CN109152277A - 一种新型导热石墨片 - Google Patents

一种新型导热石墨片 Download PDF

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CN109152277A
CN109152277A CN201711033942.XA CN201711033942A CN109152277A CN 109152277 A CN109152277 A CN 109152277A CN 201711033942 A CN201711033942 A CN 201711033942A CN 109152277 A CN109152277 A CN 109152277A
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heat
graphite flake
parts
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layer
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秦荣月
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Wuhu Hwichan Electronic Technology Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive

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  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明涉及手机制造生产技术领域，具体地说，是一种新型导热石墨片，该导热石墨片可用于手机电路板的制造，包括石墨片层，石墨片层上表面涂覆有聚酰亚胺薄膜，聚酰亚胺薄膜上表面涂覆有涂覆层，涂覆层的上表面涂覆有隔热发泡树脂层，石墨片层的下表面涂覆有导热硅胶层，本发明结构设计合理，通过导热硅胶的设置使得本发明可以和待散热部件无缝接触，提高其传热效率；热量的传导具有的方向性；提高了石墨片层的强度，使之不易出现掉粉和断裂现象，延长其使用寿命。

Description

一种新型导热石墨片
技术领域
本发明涉及手机制造生产技术领域，具体地说，是一种新型导热石墨片，可用于手机的电路板上。
背景技术
随着现代微电子技术高速发展，电子设备（如笔记本电脑、手机、平板电脑等）日益变得超薄、轻便，这种结构使得电子设备内部功率密度明显提高，运行中所产生的热量不易排出、易于迅速积累而形成高温。另一方面，高温会降低电子设备的性能、可靠性和使用寿命。因此，当前电子行业对于作为热控系统核心部件的散热材料提出越来越高的要求，迫切需要一种高效导热、轻便的材料迅速将热量传递出去，保障电子设备正常运行。
导热石墨片，是一种全新的导热散热材料，具有独特的晶粒取向，沿两个方向均匀导热，片层状结构可很好地适应任何表面，屏蔽热源与组件的同时改进消费类电子产品的性能，产品均匀散热的同时也在厚度方面提供热隔离。
现有技术中聚酰亚胺薄膜大多用于柔性电路板，虽然有采用聚酰亚胺薄膜烧结获得石墨散热片，从而贴覆在热源上，但是受限于聚酰亚胺薄膜的产品质量和性能的良莠不齐，影响到了散热双面贴膜散热性能的发挥，存在以下技术问题： 散热不均匀，易出现局部过热，提高了产品的散热性能不稳定、可靠性性能差， 不利于产品质量管控，影响产品的竞争力。
发明内容
本发明披露了一种新型导热石墨片，该导热石墨片在垂直方向和水平方向均提高了导热性能，避免局部过热，实现了导热性能的均匀性的同时， 提高了产品的散热性能稳定性、可靠性，大大降低了产品的成本。
本发明披露的一种新型导热石墨片的具体技术方案如下：
一种新型导热石墨片，包括石墨片层，石墨片层上表面涂覆有聚酰亚胺薄膜，聚酰亚胺薄膜上表面涂覆有涂覆层，涂覆层的上表面涂覆有隔热发泡树脂层，石墨片层的下表面涂覆有导热硅胶层。
本发明的进一步改进，涂覆层由石墨改性剂烧结而成，石墨改性剂由以下重量份的组分组成：二苯甲酮四酸二酐 20-25份，均苯四甲酸二酐14-16份，二氨基二苯甲烷22-26份，二甲基甲酰胺 20-25份，N-甲基吡咯烷酮8-10份，乙二醇1.8-2.5份，聚二甲基硅氧烷2.5-3份，聚氟乙烯3-5份。
本发明的进一步改进，隔热发泡树脂层由发泡树脂胶发泡而成。
本发明的进一步改进，导热硅胶层的厚度为50-200微米。
本发明的有益效果：本发明披露的新型导热石墨片的底层设置有导热硅胶层，导热硅胶层可以和待散热部件无缝接触，因此可以将待散热部件的热量快速导出给石墨片层，由于石墨片层上端设置有隔热发泡树脂层，其起到隔热的作用， 使热量的传导具有的方向性，热量在二维石墨片上传导，另外隔热发泡树脂层的设置也起到很好的缓冲作用，降低了石墨片因其他部件压迫而损坏的概率，石墨片层与隔热发泡树脂层之间设置的聚酰亚胺薄膜，提高了石墨片层的强度，使之不易出现掉粉和断裂现象，延长其使用寿命。
附图说明
图1是本发明的外观结构示意图。
图中，1-聚酰亚胺薄膜，2-涂覆层，3-石墨片层，4-隔热发泡树脂层，5-导热硅胶层。
具体实施方式
为了加深对本发明的理解，下面将结合附图和实施例对本发明做进一步详细描述，该实施例仅用于解释本发明，并不对本发明的保护范围构成限定。
实施例：如图1所示，一种新型导热石墨片，包括石墨片层3，石墨片层3上表面涂覆有聚酰亚胺薄膜1，聚酰亚胺薄膜1上表面涂覆有涂覆层2，涂覆层2的上表面涂覆有隔热发泡树脂层4，石墨片层3的下表面涂覆有导热硅胶层5，隔热发泡树脂层4由发泡树脂胶发泡而成，导热硅胶层5的厚度为50-200微米。
在本实施例中，涂覆层2由石墨改性剂烧结而成，石墨改性剂由以下重量份的组分组成：二苯甲酮四酸二酐 20-25份，均苯四甲酸二酐14-16份，二氨基二苯甲烷22-26份，二甲基甲酰胺 20-25份，N-甲基吡咯烷酮8-10份，乙二醇1.8-2.5份，聚二甲基硅氧烷2.5-3份。
本实施例的制造方法，包括以下步骤：
步骤一、在聚酰亚胺薄膜1的上表面涂覆石墨改性剂获得处理后的聚酰亚胺薄膜1；
步骤二、将处理后的聚酰亚胺薄膜1升温至1200℃后冷却，从而获得预烧制的碳化膜；
步骤三、采用压延机压延步骤二的预烧制的碳化膜；
步骤四、将碳化膜升温至2850℃-2950℃后冷却覆盖至石墨片层3，从而获得主烧制的石墨片；
步骤五、然后将步骤四所得的主烧制的石墨片的上表面涂覆由发泡树脂胶发泡而成隔热发泡树脂层4，下表面涂覆50-200微米厚的导热硅胶层5再进行压延从而获得新型导热石墨片。
以上显示和描述了本发明的基本原理、主要特征及优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (4)

