CN109119961A - A kind of high-and-low-voltage bus way with temperature protector - Google Patents
A kind of high-and-low-voltage bus way with temperature protector Download PDFInfo
- Publication number
- CN109119961A CN109119961A CN201811280674.6A CN201811280674A CN109119961A CN 109119961 A CN109119961 A CN 109119961A CN 201811280674 A CN201811280674 A CN 201811280674A CN 109119961 A CN109119961 A CN 109119961A
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- CN
- China
- Prior art keywords
- shell
- heat
- low
- voltage bus
- conducting plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/06—Totally-enclosed installations, e.g. in metal casings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/10—Cooling
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of high-and-low-voltage bus ways with temperature protector; including shell; the upper surface of the shell is equipped with PLC controller; the input terminal of the PLC controller is electrically connected with the output end of external power supply; the inner surface of the shell is equipped with temperature sensor; the input terminal of the output end electrical connection PLC controller of the temperature sensor; the inside of the shell is placed with bus duct; the side surface of the bus duct is uniformly provided with wheel carrier; the outer surface of bus duct is equipped with insulating layer, and the upper surface of the shell is equipped with upper heat-conducting plate.This has the high-and-low-voltage bus way of temperature protector; pass through the cooling fin on heat pipe, semiconductor chilling plate and the lower heat-conducting plate on upper heat-conducting plate; good cooling effect can be played; heat pipe and cooling fin radiate for room temperature; reduce resource consumption, be beneficial to energy conservation environmental protection, semiconductor chilling plate is used for high efficiency and heat radiation; cooling effect is improved, temperature protection can be played the role of to circuit.
Description
Technical field
The present invention relates to bus duct technical field, specially a kind of high-and-low-voltage bus way with temperature protector.
Background technique
Bus duct is a kind of closed metal device being made of copper, aluminium busbar column, is used to be each element of decentralized system
Relatively high power is distributed, indoors more and more instead of wire and cable in the power Transmission trunk project project of low pressure.It is existing
Some has the high-and-low-voltage bus way of temperature protector, and most of cooling effect is poor, and good protection cannot be played to circuit
Effect, and resource consumption is larger, is unfavorable for energy conservation and environmental protection, while function is less, it is inconvenient for use.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the existing defects, provides a kind of high-low pressure with temperature protector
Bus duct can play good cooling effect, heat pipe and cooling fin and radiate for room temperature, reduce resource consumption, be conducive to
Energy conservation and environmental protection, semiconductor chilling plate are used for high efficiency and heat radiation, improve cooling effect, can play the role of temperature protection to circuit,
The problems in background technique can effectively be solved.
To achieve the above object, the invention provides the following technical scheme: a kind of high-low pressure bus with temperature protector
Slot, including shell, the upper surface of the shell are equipped with PLC controller, the input terminal of the PLC controller and external power supply it is defeated
Outlet electrical connection, the inner surface of the shell are equipped with temperature sensor, the output end electrical connection PLC control of the temperature sensor
The input terminal of device processed, the inside of the shell are placed with bus duct, and the side surface of the bus duct is uniformly provided with wheel carrier, female
The outer surface of wire casing is equipped with insulating layer, and the upper surface of the shell is equipped with upper heat-conducting plate, and the upper heat-conducting plate penetrates in shell
Portion, and the upper surface of the upper heat-conducting plate is evenly arranged with semiconductor chilling plate, the input terminal and PLC of the semiconductor chilling plate
The output end of controller is electrically connected, and the distance between adjacent semiconductor cooling piece is not more than 50 centimeters, the upper heat-conducting plate
Upper surface two sides be equipped with heat pipe, the evaporation ends of the heat pipe penetrate enclosure interior, and the condensation end of heat pipe is arranged in shell
The side surface of outside, the shell is equipped with damp-proof device.
As a preferred technical solution of the present invention, the lower surface of the shell is equipped with lower heat-conducting plate, lower heat-conducting plate
Lower surface is equipped with cooling fin.
