CN109163809A - The two waveband thermal imaging method and device of multiple aperture field of view portion overlapping - Google Patents
The two waveband thermal imaging method and device of multiple aperture field of view portion overlapping Download PDFInfo
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- 241000238631 Hexapoda Species 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
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- 235000009508 confectionery Nutrition 0.000 description 1
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- 238000005286 illumination Methods 0.000 description 1
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- 238000009828 non-uniform distribution Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000009885 systemic effect Effects 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
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Abstract
The invention discloses the two waveband thermal imaging methods and device of a kind of overlapping of multiple aperture field of view portion.It can be realized the complementation and abundant, raising target acquisition, quickly tracking and recognition capability of big visual field, high-resolution, more mesh multiband information using the present invention.The present invention includes the infrared imaging detector component of multiple groups single aperture, wherein the visual field of adjacent single aperture infrared imaging detector component has overlapping；The infrared imaging detector component includes long wave detector assembly and medium wave detector component, and long wave detector assembly and medium wave detector component are alternatively arranged, and congener detector assembly is centrosymmetric distribution.The detector being overlapped in visual field overlapping region is more, then the regional resolution is higher；Also, overlapping region can obtain long wave imaging data and medium wave imaging data simultaneously, can make full use of the complementation and abundant, raising target acquisition of multiband information, quickly tracking and recognition capability.
Description
Technical field
The invention belongs to photodetections and technical field of image processing, and in particular to a kind of overlapping of multiple aperture field of view portion
Two waveband thermal imaging method and device.
Background technique
Infrared thermal imaging is the key technology currently given priority to both at home and abroad.Infrared medium wave, long wave have different radiation
Characteristic, information have complementary, united effect.Infrared medium wave, long wave radiate different in height warm area.Due to target and background
The difference of difference, middle wave radiation is greater than long wave, and thermal target is more prominent in medium wave.Long wave is more sensitive for middle Low Temperature Target, in
Wave image high temperature target is more obvious.Infrared medium wave, long wave image are merged, the advantage of dual-band image is combined,
More easily in the case where background is more complicated, Small object is detected.Image co-registration have become future battlefield equipment must
Standby means and development trend.
Since infrared focal plane detector array (InfraRed Focal Plane Array, IRFPA) can with respect to silicon substrate
Light-exposed CCD/CMOS detector scale is much smaller, so that systemic effect distance and the contradiction of imaging viewing field are more prominent.Multiple aperture
Imaging technique is the novel imaging pattern currently rapidly developed, it is expected to solve or slow down traditional many of single aperture thermal imaging to ask
Topic: 1) big visual field and high-resolution contradiction；2) miniaturization issues of diffraction limit system；3) single aperture imaging does not play optics simultaneously
Row processing；4) imaging process loses scenery three-dimensional information problem；5) lack itself detection, tracking of the biological vision to moving object
And judgement.
The mankind and many mammals, which all have, can be rated as perfect " Binocular Stereo Vision System ", but its imaging viewing field is differentiated
Rate and non-uniform Distribution, but reduce rapidly from center to edge pixel ensure that search to big visual field and to concern target
High-resolution stare discrimination, cross the space orientation of the more available short distance of visual field or moving target in conjunction with binocular.And it is such as sweet
The compound eye of the insects such as bee, dragonfly is then the vision system of another kind of ideal miniaturization, multiple aperture and big visual field, although due to multiple
Eye sub-aperture very little, keeps insect eyesight poor, and more demanding to ambient light illumination, but it has very high spy to moving target
Sensitivity is surveyed, also there are the intelligent characteristics such as stronger resolving power to the intensity of light, wavelength (color) and polarization etc..Current artificial photoelectricity
Imaging system is mostly monocular system, and not only limited detector array, which is listed in visual field, is uniformly distributed, and causes imaging viewing field and divides
The mutual limitation of resolution, and the moving target space orientation of monocular vision shortcoming, the quickly intelligent characteristics such as tracking.
