CN109108278B - Silver-plated plastic microsphere for solar cell conductive circuit and preparation method thereof - Google Patents
Silver-plated plastic microsphere for solar cell conductive circuit and preparation method thereof Download PDFInfo
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- CN109108278B CN109108278B CN201810464850.5A CN201810464850A CN109108278B CN 109108278 B CN109108278 B CN 109108278B CN 201810464850 A CN201810464850 A CN 201810464850A CN 109108278 B CN109108278 B CN 109108278B
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- 239000004005 microsphere Substances 0.000 title claims abstract description 81
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 51
- 229910052709 silver Inorganic materials 0.000 claims abstract description 26
- 239000004332 silver Substances 0.000 claims abstract description 26
- 239000002270 dispersing agent Substances 0.000 claims abstract description 18
- 238000003756 stirring Methods 0.000 claims abstract description 18
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims abstract description 11
- PLKATZNSTYDYJW-UHFFFAOYSA-N azane silver Chemical compound N.[Ag] PLKATZNSTYDYJW-UHFFFAOYSA-N 0.000 claims abstract description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 230000001235 sensitizing effect Effects 0.000 claims abstract description 8
- 150000001412 amines Chemical class 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 7
- 238000001914 filtration Methods 0.000 claims abstract description 7
- 238000002791 soaking Methods 0.000 claims abstract description 7
- 239000003760 tallow Substances 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims abstract description 6
- 238000011282 treatment Methods 0.000 claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims abstract description 5
- 239000002244 precipitate Substances 0.000 claims abstract description 4
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 27
- 239000008367 deionised water Substances 0.000 claims description 24
- 229910021641 deionized water Inorganic materials 0.000 claims description 24
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 20
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 18
- 238000002156 mixing Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 239000002002 slurry Substances 0.000 claims description 10
- ZZZCUOFIHGPKAK-UHFFFAOYSA-N D-erythro-ascorbic acid Natural products OCC1OC(=O)C(O)=C1O ZZZCUOFIHGPKAK-UHFFFAOYSA-N 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 229930003268 Vitamin C Natural products 0.000 claims description 9
- 235000019154 vitamin C Nutrition 0.000 claims description 9
- 239000011718 vitamin C Substances 0.000 claims description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 7
- 108010010803 Gelatin Proteins 0.000 claims description 7
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 7
- 229910052731 fluorine Inorganic materials 0.000 claims description 7
- 239000011737 fluorine Substances 0.000 claims description 7
- 239000008273 gelatin Substances 0.000 claims description 7
- 229920000159 gelatin Polymers 0.000 claims description 7
- 235000019322 gelatine Nutrition 0.000 claims description 7
- 235000011852 gelatine desserts Nutrition 0.000 claims description 7
- 229910017604 nitric acid Inorganic materials 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 7
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 claims description 6
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 6
- 239000001863 hydroxypropyl cellulose Substances 0.000 claims description 6
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 claims description 6
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims description 4
- KXOXLYRTAZLDIS-MXWKQRLJSA-N (2R)-1-[(2S)-1-[(2R)-1-ethoxypropan-2-yl]oxypropan-2-yl]oxypropan-2-ol Chemical compound CCOC[C@@H](C)OC[C@H](C)OC[C@@H](C)O KXOXLYRTAZLDIS-MXWKQRLJSA-N 0.000 claims description 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 3
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 claims description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 3
- 206010070834 Sensitisation Diseases 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 235000019353 potassium silicate Nutrition 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 230000008313 sensitization Effects 0.000 claims description 3
- 238000000354 decomposition reaction Methods 0.000 claims description 2
- 230000001788 irregular Effects 0.000 claims description 2
- 239000006260 foam Substances 0.000 claims 1
- 238000005303 weighing Methods 0.000 claims 1
- 238000001132 ultrasonic dispersion Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000005245 sintering Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- General Physics & Mathematics (AREA)
- Sustainable Energy (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
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Abstract
A silver-plated plastic microsphere for a solar cell conductive circuit is prepared by plating silver on the surface of a foamed microsphere to prepare a silver-plated plastic microsphere; the preparation method comprises the following steps: preparing silver-ammonia solution B, (II) preparing reducing solution A, (III) sensitizing plastic microspheres, (IV) putting the sensitized plastic microspheres into the silver-ammonia solution B in the step (I), pouring the solution into an ultrasonic disperser at the same time, stirring and dispersing, continuously adding the reducing solution A in the step (II) under the environment of ultrasonic dispersion treatment, taking out the plastic microsphere precipitate after silver plating is finished after the reducing solution A is completely added, and then filtering and cleaning; then using ethanol mixed with tallow amine as a dispersing agent for treatment, stirring, soaking, separating and drying to prepare silver-plated plastic microspheres; the silver content of the silver-plated plastic microspheres is only 30-50% actually, and is reduced by about 40% compared with the traditional content, so that the silver consumption is greatly reduced, and the cost is reduced by about 30-40% suddenly.
