CN109164850A - Based on it is passive can variable resistance temprature control method - Google Patents
Based on it is passive can variable resistance temprature control method Download PDFInfo
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- CN109164850A CN109164850A CN201811047344.2A CN201811047344A CN109164850A CN 109164850 A CN109164850 A CN 109164850A CN 201811047344 A CN201811047344 A CN 201811047344A CN 109164850 A CN109164850 A CN 109164850A
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- temperature
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
- G05D23/303—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature using a sensing element having a resistance varying with temperature, e.g. thermistor
- G05D23/306—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature using a sensing element having a resistance varying with temperature, e.g. thermistor using semiconductor devices
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- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Control Of Temperature (AREA)
Abstract
The present invention provide it is a kind of based on it is passive can variable resistance temprature control method, its technical solution is, the heating actuator of temperature control device and setting between actuator and temperature control object of freezing realize it is passive can variable resistance semiconductor temperature difference module, according to the temperature signal collected, change hot-fluid by adjusting thermal resistance, realizes temperature control.The present invention promotes response speed without energy consumption, no intermediate regulations link, can improve temperature-controlled precision by variable resistance, such as the two-way active temperature control that conjunction with semiconductors is freezed, can be rapidly reached thermal balance, realize high accuracy temperature control.The present invention is flexible and convenient, at low cost, effectively promotion accuracy of temperature control, can be widely used in the high accuracy temperature control in different temperatures region.
Description
Technical field
The present invention relates to it is a kind of based on it is passive can variable resistance temprature control method, it is especially a kind of to be based on semiconductor temperature difference
Module passive can variable resistance temprature control method.
Background technique
Temperature is most important controlled parameter, and high-precision temperature control, which has, is extremely widely applied demand and prospect.
Temperature control system contains pure lag system, and heating/refrigerating actuator has certain inertia, and the inhomogeneities and heat of controlled device are used
Property and load variations and external interference, this all easily causes system overshoot and oscillation and the variation of system parameter, it is this with
The variation that machine generates and can not accurately expect, undoubtedly increases the difficulty of high accuracy temperature control realization.
Thermal resistance (Thermal Resistance) reflection prevents the synthesis parameter of the ability of heat transfer.Reduction can be passed through
Thermal resistance is to reinforce conducting heat；By increasing thermal resistance to inhibit the transmitting of heat.
Existing patent (CN201711169864, temperature regulating device and temperature control method) proposes a kind of to be related to the temperature regulating device of thermal resistance
And method.At least there is following technological deficiency: adjusting thermal resistance and be not used to real-time temperature control, realizes setting temperature just with thermal resistance
Thermal resistance is adjusted the different temperature condition for being applied to refrigerator by the initial temperature state of the refrigerator of degree, and temperature control relies in real time
The fine tuning of heater is completed；The absolute temperature state of the temperature fluctuation of refrigeration machine itself is only accounted in specific temperature control route, not
Consider to influence thermal inertia, inertia and the rate of temperature change of temperature-controlled precision and the necessary factor of variation tendency；Intermediate thermal resistor is adopted
With mechanical and hot fluid two ways, controllability and responding ability are very poor, are not able to satisfy the technical requirements of real-time temperature control, without
It can not be designed to be used as real time temperature control；Certain power supply is needed, consuming energy generates additional interference source；It answers
With and be confined to low temperature field.
Semiconductor heat power technology is based on reversible physical effect (peltier effect and Seebeck effect), it can be achieved that the temperature difference is sent out
Electricity or electric drive realize refrigeration and heating.
Summary of the invention
Present invention aim to address the defects of the prior art, provide a kind of for the high-precision temperature control of different temperatures region
System based on semiconductor temperature difference module it is passive can variable resistance temprature control method.