Summary of the invention
In view of this, the present invention provides the two waveband thermal imaging method and device of a kind of overlapping of multiple aperture field of view portion,
It can be realized the complementation and abundant, raising target acquisition, quickly tracking and identification of big visual field, high-resolution, more mesh multiband information
Ability.
The two waveband thermal imaging device of multiple aperture field of view portion overlapping of the invention, the infrared imaging including multiple groups single aperture
Detector assembly, wherein the visual field of adjacent single aperture infrared imaging detector component has overlapping；The infrared imaging detector group
Part includes long wave detector assembly and medium wave detector component, and long wave detector assembly and medium wave detector component are alternatively arranged,
And congener detector assembly is centrosymmetric distribution.
Further, the single aperture infrared imaging detector component is circularly and evenly distributed or array is uniformly distributed.
Further, the visual field Duplication of 2 adjacent single aperture infrared imaging detector components be 10%~90% it
Between.
Further, the visual field Duplication of 2 adjacent single aperture infrared imaging detector components is 50%.
The present invention also provides a kind of two waveband thermal imaging methods of multiple aperture field of view portion overlapping, using above-mentioned two waveband
Thermal imaging device is imaged, wherein the sub- visual field for overlapping with medium wave and LONG WAVE INFRARED light utilizes two-hand infrared image fusion method
It is imaged；The only sub- visual field of medium wave or LONG WAVE INFRARED light, is imaged using single band image imaging method；It overlaps with more
The sub- visual field of a medium wave and LONG WAVE INFRARED light is first overlapped the imaging data of medium wave and long wave respectively, forms 1 medium wave
Then image and 1 long wave image carry out two-hand infrared image fusion again, complete dual-waveband imaging.
Further, before carrying out image co-registration processing, heterogeneity first is carried out to the data of each detector assembly output
Correction process and numerical details enhancing processing, then carry out image co-registration again.
Further, for image to be fused, Pixel-level colour or black and white fusion are carried out in color space or gray space.
The utility model has the advantages that
The present invention using multiple groups there is the single aperture infrared imaging detector component at certain inclination angle target to be imaged, and
Field of view portion overlapping is formed, visual field is divided into multiple sub- visual fields；The detector of overlapping is more, then the subregion resolution ratio is got over
It is high；Also, the infrared imaging detector component includes long wave detector assembly and medium wave detector component, can in overlapping region
Long wave imaging data and medium wave imaging data are obtained simultaneously, the complementation and abundant, raising target of multiband information can be made full use of
Detection, quickly tracking and recognition capability, effectively realize the Small object accurately detecting of background complexity.
Detailed description of the invention
Fig. 1 is the two waveband thermal imaging device schematic diagram that 4 aperture field of view portion of the invention are overlapped.
Fig. 2 is the two waveband thermal imaging SOLIDWORKS schematic diagram that 4 aperture field of view portion of the invention are overlapped.
Fig. 3 is that visual field of the invention is overlapped schematic diagram.
Fig. 4 is the variation schematic diagram of visual field Duplication of the invention.
Specific embodiment
The present invention will now be described in detail with reference to the accompanying drawings and examples.
The present invention provides the two waveband thermal imaging methods and device of a kind of overlapping of multiple aperture field of view portion, and multiple aperture is regarded
Partly overlapping thermal imaging combines with two-hand infrared image fusion, the two waveband heat that design multiple aperture field of view portion is overlapped at
As method and apparatus, big visual field, high-resolution are realized, two waveband thermal imaging fusion makes full use of the complementation of more mesh multiband information
With abundant, raising target acquisition, quick tracking and recognition capability especially solve the detection problem of the Small object of background complexity.
The two waveband thermal imaging device of multiple aperture field of view portion overlapping of the invention, the infrared imaging including multiple groups single aperture
The optical axis of detector assembly, the single aperture infrared imaging detector component has certain inclination, to form field of view portion weight
It is folded, to constitute the multiple aperture imaging pattern of similar bionic compound eyes.Wherein, the single aperture infrared imaging detector component includes
Infrared objective and IRFPA (infrared focal plane array)；Wherein, infrared imaging detector includes long wave detector and medium wave detection
Device；The quantity of long wave detector and medium wave detector is equal, and long wave detector and medium wave detector are alternatively arranged, and same type
Detector be centrosymmetric distribution.It can be by the infrared imaging detector component of single aperture by array is evenly distributed or even circumferential
Arrangement.