Description
Technical Field
The invention relates to a raw material for preparing a solar electromagnetic conductive circuit and a preparation method thereof, in particular to silver-plated plastic microspheres for a solar cell conductive circuit and a preparation method thereof
Background
The conductive silver powder is generally used in the market at present, the conductive silver powder with the silver content of more than 99.5 percent is required to be prepared into conductive paste, and the conductive paste is silk-screened on the functional surface of an electronic product, or is in a line shape or a point connecting line shape and other conductive lines with different shapes, and the purpose is to conduct electricity. Silver-plated copper powder, silver-plated nickel powder and the like are adopted to try to reduce the consumption of silver to reduce the cost, but the nickel or the copper after being plated with the silver has various defects, and particularly, the copper or the nickel is seriously oxidized due to high temperature in the aspect of high-temperature sintering, so the conductivity of the final lead is seriously influenced.
Disclosure of Invention
A silver-plated plastic microsphere is used on the conductive circuit of various electronic products, such as automobile glass heating circuits, single-chip glass touch screens and solar cell electronic products, can save the consumption of silver, does not influence the conductive performance and saves the cost of the electronic products. After the silver-plated plastic microspheres are used for preparing the conductive silk-screen paste, various circuits are subjected to medium-temperature or high-temperature sintering to form hollow foam-shaped conductive circuits, so that the conductive silk-screen paste has excellent conductivity, meets the performance requirements of various electronic products, and has the cost which is only 30-50% of that of the original conductive silver powder, therefore, the cost of the electronic products can be reduced. The invention is mainly applied to the solar cell conducting circuit and can also be applied to other products.
The invention utilizes plastic microspheres, selects foaming microspheres with corresponding particle sizes, adopts a chemical silver plating method to plate silver on the foaming microspheres to prepare silver-plated plastic microspheres with different silver contents of 30-50%, and after silver paste is printed on an electronic product and is sintered at high temperature (600-800 ℃), the foaming microspheres made of plastic materials are completely decomposed by heating, and silver-plated spherical shells are left to be tightly connected together to form foam-shaped conductive lines, thereby being beneficial to improving the contact conductivity and saving the silver consumption.
In order to solve the technical problems, the invention adopts a technical scheme that:
a silver-plated plastic microsphere for a solar cell conductive circuit is characterized by comprising a plastic microsphere, wherein a silver layer is plated on the surface of the foamed microsphere to prepare the silver-plated plastic microsphere.
The invention also comprises a preparation method of the silver-plated plastic microspheres for the solar cell conductive circuit, which is characterized by comprising the following steps of:
firstly, silver nitrate is selected as a silver source, the silver nitrate is dissolved into a solution, and a silver ammonia solution B is prepared according to the following specific formula in percentage by mass:
(1) preparing a silver nitrate solution:
the specific formula is as follows:
silver nitrate: 10% -40%;
deionized water: 60% -90%;
mixing silver nitrate and deionized water according to the proportion to prepare a silver nitrate solution for later use;
(2) mixing 85-98% of silver nitrate solution, 1-10% of ammonia water and 1-5% of sodium hydroxide solution according to mass percentage to obtain silver-ammonia solution B for later use;
and (II) preparing a reducing solution A by using vitamin C as a reducing agent, wherein the specific formula comprises the following components in percentage by mass:
vitamin C: 5% -30%;
deionized water: 60% -80%;
nitric acid: 0.5% -1%;
fluorine-containing dispersant 3000: 0.1% -0.5%;
gelatin: 0.1% -0.5%;
according to the proportion, firstly, deionized water is weighed and poured into a 316# stainless steel dispersing barrel, then vitamin C is added, the mixture is stirred until the mixture becomes clear and transparent solution, then nitric acid is slowly dropped, and then the fluorine-containing dispersing agent 3000 is added; adding gelatin into hot water in advance for dissolving, and adding into the solution in the dispersing barrel to obtain a reducing solution A for later use;
(III) sensitization treatment of plastic microspheres:
(1) preparing a sensitizing solution C, wherein the specific formula comprises the following components in percentage by mass:
tin chloride: 5% -20%;
