CN109119545A - A kind of display device and preparation method thereof - Google Patents
A kind of display device and preparation method thereof Download PDFInfo
- Publication number
- CN109119545A CN109119545A CN201710484674.7A CN201710484674A CN109119545A CN 109119545 A CN109119545 A CN 109119545A CN 201710484674 A CN201710484674 A CN 201710484674A CN 109119545 A CN109119545 A CN 109119545A
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- China
- Prior art keywords
- layer
- display device
- cover board
- glass substrate
- packaging plastic
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The present invention relates to display technology fields, more particularly to a kind of display device and preparation method thereof, the packing material with preset range refractive index is full of by the area of space between display module and cover board and packaging plastic, change the refractive index that display module projects different medium on light propagation path, to effectively improve the light extraction efficiency of display device, and then promote the display performance of display device.
Description
Technical field
The present invention relates to display technology fields more particularly to a kind of display device and preparation method thereof.
Background technique
With the development of display technology, requirement of the consumer for video and audio product is higher and higher, for display manufacturer,
Produce high-resolution, the display of high image quality is developing direction, and Organic Light Emitting Diode (Organic Light Emitting
Diode, OLED) since it with self-luminous, high brightness, wide viewing angle, fast reaction and RGB full-color component the spies such as can all make
Matter has been widely used in display, and the application of OLED display panel comes into practical stage at present, in the market
There are automobile audio and mobile phone using OLED display panel, OLED display panel will be widely used in take action product, pen from now on
Remember in the frivolous escope such as this computer, monitor, wall hung television, and the development of true color will improve the competition of OLED product
Power.
Currently, not contacting between display module and cover board in the structure of display panel, there is vacuum layer, and show mould
When the light of group transmitting projects display panel through cover board through the vacuum layer, light extraction efficiency is only capable of reaching 80%~85% left side
The right side, i.e., there are also nearly 15% light can not project display device, thereby reduces the display performance of product, this is this field skill
What art personnel were unwilling to see.
Summary of the invention
In view of the above problems, the invention discloses a kind of display devices, comprising:
Glass substrate, with device region and around the encapsulation region of device region setting;
Display module is set on the device region of the glass substrate;
Packaging plastic is arranged on the encapsulation region of the glass substrate and around the display module;
Cover board is pressed on the packaging plastic, with together with the packaging plastic and the glass substrate by the display
Mould group is sealed;And
Transparent filled layer, full of the area of space between the display module and the cover board and the packaging plastic.
Above-mentioned display device, wherein the light of the display module transmitting passes through described through the transparent filled layer
Cover board projects the display device.
Above-mentioned display device, wherein the ranges of indices of refraction of the transparent filled layer is 1.2~2.4.
Above-mentioned display device, wherein the transparent filled layer is macromolecule epoxy resin material.
Above-mentioned display device, wherein the glass substrate is non-flexible glass substrate.
Above-mentioned display device, wherein the display module successively includes anode, You Jigong according to sequence from bottom to up
Ergosphere and cathode.
Above-mentioned display device, wherein the organic function layer includes hole injection layer, hole transmission layer, electronic blocking
Layer, luminescent layer, hole blocking layer, electron transfer layer, all or part in electron injecting layer.
The invention also discloses a kind of preparation methods of display device, comprising:
One glass substrate with device region and around the encapsulation region of the device region, and the device of the glass substrate are provided
Part is provided with display module in area;
There is provided a cover board, and the cover board corresponds to the position of the encapsulation region of the glass substrate and is provided with seal area;
In coating packaging plastic on the seal area of the cover board;
In being coated with transparent material on the cover board in the circular region of the packaging plastic;
The cover board is pressed on the glass substrate, in the display module and the cover board and the encapsulation
Filled layer is formed between glue;
After carrying out curing process to the packaging plastic, continue cutting technique, to form the display device.
The preparation method of above-mentioned display device, wherein the light of the display module transmitting is worn through the filled layer
It crosses the cover board and projects the display device.
