CN109161307A - A kind of intelligent chip heat radiation coating - Google Patents
A kind of intelligent chip heat radiation coating Download PDFInfo
- Publication number
- CN109161307A CN109161307A CN201811057417.6A CN201811057417A CN109161307A CN 109161307 A CN109161307 A CN 109161307A CN 201811057417 A CN201811057417 A CN 201811057417A CN 109161307 A CN109161307 A CN 109161307A
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- heat radiation
- intelligent chip
- radiation coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Abstract
A kind of intelligent chip heat radiation coating, is made of the raw material of following parts by weight: 10~14 parts of graphite powder, 12~16 parts of binder, 3~7 parts of 6~10 part, nanometer diatom ooze of carbon nanotubes, 1~2 part of stabilizer, 15~20 parts of ethylene glycol.The invention has the benefit that (1), present invention adds carbon nanotubes, pyroconductivity with higher and emissivity, reduction heat shielding is obviously improved heat dissipation effect;(2) phenomena such as nanometer diatom ooze being added simultaneously has good wear-resisting, heat resistance, and excellent surface property, increase-volume, thickening and raising adhesive force are provided for coating, prevents the cracking of heat radiation coating caused by temperature change in long term from falling off.
Description
Technical field
The invention belongs to intelligent chip fields, and in particular to a kind of intelligent chip heat radiation coating.
Background technique
Intelligent chip is one of component necessary to smart machine is run, and the classification of intelligent chip has very much, according to purposes
Difference, classification also can be different.Intelligent chip generally works with induction system and power drive system one, mutually makes up.
Play respective advantage.General intelligence chip is equivalent to a single-chip microcontroller, responsible to handle the induction model being collected into, then passes through
Instruction is passed to transmission system to complete initial effect to be achieved by electric switch driving power motor.
Smart machine (intelligent device) refer to any equipment with calculation processing ability, instrument or
Person's machine.The smart machine of complete function must have sensitive and accurate perceptional function, correct thinking and arbitration functions and
Effective execution function.
Smart machine be conventional electrical devices and computer technology, data processing technique, control theory, sensor technology,
The product that network communication technology, power electronic technique etc. combine.
Smart machine mainly includes both sides key content: self detection is the basis of smart machine;Self diagnosis is
The core of smart machine.
Smart machine is a kind of supermatic electromechanical integration equipment, since its structure is complicated, work in systems
With particularly significant, therefore there is very high requirement to the reliability of smart machine.The reliability of component, Technology design, process water
Gentle technical management etc. has codetermined the reliability index of electronic product.Improve the reliability of product, it is necessary to grasp product
Failure regularity only comprehensively understands the failure regularity of product, and can just take effective measures to improve product can
By property.
Smart machine in the process of running, can generate a large amount of heat, and intelligent chip is also in this way, if heat cannot get
It timely distributes, the work of intelligent chip will be directly influenced, directly resulting in smart machine cannot normally operate.
Summary of the invention
Technical problem to be solved by the present invention lies in: intelligent chip in the process of running, can generate a large amount of heat, such as
Fruit heat cannot be distributed timely, will directly influence the work of intelligent chip, and directly resulting in smart machine cannot be normal
Operating.For this purpose, providing a kind of intelligent chip heat radiation coating.
In order to solve the above technical problems, the technical solution of the present invention is as follows:
A kind of intelligent chip heat radiation coating, is made of the raw material of following parts by weight: 10~14 parts of graphite powder, binder
12~16 parts, 3~7 parts of 6~10 part, nanometer diatom ooze of carbon nanotubes, 1~2 part of stabilizer, 15~20 parts of ethylene glycol.
Further, be made of the raw material of following parts by weight: 10 parts of graphite powder, 12 parts of binder, 6 parts of carbon nanotubes,
Nanometer 3 parts of diatom ooze, 1 part of stabilizer, 15 parts of ethylene glycol.
Further, be made of the raw material of following parts by weight: 14 parts of graphite powder, 16 parts of binder, 10 parts of carbon nanotubes,
Nanometer 7 parts of diatom ooze, 2 parts of stabilizer, 20 parts of ethylene glycol.