As a preferred technical solution of the present invention, the both side surface of the shell offers heat release hole, heat release hole
Quantity be no less than three groups, and no less than three groups of heat release hole is equidistantly positioned.
As a preferred technical solution of the present invention, the inner surface of the heat release hole is equipped with installing pipe, installing pipe
Side surface be equipped with Air Filter.
As a preferred technical solution of the present invention, the damp-proof device includes the installation that casing lateral surfaces two sides open up
Slot slidably connects Damp-proof box in mounting groove, and the upper surface of Damp-proof box is uniformly provided with through-hole.
As a preferred technical solution of the present invention, the inside of the Damp-proof box is equipped with moisture resistant material, barrier material
Layer is silica gel damp-proof layer or calcium oxide damp-proof layer.
As a preferred technical solution of the present invention, the side surface of the Damp-proof box is equipped with knob, the side surface of knob
Equipped with anti-skid chequer.
As a preferred technical solution of the present invention, the both side surface of the shell is equipped with mounting blocks, mounting blocks
Upper surface is uniformly provided with mounting hole.
As a preferred technical solution of the present invention, the side surface of the mounting blocks is equipped with yielding rubber pad, damping rubber
It is splicing between rubber mat and mounting blocks.
As a preferred technical solution of the present invention, the inside of the shell offers cavity, is equipped in cavity heat-insulated
Material layer.
Compared with prior art, the beneficial effects of the present invention are:
1, this high-and-low-voltage bus way for having temperature protector, by heat pipe on upper heat-conducting plate, semiconductor chilling plate and
Cooling fin on lower heat-conducting plate can play good cooling effect, heat pipe and cooling fin and radiate for room temperature, reduce resource
Consumption, is beneficial to energy conservation environmental protection, and semiconductor chilling plate is used for high efficiency and heat radiation, improves cooling effect, can play temperature to circuit
Spend protective effect.
2, this high-and-low-voltage bus way for having temperature protector, can play the role of ventilation and heat by heat release hole, into
One step reduces resource consumption, while installing pipe is equipped in heat release hole, and the Air Filter in installing pipe is for preventing dust and miscellaneous
Object enters in shell, ensure that the normal operation of circuit, and installing pipe is taken out and cleared up or replaced in which can be convenient.
3, this high-and-low-voltage bus way for having temperature protector, can be played moisture-proof by the moisture resistant material in Damp-proof box
It acts on, steam etc. of the through-hole on Damp-proof box convenient for moisture resistant material absorption housing adjacent, Damp-proof box company of sliding in mounting groove
It connects, replace moisture resistant material with can be convenient, it is easy to operate.
4, this high-and-low-voltage bus way for having temperature protector, shell is installed fix by the mounting hole on mounting blocks,
The yielding rubber pad of mounting blocks side surface can play the role of bumper and absorbing shock, and insulation material layer is used for heat-insulating, fire-preventing, and function is rich
Richness, it is easy to use.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention;
Fig. 2 is side structure schematic view of the present invention.