The preparation method of above-mentioned display device, wherein the ranges of indices of refraction of the filled layer is 1.2~2.4.
The preparation method of above-mentioned display device, wherein the material macromolecule epoxy resin material of the filled layer.
The preparation method of above-mentioned display device, wherein the lid being set forth in the circular region of the packaging plastic
The step of transparent material is coated on plate specifically:
The macromolecule epoxy resin material packaging plastic is coated on by the way of spraying or spin coating to surround
Region in the cover board on.
The preparation method of above-mentioned display device, wherein it is described that the cover board is pressed on the glass substrate, with
The step of filled layer is formed between the display module and the cover board and the packaging plastic specifically:
The cover board is pressed under vacuum conditions using vacuum pressing-combining cavity (Vacuum Assemble System)
On the glass substrate, to form the filled layer between the display module and the cover board and the packaging plastic.
The preparation method of above-mentioned display device, wherein the glass substrate is non-flexible glass substrate.
The preparation method of above-mentioned display device, wherein prepare the display module according to sequence from bottom to up successively
Including anode, organic function layer and cathode.
The preparation method of above-mentioned display device, wherein preparing the organic function layer includes hole injection layer, hole biography
Defeated layer, electronic barrier layer, luminescent layer, hole blocking layer, electron transfer layer, all or part in electron injecting layer.
Foregoing invention is with the following advantages or beneficial effects:
The invention discloses a kind of display devices and preparation method thereof, by between display module and cover board and packaging plastic
Area of space (original vacuum layer) be full of with preset range refractive index packing material, change display module project light
The refractive index of different medium on propagation path to effectively improve the light extraction efficiency of display device, and then promotes display device
Display performance.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, the present invention and its feature, outer
Shape and advantage will become more apparent.Identical label indicates identical part in all the attached drawings.Not can according to than
Example draws attached drawing, it is preferred that emphasis is shows the gist of the present invention.
Fig. 1 is the structural schematic diagram of the display device in the embodiment of the present invention;
Fig. 2 is redgreenblue light transmission with packing material variations in refractive index curve synoptic diagram;
Fig. 3 is redgreenblue light oblique incidence light transmittance and oblique fire angle relation curve schematic diagram;
Fig. 4 is that total transmitance and light-emitting angle change correlation curve schematic diagram;
Fig. 5 is the method flow diagram for preparing display device in the embodiment of the present invention;
Fig. 6~10 are the method flow structural schematic diagrams for preparing display device in the embodiment of the present invention.
Specific embodiment
The present invention is further illustrated with specific embodiment with reference to the accompanying drawing, but not as limit of the invention
It is fixed.
Embodiment one:
As shown in Figure 1, the present embodiment is related to a kind of display device, including with device region and around device region setting
The glass substrate 101 of encapsulation region, is located at glass substrate 101 at the display module 102 being set on the device region of glass substrate 101
Encapsulation region on and around display module 102 be arranged packaging plastic 103, be pressed on packaging plastic 103, with packaging plastic 103
The cover board 104 that is together sealed display module 102 with glass substrate 101 and full of display module 102 and cover board 104 and
The transparent filled layer 105 of area of space between packaging plastic 103.
In a preferred embodiment of the invention, the light that above-mentioned display module 102 emits penetrates transparent filled layer 105
Display device is projected across cover board 104, i.e. the display device is top light-emitting display device.
In a preferred embodiment of the invention, the ranges of indices of refraction of above-mentioned transparent filled layer 105 is 1.2~2.4 (examples
Such as 1.2,1.6,1.8 or 2.4).
In a preferred embodiment of the invention, above-mentioned transparent filled layer 105 is macromolecule epoxy resin material.
In a preferred embodiment of the invention, above-mentioned glass substrate 101 is non-flexible glass substrate.
In a preferred embodiment of the invention, above-mentioned display module 102 successively includes according to sequence from bottom to up
Anode, organic function layer and cathode.