Further, be made of the raw material of following parts by weight: 12 parts of graphite powder, 14 parts of binder, 8 parts of carbon nanotubes,
Nanometer 5 parts of diatom ooze, 1.5 parts of stabilizer, 18 parts of ethylene glycol.
Further, the binder is epoxy acrylic resin.
Further, the partial size of the graphite powder is 0.3~0.8 μm.
Further, it according to mass parts ratio is 1:1.5:1's that the stabilizer, which is kerosene, gelatin and triethanolamine three,
Mixture.
Carbon nanotubes pyroconductivity with higher and emissivity, so that the thermal coefficient of entire heat radiation coating increases
Add, can make coating surface that the nano material constituent element of the pattern of the bright and clean micro-rough of macroscopic view be presented, intelligent chip can be greatly increased
With extraneous contact area, heat shielding is reduced, heat dissipation effect is obviously improved.
Nanometer diatom ooze has the characteristics that porosity is big, absorbability is strong, chemical property is stable, wear-resisting, heat-resisting, can be coating
Excellent surface property, increase-volume, thickening and raising adhesive force are provided.I.e. not only heat dissipation effect is good for this heat radiation coating, simultaneously
It is not easy to crack and fall off with good adhesive capacity.
The invention has the benefit that (1) present invention adds carbon nanotubes, pyroconductivity with higher and transmittings
Property, heat shielding is reduced, heat dissipation effect is obviously improved;(2) the nanometer diatom ooze being added simultaneously has good wear-resisting, heat resistance
Can, excellent surface property, increase-volume, thickening and raising adhesive force are provided for coating, prevent from dissipating caused by temperature change in long term
Phenomena such as hot coating cracking falls off.
Specific embodiment
The effect of to make to structure feature of the invention and being reached, has a better understanding and awareness, to preferable
Embodiment cooperation detailed description, is described as follows:
Embodiment 1
A kind of intelligent chip heat radiation coating, is made of the raw material of following parts by weight: 10 parts of graphite powder, binder 12
Part, 3 parts of 6 part, nanometer diatom ooze of carbon nanotubes, 1 part of stabilizer, 15 parts of ethylene glycol.
Wherein, the binder is epoxy acrylic resin;The partial size of the graphite powder is 0.3 μm.The stabilizer is
The mixture that kerosene, gelatin and triethanolamine three are 1:1.5:1 according to mass parts ratio.
Embodiment 2
A kind of intelligent chip heat radiation coating, is made of the raw material of following parts by weight: 14 parts of graphite powder, binder 16
Part, 7 parts of 10 part, nanometer diatom ooze of carbon nanotubes, 2 parts of stabilizer, 20 parts of ethylene glycol.
Wherein, the binder is epoxy acrylic resin;The partial size of the graphite powder is 0.8 μm.The stabilizer is
The mixture that kerosene, gelatin and triethanolamine three are 1:1.5:1 according to mass parts ratio.
Embodiment 3
A kind of intelligent chip heat radiation coating, is made of the raw material of following parts by weight: 12 parts of graphite powder, binder 14
Part, 5 parts of 8 part, nanometer diatom ooze of carbon nanotubes, 1.5 parts of stabilizer, 18 parts of ethylene glycol.
Wherein, the binder is epoxy acrylic resin;The partial size of the graphite powder is 0.6 μm.The stabilizer is
The mixture that kerosene, gelatin and triethanolamine three are 1:1.5:1 according to mass parts ratio.
The preparation step of intelligent chip heat radiation coating is, respectively by parts by weight described in above-described embodiment 1~3
Several raw materials is sufficiently mixed, grinds, stir after the intelligent chip heat radiation coating can be obtained.Preparation step is simple, behaviour
Make at low cost.
The concrete application of the heat radiation coating are as follows: the heat radiation coating is evenly applied to dry intelligent chip surface, thickness
12μm;Then the intelligent chip placement of above-mentioned steps is subjected to spontaneous curing at room temperature, after solidification is completed, room temperature item
60~80min is kept the temperature under part.
Surface temperature under intelligent chip general work state is 80~90 DEG C, coats intelligent core after above-mentioned heat radiation coating
The surface temperature of piece is 60~70 DEG C.