In figure: 1 shell, 2 PLC controllers, heat-conducting plate, 31 heat pipes, 32 semiconductor chilling plates, 4 bus ducts, 5 hold lines on 3
Chamber, 6 heat release holes, 61 installing pipes, 62 Air Filters, 7 mounting grooves, 71 Damp-proof boxs, 72 knobs, 73 through-holes, 8 lower heat-conducting plates, 81 heat dissipations
Piece, 9 temperature sensors, 10 mounting blocks, 11 mounting holes, 12 yielding rubber pads, 13 insulating layers, 14 insulation material layers.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The present invention provides a kind of technical solution referring to FIG. 1-2: a kind of high-and-low-voltage bus way with temperature protector,
Including shell 1, the upper surface of shell 1 is equipped with PLC controller 2, the input terminal of PLC controller 2 and the output end electricity of external power supply
The inner surface of connection, the model mitsubishi FX2N of PLC controller 2 used, shell 1 is equipped with temperature sensor 9, temperature sensor
The input terminal of 9 output end electrical connection PLC controller 2, the inside of shell 1 are placed with bus duct 4, and the side surface of bus duct 4 is equal
Even to offer wheel carrier 5, the outer surface of bus duct 4 is equipped with insulating layer 13, and the upper surface of shell 1 is equipped with upper heat-conducting plate 3, above leads
Hot plate 3 penetrates inside shell 1, and the upper surface of upper heat-conducting plate 3 is evenly arranged with semiconductor chilling plate 32, semiconductor chilling plate 32
Input terminal be electrically connected with the output end of PLC controller 2, PLC controller 2 controls semiconductor chilling plate 32 and temperature sensor 9
Mode be method commonly used in the prior art, and the distance between adjacent semiconductor cooling piece 32 is not more than 50 centimeters,
The upper surface two sides of upper heat-conducting plate 3 are equipped with heat pipe 31, and the evaporation ends of heat pipe 31 penetrate inside shell 1, and the condensation of heat pipe 31
End is arranged outside shell 1, and the lower surface of shell 1 is equipped with lower heat-conducting plate 8, and the lower surface of lower heat-conducting plate 8 is equipped with cooling fin 81, leads to
The cooling fin 81 on the heat pipe 31 on heat-conducting plate 3, semiconductor chilling plate 32 and lower heat-conducting plate 8 is crossed, good drop can be played
Temperature effect, heat pipe 31 and cooling fin 81 radiate for room temperature, reduce resource consumption, are beneficial to energy conservation environmental protection, semiconductor refrigerating
Piece 32 is used for high efficiency and heat radiation, improves cooling effect, can play the role of temperature protection to circuit, the both side surface of shell 1 is equal
Heat release hole 6 is offered, the quantity of heat release hole 6 is no less than three groups, and no less than three groups of heat release hole 6 is equidistantly positioned, heat release hole 6
Inner surface installing pipe 61 is installed, the side surface of installing pipe 61 is equipped with Air Filter 62, can play ventilation by heat release hole 6
The effect of heat dissipation further reduces resource consumption, while being equipped with installing pipe 61 in heat release hole 6, dust-proof in installing pipe 61
Net 62 ensure that the normal operation of circuit, and installing pipe 61 takes in which can be convenient for preventing dust and sundries from entering in shell 1
It is cleared up or is replaced out, the side surface of shell 1 is equipped with damp-proof device, and damp-proof device includes that 1 side surface two sides of shell open up
Mounting groove 7 slidably connects Damp-proof box 71 in mounting groove 7, and the upper surface of Damp-proof box 71 is uniformly provided with through-hole 73, Damp-proof box 71
Inside be equipped with moisture resistant material, moisture resistant material be silica gel damp-proof layer or calcium oxide damp-proof layer, the side surface of Damp-proof box 71 is set
Have knob 72, shake hands 72 side surface be equipped with anti-skid chequer, moisture-proof role can be played by the moisture resistant material in Damp-proof box 71,
Convenient for the steam etc. near moisture resistant material absorption shell 1, Damp-proof box 71 slides through-hole 73 on Damp-proof box 71 in mounting groove 7
Connection, replaces moisture resistant material, easy to operate, the both side surface of shell 1 is equipped with mounting blocks 10, mounting blocks 10 in which can be convenient
Upper surface be uniformly provided with mounting hole 11, the side surface of mounting blocks 10 is equipped with yielding rubber pad 12, yielding rubber pad 12 and peace
It fills to be glued between block 10, the inside of shell 1 offers cavity, insulation material layer 14 is equipped in cavity, by mounting blocks 10
Mounting hole 11 shell 1 installed fix, the yielding rubber pad 12 of 10 side surface of mounting blocks can play the role of bumper and absorbing shock,
Insulation material layer 14 is used for heat-insulating, fire-preventing, feature-rich, easy to use.
