CN109152217A - A kind of roll-to-roll production technology of FPC - Google Patents

A kind of roll-to-roll production technology of FPC Download PDF

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Publication number
CN109152217A
CN109152217A CN201810971051.7A CN201810971051A CN109152217A CN 109152217 A CN109152217 A CN 109152217A CN 201810971051 A CN201810971051 A CN 201810971051A CN 109152217 A CN109152217 A CN 109152217A
Authority
CN
China
Prior art keywords
rtr
roll
production technology
fpc
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810971051.7A
Other languages
Chinese (zh)
Inventor
曹明峰
朱鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN LONGPENG PRECISION ELECTRONICS Co Ltd
Original Assignee
KUNSHAN LONGPENG PRECISION ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN LONGPENG PRECISION ELECTRONICS Co Ltd filed Critical KUNSHAN LONGPENG PRECISION ELECTRONICS Co Ltd
Priority to CN201810971051.7A priority Critical patent/CN109152217A/en
Publication of CN109152217A publication Critical patent/CN109152217A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

The invention discloses a kind of roll-to-roll production technology of FPC, the roll-to-roll production technology of this kind of FPC is the following steps are included: RTR drills;RTR sinks copper/copper facing;RTR press mold;RTR contraposition/exposure;RTR development;RTR etches/move back film;AOI automatic optics inspection;RTR patch, pressure and baking cover film;RTR laser open covering film;RTR table surface treatment;Automatic machine pastes auxiliary material;RTR laser formation, FPC technique produce to laser formation from sawing sheet and are all made of roll-to-roll process, and RTR collocation laser technology replaces traditional punching machine punching.By the above-mentioned means, the present invention replaces traditional punching machine punching, labour is saved, production automation degree is improved, improves product efficiency and yield, reduces production cost.