hydrochloric acid: 10% -30%;
hydrofluoric acid: 1% -5%;
deionized water: 50% -80%;
organic silicon dispersant: 0.1% -0.5%;
mixing and dispersing the materials in a 316# stainless steel dispersing barrel according to the proportion to obtain a sensitizing solution C, putting the plastic microspheres into the sensitizing solution C, soaking and stirring for 30min, filtering out the plastic microspheres, washing with deionized water, dehydrating by a centrifugal machine, and drying to obtain sensitized plastic microspheres for later use;
putting the sensitized plastic microspheres into the silver-ammonia solution B in the step (I), pouring the solution into an ultrasonic disperser at the same time, stirring and dispersing for 10min, continuously and slowly adding the reducing solution A in the step (II) in the ultrasonic dispersing environment, adjusting the adding rate when adding, controlling the dropping rate by using a throttle valve and a microcomputer, taking out the silver-plated plastic microsphere precipitate after the reducing solution A is completely added, and then filtering and cleaning; mixing with ethanol, and treating with 1% tallow amine as dispersant, stirring, soaking for 30min, separating, and drying to obtain silver-plated plastic microsphere.
The application of the silver-plated plastic microspheres as silver powder in solar conductive silver paste to replace pure silver powder specifically comprises the following steps: the silver-plated plastic microspheres are applied to solar conductive silver paste to replace pure silver powder. Selecting water-soluble hydroxypropyl cellulose (HPC) as an organic binder, selecting tallow amine as a dispersant, and matching with ethylene glycol phenyl ether, diethylene glycol butyl ether, tripropylene glycol ethyl ether and deionized water as organic solvents to prepare a pre-use material D; and (3) placing the pre-used material D into a 316# stainless steel dispersing barrel, adding the liquid glass mixture and the grinding aid A under the condition of slow stirring by a planetary stirrer, finally adding the silver-plated plastic microspheres, and stirring for 120 minutes until the mixture is uniformly dispersed without soft agglomerated granular matters. Moving the silver-plated plastic microsphere slurry into a three-roller dispersion machine, and carrying out three-roller slurry rolling on the silver-plated plastic microsphere slurry for 10 times according to proper conditions to obtain a finished product. And manufacturing the solar conductive silver paste suitable for printing, and applying the solar conductive silver paste to the crystalline silicon solar cell.
The invention has the beneficial effects that:
(1) the silver-plated plastic microspheres are used for manufacturing the solar cell conductive silver paste to replace pure silver powder, so that the crystalline silicon solar cell electrode is finer, the height-width ratio is larger, the light receiving area of the cell is large, the series resistance is lower, and the conversion efficiency is higher. The technical key point is that the silver-plated plastic microspheres can be completely decomposed and do not remain after receiving the sintering temperature of 600-800 ℃, and only silver substances are left to be combined with glass frit to grow on the crystalline silicon battery, so that excellent conductivity is formed. Because the spherical silver-plated plastic microspheres are in arc-to-arc contact with each other in a spherical surface before encountering high temperature, the contact surface is small, and the resistance is high; after high-temperature sintering, the plastic microspheres can form broken wall type decomposition to break the silver plating layer, so that the silver plating layer forms irregular polyhedron or multi-foot claw-shaped contact with the suede, the contact area between the ball and the sphere is greatly increased, the resistance is small, the current is large, and the conversion efficiency of the battery can be improved.
(2) Meanwhile, the silver-plated plastic microspheres with the silver content of 30-35% are used, namely 80-90% of the silver paste is added, the silver content is only 30-50% actually, the content is reduced by about 40% compared with the traditional content, the silver content is greatly reduced, the cost is reduced by about 30-40% suddenly, the cost of the solar cell is correspondingly reduced by 10-20%, and the method is a good method for improving the efficiency and reducing the cost.
Drawings
FIG. 1 is a schematic structural view of silver-plated plastic microspheres of the present invention.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to specific examples.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
A silver-plated plastic microsphere for a solar cell conductive circuit is characterized by comprising a plastic microsphere 1, and a silver layer 2 is plated on the surface of the plastic microsphere 1 to prepare the silver-plated plastic microsphere.
