CN109152217A - A kind of roll-to-roll production technology of FPC - Google Patents
A kind of roll-to-roll production technology of FPC Download PDFInfo
- Publication number
- CN109152217A CN109152217A CN201810971051.7A CN201810971051A CN109152217A CN 109152217 A CN109152217 A CN 109152217A CN 201810971051 A CN201810971051 A CN 201810971051A CN 109152217 A CN109152217 A CN 109152217A
- Authority
- CN
- China
- Prior art keywords
- rtr
- roll
- production technology
- fpc
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of roll-to-roll production technology of FPC, the roll-to-roll production technology of this kind of FPC is the following steps are included: RTR drills;RTR sinks copper/copper facing;RTR press mold;RTR contraposition/exposure;RTR development;RTR etches/move back film;AOI automatic optics inspection;RTR patch, pressure and baking cover film;RTR laser open covering film;RTR table surface treatment;Automatic machine pastes auxiliary material;RTR laser formation, FPC technique produce to laser formation from sawing sheet and are all made of roll-to-roll process, and RTR collocation laser technology replaces traditional punching machine punching.By the above-mentioned means, the present invention replaces traditional punching machine punching, labour is saved, production automation degree is improved, improves product efficiency and yield, reduces production cost.
Description
Technical field
The present invention relates to work flexible circuit board production technical fields, more particularly to a kind of roll-to-roll production technology of FPC.
Background technique
The production of flexible circuit board (Flexible Printed Circuit abbreviation FPC) traditional flake belongs to labor-intensive
Industry, time-consuming and laborious, large labor intensity, productivity are low and dimensional stability is relatively difficult to guarantee, and manufacture high precision fine linewidth/line
Away from FPC qualification rate it is lower, with the development of science and technology, human cost improves, the raising of quality requirements and market efficiency
Become FPC industry short slab in the urgent need to address Deng more and more sharp problem.
The appearance of roll-to-roll (Roll to Roll abbreviation RTR) technique alleviates the above problem to a certain extent, however
Roll to Roll technique only arrives circuit etching in FPC industrial application and completes at present, and coiled strip material is then sub-partitioned into piece
Shape production, the production technology after dividing is by completely returning to most traditional mode, and Roll to Roll technique is only to solve at present
Problem before route of having determined molding, in addition, to pass through before the fitting of existing cover film: sawing sheet-drilling-slitting-punching-is to be fit
Equal production procedures, it is therefore an objective to cover film be punched without the part retained with mold in advance, undoubtedly increase workload and throwing
Enter cost.
Summary of the invention
The invention mainly solves the technical problem of providing a kind of roll-to-roll production technology of FPC, RTR arranges in pairs or groups laser technology,
Replace traditional punching machine punching, save labour, improve production automation degree, improves product efficiency and yield, reduction are produced into
This.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: a kind of roll-to-roll production work of FPC is provided
Skill, the roll-to-roll production technology of this kind of FPC the following steps are included:
RTR drilling;RTR sinks copper/copper facing;RTR press mold;RTR contraposition/exposure;RTR development;RTR etches/move back film;AOI is certainly
Dynamic optical detection;RTR patch, pressure and baking cover film;RTR laser open covering film;RTR table surface treatment;Automatic machine pastes auxiliary material;RTR
Laser formation.
Preferably, cover epiphragma using vacuum film pressing machine in RTR press mold step, 50~60 DEG C of temperature, pressure 3~
5Kg presses 20s.
Preferably, exposure machine and the film, 500~1000mJ/cm of ultraviolet light are used in RTR contraposition/step of exposure2, grade
Number 8/21.
Preferably, developing line uses 1.0%Na in RTR development step2CO3, 30 DEG C of temperature, time 30s, pressure
0.18MPa。
Preferably, RTR, which is pasted, presses and toasted, uses baking oven in cover film step, and 150 DEG C of temperature, time 90min.
Preferably, the replaceable photosensitive-ink of cover film or thermosetting oil used in RTR patch, pressure and baking cover film step
Ink.
Preferably, the part that needs to open a window in RTR laser open covering film step is opened a window using roll-to-roll laser, advantage
It is to save the mold of punching cover film, does not need cover film fitting or ink printing precision, need reserved pad locations straight
It connects and is outputed by RTR laser, precision ± 0.03mm.
Compared with prior art, the beneficial effects of the present invention are:
1.RTR collocation laser technology replaces traditional punching machine punching;
2. saving labour;
3. improving production automation degree;
4. improving product efficiency and yield;
5. reducing production cost.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of the roll-to-roll production technology of FPC.
