CN109140251A - Lighting device - Google Patents
Lighting device Download PDFInfo
- Publication number
- CN109140251A CN109140251A CN201710455852.3A CN201710455852A CN109140251A CN 109140251 A CN109140251 A CN 109140251A CN 201710455852 A CN201710455852 A CN 201710455852A CN 109140251 A CN109140251 A CN 109140251A
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- China
- Prior art keywords
- circuit board
- main circuit
- accommodating cavity
- lighting device
- sub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
This exposure provides a kind of lighting device, includes ontology, electrode tip holder, multiple pins, main circuit board, sub-circuit board and light-emitting component.Ontology has the first accommodating cavity, the second accommodating cavity, connectivity slot and the first Ka Gou.Electrode tip holder is configured in connectivity slot, and wherein electrode tip holder includes the holding section being coupled in the first card ditch.Pin is set in electrode tip holder, and the first end of pin and second end extend respectively to the first accommodating cavity and the second accommodating cavity.Main circuit board is configured in the second accommodating cavity.Sub-circuit board is configured above main circuit board, and is electrically connected with main circuit board, and wherein the second end of pin is connect through main circuit board and with sub-circuit board.Light-emitting component is configured on main circuit board, and is electrically connected with main circuit board.The lighting device of this exposure can effectively promote production reliability and reduce production cost.
Description
Technical field
This exposure is about a kind of lighting device, especially with regard to a kind of lighting device of light emitting diode.
Background technique
With the development of lighting, used lamps and lanterns also become a big emphasis of its development on means of transport.Cooperation
It is scientific and technological now, due to light emitting diode (light-emitting diode；LED appearance), so that passing through light emitting diode institute
The lamps and lanterns of design have the advantages that high brightness, consumption power are low with stabilized illumination state, thus the light emitting source of Vehicular lamp from
Light bulb is replaced into LED light.
However, for traditional LED car lamp structure, usually directly by LED to be manually attached at lamp housing, and in being sticked
It is dependent on assembling experience in journey without close adjustment, therefore has all multiple errors and leads to the incorrect situation of light type, and need to expend
The cost of many manpowers, built-up time and subsequent survey error.In addition, the connection of LED car lamp and car body is penetrating many wire rods,
Other than expending built-up time, many interior spaces are also wasted.
Summary of the invention
One embodiment of this exposure is a kind of lighting device, includes ontology, electrode tip holder, multiple pins, main circuit board, son electricity
Road plate and light-emitting component.Ontology has the first accommodating cavity, the second accommodating cavity, and the first accommodating cavity of connection and the second accommodating
The connectivity slot of chamber, ontology also include the first Ka Gou, are set to connectivity slot and neighbouring first accommodating cavity.Electrode tip holder is configured at connectivity slot
Interior, electrode tip holder includes holding section, and holding section is coupled in the first card ditch.Pin is set in electrode tip holder, and multiple the of pin
One end extends to the first accommodating cavity, and multiple second ends of pin extend to the second accommodating cavity.Main circuit board is configured at the second appearance
It sets intracavitary, and includes opposite first surface and second surface, wherein first surface is towards ontology.Sub-circuit board is configured at main electricity
It above the plate of road, and is electrically connected with main circuit board, wherein the second end of pin is connect through main circuit board and with sub-circuit board.Hair
Optical element is configured on main circuit board, and is electrically connected with main circuit board.
According to the section Example of this exposure, ontology also includes the second Ka Gou, and the second Ka Gou is set to connectivity slot and neighbouring
Second accommodating cavity.Electrode tip holder includes protrusion, and protrusion is coupled in the second card ditch.
According to the section Example of this exposure, wherein main circuit board includes notch, and the second end of pin is via notch
It is connect with sub-circuit board.
According to the section Example of this exposure, wherein main circuit board is set to electrically-conductive backing plate comprising electrically-conductive backing plate, insulating layer
On, and the circuit layer on insulating layer, wherein sub-circuit board is electrically connected via circuit layer and main circuit board.
According to the section Example of this exposure, lighting device also includes the company being configured between sub-circuit board and main circuit board
Element is connect, wherein sub-circuit board is electrically connected to main circuit board by connecting element.