Semiconductor temperature difference module of the present invention carry out can variable resistance technical principle be based on semiconductor heat electrical effect,
In left side view as shown in Figure 1, the both ends of the surface heat source temperature of semicondcutor thermoelements is respectively TAAnd TB, hot-fluid Q, and even
Meet load RL, it is based on Seebeck effect, the temperature difference (TA-TB) semicondcutor thermoelements is caused to produce electricl energy, it can be equivalent on the right side of Fig. 1
Internal resistance is RiPower supply with load RLCircuit, be based on peltier effect, the electric current in circuit leads to semicondcutor thermoelements two again
End face, which generates, inhales heat release, inhales heat release stream size by load RLInfluence, be superimposed with original hot-fluid Q, and influence the temperature difference (TA-TB) big
It is small, according to the knowledge (hot-fluid=temperature difference/heat hinders) of thermal conduction study, adjust RLThe thermal resistance of changeable semicondcutor thermoelements.
To realize goal of the invention, be based on above-mentioned technical principle, the technical scheme is that it is a kind of based on it is passive can heating
Semiconductor temperature difference is arranged between the heating actuator and refrigeration actuator and temperature control object of temperature control device in the temprature control method of resistance
Module, the semiconductor temperature difference module concatenate variable resistance, the variable resistance connect the controller of the temperature control device and by
The control of the controller, temperature sensor acquire the temperature and the heating actuator and refrigeration of the temperature control object in real time
The temperature of actuator, the temperature control device are calculated according to the Current Temperatures of the temperature control object collected using dibit, PID
The existing temperature control algorithm such as method and fuzzy algorithmic approach carries out temperature control, when the set temperature of the temperature control object and working as temperature control object
When preceding temperature difference is greater than given threshold, the resistance value for adjusting the variable resistance is zero, i.e., the short-circuit semiconductor temperature difference module,
The thermal resistance of the semiconductor temperature difference module is minimum at this time, when the Current Temperatures of the controlled device and the setting of the controlled device
When temperature difference is less than given threshold, the controller is according to the heating actuator collected and the temperature of refrigeration actuator
Degree calculates the corresponding change of thermal resistance based on certain thermal resistance control algolithm, and output thermal resistance controls signal, drive and adjust it is described can
Become resistance and then change the thermal resistance of the semiconductor temperature difference module, changes the heating actuator and refrigeration actuator to institute
The hot-fluid of temperature control object is stated, realizes temperature control.
The given threshold is calculated by the controller, it is contemplated that the temperature of the temperature control object and it is described plus
The temperature of thermal actuator and refrigeration actuator, while considering the rate of temperature change of system thermal inertia and inertia and controlled device
With the factors such as temperature changing trend.
The thermal resistance control algolithm is realized by the controller, it is contemplated that the temperature of the temperature control object and it is described plus
The temperature of thermal actuator and refrigeration actuator, while considering the rate of temperature change of system thermal inertia and inertia and controlled device
With the factors such as temperature changing trend.
The semiconductor temperature difference module can be using the series connection of semiconductor refrigerating component and obtained variation combination in parallel.
The semiconductor temperature difference module can select the material of different figure of merit Z values, and change p-type and N-type element
The geometric dimensions such as brachium, sectional area are customized.
The beneficial effects of the invention are as follows inventions due to taking above technical scheme, has the advantage that without energy consumption, surveys
It is unrelated with power supply stability to measure accuracy, not to the measured interference taken or released energy, reduce to temperature field；Using partly leading
Body heat electrical effect changes thermal resistance by resistance, can directly design interlock circuit changes in resistance or even thermal resistance carries out temperature control,
It is easy to circuit and modularization, no intermediate regulations link directly controls, and promote response speed；By the way that dynamic threshold, threshold is arranged
The big temperature difference utilizes the quick temperature control of heating/refrigerating actuator on value, and the small temperature difference utilizes the fine temperature control of thermal resistance under threshold value, can be fast
Speed approaches set temperature, and effectively reduces temperature fluctuation and the inertia of heating/refrigerating generation, and control can be also improved by variable resistance
Warm precision；In conjunction with thermal resistance control algolithm, it is contemplated that the rate of temperature change of the factors such as system thermal inertia and inertia and controlled device
And temperature changing trend, thermal inertia and inertia effects can be substantially reduced, and can precondition according to trend, improve temperature-controlled precision；Such as
The two-way active temperature control of conjunction with semiconductors refrigeration can be rapidly reached thermal balance, and high sensitivity, response is fast, is easy to thermal balance, energy
Realize high accuracy temperature control.The present invention is flexible and convenient, at low cost, effectively promotion accuracy of temperature control, can be widely used in difference
The high accuracy temperature control of temperature region.