According to single aperture infrared imaging detector component count corresponding to visual field lap and single aperture it is infrared at
As the type of wavelength of detector assembly, visual field can be divided into multiple sub- visual fields, overlap with the infrared of multi-wavelength in sub- visual field
Light realizes the detected with high accuracy of Small object then using two-hand infrared image fusion technology；The single aperture being overlapped in sub- visual field is infrared
Imaging detector component count is more, then the resolution ratio of the sub- visual field is higher.All single aperture infrared imaging detectors can be enabled
Component possesses common visual field lap, claims sub- visual field centered on the sub- visual field, then in this center visual field resolution ratio highest.
The visual field Duplication of 2 adjacent single aperture infrared imaging detector components can be between 10%~90%, preferably, can be with
Selection 50% or so.
It is non-that the signal of medium wave and Long Wave Infrared Probe component is respectively fed to digital video image processing board progress image
Even property correction, image enhancement and image real time fusion, and digital video image is sent in the PC machine of rear end, it shows related to storage
Image information, or realize more complicated Real-time image fusion, realize the control to digital video image processing plate.
It is uniformly arranged with 4 single aperture infrared imaging detector assembly arrays, 2 long wave detectors are individually positioned in one
Cornerwise both ends, 2 medium wave detectors are individually positioned in another cornerwise both ends；Adjacent 2 single aperture infrared imagings
Detector assembly it is horizontal or (and) for vertical direction has about 50% overlapped fov, composition as shown in Figure 1, its
SOLIDWORKS schematic layout pattern is as shown in Fig. 2, visual field overlapping region is (number is that visual field is overlapped number in Fig. 3) as shown in Figure 3, originally
The entire visual field of the two waveband thermal imaging device of invention is divided into 9 sub- visual fields, it may be assumed that center, upper and lower, left and right and 4 are right
Angle, each sub- visual field respectively account for 1/9 visual field；Wherein, middle center visual field is folded for the visual field of 2 long wave detectors and 2 medium wave detectors
Add, is two waveband, three-dimensional high-resolution multiple aperture thermal imaging mode, resolution ratio highest；The sub- visual field in upper and lower, left and right is 1 long
The superimposition of wave detector and 1 medium wave detector, is two waveband thermal imaging mode, and resolution ratio is taken second place；4 to silver coin visual field
For single long wave or the visual field of medium wave detector, for length/medium wave band thermal imaging mode, resolution ratio is minimum.
Wherein, the mounting bracket of mobile single aperture infrared imaging detector component, such as changes infrared objective focal length or bracket
Angle, visual field Duplication change (as shown in Figure 4), to realize that the quick high accuracy of target is visited by changing resolution ratio
It surveys.
Effect is preferable, and LONG WAVE INFRARED object lens parameter is focal length 19mm, F=1；LONG WAVE INFRARED IRFPA component is that Zhejiang is red
The amorphous silicon uncooled fpa detector component TC790 of phase Science and Technology Ltd., pixel number are 640 × 480, pixel spacing
It is 17 μm, response wave band is 8~12um, NETD=60mK, frame frequency 50Hz, and output video is CameraLink digital video.
Medium-wave infrared object lens parameter is focal length 19mm, F=1；Medium-wave infrared IRFPA component is Yantai IRay Technology Co., Ltd.
LA6110 (detector model RTD611WB wide spectrum non-refrigerated infrared focal plane probe), pixel number are 640 × 512,
Pixel spacing is 17 μm, and response wave band is 3~14um, NETD≤30mK, frame frequency 50Hz, and output video is CameraLink number
Word video.