According to the section Example of this exposure, wherein sub-circuit board includes insulating substrate, and insulating substrate includes opposite the
Three surfaces and the 4th surface, third surface is towards main circuit board, and third surface and the 4th surface are respectively provided with circuit layer, wherein
The circuit layer on third surface is connect with the circuit layer on the 4th surface through the conducting element through insulating substrate.
According to the section Example of this exposure, wherein the second end of pin is protruded from the 4th surface, and via scolding tin and the
The circuit connection on four surfaces.
According to the section Example of this exposure, wherein the sectional area of connectivity slot is from the first accommodating cavity toward the side of the second accommodating cavity
To becoming larger.
According to the section Example of this exposure, wherein ontology is radiating piece.
According to the section Example of this exposure, wherein ontology includes multiple fins.
Detailed description of the invention
Reading describes in detailed below and corresponding attached drawing of arranging in pairs or groups, it may be appreciated that multiple aspects of this exposure.It should be noted that according to industry
Standing procedure in boundary, multiple features are not necessarily drawn to scale.In fact, the size of multiple features can arbitrarily increase or decrease with
Conducive to the clarity of discussion.
Fig. 1 is the perspective view of the explosion of the lighting device of the section Example of this exposure；
Fig. 2 is the sectional view intercepted along the line A-A of Fig. 1；
Fig. 3 A and Fig. 3 B are the local element perspective view of the lighting device of the section Example of this exposure；
Fig. 3 C is the sectional view intercepted along the line C-C of Fig. 3 A；
Fig. 4 A is the local element perspective view of the lighting device of the section Example of this exposure；
Fig. 4 B is the local element perspective view of the lighting device of the section Example of this exposure；
Fig. 4 C is the sectional view intercepted along the line C-C of Fig. 4 B；
Fig. 4 D is the local element perspective view of the lighting device of the section Example of this exposure；
Fig. 5 A is the perspective view of the lighting device of the section Example of this exposure；
Fig. 5 B is the sectional view intercepted along the line B-B of Fig. 5 A.
Specific embodiment
It discloses below and numerous different embodiments or example is provided, it is special for implementing the difference of main contents of this case offer
Sign.Component and the configuration of a particular example is described below to simplify this exposure.Certainly, this example is only schematic, and is not intended to
Definite limitation.For example, " above and over that fisrt feature is formed in second feature " is described below, may include in embodiment
Fisrt feature is directly contacted with second feature, and also may include forming additional features between fisrt feature and second feature to make
Fisrt feature and second feature are without directly contact.In addition, this exposure can reuse component symbol and/or word in each example
It is female.This duplicate purpose is to simplify and differentiate, and its own is not provided between each embodiment discussed and/or configuration
Relationship.
In addition, spatially relative term, such as " lower section (beneath) ", " following (below) ", " lower part (lower) ", " on
Side (above) ", " top (upper) " etc. are herein for simplifying description, to describe a member as illustrated in the accompanying drawings
The relationship of part or feature structure and another elements or features structure.Other than describing the orientation of diagram, spatially relative term is also wrapped
Different direction containing element in use or under operation.This equipment, which can be oriented otherwise, (to be rotated by 90 ° or in its other party
On position), and space relative descriptors used in this case can be explained correspondingly.
Fig. 1 is the perspective view of the explosion of the lighting device of the section Example of this exposure.Lighting device 10 includes ontology 20, electricity
Electrode seat 30, multiple pins 40, main circuit board 50, sub-circuit board 60 and light-emitting component 70.Ontology 20 is a radiating piece.And in
In section Example, ontology 20 has multiple radiating fins 202.Ontology 20 can be non-insulating material, such as metal.
Pin 40 is configured inside electrode tip holder 30, and the two sides up and down of the both ends difference self-electrode seat 30 of each pin 40 expose
Dew, to provide electric connection.In summary, the part that the two sides up and down of 40 self-electrode seat 30 of pin are exposed to the open air is for by external electrical
Source supply device is electrically connected to main circuit board 50, sub-circuit board 60 and light-emitting component 70, and particular content will continue after
It is bright.In addition, the quantity of pin 40 is only illustrative nature, and the usual skill of this field can be according to reality in present embodiment
The quantity of pin 40 needed for Demand Design.