1.一种新型导热石墨片，其特征在于：包括石墨片层，所述石墨片层上表面涂覆有聚酰亚胺薄膜，所述聚酰亚胺薄膜上表面涂覆有涂覆层，所述涂覆层的上表面涂覆有隔热发泡树脂层，所述石墨片层的下表面涂覆有导热硅胶层。
2.根据权利要求1所述的新型导热石墨片，其特征在于：所述涂覆层由石墨改性剂烧结而成，石墨改性剂由以下重量份的组分组成：二苯甲酮四酸二酐 20-25份，均苯四甲酸二酐14-16份，二氨基二苯甲烷22-26份，二甲基甲酰胺 20-25份，N-甲基吡咯烷酮8-10份，乙二醇1.8-2.5份，聚二甲基硅氧烷2.5-3份，聚氟乙烯3-5份。
3.根据权利要求2所述的新型导热石墨片，其特征在于：所述隔热发泡树脂层由发泡树脂胶发泡而成。
4.根据权利要求1-3任一项所述的新型导热石墨片，其特征在于：所述导热硅胶层的厚度为50-200微米。
CN201711033942.XA 2017-10-30 2017-10-30 一种新型导热石墨片 Withdrawn CN109152277A (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109819629A (zh) * 2019-01-16 2019-05-28 苏州世沃电子科技有限公司 一种阻燃抗裂型石墨散热片及其制备方法
CN110267502A (zh) * 2019-07-10 2019-09-20 东莞市源冠塑胶模具有限公司 一种新型电子设备散热贴片
CN110936677A (zh) * 2019-12-09 2020-03-31 苏州康丽达精密电子有限公司 一种石墨与导电层复合薄膜的制备方法及应用

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109819629A (zh) * 2019-01-16 2019-05-28 苏州世沃电子科技有限公司 一种阻燃抗裂型石墨散热片及其制备方法
CN110267502A (zh) * 2019-07-10 2019-09-20 东莞市源冠塑胶模具有限公司 一种新型电子设备散热贴片
CN110936677A (zh) * 2019-12-09 2020-03-31 苏州康丽达精密电子有限公司 一种石墨与导电层复合薄膜的制备方法及应用

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