When in use: at work, the heat generated in slot is passed by upper heat-conducting plate 3 and lower heat-conducting plate 8 bus duct 4 respectively
It leads outside shell 1, the cooling fin 81 on heat pipe 31 and lower heat-conducting plate 8 on upper heat-conducting plate 3 can reduce money with automatic heat radiation
Source consumption, is beneficial to energy conservation environmental protection;Temperature sensor 9 detects the temperature inside shell 1 and transmits corresponding signal to PLC controller
2, semiconductor chilling plate 32 is opened when PLC controller 2 judges that temperature is higher than setting value and carries out refrigeration temperature control, plays temperature guarantor
The effect of shield;It is put into silica gel damp-proof layer or calcium oxide damp-proof layer in Damp-proof box 71, Damp-proof box 71 is then put into mounting groove 7
It is interior, the steam etc. near shell 1 can be adsorbed, prevents circuit from making moist and influences to run well, it is feature-rich, it is easy to use.
The present invention by the cooling fin 81 on heat pipe 31, semiconductor chilling plate 32 and the lower heat-conducting plate 8 on upper heat-conducting plate 3,
Good cooling effect, heat pipe 31 and cooling fin 81 can be played to radiate for room temperature, reduce resource consumption, be beneficial to energy conservation
Environmental protection, semiconductor chilling plate 32 are used for high efficiency and heat radiation, improve cooling effect, can play the role of temperature protection to circuit;It is logical
Ventilation and heat can be played the role of by crossing heat release hole 6, further reduce resource consumption, while installation is equipped in heat release hole 6
Pipe 61, Air Filter 62 in installing pipe 61 ensure that the normal operation of circuit for preventing dust and sundries from entering in shell 1,
And installing pipe 61 is taken out and is cleared up or replaced in which can be convenient;It can be played by the moisture resistant material in Damp-proof box 71 moisture-proof
It acts on, the through-hole 73 on Damp-proof box 71 is convenient for the steam etc. near moisture resistant material absorption shell 1, and Damp-proof box 71 is in mounting groove 7
It is inside slidably connected, replaces moisture resistant material with can be convenient, it is easy to operate;By the mounting hole 11 on mounting blocks 10 by shell 1
Installation is fixed, and the yielding rubber pad 12 of 10 side surface of mounting blocks can play the role of bumper and absorbing shock, and insulation material layer 14 is used for
Heat-insulating, fire-preventing, it is feature-rich, it is easy to use.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of high-and-low-voltage bus way with temperature protector, including shell (1), it is characterised in that: the shell (1) it is upper
Surface is equipped with PLC controller (2), and the input terminal of the PLC controller (2) is electrically connected with the output end of external power supply, the shell
The inner surface of body (1) is equipped with temperature sensor (9), and the output end of the temperature sensor (9) is electrically connected PLC controller (2)
Input terminal, the inside of the shell (1) is placed with bus duct (4), and the side surface of the bus duct (4) is uniformly provided with appearance line
The outer surface of chamber (5), bus duct (4) is equipped with insulating layer (13), and the upper surface of the shell (1) is equipped with upper heat-conducting plate (3), institute
It states heat-conducting plate (3) and penetrates shell (1) inside, and the upper surface of the upper heat-conducting plate (3) is evenly arranged with semiconductor chilling plate
(32), the input terminal of the semiconductor chilling plate (32) is electrically connected with the output end of PLC controller (2), and adjacent semiconductor system
The distance between cold (32) are not more than 50 centimeters, and the upper surface two sides of the upper heat-conducting plate (3) are equipped with heat pipe (31), institute
The evaporation ends for stating heat pipe (31) penetrate shell (1) inside, and the condensation end setting of heat pipe (31) is external in shell (1), the shell
The side surface of body (1) is equipped with damp-proof device.
2. a kind of high-and-low-voltage bus way with temperature protector according to claim 1, it is characterised in that: the shell
(1) lower surface is equipped with lower heat-conducting plate (8), and the lower surface of lower heat-conducting plate (8) is equipped with cooling fin (81).