Digital video image processing board uses the high-speed digital signal processing card with FPGA (model Virtex-5) for core,
It is inputted with 4 road CameraLink digital videos, the output of 2 road CameraLink digital videos.It can choose fusion video output
Or medium wave, LONG WAVE INFRARED video output.Using multiple aperture thermal imaging assembly bracket, wherein connecting two dimension on 3 assembly supports
Micro-displacement regulates and controls platform, to control the relative displacement between infrared objective and infrared IRFPA component, constitutes the double of field of view portion overlapping
Wave band thermal imaging system.
When carrying out image imaging, 4 silver coin visual fields only exist the unicast infrared light of long wave or medium wave, and utilization is red
Outer imaging algorithm is imaged；Middle center visual field and up and down sub- visual field due to existing simultaneously medium wave and LONG WAVE INFRARED light,
Then it is imaged using two-hand infrared image fusion method.
Wherein, up and down sub- visual field be 1 medium wave and 1 LONG WAVE INFRARED light superposition, directly progress medium wave image with
The fusion of long wave image obtains blending image；In middle center visual field, there are multiple medium waves and LONG WAVE INFRARED light, in order to reduce with
Machine noise is overlapped medium wave and long wave imaging data respectively, 1 medium wave and 1 long wave image is formed, then to medium wave figure
Picture and long wave image are merged, and blending image is obtained.Wherein, when image co-registration, can color space or gray space into
Row Pixel-level is colored or black and white merges.
The method of gray scale fusion is as follows.
For middle center visual field, shown in calculation method such as formula (1)-(3) for carrying out gray scale fusion,
IRL=(IRL1+IRL2)/2 (1)
IRM=(IRM1+IRM2)/2 (2)
IR=a × IRL+b×IRM (3)
Wherein IRL1And IRL2Indicate two long wave data, IRM1And IRM2Indicate two medium wave data, IRLAnd IRMTable respectively
Show that superimposed long wave and medium wave image, IR indicate fused image.A and b is fusion coefficients, is empirical value.
For sub- visual field up and down, shown in the calculation method such as formula (4) for carrying out gray scale fusion,
IR=a × IRL+b×IRM (4)
Wherein IRLAnd IRMSuperimposed long wave and medium wave image are respectively indicated, IR indicates fused image.A and b is to melt
Collaboration number is empirical value.
For angular field, it is individual long wave or medium wave image, remains unchanged.
The method of color integration is as follows.
For middle center visual field, shown in calculation method such as formula (5)-(9) for carrying out color integration,
IRL=(IRL1+IRL2)/2 (5)
IRM=(IRM1+IRM2)/2 (6)
Yfus=a1×IRL+b1×IRM (7)
Ufus=a2×IRL-b2×IRM (8)
Vfus=a3×IRM-b3×IRL (9)
Wherein IRL1And IRL2Indicate two long wave data, IRM1And IRM2Indicate two medium wave data, IRLAnd IRMTable respectively
Show superimposed long wave and medium wave image, Yfus、Ufus、VfusThe Y of digital picture, U, V component after respectively merging.
For sub- visual field up and down, shown in calculation method such as formula (10)-(12) for carrying out color integration,
Yfus=a1×IRL+b1×IRM (10)
Ufus=a2×IRL-b2×IRM (11)
Vfus=a3×IRM-b3×IRL (12)
Wherein IRLAnd IRMRespectively indicate long wave and medium wave image, Yfus、Ufus、VfusThe Y of digital picture after respectively merging,
U, V component.ai, bi(i=1,2,3) is fusion coefficients, is empirical value；Yfus,Ufus,VfusThe Y of digital picture after respectively merging,
U, V component.
For angular field, shown in calculation method such as formula (13)-(15) for carrying out color integration,
Yfus=a1×IRL+b1×IRM+c1 (13)
Ufus=a2×IRL+b2×IRM+c2 (14)
Vfus=a3×IRM+b3×IRL+c3 (15)
Wherein IRLAnd IRMLong wave and medium wave image are respectively indicated, in angular field, only exists individual long wave or medium wave figure
Picture, IRLAnd IRMOne of them is zero.Yfus,Ufus,VfusThe Y of digital picture, U, V component after respectively merging.ai, bi, ci(i
=1,2,3) it is fusion coefficients, is empirical value；Yfus,Ufus,VfusThe Y of digital picture, U, V component after respectively merging.