Description

A kind of roll-to-roll production technology of FPC
Technical field
The present invention relates to work flexible circuit board production technical fields, more particularly to a kind of roll-to-roll production technology of FPC.
Background technique
The production of flexible circuit board (Flexible Printed Circuit abbreviation FPC) traditional flake belongs to labor-intensive Industry, time-consuming and laborious, large labor intensity, productivity are low and dimensional stability is relatively difficult to guarantee, and manufacture high precision fine linewidth/line Away from FPC qualification rate it is lower, with the development of science and technology, human cost improves, the raising of quality requirements and market efficiency Become FPC industry short slab in the urgent need to address Deng more and more sharp problem.
The appearance of roll-to-roll (Roll to Roll abbreviation RTR) technique alleviates the above problem to a certain extent, however Roll to Roll technique only arrives circuit etching in FPC industrial application and completes at present, and coiled strip material is then sub-partitioned into piece Shape production, the production technology after dividing is by completely returning to most traditional mode, and Roll to Roll technique is only to solve at present Problem before route of having determined molding, in addition, to pass through before the fitting of existing cover film: sawing sheet-drilling-slitting-punching-is to be fit Equal production procedures, it is therefore an objective to cover film be punched without the part retained with mold in advance, undoubtedly increase workload and throwing Enter cost.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of roll-to-roll production technology of FPC, RTR arranges in pairs or groups laser technology, Replace traditional punching machine punching, save labour, improve production automation degree, improves product efficiency and yield, reduction are produced into This.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: a kind of roll-to-roll production work of FPC is provided Skill, the roll-to-roll production technology of this kind of FPC the following steps are included:
RTR drilling;RTR sinks copper/copper facing;RTR press mold;RTR contraposition/exposure;RTR development;RTR etches/move back film;AOI is certainly Dynamic optical detection;RTR patch, pressure and baking cover film;RTR laser open covering film;RTR table surface treatment;Automatic machine pastes auxiliary material;RTR Laser formation.
Preferably, cover epiphragma using vacuum film pressing machine in RTR press mold step, 50~60 DEG C of temperature, pressure 3~ 5Kg presses 20s.
Preferably, exposure machine and the film, 500~1000mJ/cm of ultraviolet light are used in RTR contraposition/step of exposure2, grade Number 8/21.
Preferably, developing line uses 1.0%Na in RTR development step2CO3, 30 DEG C of temperature, time 30s, pressure 0.18MPa。
Preferably, RTR, which is pasted, presses and toasted, uses baking oven in cover film step, and 150 DEG C of temperature, time 90min.
Preferably, the replaceable photosensitive-ink of cover film or thermosetting oil used in RTR patch, pressure and baking cover film step Ink.
Preferably, the part that needs to open a window in RTR laser open covering film step is opened a window using roll-to-roll laser, advantage It is to save the mold of punching cover film, does not need cover film fitting or ink printing precision, need reserved pad locations straight It connects and is outputed by RTR laser, precision ± 0.03mm.
Compared with prior art, the beneficial effects of the present invention are:
1.RTR collocation laser technology replaces traditional punching machine punching;
2. saving labour;
3. improving production automation degree;
4. improving product efficiency and yield;
5. reducing production cost.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of the roll-to-roll production technology of FPC.
Specific embodiment
Present pre-ferred embodiments are described in detail with reference to the accompanying drawing, so as to can be easier to the advantages of invention with feature In being readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
Referring to Fig. 1, the embodiment of the present invention includes:
A kind of roll-to-roll production technology of FPC, the roll-to-roll production technology of this kind of FPC the following steps are included:
RTR drilling;RTR sinks copper/copper facing;RTR press mold;RTR contraposition/exposure;RTR development;RTR etches/move back film;AOI is certainly Dynamic optical detection;RTR patch, pressure and baking cover film;RTR laser open covering film;RTR table surface treatment;Automatic machine pastes auxiliary material;RTR Laser formation.
It carries out covering epiphragma using vacuum film pressing machine in RTR press mold step, 50~60 DEG C of temperature, 3~5Kg of pressure, press 20s。
Exposure machine and the film, 500~1000mJ/cm of ultraviolet light are used in RTR contraposition/step of exposure2, series 8/21.
Developing line uses 1.0%Na in RTR development step2CO3, 30 DEG C of temperature, time 30s, pressure 0.18MPa.
RTR, which is pasted, presses and toasted, uses baking oven in cover film step, and 150 DEG C of temperature, time 90min.
The replaceable photosensitive-ink of cover film or thermosetting ink used in RTR patch, pressure and baking cover film step.
The part that needs to open a window in RTR laser open covering film step is opened a window using roll-to-roll laser, and advantage is to save It is punched the mold of cover film, cover film fitting or ink printing precision is not needed, reserved pad locations is needed directly to be swashed by RTR Light is outputed, precision ± 0.03mm.
A kind of roll-to-roll production technology of FPC of the present invention, RTR collocation laser technology replace traditional punching machine punching, save and work Power improves production automation degree, improves product efficiency and yield, reduces production cost.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills Art field, is included within the scope of the present invention.

Claims (7)