3. a kind of high-and-low-voltage bus way with temperature protector according to claim 1, it is characterised in that: the shell
(1) both side surface offers heat release hole (6), and the quantity of heat release hole (6) is no less than three groups, and no less than three groups of heat release hole
(6) it is equidistantly positioned.
4. a kind of high-and-low-voltage bus way with temperature protector according to claim 3, it is characterised in that: the heat dissipation
The inner surface in hole (6) is equipped with installing pipe (61), and the side surface of installing pipe (61) is equipped with Air Filter (62).
5. a kind of high-and-low-voltage bus way with temperature protector according to claim 1, it is characterised in that: described moisture-proof
Device includes the mounting groove (7) that shell (1) side surface two sides open up, and is slidably connected Damp-proof box (71) in mounting groove (7), moisture-proof
The upper surface of box (71) is uniformly provided with through-hole (73).
6. a kind of high-and-low-voltage bus way with temperature protector according to claim 5, it is characterised in that: described moisture-proof
The inside of box (71) is equipped with moisture resistant material, and moisture resistant material is silica gel damp-proof layer or calcium oxide damp-proof layer.
7. a kind of high-and-low-voltage bus way with temperature protector according to claim 5, it is characterised in that: described moisture-proof
The side surface of box (71) is equipped with knob (72), and the side surface of knob (72) is equipped with anti-skid chequer.
8. a kind of high-and-low-voltage bus way with temperature protector according to claim 1, it is characterised in that: the shell
(1) both side surface is equipped with mounting blocks (10), and the upper surface of mounting blocks (10) is uniformly provided with mounting hole (11).
9. a kind of high-and-low-voltage bus way with temperature protector according to claim 8, it is characterised in that: the installation
The side surface of block (10) is equipped with yielding rubber pad (12), is glued between yielding rubber pad (12) and mounting blocks (10).
10. a kind of high-and-low-voltage bus way with temperature protector according to claim 1, it is characterised in that: the shell
The inside of body (1) offers cavity, is equipped with insulation material layer (14) in cavity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811280674.6A CN109119961A (en) | 2018-10-30 | 2018-10-30 | A kind of high-and-low-voltage bus way with temperature protector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811280674.6A CN109119961A (en) | 2018-10-30 | 2018-10-30 | A kind of high-and-low-voltage bus way with temperature protector |
Publications (1)
Publication Number | Publication Date |
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CN109119961A true CN109119961A (en) | 2019-01-01 |
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ID=64854460
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CN201811280674.6A Withdrawn CN109119961A (en) | 2018-10-30 | 2018-10-30 | A kind of high-and-low-voltage bus way with temperature protector |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111884154A (en) * | 2020-08-05 | 2020-11-03 | 李锋 | Energy-saving bus duct with high-protection-level copper-aluminum composite conductor |
WO2021102868A1 (en) * | 2019-11-27 | 2021-06-03 | 扬州仁智信息科技有限公司 | Copper-aluminum composite bus duct |
CN113097955A (en) * | 2021-04-22 | 2021-07-09 | 江苏奥凯电气有限公司 | Bus duct with temperature control device |
CN113760006A (en) * | 2021-09-23 | 2021-12-07 | 沈阳铝镁设计研究院有限公司 | High-power rectification water-cooling bus temperature protection device and working method thereof |
-
2018
- 2018-10-30 CN CN201811280674.6A patent/CN109119961A/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021102868A1 (en) * | 2019-11-27 | 2021-06-03 | 扬州仁智信息科技有限公司 | Copper-aluminum composite bus duct |
CN111884154A (en) * | 2020-08-05 | 2020-11-03 | 李锋 | Energy-saving bus duct with high-protection-level copper-aluminum composite conductor |
CN113097955A (en) * | 2021-04-22 | 2021-07-09 | 江苏奥凯电气有限公司 | Bus duct with temperature control device |
CN113760006A (en) * | 2021-09-23 | 2021-12-07 | 沈阳铝镁设计研究院有限公司 | High-power rectification water-cooling bus temperature protection device and working method thereof |
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Application publication date: 20190101 |