Fig. 2 is the sectional view along the line A-A of Fig. 1 ontology 20 intercepted.Ontology 20 include the first accommodating cavity 210 and
Second accommodating cavity 220.In section Example, the first accommodating cavity 210 and the second accommodating cavity 220 are respectively arranged at ontology 20
Two sides.Ontology 20 further includes the connectivity slot 230 for being connected to the first accommodating cavity 210 and the second accommodating cavity 220.In other words, ontology
20 inside be of virtually up and down perforative channel, and this channel be by the first accommodating cavity 210, the second accommodating cavity 220, and
Connectivity slot 230 is constituted.
In this present embodiment, the area of the second accommodating cavity 220 is greater than the area of the first accommodating cavity 210, and 230 system of connectivity slot
It is configured at the edge of the second accommodating cavity 220.Such configuration enables connectivity slot 230 and the neighbouring space of the first accommodating cavity 210 to be used
In configuration radiating fin 202, space can be effectively utilized.So this configuration is only a kind of embodiment of this exposure, not
For limiting this exposure.
In section Example, connectivity slot 230 can from top to bottom design variable cross-section product.For example, the present embodiment
The sectional area of connectivity slot 230 becomes larger from the first accommodating cavity 210 toward the direction of the second accommodating cavity 220.The advantages of this configuration, exists
In can effectively consolidate electrode tip holder of the subsequent configuration in connectivity slot 230, the particular content of electrode tip holder will be in subsequent explanation.Yu Qi
In his section Example, the sectional area of connectivity slot 230 can be segmentation or continuous gradation.
Ontology 20 further comprises the first card ditch 240 and the second card ditch 250.First card ditch 240 is set on connectivity slot 230,
And adjacent to the first accommodating cavity 210.On the other hand, the second card ditch 250 is set on connectivity slot 230, and adjacent to the second accommodating
Chamber 220.Specifically, the first card ditch 240 and the second card ditch 250 are to be set to connectivity slot 230 with respect to two tops respectively.First card
Ditch 240 is also connected to the first accommodating cavity 210 and the second accommodating cavity 220 respectively with the second card ditch 250.For outline, the first Ka Gou
240 and second card ditch 250 be in order to have better fixed effect when the subsequent electrode tip holder 30 by Fig. 1 is inserted into, it is specific in
Appearance will be in subsequent explanation.
Fig. 3 A to Fig. 3 C depicts the electrode tip holder 30 and pin 40 of Fig. 1.Wherein Fig. 3 A and Fig. 3 B is different angle respectively
Electrode tip holder 30 perspective view.Electrode tip holder 30 has multiple grooves 302, and 302 purpose of design of further groove is electrode tip holder 30 in list
When body formed, the fault location of injection molding is avoided in advance, and being directly designed to groove then in fault location can actually avoid in molding
Defect, furthermore, groove is formed by reserved space, then may make electrode tip holder 30 in connectivity slot 230 will not because of thermal expansion and
Lead to that overall structure is squeezed and is damaged.
Electrode tip holder 30 has protrusion 320, and wherein the design of protrusion 320 is in the next steps to be inserted into electrode tip holder 30
There can be preferably firm effect after to ontology 20, detailed content will be in subsequent explanation.On the other hand, electrode tip holder 30 has engaging
Portion 310 wherein has around holding section 310 and is also reserved with some spaces, so that holding section 310 has elasticity, in subsequent step
In electrode tip holder 30 can be inserted into ontology 20 (as shown in Figure 2) easily.By and large, holding section 310 and protrusion 320 are to match
It is placed in the opposite sides of electrode tip holder 30.
Fig. 3 C is the sectional view intercepted along the line C-C of Fig. 3 A.In section Example, pin 40 has in electrode tip holder 30
Have bending, this configuration the advantages of be effectively pin 40 to be fixed in electrode tip holder 30.By and large, electrode tip holder 30 with draw
The assembling flow path of foot 40 can be first via the pin 40 for forming bending, then the mode projected through embedment forms electrode tip holder 30 and coats
Pin 40.In section Example, pin 40 by bending twice, so that the first end 401 and second end 402 of pin 40 are divided
The opposite sides of other self-electrode seat 30 exposes to the open air.