Detailed description of the invention
Fig. 1 is variable resistance schematic illustration of the invention.
Fig. 2 is system principle schematic diagram of the invention.
Fig. 3 is temperature control flow figure of the invention.
In figure: 1- temperature control device, 2- heat actuator and the actuator that freezes, 3- semiconductor temperature difference module, 4- variable resistance,
5- controller, 6- temperature sensor, 7- temperature control object, 8- power supply.
Specific embodiment
In order to be more clear the objectives, technical solutions, and advantages of the present invention, with reference to the accompanying drawings and embodiments, to this hair
It is bright to be further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and do not have to
It is of the invention in limiting.
For realize goal of the invention, based on semiconductor temperature difference module carry out can variable resistance technical principle, the present invention provide one
Kind based on it is passive can variable resistance temprature control method, be illustrated in figure 2 using semiconductor refrigerating/heating temperature control device 1, temperature
The heating actuator and refrigeration actuator 2 for controlling device 1 are to be realized by semiconductor refrigerating module, and driven by power supply 8, pass through control
Device 5 controls the current direction of power supply 8 and size facilitates the two-way active temperature control of realization, further, in heating actuator and refrigeration
It is provided with the adjustable thermal resistance module that semiconductor temperature difference module 3 is realized between actuator 2 and temperature control object 7, considers economy and conveniently
It obtains, semiconductor temperature difference module 3 is formed by stacking using commercially available semiconductor chilling plate (TEC1-12704) two panels, can also select height
The material of figure of merit Z value, and change the geometric dimensions such as the brachium of p-type and N-type element, sectional area and optimize customization, performance
More preferably.Meanwhile semiconductor temperature difference module 3 concatenates variable resistance 4 by driving and output circuit, variable resistance 4 connects temperature control dress
Control of the controller 5 and resistance value set by controller 5, the temperature and heating of the real-time acquisition temperature control object 7 of temperature sensor 6
Temperature between actuator and refrigeration actuator 2 and 3 surface of semiconductor temperature difference module, the controller 5 of temperature control device 1 embed PID calculation
Method carries out PID temperature control, when the set temperature and temperature control of temperature control object 7 according to the Current Temperatures of the temperature control object 7 collected
When the Current Temperatures difference of object 7 is greater than given threshold, the resistance value for adjusting variable resistance 4 is zero, i.e., short-circuit semiconductor temperature difference mould
Block 3, the thermal resistance of semiconductor temperature difference module 3 is minimum at this time, when the Current Temperatures of controlled device 7 and the set temperature of controlled device 7
When difference is less than given threshold, controller 5 is based on one according to the temperature of the heating actuator collected and the actuator 2 that freezes
Fixed thermal resistance control algolithm calculates the corresponding change of thermal resistance, and output thermal resistance controls signal, drives and adjust the resistance value of variable resistance 4
And then change the thermal resistance of semiconductor temperature difference module 3, and change heating actuator and hot-fluid of the actuator 2 to temperature control object 7 that freeze, it is real
Existing temperature control, representative temperature control flow are as shown in Figure 3.
Further, given threshold is calculated by controller 5, it is contemplated that the temperature of temperature control object 7 and heating are held
The temperature of row device and refrigeration actuator 2, at the same consider system thermal inertia and inertia and controlled device 7 rate of temperature change and
The factors such as temperature changing trend.It is set as the temperature difference of the set temperature and Current Temperatures when temperature control object 7 in the present embodiment
Value is equal to 0.5 DEG C, while the rate of temperature change of the Current Temperatures of temperature control object 7 is equal to 3 DEG C/min.
Further, thermal resistance control algolithm is realized by controller 5, it is contemplated that the temperature of temperature control object 7 and heating are held
The temperature of row device and refrigeration actuator 2, at the same consider system thermal inertia and inertia and controlled device 7 rate of temperature change and
The factors such as temperature changing trend.Temperature drift caused by above-mentioned factor is mainly prevented and offsets, practice obtains, and inertia is bigger,
More early at the time of needing to intervene, the variation for controlling thermal resistance is also stronger, corrects and approaches repeatedly, to achieve the purpose that temperature control.