The basic principles, main features and advantages of the present invention have been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and what is described in the above embodiment and the description is only the present invention
Principle, various changes and improvements may be made to the invention without departing from the spirit and scope of the present invention, these variation and
Improvement is both fallen in the range of claimed invention.The present invention claims protection scope by appended claims and its
Equivalent defines.
Claims (7)
1. a kind of intelligent chip heat radiation coating, it is characterised in that: be made of the raw material of following parts by weight: graphite powder 10~14
Part, 12~16 parts of binder, 3~7 parts of 6~10 part, nanometer diatom ooze of carbon nanotubes, 1~2 part of stabilizer, ethylene glycol 15~20
Part.
2. a kind of intelligent chip heat radiation coating according to claim 1, it is characterised in that: by the original of following parts by weight
Material composition: 10 parts of graphite powder, 12 parts of binder, 3 parts of 6 part, nanometer diatom ooze of carbon nanotubes, 1 part of stabilizer, 15 parts of ethylene glycol.
3. a kind of intelligent chip heat radiation coating according to claim 1, it is characterised in that: by the original of following parts by weight
Material composition: 14 parts of graphite powder, 16 parts of binder, 7 parts of 10 part, nanometer diatom ooze of carbon nanotubes, 2 parts of stabilizer, 20 parts of ethylene glycol.
4. a kind of intelligent chip heat radiation coating according to claim 1, it is characterised in that: by the original of following parts by weight
Material composition: 12 parts of graphite powder, 14 parts of binder, 5 parts of 8 part, nanometer diatom ooze of carbon nanotubes, 1.5 parts of stabilizer, ethylene glycol 18
Part.
5. a kind of intelligent chip heat radiation coating according to claim 1, it is characterised in that: the binder is epoxy third
Olefin(e) acid resin.
6. a kind of intelligent chip heat radiation coating according to any one of claims 1 to 4, it is characterised in that: the stone
The partial size of ink powder is 0.3~0.8 μm.
7. a kind of intelligent chip heat radiation coating according to any one of claims 1 to 4, it is characterised in that: described steady
Determining agent is the mixture that kerosene, gelatin and triethanolamine three are 1:1.5:1 according to mass parts ratio.
Priority Applications (1)
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CN201811057417.6A CN109161307A (en) | 2018-09-11 | 2018-09-11 | A kind of intelligent chip heat radiation coating |
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CN201811057417.6A CN109161307A (en) | 2018-09-11 | 2018-09-11 | A kind of intelligent chip heat radiation coating |
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CN109161307A true CN109161307A (en) | 2019-01-08 |
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CN201811057417.6A Pending CN109161307A (en) | 2018-09-11 | 2018-09-11 | A kind of intelligent chip heat radiation coating |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116376356A (en) * | 2023-05-09 | 2023-07-04 | 张家港市黎明化工有限公司 | Gravure printing ink and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102206450A (en) * | 2011-05-26 | 2011-10-05 | 开平市日固力涂料有限公司 | Composite photocatalysis coating |
CN108129100A (en) * | 2017-12-28 | 2018-06-08 | 深圳光天建材有限公司 | Environment-protection nano diatom mud dry powder and preparation method thereof |
CN108504152A (en) * | 2018-05-07 | 2018-09-07 | 合肥仁德电子科技有限公司 | The high heat radiation coating of a kind of electronic equipment shell |
-
2018
- 2018-09-11 CN CN201811057417.6A patent/CN109161307A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102206450A (en) * | 2011-05-26 | 2011-10-05 | 开平市日固力涂料有限公司 | Composite photocatalysis coating |
CN108129100A (en) * | 2017-12-28 | 2018-06-08 | 深圳光天建材有限公司 | Environment-protection nano diatom mud dry powder and preparation method thereof |
CN108504152A (en) * | 2018-05-07 | 2018-09-07 | 合肥仁德电子科技有限公司 | The high heat radiation coating of a kind of electronic equipment shell |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116376356A (en) * | 2023-05-09 | 2023-07-04 | 张家港市黎明化工有限公司 | Gravure printing ink and preparation method thereof |
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