The shape of electrode tip holder 30 may be designed, for example, the electrode tip holder 30 of Fig. 3 C is wedge shape.In other words, electrode
The sectional area of seat 30 becomes larger from lower to upper.It's not limited to that for this right exposure, and electrode tip holder 30 can in other embodiments
With other shapes.In section Example, electrode tip holder 30 is insulating materials, such as plastic cement.
Fig. 4 A to Fig. 4 D is the office of electrode tip holder 30, pin 40, main circuit board 50, sub-circuit board 60 and light-emitting component 70
Portion's schematic diagram.In section Example, the structure of main circuit board 50 includes electrically-conductive backing plate 525, is configured on electrically-conductive backing plate 525
Insulating layer 528, and the circuit layer 530 on insulating layer 528.In other words, insulating layer 528 is to be located at electrically-conductive backing plate and electricity
Between road floor 530, circuit layer 530 and electrically-conductive backing plate 525 are electrically insulated.It, can be in electrically-conductive backing plate 525 in section Example
Upper formation insulating layer 528, then circuit layer 530 is formed on insulating layer 528 via processing procedures such as printing, etchings.Depicted electricity herein
The profile of road floor 530 is only illustrative nature, is not limited to this exposure.
Electrically-conductive backing plate 525 is arranged in close to the side of electrode tip holder 30, and circuit layer 530 is arranged in far from electrode tip holder 30
Side.For another angle, main circuit board 50 includes opposite first surface 501 and second surface 502, wherein first
Surface 501 is towards electrode tip holder 30.First surface 501 is to be made of electrically-conductive backing plate 525, and second surface 502 is then by insulating
Layer 528 and circuit layer 530 thereon are constituted.Since opposite two surfaces of main circuit board 50 have conductive material (i.e. conductive
Substrate 525 and circuit layer 530) so that generally speaking main circuit board 50 has conductive characteristic (other than insulating layer 528).
In section Example, the material of electrically-conductive backing plate 525 can be aluminium (Al), silver-colored (Ag), or suitable metal etc..
In Fig. 4 A, main circuit board 50 has notch 510.Main circuit board 50 is configured at the top of electrode tip holder 30, wherein from electricity
The pin 40 that electrode seat 30 exposes to the open air extends upwardly to the top of main circuit board 50 via notch 510.Due to main circuit board 50 substantially and
Speech has conductive characteristic, therefore pin 40 is arranged in by notch 510, but not in contact with main circuit board 50.In other words,
The notch 510 of main circuit board 50 is through designing with certain space, so that pin 40 will not be touched when passing through notch 510
Main circuit board 50 and lead to short circuit.Wherein the design of notch 510 also has space-efficient effect.
Light-emitting component 70 is configured on main circuit board 50, and with the circuit layer 530 on the second surface of main circuit board 50 502
It is electrically connected.Multiple connecting elements 520, connecting element 520 and the second of main circuit board 50 are wherein configured on main circuit board 50
Circuit layer 530 on surface 502 is electrically connected.In section Example, connecting element 520 can be tin cream.
Fig. 4 B is the perspective view of sub-circuit board 60.Fig. 4 C is the sectional view that is intercepted along the line C-C of Fig. 4 B.Sub-circuit board
60 include insulating substrate 610, and insulating substrate 610 includes opposite first surface 611 and second surface 612, wherein first surface
611 and second surface 612 be each configured with circuit layer 613 and 614.In section Example, circuit layer 613 and 614 can be via
The modes such as printing, etching are formed on insulating substrate 610.
In addition, insulating substrate 610 has more multiple holes 620, hole 620 extends vertically through insulating substrate 610.Hole 620
Conducting element 622 has inside been filled up, such as copper foil, and the circuit layer 613 and 614 electricity of first surface 611 and second surface 612 will be located at
Property connection.That is, the circuit layer 613 and 614 of the upper and lower surface of sub-circuit board 60 electrically conducts mutually.Insulating substrate
There are multiple notches 630 on 610.