The plastic microspheres of this example were 0.5-1 μm plastic microspheres commercially available from Acksonobel.
The invention also comprises a preparation method of the silver-plated plastic microspheres for the solar cell conductive circuit, which is characterized by comprising the following steps of:
firstly, silver nitrate is selected as a silver source, the silver nitrate is dissolved into a solution, and a silver ammonia solution B is prepared according to the following specific formula in percentage by mass:
(1) preparing a silver nitrate solution:
the specific formula is as follows:
silver nitrate: 28%;
deionized water: 72 percent;
mixing silver nitrate and deionized water according to the proportion to prepare a silver nitrate solution for later use;
(2) mixing 92% silver nitrate solution, 5% ammonia water and 3% sodium hydroxide solution according to the mass percentage to obtain silver-ammonia solution B for later use;
and (II) preparing a reducing solution A by using vitamin C as a reducing agent, wherein the specific formula comprises the following components in percentage by mass:
vitamin C: 14 percent;
deionized water: 85 percent;
nitric acid: 0.6 percent;
fluorine-containing dispersant 3000: 0.2 percent;
gelatin: 0.2 percent;
according to the proportion, firstly, deionized water is weighed and poured into a 316# stainless steel dispersing barrel, then vitamin C is added, the mixture is stirred until the mixture becomes clear and transparent solution, then nitric acid is slowly dropped, and then the fluorine-containing dispersing agent 3000 is added; adding gelatin into hot water in advance for dissolving, and adding into the solution in the dispersing barrel to obtain a reducing solution A for later use;
(III) sensitization treatment of plastic microspheres:
(1) preparing a sensitizing solution C, wherein the specific formula comprises the following components in percentage by mass:
tin chloride: 8.8 percent;
hydrochloric acid: 16 percent;
hydrofluoric acid: 4 percent;
deionized water: 71 percent;
organic silicon dispersant: 0.2 percent;
mixing and dispersing the materials in a 316# stainless steel dispersing barrel according to the proportion to obtain a sensitizing solution C, soaking and stirring the plastic microspheres 1 in the sensitizing solution C for 30min, filtering the plastic microspheres, washing the plastic microspheres with deionized water, dehydrating the plastic microspheres by a centrifugal machine, and drying the plastic microspheres to obtain sensitized plastic microspheres for later use;
putting the sensitized plastic microspheres into the silver-ammonia solution B in the step (I), pouring the solution into an ultrasonic disperser at the same time, stirring and dispersing for 10min, continuously and slowly adding the reducing solution A in the step (II) in the ultrasonic dispersing environment, adjusting the adding rate when adding, controlling the dropping rate by using a throttle valve and a microcomputer, taking out the silver-plated plastic microsphere precipitate after the reducing solution A is completely added, and then filtering and cleaning; mixing with ethanol, and treating with 1% tallow amine as dispersant, stirring, soaking for 30min, separating, and drying to obtain silver-plated plastic microsphere.
The application of the silver-plated plastic microspheres as silver powder in solar conductive silver paste to replace pure silver powder specifically comprises the following steps: the silver-plated plastic microspheres are applied to solar conductive silver paste to replace pure silver powder. Selecting water-soluble hydroxypropyl cellulose (HPC) as an organic binder, selecting tallow amine as a dispersant, and matching with ethylene glycol phenyl ether, diethylene glycol butyl ether, tripropylene glycol ethyl ether and deionized water as organic solvents to prepare a pre-use material D; and (3) placing the pre-used material D into a 316# stainless steel dispersing barrel, adding the liquid glass mixture and the grinding aid A under the condition of slow stirring by a planetary stirrer, finally adding the silver-plated plastic microspheres, and stirring for 120 minutes until the mixture is uniformly dispersed without soft agglomerated granular matters. Moving the silver-plated plastic microsphere slurry into a three-roller dispersion machine, and carrying out three-roller slurry rolling on the silver-plated plastic microsphere slurry for 10 times according to proper conditions to obtain a finished product. And manufacturing the solar conductive silver paste suitable for printing, and applying the solar conductive silver paste to the crystalline silicon solar cell.