1. a kind of roll-to-roll production technology of FPC, it is characterised in that: the roll-to-roll production technology of this kind of FPC the following steps are included:
RTR drilling;RTR sinks copper/copper facing;RTR press mold;RTR contraposition/exposure;RTR development;RTR etches/move back film;The automatic light of AOI Learn detection;RTR patch, pressure and baking cover film;RTR laser open covering film;RTR table surface treatment;Automatic machine pastes auxiliary material;RTR laser Molding.
2. the roll-to-roll production technology of a kind of FPC according to claim 1, it is characterised in that: using true in RTR press mold step Empty film laminator carries out covering epiphragma, 50~60 DEG C of temperature, 3~5Kg of pressure, presses 20s.
3. the roll-to-roll production technology of a kind of FPC according to claim 1, it is characterised in that: in RTR contraposition/step of exposure Using exposure machine and the film, 500~1000mJ/cm of ultraviolet light2, series 8/21.
4. the roll-to-roll production technology of a kind of FPC according to claim 1, it is characterised in that: developing line in RTR development step Using 1.0%Na2CO3, 30 DEG C of temperature, time 30s, pressure 0.18MPa.
5. the roll-to-roll production technology of a kind of FPC according to claim 1, it is characterised in that: RTR patch, pressure and baking covering In film step use baking oven, 150 DEG C of temperature, time 90min.
6. the roll-to-roll production technology of a kind of FPC according to claim 1, it is characterised in that: RTR patch, pressure and baking covering The replaceable photosensitive-ink of the cover film used in film step or thermosetting ink.
7. the roll-to-roll production technology of a kind of FPC according to claim 1, it is characterised in that: RTR laser open covering film step Middle needs windowing part is opened a window using roll-to-roll laser, precision ± 0.03mm.
CN201810971051.7A 2018-08-24 2018-08-24 A kind of roll-to-roll production technology of FPC Pending CN109152217A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810971051.7A CN109152217A (en) 2018-08-24 2018-08-24 A kind of roll-to-roll production technology of FPC

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810971051.7A CN109152217A (en) 2018-08-24 2018-08-24 A kind of roll-to-roll production technology of FPC

Publications (1)

Publication Number Publication Date
CN109152217A true CN109152217A (en) 2019-01-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810971051.7A Pending CN109152217A (en) 2018-08-24 2018-08-24 A kind of roll-to-roll production technology of FPC

Country Status (1)

Country Link
CN (1) CN109152217A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110139496A (en) * 2019-05-07 2019-08-16 深圳市新宇腾跃电子有限公司 A kind of cover film windowing process
CN113597146A (en) * 2021-08-25 2021-11-02 盐城维信电子有限公司 Roll-to-roll preparation process of multilayer flexible circuit board
CN114786352A (en) * 2022-03-16 2022-07-22 珠海中京元盛电子科技有限公司 Manufacturing method of anti-warping circuit board

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070113961A1 (en) * 2005-11-24 2007-05-24 Nitto Denko Corporation Conductor-clad laminate, wiring circuit board, and processes for producing the same
CN102159041A (en) * 2011-03-15 2011-08-17 珠海元盛电子科技股份有限公司 Method for once pressure-forming of inner and outer layers of multi-layer flexible circuit board
CN107949180A (en) * 2017-12-18 2018-04-20 厦门市铂联科技股份有限公司 A kind of FPC cover layers method and device
CN108067752A (en) * 2017-12-18 2018-05-25 深圳光韵达激光应用技术有限公司 A kind of roll-to-roll cover film laser cutting system and cutting method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070113961A1 (en) * 2005-11-24 2007-05-24 Nitto Denko Corporation Conductor-clad laminate, wiring circuit board, and processes for producing the same
CN102159041A (en) * 2011-03-15 2011-08-17 珠海元盛电子科技股份有限公司 Method for once pressure-forming of inner and outer layers of multi-layer flexible circuit board
CN107949180A (en) * 2017-12-18 2018-04-20 厦门市铂联科技股份有限公司 A kind of FPC cover layers method and device
CN108067752A (en) * 2017-12-18 2018-05-25 深圳光韵达激光应用技术有限公司 A kind of roll-to-roll cover film laser cutting system and cutting method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110139496A (en) * 2019-05-07 2019-08-16 深圳市新宇腾跃电子有限公司 A kind of cover film windowing process
CN113597146A (en) * 2021-08-25 2021-11-02 盐城维信电子有限公司 Roll-to-roll preparation process of multilayer flexible circuit board
CN114786352A (en) * 2022-03-16 2022-07-22 珠海中京元盛电子科技有限公司 Manufacturing method of anti-warping circuit board
CN114786352B (en) * 2022-03-16 2023-08-29 珠海中京元盛电子科技有限公司 Manufacturing method of anti-warping circuit board

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Application publication date: 20190104