Using the temperature control device of above-described embodiment, the pure water that controlled device is 1 liter, set temperature is 35 DEG C, does not install half
Conductor temperature difference module 3 as can variable resistance temperature control device 1, merely with PID temperature control precision be ± 0.5 DEG C, install semiconductor
Temperature difference module 3 as can variable resistance but the temperature control device 1 that does not work, the precision merely with PID temperature control is ± 0.1 DEG C, and is installed
Semiconductor temperature difference module 3 as can variable resistance temperature control temperature control device 1, using temperature control flow as shown in Figure 3, in conjunction with PID
The precision of temperature control is ± 0.01 DEG C, compares to obtain, temperature-controlled precision improves an order of magnitude.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (5)
1. it is a kind of based on it is passive can variable resistance temprature control method, which is characterized in that in the heating actuator of temperature control device (1)
Semiconductor temperature difference module (3) are set between refrigeration actuator (2) and temperature control object (7), semiconductor temperature difference module (3) concatenation
Variable resistance (4), the variable resistance (4) connect the controller (5) of the temperature control device (1) and by the controllers (5)
Control, temperature sensor (6) acquire in real time the temperature control object (7) temperature and the heating actuator and freeze actuator
(2) temperature, the Current Temperatures for the temperature control object (7) that temperature control device (1) basis collects, using existing temperature
Control algolithm carries out temperature control, sets when the set temperature of the temperature control object (7) is greater than with the Current Temperatures difference of temperature control object (7)
When determining threshold value, the resistance value for adjusting the variable resistance (4) is zero, and the thermal resistance of the semiconductor temperature difference module (3) is minimum at this time, when
When the Current Temperatures of the controlled device (7) and the set temperature difference of the controlled device (7) are less than given threshold, the control
Device (5) processed is controlled based on certain thermal resistance and is calculated according to the heating actuator collected and the temperature of refrigeration actuator (2)
Method calculates the corresponding change of thermal resistance, and output thermal resistance controls signal, drives and adjusts the variable resistance (4) resistance value and then change institute
The thermal resistance of semiconductor temperature difference module (3) is stated, changes the heating actuator and refrigeration actuator (2) to the temperature control object (7)
Hot-fluid, realize temperature control.
2. according to claim 1 based on it is passive can variable resistance temprature control method, which is characterized in that the given threshold
It is calculated by the controller (5), it is contemplated that the temperature of the temperature control object (7) and the heating actuator and refrigeration
The temperature of actuator (2), while considering rate of temperature change and the temperature change of system thermal inertia and inertia and controlled device (7)
Change trend.
3. according to claim 1 based on it is passive can variable resistance temprature control method, which is characterized in that thermal resistance control
Algorithm is realized by the controller (5), it is contemplated that the temperature of the temperature control object (7) and the heating actuator and refrigeration
The temperature of actuator (2), while considering rate of temperature change and the temperature change of system thermal inertia and inertia and controlled device (7)
Change trend.
4. according to claim 1 based on it is passive can variable resistance temprature control method, which is characterized in that the semiconductor temperature
Difference module (3) is using the series connection of semiconductor refrigerating component and obtained variation combination in parallel.