Fig. 4 D is by the schematic diagram after the assembling of pin 40, main circuit board 50 and sub-circuit board 60.Please arrange in pairs or groups Fig. 4 A together
To Fig. 4 C, sub-circuit board 60 is configured at 50 top of main circuit board, and first surface 611 (such as Fig. 4 B and Fig. 4 C of sub-circuit board 60
It is shown) towards main circuit board 50.Specifically, the circuit layer 613 on the first surface 611 of sub-circuit board 60 and main circuit board 50
On connecting element 520 connect.In section Example, connecting element 520 can be tin cream.Main circuit board 50 and sub-circuit board 60
It can pass through surface mount technology (surface mount technology；SMT it) further connects and generates and electrically conduct.
On the other hand, the second end 402 of pin 40 passes through the notch 630 of sub-circuit board 60 and extends to sub-circuit board 60
Top.In section Example, the pin 40 (or second end 402) for extending to the top of sub-circuit board 60 can pass through the side of welding
Formula is connect with the circuit layer 614 on the second surface 612 of sub-circuit board 60.
According to above-mentioned, the transmission path of electric current is the electricity that the second surface 612 of sub-circuit board 60 is transferred to via pin 40
Road floor 614, then via through sub-circuit board 60 conducting element 622 be transferred to sub-circuit board 60 first surface 611 circuit
Layer 613, then it is transferred to via connecting element 520 circuit layer 530 of main circuit board 50, finally again via the circuit of main circuit board 50
Layer 530 is transferred to light-emitting component 70.As previously suggested, since the main circuit board of this exposure 50 is to have conductive spy by and large
Property, so design can be effectively shielded from pin 40 and contact with main circuit board 50 and generate short circuit.
Fig. 5 A and Fig. 5 B depict schematic diagram of the lighting device of the section Example of this exposure after assembling, wherein Fig. 5 B
For the sectional view intercepted along the line B-B of Fig. 5 A.Electrode tip holder 30 is inserted into connectivity slot 230.Main circuit board 50 is configured at second
In accommodating cavity 220, wherein the first surface 501 of main circuit board 50 is towards ontology 20.Sub-circuit board 60 is configured at main circuit board 50
Top, and be electrically connected with main circuit board 50.Light-emitting component 70 is configured on main circuit board 50, and is electrically connected with main circuit board 50
It connects.
The first end 401 for being set to the pin 40 in electrode tip holder 30 extends to the direction of the first accommodating cavity 210, pin 40
Second end 402 then extends to the direction of the second accommodating cavity 220.Wherein the second end 402 of pin 40 through main circuit board 50 and with
Sub-circuit board 60 connects.It is inserted into the connectivity slot 230 of ontology 20 together by electrode tip holder 30 and configuration pin 40 therein, it can
Saving additionally makes the trouble run wires to, not only stabilized structure, and easy to assembly.In section Example, the first accommodating cavity
210 are used to accommodate external device (ED), such as automobile-used power supply supplies seat, and the first end 401 of external device (ED) and pin 40 couples, whereby
By electric signal transmission into lighting device.
In section Example, since the sectional area of connectivity slot 230 is from the first accommodating cavity 210 toward the second accommodating cavity 220
Direction becomes larger, and the shape of electrode tip holder 30 is wedge shape.The shape of electrode tip holder 30 is generally coincide with connectivity slot 230.On and
Electrode tip holder 30 can be effectively stable in connectivity slot 230 by the design stated.In addition, the holding section 310 of electrode tip holder 30 is coupled to
First card ditch 240, and the protrusion 320 of electrode tip holder 30 is coupled in the second card ditch 250, can also reinforce fixed effect.
Pin is set in electrode tip holder by the lighting device of this exposure by modular design, through electrode tip holder is straight
It patches into ontology, the trouble of wiring can be simplified, and increase integrally-built stability.On the other hand, one end of pin passes through master
Circuit board is simultaneously connect with the sub-circuit board being configured above main circuit board, then pin is electrically connected to main electricity via sub-circuit board
Road plate can be effectively prevented from pin and contact with main circuit board and lead to the problem of short circuit.The lighting device of this exposure can be effectively
The assembling reliability for promoting finished product, can also reduce the cost of production.