On this basis, further, organic function layer includes hole injection layer, hole transmission layer, electronic barrier layer, hair
Photosphere, hole blocking layer, electron transfer layer, all or part in electron injecting layer, due to the specific knot of the display module 102
Structure and the improved emphasis of non-present invention, are not just repeated herein.
Advantage of the invention is further described with specific experiment below:
Assuming that the refractive index of cover board is n1(about 1.5), the refractive index of transparent filled layer are n2(1.2~2.4):
One, when incident ray incidence angle is 0 °, transmissivity (light transmittance or light extraction efficiency can also be referred to as) and medium
Refractive Index of Material relationship are as follows:
The present embodiment is according to the relationship of transmissivity and interface two sides refractive index export light via the (refraction of Caping (encapsulation) layer
Rate is about 2.2), the transmitance relation curve of light is as shown in Figure 2 after three layers of vacuum layer (filled layer), cover board medium.It can from Fig. 2
To find out, when the area of space between display module and cover board and packaging plastic becomes transparent filled layer (n=from vacuum layer (n=1)
1.4) when, total transmissivity has about 10% or so promotion.
Two, when incident ray incidence angle is not 0 deg, transmissivity (light transmittance or light extraction efficiency can also be referred to as) and Jie
The relationship of material refractive index are as follows:
n1sinθ1=n2sinθ2
Rs=[sin (θ1-θ2)/sin(θ1+θ2)/]^2
Rp=[tan (θ1-θ2)/tan(θ1+θ2)/]^2
T=1- (Rs+Rp)/2
n1Refractive Index of Material where incident light;n2Refractive Index of Material where emergent light;
θ1Incidence angle;θ2The angle of emergence;RsIncident light s component reflectivity;
RpIncident light p-component reflectivity;T transmitance;
From figure 3, it can be seen that when the area of space between display module and cover board and packaging plastic is from vacuum layer (n=1)
When becoming transparent filled layer (n=1.4), not only original incidence angle is extracted for 30 °~35 ° light being totally reflected, and
And incidence angle is the promotion that 5 °~30 ° of light has 10% or so in transmissivity before.
And as seen from Figure 4, when the area of space between display module and cover board and packaging plastic is from vacuum layer (n=1)
After becoming transparent filled layer (n=1.4), the light intensity of light all angles has increase out, and as the increase of shooting angle is emitted
Gain in strength amplitude is being gradually reduced.
Embodiment two:
As shown in figure 5, the present embodiment is related to a kind of preparation method of display device, specifically, this method includes following step
It is rapid:
Step 1, providing one has device region and the glass substrate 1 around the encapsulation region of device region, and glass substrate 1
Display module 2, structure as shown in FIG. 6 are provided on device region.
In a preferred embodiment of the invention, preparing display module 2 according to sequence from bottom to up successively includes
Anode, organic function layer and cathode.
In a preferred embodiment of the invention, prepare organic function layer include hole injection layer, hole transmission layer,
Electronic barrier layer, luminescent layer, hole blocking layer, electron transfer layer, all or part in electron injecting layer.
In an embodiment of the present invention, above-mentioned steps one specifically include:
Firstly, providing the TFT substrate (glass substrate) of anode material (anode material includes silverskin and ito film layer).
Secondly, in the first hole injection layer HIL1 (hole-injection-layer, letter are successively deposited in the TFT substrate
Claim HIL), the first hole injection layer HIL2, in an embodiment of the present invention, plated film vacuum degree < 5e-6Tor.
Again, bluish-green red trichromatism HTL (Hole Transport Layer, hole transmission layer) is successively deposited, EML (shines
Layer) film layer.
Then, HBL (hole blocking layer, hole blocking layer), EIL (Electron Injection is deposited
Layer, electron injecting layer) film layer.
Later, evaporation cathode film layer and encapsulation film layer (Caping).
In a preferred embodiment of the invention, above-mentioned glass substrate 1 is non-flexible glass substrate.