5. according to claim 1 based on it is passive can variable resistance temprature control method, which is characterized in that the semiconductor temperature
Difference module (3) selects the material of different figure of merit Z values, and changes the geometry such as the brachium of p-type element and N-type element, sectional area
Size is customized.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811047344.2A CN109164850B (en) | 2018-09-09 | 2018-09-09 | Temperature control method based on passive variable thermal resistance |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811047344.2A CN109164850B (en) | 2018-09-09 | 2018-09-09 | Temperature control method based on passive variable thermal resistance |
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| CN109164850B CN109164850B (en) | 2020-10-23 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109460089A (en) * | 2019-01-23 | 2019-03-12 | 青岛大学 | Based on it is passive can variable resistance temprature control method |
| CN109582064A (en) * | 2019-01-23 | 2019-04-05 | 青岛大学 | Passive variable resistance temperature controls dibit adjusting method |
| CN109582065A (en) * | 2019-01-23 | 2019-04-05 | 青岛大学 | Temprature control method based on thermoelectric effect |
| CN109597447A (en) * | 2019-01-23 | 2019-04-09 | 青岛大学 | Passive variable resistance temperature controls dibit adjusting method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2612912Y (en) * | 2003-05-07 | 2004-04-21 | 武汉凌云光电科技有限责任公司 | High power compact thermostatic device without liquid cooling |
| CN2919141Y (en) * | 2006-03-03 | 2007-07-04 | 浙江工业大学 | Temperature regulating device based on semiconductor refrigeration technology and thermal superconduction technology |
| CN201156987Y (en) * | 2007-12-06 | 2008-12-03 | 郭世勇 | Semiconductor isothermic garments |
| CN203262339U (en) * | 2013-04-16 | 2013-11-06 | 上海理工大学 | Temperature difference power generation warming glove |
| CN103393237A (en) * | 2013-08-19 | 2013-11-20 | 青岛大学 | Thermoregulation garment |
| CN107421980A (en) * | 2017-02-04 | 2017-12-01 | 青岛大学 | Heating impedance compensation type thermo-resistance measurement method |
| US20180053669A1 (en) * | 2016-08-17 | 2018-02-22 | Kelk Ltd. | Temperature Controller of Semiconductor Wafer and Temperature Control Method of Semiconductor Wafer |
| CN207396602U (en) * | 2017-10-24 | 2018-05-22 | 河北科技大学 | The system for measuring electrothermal module peak power output |
| CN108121379A (en) * | 2017-11-21 | 2018-06-05 | 中国科学院理化技术研究所 | Temperature regulating device and temperature control method |
-
2018
- 2018-09-09 CN CN201811047344.2A patent/CN109164850B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2612912Y (en) * | 2003-05-07 | 2004-04-21 | 武汉凌云光电科技有限责任公司 | High power compact thermostatic device without liquid cooling |
| CN2919141Y (en) * | 2006-03-03 | 2007-07-04 | 浙江工业大学 | Temperature regulating device based on semiconductor refrigeration technology and thermal superconduction technology |
| CN201156987Y (en) * | 2007-12-06 | 2008-12-03 | 郭世勇 | Semiconductor isothermic garments |
| CN203262339U (en) * | 2013-04-16 | 2013-11-06 | 上海理工大学 | Temperature difference power generation warming glove |
| CN103393237A (en) * | 2013-08-19 | 2013-11-20 | 青岛大学 | Thermoregulation garment |
| US20180053669A1 (en) * | 2016-08-17 | 2018-02-22 | Kelk Ltd. | Temperature Controller of Semiconductor Wafer and Temperature Control Method of Semiconductor Wafer |
| CN107421980A (en) * | 2017-02-04 | 2017-12-01 | 青岛大学 | Heating impedance compensation type thermo-resistance measurement method |
| CN207396602U (en) * | 2017-10-24 | 2018-05-22 | 河北科技大学 | The system for measuring electrothermal module peak power output |
| CN108121379A (en) * | 2017-11-21 | 2018-06-05 | 中国科学院理化技术研究所 | Temperature regulating device and temperature control method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109460089A (en) * | 2019-01-23 | 2019-03-12 | 青岛大学 | Based on it is passive can variable resistance temprature control method |
| CN109582064A (en) * | 2019-01-23 | 2019-04-05 | 青岛大学 | Passive variable resistance temperature controls dibit adjusting method |
| CN109582065A (en) * | 2019-01-23 | 2019-04-05 | 青岛大学 | Temprature control method based on thermoelectric effect |
| CN109597447A (en) * | 2019-01-23 | 2019-04-09 | 青岛大学 | Passive variable resistance temperature controls dibit adjusting method |
| CN109460089B (en) * | 2019-01-23 | 2021-01-12 | 青岛大学 | Temperature control method based on passive variable thermal resistance |
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