Specific embodiment
Present pre-ferred embodiments are described in detail with reference to the accompanying drawing, so as to can be easier to the advantages of invention with feature
In being readily appreciated by one skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
Referring to Fig. 1, the embodiment of the present invention includes:
A kind of roll-to-roll production technology of FPC, the roll-to-roll production technology of this kind of FPC the following steps are included:
RTR drilling;RTR sinks copper/copper facing;RTR press mold;RTR contraposition/exposure;RTR development;RTR etches/move back film;AOI is certainly
Dynamic optical detection;RTR patch, pressure and baking cover film;RTR laser open covering film;RTR table surface treatment;Automatic machine pastes auxiliary material;RTR
Laser formation.
It carries out covering epiphragma using vacuum film pressing machine in RTR press mold step, 50~60 DEG C of temperature, 3~5Kg of pressure, press
20s。
Exposure machine and the film, 500~1000mJ/cm of ultraviolet light are used in RTR contraposition/step of exposure2, series 8/21.
Developing line uses 1.0%Na in RTR development step2CO3, 30 DEG C of temperature, time 30s, pressure 0.18MPa.
RTR, which is pasted, presses and toasted, uses baking oven in cover film step, and 150 DEG C of temperature, time 90min.
The replaceable photosensitive-ink of cover film or thermosetting ink used in RTR patch, pressure and baking cover film step.
The part that needs to open a window in RTR laser open covering film step is opened a window using roll-to-roll laser, and advantage is to save
It is punched the mold of cover film, cover film fitting or ink printing precision is not needed, reserved pad locations is needed directly to be swashed by RTR
Light is outputed, precision ± 0.03mm.
A kind of roll-to-roll production technology of FPC of the present invention, RTR collocation laser technology replace traditional punching machine punching, save and work
Power improves production automation degree, improves product efficiency and yield, reduces production cost.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (7)
1. a kind of roll-to-roll production technology of FPC, it is characterised in that: the roll-to-roll production technology of this kind of FPC the following steps are included:
RTR drilling;RTR sinks copper/copper facing;RTR press mold;RTR contraposition/exposure;RTR development;RTR etches/move back film;The automatic light of AOI
Learn detection;RTR patch, pressure and baking cover film;RTR laser open covering film;RTR table surface treatment;Automatic machine pastes auxiliary material;RTR laser
Molding.
2. the roll-to-roll production technology of a kind of FPC according to claim 1, it is characterised in that: using true in RTR press mold step
Empty film laminator carries out covering epiphragma, 50~60 DEG C of temperature, 3~5Kg of pressure, presses 20s.
3. the roll-to-roll production technology of a kind of FPC according to claim 1, it is characterised in that: in RTR contraposition/step of exposure
Using exposure machine and the film, 500~1000mJ/cm of ultraviolet light2, series 8/21.
4. the roll-to-roll production technology of a kind of FPC according to claim 1, it is characterised in that: developing line in RTR development step
Using 1.0%Na2CO3, 30 DEG C of temperature, time 30s, pressure 0.18MPa.
5. the roll-to-roll production technology of a kind of FPC according to claim 1, it is characterised in that: RTR patch, pressure and baking covering
In film step use baking oven, 150 DEG C of temperature, time 90min.
6. the roll-to-roll production technology of a kind of FPC according to claim 1, it is characterised in that: RTR patch, pressure and baking covering
The replaceable photosensitive-ink of the cover film used in film step or thermosetting ink.
