good.Phenolic resin performance is stablized easy to use；Iron powder
Material, phenolic resin, couplant weight proportion are as follows: iron powder material 100: phenolic resin 3 ~ 5: couplant 0.1 ~ 0.3 is conducive to further
Shorten the heating and softening time and hot-press solidifying time of thermosetting adhesive in semi-finished product, improves iron powder in integral molding inductance
The density of material, and then improve the performance of integral molding inductance.Preheating temperature is 160 ~ 180 DEG C；Softening temperature is 130 ~ 150
DEG C, the softening time is 30 ~ 60s；Heat curing temperature is 155 DEG C ~ 180 DEG C, and heat curable pressure is 2 ~ 3.5T/cm2, dwell time 50
~120 s.Soften the time and the hot-press solidifying time is short and heat cure works well.The thermoforming mould is by being set in lower die
Heating devices heat and temperature controller temperature control, the lower platen that is connect with the driving device of press push push-down head to move upwards,
The top board that connect with the driving device of press pushes seaming chuck to move downward, to the semi-finished product being placed in inductance accommodating hole into
Row hot pressing is able to satisfy the needs of integrated inductance forming method hot-press solidifying, and hot-press solidifying efficiency is higher.SMD pin holds
The distance between hole lower end and inductance accommodating hole side is set to be greater than between SMD pin accommodating hole upper end and inductance accommodating hole side
Distance is conducive to SMD pin bending forming while carrying out hot pressing and improves production efficiency.
In addition to the implementation, within the scope of the claims of the present invention and the specification, skill of the invention
Art feature or technical data can be reselected and be combined, to constitute new embodiment, these are all art technologies
Personnel are without carrying out what creative work can be realized, therefore the embodiment that these present invention are not described in also should be regarded as this
The specific embodiment of invention and within protection scope of the present invention.
Claims (5)
1. a kind of integrated inductance forming method, characterized in that step 1 by coil, SMD pin, is mixed with thermosetting property and glues
The iron powder material of knot agent and couplant is placed in the die cavity of cold forming mould, is carried out with the pressure of 1.8 ~ 2.5T/cm2 preforming cold
Pressure, coil, which is fixed in iron powder material, is pressed into semi-finished product；Step 2, thermoforming mould are heated to preheating temperature, and preheating temperature is higher than
The softening temperature for becoming easy thermosetting adhesive softening, iron powder grain relative displacement；Step 3, semi-finished product are placed on thermoforming
Softening temperature is heated in inductance accommodating hole that mould is equipped with, SMD pin accommodating hole；Step 3, to be placed on inductance accommodating hole,
Semi-finished product in SMD pin accommodating hole carry out hot pressing with heat curable pressure, and are warming up to the heat curing temperature of thermosetting adhesive
Make thermosetting adhesive solidification and pressure maintaining, completes the molding of integral molding inductance.
2. integrated inductance forming method according to claim 1, characterized in that the thermosetting adhesive is phenol
Urea formaldehyde；Iron powder material, phenolic resin, couplant weight proportion are as follows: iron powder material 100: phenolic resin 3 ~ 5: couplant 0.1 ~
0.3。
3. integrated inductance forming method according to claim 2, characterized in that the preheating temperature be 160 ~
180℃；Softening temperature is 130 ~ 150 DEG C, and the softening time is 30 ~ 60s；Heat curing temperature is 155 DEG C ~ 180 DEG C, heat curable pressure
For 2 ~ 3.5T/cm2,50 ~ 120 s of dwell time.
4. integrated inductance forming method according to claim 1 or 2 or 3, characterized in that the thermoforming mould packet
It includes: the lower die equipped with hold-down devices, heating device and temperature controller, the upper mold equipped with upper pressure device；Hold-down devices include: to push
Plate, several push component；Pushing component includes: the pushing post holes set on lower die lower end, is set to lower die upper end and lower end is under
The inductance accommodating hole of compression leg hole connection, two correspond the SMD pin accommodating hole for being set to inductance accommodating hole opposite sides end, wear
Set on the lower compression leg pushed in post holes, the push-down head that lower end is connect with lower compression leg upper end；Inductance accommodating is protruded into the upper end of push-down head
Hole lower end；The lower end of lower compression leg is connect with lower platen；Upper pressure device includes: top board, number it is identical as number of components is pushed and
One-to-one upper pressure component；Upper pressure component includes: the seaming chuck hole set on upper mold upper end and with the perforation of upper mold lower end, is set to upper
The seaming chuck of in pressure head hole and upper end stretching seaming chuck hole upper end；The upper end of seaming chuck is connect with top board.
5. integrated inductance forming method according to claim 4, characterized in that under the SMD pin accommodating hole
The distance between end and inductance accommodating hole side are greater than the distance between SMD pin accommodating hole upper end and inductance accommodating hole side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811022929.9A CN109166717B (en) | 2018-09-03 | 2018-09-03 | Integrally-formed inductor forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811022929.9A CN109166717B (en) | 2018-09-03 | 2018-09-03 | Integrally-formed inductor forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109166717A true CN109166717A (en) | 2019-01-08 |
| CN109166717B CN109166717B (en) | 2020-03-20 |
Family
ID=64893953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811022929.9A Active CN109166717B (en) | 2018-09-03 | 2018-09-03 | Integrally-formed inductor forming method |
Country Status (1)
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| CN (1) | CN109166717B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110391079A (en) * | 2018-04-20 | 2019-10-29 | 许栋樑 | Manufacturing device and manufacturing method of molded inductance element and application thereof |
| CN114023548A (en) * | 2021-11-01 | 2022-02-08 | 横店集团东磁股份有限公司 | Inductive magnetic element manufacturing method and inductive magnetic element |
| CN114400139A (en) * | 2022-01-19 | 2022-04-26 | 山东恒瑞磁电科技有限公司 | Integrally-formed inductor bending method |
| CN114628136A (en) * | 2022-03-22 | 2022-06-14 | 横店集团东磁股份有限公司 | Inductor forming die |
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| CN110391079A (en) * | 2018-04-20 | 2019-10-29 | 许栋樑 | Manufacturing device and manufacturing method of molded inductance element and application thereof |
| CN114023548A (en) * | 2021-11-01 | 2022-02-08 | 横店集团东磁股份有限公司 | Inductive magnetic element manufacturing method and inductive magnetic element |
| CN114400139A (en) * | 2022-01-19 | 2022-04-26 | 山东恒瑞磁电科技有限公司 | Integrally-formed inductor bending method |
| CN114628136A (en) * | 2022-03-22 | 2022-06-14 | 横店集团东磁股份有限公司 | Inductor forming die |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109166717B (en) | 2020-03-20 |
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