Step 2 provides a cover board 3, and the position of the encapsulation region of the corresponding glass substrate 1 of cover board 3 is provided with seal area, such as
Structure shown in Fig. 7.
Step 3, in coating packaging plastic 4 (being completed by sealing machine) on the seal area of cover board 3, it is preferred that the packaging plastic 4 is
Glass cement;Structure as shown in Figure 8.
Step 4, in coating transparent material 5 on the cover board 3 in the circular region of packaging plastic 4, it is preferred that the transparent material
Material is macromolecule epoxy resin material;Structure as shown in Figure 9.
It is transparent in being coated on the cover board 3 in the circular region of packaging plastic 4 in a preferred embodiment of the invention
The step of material 5 specifically:
Macromolecule epoxy resin material is coated in the circular region of packaging plastic 4 by the way of spraying or spin coating
Cover board 3 on.
Cover board 3 is pressed on glass substrate 1 by step 5, with the shape between display module 2 and cover board 3 and packaging plastic 4
At filled layer 5;Structure as shown in Figure 10;
In a preferred embodiment of the invention, cover board 3 is pressed on glass substrate 1, in display module 2
The step of filled layer 5 are formed between cover board 3 and packaging plastic 4 specifically:
Using vacuum pressing-combining cavity (Vacuum Assemble System), under conditions of 1-100pa vacuum, by cover board
3 and substrate fit together.Then the atmospheric environment that vacuum returns to 105pa is destroyed, under the pressure of atmosphere, 3 He of cover board
Glass substrate 1 can be close to;Due to being the environment of vacuum, the macromolecule epoxy resin material of coating between cover board 3 and glass substrate 1
Material can form filled layer 5 by siphonage full of the area of space between display module 2 and cover board 3 and packaging plastic 4.
In a preferred embodiment of the invention, the ranges of indices of refraction of above-mentioned filled layer 5 be 1.2~2.4 (such as 1.2,
1.6,1.8 or 2.4 etc.).
Step 6 after carrying out curing process (sintering) to packaging plastic 4, continues cutting technique, to form display device.
In a preferred embodiment of the invention, the light that display module 2 emits passes through cover board 3 through filled layer 5
Project display device.
It is not difficult to find that the present embodiment is embodiment of the method corresponding with the embodiment of aforementioned display device part, the present embodiment
Can work in coordination implementation with the embodiment of aforementioned display device part.The relevant technical details mentioned in the embodiment of aforementioned display device part
Still effectively in the present embodiment, in order to reduce repetition, which is not described herein again.Correspondingly, the correlation mentioned in present embodiment
Technical detail is also applicable in the embodiment of aforementioned display device part.
To sum up, the invention discloses a kind of display devices and preparation method thereof, by display module and cover board and encapsulation
Area of space (original vacuum layer) between glue is full of the packing material with preset range refractive index, changes display module and penetrates
Out on light propagation path different medium refractive index, to effectively improve the light extraction efficiency of display device, and then promoted aobvious
Show the display performance of device.
It should be appreciated by those skilled in the art that those skilled in the art are combining the prior art and above-described embodiment can be with
Realize change case, this will not be repeated here.Such change case does not affect the essence of the present invention, and it will not be described here.
Presently preferred embodiments of the present invention is described above.It is to be appreciated that the invention is not limited to above-mentioned
Particular implementation, devices and structures not described in detail herein should be understood as gives reality with the common mode in this field
It applies;Anyone skilled in the art, without departing from the scope of the technical proposal of the invention, all using the disclosure above
Methods and technical content many possible changes and modifications are made to technical solution of the present invention, or be revised as equivalent variations etc.
Embodiment is imitated, this is not affected the essence of the present invention.Therefore, anything that does not depart from the technical scheme of the invention, foundation
Technical spirit of the invention any simple modifications, equivalents, and modifications made to the above embodiment, still fall within the present invention
In the range of technical solution protection.