7. the roll-to-roll production technology of a kind of FPC according to claim 1, it is characterised in that: RTR laser open covering film step
Middle needs windowing part is opened a window using roll-to-roll laser, precision ± 0.03mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810971051.7A CN109152217A (en) | 2018-08-24 | 2018-08-24 | A kind of roll-to-roll production technology of FPC |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810971051.7A CN109152217A (en) | 2018-08-24 | 2018-08-24 | A kind of roll-to-roll production technology of FPC |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109152217A true CN109152217A (en) | 2019-01-04 |
Family
ID=64827719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810971051.7A Pending CN109152217A (en) | 2018-08-24 | 2018-08-24 | A kind of roll-to-roll production technology of FPC |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109152217A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110139496A (en) * | 2019-05-07 | 2019-08-16 | 深圳市新宇腾跃电子有限公司 | A kind of cover film windowing process |
CN113597146A (en) * | 2021-08-25 | 2021-11-02 | 盐城维信电子有限公司 | Roll-to-roll preparation process of multilayer flexible circuit board |
CN114786352A (en) * | 2022-03-16 | 2022-07-22 | 珠海中京元盛电子科技有限公司 | Manufacturing method of anti-warping circuit board |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070113961A1 (en) * | 2005-11-24 | 2007-05-24 | Nitto Denko Corporation | Conductor-clad laminate, wiring circuit board, and processes for producing the same |
CN102159041A (en) * | 2011-03-15 | 2011-08-17 | 珠海元盛电子科技股份有限公司 | Method for once pressure-forming of inner and outer layers of multi-layer flexible circuit board |
CN107949180A (en) * | 2017-12-18 | 2018-04-20 | 厦门市铂联科技股份有限公司 | A kind of FPC cover layers method and device |
CN108067752A (en) * | 2017-12-18 | 2018-05-25 | 深圳光韵达激光应用技术有限公司 | A kind of roll-to-roll cover film laser cutting system and cutting method |
-
2018
- 2018-08-24 CN CN201810971051.7A patent/CN109152217A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070113961A1 (en) * | 2005-11-24 | 2007-05-24 | Nitto Denko Corporation | Conductor-clad laminate, wiring circuit board, and processes for producing the same |
CN102159041A (en) * | 2011-03-15 | 2011-08-17 | 珠海元盛电子科技股份有限公司 | Method for once pressure-forming of inner and outer layers of multi-layer flexible circuit board |
CN107949180A (en) * | 2017-12-18 | 2018-04-20 | 厦门市铂联科技股份有限公司 | A kind of FPC cover layers method and device |
CN108067752A (en) * | 2017-12-18 | 2018-05-25 | 深圳光韵达激光应用技术有限公司 | A kind of roll-to-roll cover film laser cutting system and cutting method |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110139496A (en) * | 2019-05-07 | 2019-08-16 | 深圳市新宇腾跃电子有限公司 | A kind of cover film windowing process |
CN113597146A (en) * | 2021-08-25 | 2021-11-02 | 盐城维信电子有限公司 | Roll-to-roll preparation process of multilayer flexible circuit board |
CN114786352A (en) * | 2022-03-16 | 2022-07-22 | 珠海中京元盛电子科技有限公司 | Manufacturing method of anti-warping circuit board |
CN114786352B (en) * | 2022-03-16 | 2023-08-29 | 珠海中京元盛电子科技有限公司 | Manufacturing method of anti-warping circuit board |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109152217A (en) | A kind of roll-to-roll production technology of FPC | |
CN102724818A (en) | Solder mask green ink plugging method | |
CN103209546B (en) | The manufacture method of the direct circuit etching of a kind of negative film | |
CN110049623B (en) | Process method for improving chromatic aberration of LED display screen | |
CN201317154Y (en) | Peelable solder mask ink bushing plate printing device | |
CN109511235A (en) | The production method for the selective jack panel that a kind of hole VIP hole copper requires | |
CN202949649U (en) | Solder mask nail bed for circuit board | |
CN204936375U (en) | A kind of noble metal frosted minute surface imitative print thin slice | |
CN104582317A (en) | Printed circuit board manufacturing method | |
CN203957028U (en) | The prepreg windowing facility of flexible and hard combined circuit board | |
CN203934150U (en) | A kind of PCB consent plate | |
CN203449724U (en) | Silk screen printing base of touch screen of mobile phone | |
CN103687321A (en) | Machining method for hollow metal graph | |
CN202979476U (en) | Exposure alignment mould | |
CN103823593A (en) | Method for preparing cover glass with colorful window frame and application of cover glass | |
CN102917545A (en) | Method for manufacturing high-frequency silver immersion circuit board | |
CN104320915B (en) | A kind of preparation method of mobile phone module flexibility double face hollow out printed board | |
CN206533624U (en) | A kind of FPC industries pure copper foil new technological flow producing device | |
CN201900793U (en) | Local glazing device taking offset press as carrier | |
CN204822293U (en) | Bleeder label pasted device | |
CN209381567U (en) | A kind of printing machine is to embossing device | |
CN103009839B (en) | A kind of two-sided dye-transfer-preventblueprint blueprint cloth method | |
CN103997853A (en) | Manufacturing method for ultra-long aluminum-base circuit board | |
CN206389611U (en) | A kind of wiring board printing apparatus | |
CN102307434A (en) | UV adding line instrument and adding line method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190104 |