It should be understood, however, that the description herein of preferred embodiments of the present invention is not intended to limit the invention to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims. Moreover, the above technical features are combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention described in the specification; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
Claims (1)
1. A silver-plated plastic microsphere for a solar cell conductive circuit is characterized by comprising a plastic microsphere, wherein a silver layer is plated on the surface of the foamed plastic microsphere to prepare the silver-plated plastic microsphere;
the preparation method comprises the following steps:
the preparation of the silver ammonia solution B comprises the following specific formula:
(1) preparing a silver nitrate solution:
the formula comprises the following components in percentage by mass:
silver nitrate: 10% -40%;
deionized water: 60% -90%;
mixing silver nitrate and deionized water according to the proportion of silver nitrate and deionized water to prepare a silver nitrate solution for later use;
(2) mixing 85-98% of silver nitrate solution, 1-10% of ammonia water and 1-5% of sodium hydroxide solution according to mass percentage to obtain silver-ammonia solution B for later use;
(II) preparing a reducing solution A, wherein the specific formula is as follows according to mass percentage:
vitamin C: 5% -30%;
deionized water: 60% -80%;
nitric acid: 0.5% -1%;
fluorine-containing dispersant 3000: 0.1% -0.5%;
gelatin: 0.1% -0.5%;
according to the proportion of vitamin C, deionized water, nitric acid, fluorine-containing dispersant and gelatin, firstly weighing deionized water and pouring into a dispersing barrel, then adding vitamin C, stirring and dissolving, then dripping nitric acid, and then adding 3000 fluorine-containing dispersant; adding gelatin into hot water in advance for dissolving, and adding into a dispersing barrel to obtain a reducing solution A for later use;
(III) sensitization treatment of plastic microspheres:
(1) preparing a sensitizing solution C, wherein the specific formula is as follows according to mass percent:
tin chloride: 5% -20%;
hydrochloric acid: 10% -30%;
hydrofluoric acid: 1% -5%;
deionized water: 50% -80%;
organic silicon dispersant: 0.1% -0.5%;
mixing and dispersing the materials in a dispersing barrel according to the proportion of tin chloride, hydrochloric acid, hydrofluoric acid, deionized water and an organic silicon dispersing agent to obtain a sensitized solution C, putting the plastic microspheres into the sensitized solution C, soaking and stirring, filtering out the plastic microspheres, cleaning with deionized water, dehydrating by a centrifugal machine, and drying to obtain sensitized plastic microspheres for later use;
putting the sensitized plastic microspheres into the silver-ammonia solution B in the step (I), pouring the solution into an ultrasonic disperser at the same time, stirring and dispersing, continuously adding the reducing solution A in the step (II) in an ultrasonic dispersing environment, taking out the plastic microsphere precipitate after silver plating is finished after the reducing solution A is completely added, and then filtering and cleaning; then using ethanol mixed with tallow amine as a dispersing agent for treatment, stirring, soaking, separating and drying to prepare silver-plated plastic microspheres;
the application of the silver-plated plastic microspheres as silver powder in solar conductive silver paste is applied to a crystalline silicon solar cell, and specifically comprises the following steps:
the silver-plated plastic microspheres are applied to solar conductive silver paste to replace pure silver powder;
selecting water-soluble hydroxypropyl cellulose (HPC) as an organic binder, selecting tallow amine as a dispersant, and matching ethylene glycol phenyl ether, diethylene glycol butyl ether, tripropylene glycol ethyl ether and deionized water as organic solvents to prepare a pre-use material D; placing the pre-used material D into a 316# stainless steel dispersing barrel, adding the liquid glass mixture and the grinding aid A under the condition of slow stirring by a planetary stirrer, finally adding the silver-plated plastic microspheres, and stirring for 120 minutes until the mixture is uniformly dispersed without soft agglomerated granular matters; moving the silver-plated plastic microsphere slurry into a three-roller dispersion machine, and carrying out three-roller slurry rolling on the silver-plated plastic microsphere slurry for 10 times according to a proper condition to obtain the solar conductive silver slurry suitable for printing; after the solar conductive silver paste made of the silver-plated plastic microspheres is used as slurry to print various circuits, the circuits are sintered at the high temperature of 600-800 ℃ to form hollow foam conductive circuits, and after the circuits are sintered at the high temperature, the plastic microspheres can form broken wall type decomposition to break the silver-plated layer, so that the silver-plated layer forms irregular polyhedron or suede multi-foot claw-shaped contact.
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