Claims (16)
1. a kind of display device characterized by comprising
Glass substrate, with device region and around the encapsulation region of device region setting;
Display module is set on the device region of the glass substrate;
Packaging plastic is arranged on the encapsulation region of the glass substrate and around the display module;
Cover board is pressed on the packaging plastic, with together with the packaging plastic and the glass substrate by the display module
It is sealed;And
Transparent filled layer, full of the area of space between the display module and the cover board and the packaging plastic.
2. display device as described in claim 1, which is characterized in that the light of the display module transmitting is through described transparent
Filled layer passes through the cover board and projects the display device.
3. display device as described in claim 1, which is characterized in that the ranges of indices of refraction of the transparent filled layer be 1.2~
2.4。
4. display device as claimed in claim 3, which is characterized in that the transparent filled layer is macromolecule epoxy resin material
Material.
5. display device as described in claim 1, which is characterized in that the glass substrate is non-flexible glass substrate.
6. display device as described in claim 1, which is characterized in that the display module according to sequence from bottom to up successively
Including anode, organic function layer and cathode.
7. OLED display panel as claimed in claim 6, which is characterized in that the organic function layer include hole injection layer,
Hole transmission layer, electronic barrier layer, luminescent layer, hole blocking layer, electron transfer layer, all or part in electron injecting layer.
8. a kind of preparation method of display device characterized by comprising
One glass substrate with device region and around the encapsulation region of the device region, and the device region of the glass substrate are provided
On be provided with display module;
There is provided a cover board, and the cover board corresponds to the position of the encapsulation region of the glass substrate and is provided with seal area;
In coating packaging plastic on the seal area of the cover board;
In being coated with transparent material on the cover board in the circular region of the packaging plastic;
The cover board is pressed on the glass substrate, with the display module and the cover board and the packaging plastic it
Between form filled layer;
After carrying out curing process to the packaging plastic, continue cutting technique, to form the display device.
9. the preparation method of display device as claimed in claim 8, which is characterized in that the light of the display module transmitting is saturating
It crosses the filled layer and projects the display device across the cover board.
10. the preparation method of display device as claimed in claim 9, which is characterized in that the ranges of indices of refraction of the filled layer
It is 1.2~2.4.
11. the preparation method of display device as claimed in claim 10, which is characterized in that the material macromolecule of the filled layer
Epoxide resin material.
12. the preparation method of display device as claimed in claim 11, which is characterized in that be set forth in the packaging plastic and surround
Region in the cover board on be coated with transparent material the step of specifically:
The macromolecule epoxy resin material is coated on the circular area of the packaging plastic by the way of spraying or spin coating
On the cover board in domain.
13. the preparation method of display device as claimed in claim 8, which is characterized in that
It is described that the cover board is pressed on the glass substrate, in the display module and the cover board and the encapsulation
The step of filled layer is formed between glue specifically:
The cover board is pressed on the glass substrate under vacuum conditions using vacuum pressing-combining cavity, in the display
The filled layer is formed between mould group and the cover board and the packaging plastic.
14. the preparation method of display device as claimed in claim 8, which is characterized in that the glass substrate is non-flexible glass
Glass substrate.
15. display device as claimed in claim 8, which is characterized in that it is suitable according to from bottom to up to prepare the display module
Sequence successively includes anode, organic function layer and cathode.
16. OLED display panel as claimed in claim 15, which is characterized in that preparing the organic function layer includes hole note
Enter layer, hole transmission layer, electronic barrier layer, luminescent layer, hole blocking layer, electron transfer layer, the whole in electron injecting layer or
Part.
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1459996A (en) * | 2002-05-23 | 2003-12-03 | 三星Sdi株式会社 | Method for sealing organic electroluminescence device and luminescence plate using this method |
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2017
- 2017-06-23 CN CN201710484674.7A patent/CN109119545A/en active Pending
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Publication number | Priority date | Publication date | Assignee | Title |
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CN1459996A (en) * | 2002-05-23 | 2003-12-03 | 三星Sdi株式会社 | Method for sealing organic electroluminescence device and luminescence plate using this method |
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Application publication date: 20190101 |