Foregoing has outlined the features of several embodiments, and so as to this field, those who are familiar with this art are better understood this announcement
The aspect of case.This field those who are familiar with this art should be understood that them and can easily design using based on this disclosure
Or other processing procedures and structure are modified, to carry out identical purpose and/or realize identical advantage.This field those who are familiar with this art are also
It should be appreciated that such equivalent constructions do not depart from the spirit and scope of this disclosure, and in the spirit for not departing from this disclosure
It, can be to progress various changes, substitution and change herein and in the case where scope.
Claims (10)
1. a kind of lighting device, characterized by comprising:
One ontology has one first accommodating cavity, one second accommodating cavity, and is connected to first accommodating cavity and second accommodating cavity
One connectivity slot, the ontology also include one first Ka Gou, are set to the connectivity slot and neighbouring first accommodating cavity；
One electrode tip holder is configured in the connectivity slot, which includes a holding section, which is coupled to first Ka Gou
In；
Multiple pins are set in the electrode tip holder, and multiple first ends of the multiple pin extend to first accommodating cavity, and
Multiple second ends of the multiple pin extend to second accommodating cavity；
One main circuit board is configured in second accommodating cavity, and includes opposite a first surface and a second surface, wherein should
First surface is towards the ontology；
One sub-circuit board is configured above the main circuit board, and is electrically connected with the main circuit board, wherein the multiple pin
The multiple second end is connect through the main circuit board and with the sub-circuit board；And
One light-emitting component is configured on the main circuit board, and is electrically connected with the main circuit board.
2. lighting device according to claim 1, it is characterised in that:
The ontology also includes one second Ka Gou, which is set to the connectivity slot and neighbouring second accommodating cavity；And
The electrode tip holder includes a protrusion, which is coupled in the second card ditch.
3. lighting device according to claim 1, which is characterized in that the main circuit board includes a notch, and the multiple
The multiple second end of pin is to connect via the notch with the sub-circuit board.
4. lighting device according to claim 1, which is characterized in that the main circuit board includes an electrically-conductive backing plate, an insulation
Layer is set on the electrically-conductive backing plate, and the circuit layer on the insulating layer, and wherein the sub-circuit board is via the circuit
Layer is electrically connected with the main circuit board.
5. lighting device according to claim 1, which is characterized in that also comprising being configured at the sub-circuit board and the main circuit
A connecting element between plate, wherein the sub-circuit board is electrically connected to the main circuit board by the connecting element.
6. lighting device according to claim 1, which is characterized in that the sub-circuit board includes an insulating substrate, the insulation
Substrate includes an opposite third surface and one the 4th surface, the third surface towards the main circuit board, and the third surface with
4th surface is respectively provided with a circuit layer, and wherein the circuit layer on the third surface and the circuit layer on the 4th surface penetrate
A conducting element through the insulating substrate connects.
7. lighting device according to claim 6, which is characterized in that the multiple second end of the multiple pin is protruded
From the 4th surface, and via the circuit connection of scolding tin and the 4th surface.
8. lighting device according to claim 1, which is characterized in that a sectional area of the connectivity slot is from first accommodating cavity
It is become larger toward the direction of second accommodating cavity.
9. lighting device according to claim 1, which is characterized in that the ontology is radiating piece.
10. lighting device according to claim 1, which is characterized in that the ontology includes multiple fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710455852.3A CN109140251A (en) | 2017-06-16 | 2017-06-16 | Lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710455852.3A CN109140251A (en) | 2017-06-16 | 2017-06-16 | Lighting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109140251A true CN109140251A (en) | 2019-01-04 |
Family
ID=64830203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710455852.3A Pending CN109140251A (en) | 2017-06-16 | 2017-06-16 | Lighting device |
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| Country | Link |
|---|---|
| CN (1) | CN109140251A (en) |
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Application publication date: 20190104 |