Color transmitting is carried out to fused digital picture, is obtained and the consistent digital picture of reference picture color.
Shown in calculation method such as formula (16)-(18) for carrying out color transmitting,
In formula (16)-(18), stdYref, stdUref, stdVrefFor the reference picture Y prestored, U, the standard deviation of V component, μ
Yref, μ Uref, μ VrefFor reference picture Y, U, the mean value of V component, stdYfus, stdUfus, stdVfusFor fusing digital images Y, U,
The standard deviation of V component, μ Yfus, μ Ufus, μ VfusFor fusing digital images Y, U, the mean value of V component, Ytran,Utran,VtranRespectively
The Y of fusing digital images, U, V component after color transmitting.
Preferably, before carrying out image co-registration, first using nonuniformity correction and enhancing Processing Algorithm, to IRFPA machine
The 14bit digital video data of core output, which carries out the processing of the Nonuniformity Correction SBNUC based on scene and numerical details, enhances DDE
Then processing carries out image co-registration again, improve image imaging precision.
In conclusion the above is merely preferred embodiments of the present invention, being not intended to limit the scope of the present invention.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (7)
1. a kind of two waveband thermal imaging device of multiple aperture field of view portion overlapping, which is characterized in that including the red of multiple groups single aperture
Outer imaging detection device assembly, wherein the visual field of adjacent single aperture infrared imaging detector component has overlapping；The infrared imaging is visited
Surveying device assembly includes long wave detector assembly and medium wave detector component, long wave detector assembly and medium wave detector inter-module every
Arrangement, and congener detector assembly is centrosymmetric distribution.
2. the two waveband thermal imaging device of multiple aperture field of view portion overlapping as described in claim 1, which is characterized in that the list
Aperture infrared imaging detector component is circularly and evenly distributed or array is uniformly distributed.
3. the two waveband thermal imaging device of multiple aperture field of view portion overlapping as described in claim 1, which is characterized in that adjacent
The visual field Duplication of 2 single aperture infrared imaging detector components is between 10%~90%.
4. the two waveband thermal imaging device of multiple aperture field of view portion overlapping as claimed in claim 3, which is characterized in that adjacent
The visual field Duplication of 2 single aperture infrared imaging detector components is 50%.
5. a kind of two waveband thermal imaging method of multiple aperture field of view portion overlapping, which is characterized in that using such as Claims 1 to 4
Multiple aperture field of view portion described in any one overlapping two waveband thermal imaging device be imaged, wherein overlap with medium wave and
The sub- visual field of LONG WAVE INFRARED light, is imaged using two-hand infrared image fusion method；The only son view of medium wave or LONG WAVE INFRARED light
, it is imaged using single band image imaging method；Overlap with the sub- visual field of multiple medium waves and LONG WAVE INFRARED light, first centering
The imaging data of wave and long wave is overlapped respectively, is formed 1 medium wave image and 1 long wave image, is then carried out two waveband again
Image co-registration completes dual-waveband imaging.
6. the two waveband thermal imaging method of multiple aperture field of view portion overlapping as claimed in claim 5, which is characterized in that carrying out
Before image co-registration processing, first the data of each detector assembly output are carried out at Nonuniformity Correction processing and numerical details enhancing
Reason, then carries out image co-registration again.
7. such as the two waveband thermal imaging method of multiple aperture field of view portion described in claim 5 or 6 overlapping, which is characterized in that
Color space or gray space carry out Pixel-level colour or black and white fusion.
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| CN110426128A (en) * | 2019-08-30 | 2019-11-08 | 东方电气集团东方锅炉股份有限公司 | A kind of photo-thermal power station heat dump external wall temperature measurement device and method |
| CN110595625A (en) * | 2019-09-17 | 2019-12-20 | 北京理工大学 | Cross-shaped five-aperture view field partially-overlapped bionic thermal imaging system |
| CN112304434A (en) * | 2020-09-25 | 2021-02-02 | 西北工业大学 | Non-refrigeration type medium-long wave dual-waveband infrared imaging device and method |
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