CN109087847A - A kind of sintering mold for the pin TO shell containing bending - Google Patents
A kind of sintering mold for the pin TO shell containing bending Download PDFInfo
- Publication number
- CN109087847A CN109087847A CN201811117572.2A CN201811117572A CN109087847A CN 109087847 A CN109087847 A CN 109087847A CN 201811117572 A CN201811117572 A CN 201811117572A CN 109087847 A CN109087847 A CN 109087847A
- Authority
- CN
- China
- Prior art keywords
- pin
- bending
- base plate
- metal base
- tabletting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005452 bending Methods 0.000 title claims abstract description 79
- 238000005245 sintering Methods 0.000 title claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 claims abstract description 42
- 239000012212 insulator Substances 0.000 claims abstract description 20
- 239000011521 glass Substances 0.000 claims abstract description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 230000006978 adaptation Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 7
- 238000003754 machining Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The present invention relates to a kind of sintering molds for the pin TO shell containing bending, including bed die, be arranged on bed die and middle mould compatible with TO shell, the tabletting that is arranged on middle mould and be arranged in tabletting and can vertical motion upper mold, be adapted at the top of the upper mold and bending pin.Compared with prior art, bending pin is gradually pressed into predetermined position on metal base plate during the sintering process by middle mould, tabletting, the cooperation of upper mold by the present invention, and guarantees to bend the concentricity of pin, the quality for substantially increasing product, makes yield rate can achieve 95% or more；The requirement to glass insulator machining accuracy is reduced, processing efficiency is improved, saves cost.
Description
Technical field
The invention belongs to TO shell processing technique fields, are related to a kind of sintering mold for the pin TO shell containing bending.
Background technique
TO shell it is many kinds of, generally all include metal base plate and the grounding pin that is plugged on metal base plate.It is right
In certain TO shells, in addition to the foregoing structure, also add a bending pin, the top of the bending pin be it is flat,
And in 90 ° of bendings, the glass insulator being additionally provided between pin and metal base plate for sealing and insulating is bent.This TO shell
When being sintered processing, a groove is first opened up on glass insulator in advance, convenient for the flat bending of pin will be bent when assembly
Part is caught in positioning in groove.But since the precision of glass insulator processing is often poor, and surface tension when sintering is easy
Cause the bending pin concentricity of product after being sintered poor, causes insulation resistance undesirable, thus yield rate lower (70%
Left and right).
Summary of the invention
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide one kind for drawing containing bending
The sintering mold of foot TO shell.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of sintering mold for the pin TO shell containing bending, the TO shell include metal base plate, are plugged in gold
Belong to the grounding pin on bottom plate, the bending pin being plugged on metal base plate and setting between bending pin and metal base plate
Glass insulator, the sintering mold include bed die, be arranged on bed die and middle mould compatible with TO shell, setting exist
Tabletting on middle mould and be arranged in tabletting and can vertical motion upper mold, be adapted at the top of the upper mold and bending pin.
The top for bending pin is in flat bending.Under sintering high temperature, glass insulator constantly softens, effect of the upper mold in self gravity
Under, constantly move straight down.
Further, the bed die is equipped with positioning pin, is equipped in the middle mould, tabletting and upper mold and positioning pin
Compatible location hole.By the cooperation of positioning pin and location hole, it is not only convenient for middle mould, tabletting and upper mold being quick installed at bottom
On mould, and guarantee up and down to just, meanwhile, positioning pin can also play the role of guide post, convenient for the movement straight down of upper mold.
Further, groove is offered on the bed die, the pin length of metal base plate lower part is positioned.
Further, the middle mould is equipped with product orientation block compatible with groove.Product orientation block is convenient for TO
Shell is positioned.
Further, the first metal base plate positioning chamber is offered at the top of the product orientation block.First metal base plate
Positioning chamber positions the lower part of metal base plate.
Further, the bottom of the first metal base plate positioning chamber is equipped with grounding pin positioning chamber and bending pin is fixed
Position chamber.Grounding pin positioning chamber positions grounding pin, and bending pin positioning chamber positions the lower part of bending pin.
Further, the second metal base plate positioning compatible with the top of metal base plate is offered in the tabletting
Chamber.Second metal base plate positioning chamber at the top of metal base plate to positioning.
Further, the top of the second metal base plate positioning chamber is equipped with compatible curved with the bending top of pin
Roll over pin channel.Bend the flat bending part split-phase one at the top of the channel cross-sectional shape and size and bending pin in pin channel
It causes, the direction of flat bending part can not only be oriented to, guarantee concentricity, while smoothly transporting downwards convenient for bending pin
It is dynamic.
Further, the upper mold is equipped with bending pin briquetting compatible with the bending top of pin.Upper mold to
When lower movement, at the top of bending pin briquetting while the pin of compressing bending downwards, synchronizes bending pin and move downward, bending is drawn
Foot is installed in place.
Further, the top in the bending pin channel is equipped with guide section.Guide section draws convenient for bending in horn-like
Foot press block is quickly caught in.
The present invention matches positioning pin with location hole in practical application, first middle mould is placed on bed die, then general
Grounding pin, metal base plate, glass insulator assemble；Tabletting is covered, tabletting at this time is close together with glass insulator,
And there are gap, (gap is because glass insulator manufactured size is larger, to contract when compensation softening between tabletting and middle mould
Small volume), then will bending pin by bend pin channel is fitted into mould, and bend pin top be located at bend pin
In channel；Upper mold is covered, mold is integrally put into later on the mesh belt of sintering furnace, is sintered, in sintering high temperature, glass
Insulator starts to soften, simultaneously because the weight of upper mold itself, bending pin briquetting, which will be bent, to be led at the top of pin from bending pin
It is gradually extruded in road, glass insulator has also filled up corresponding region on metal base plate when extruding completely, and bending is drawn at this time
The position and direction of foot are held essentially constant in cooling, to ensure that the concentricity of bending pin.
Compared with prior art, the invention has the characteristics that:
1) by middle mould, tabletting, the cooperation of upper mold, bending pin is gradually pressed on metal base plate in advance during the sintering process
If at position, and guarantee bend pin concentricity, substantially increase the quality of product, make yield rate can achieve 95% with
On；
2) requirement to glass insulator machining accuracy is reduced, processing efficiency is improved, saves cost.
Detailed description of the invention
Fig. 1 is schematic diagram of main cross-sectional structure of TO shell in the present invention；
Fig. 2 is the overlooking structure diagram of TO shell in the present invention；
Fig. 3 is the overlooking structure diagram of bed die in the present invention；
Fig. 4 is the left view schematic cross-sectional view of Fig. 3；
Fig. 5 is the present invention looks up structural representation of middle mould in the present invention；
Fig. 6 is schematic diagram of main cross-sectional structure of product orientation block in the present invention；
Fig. 7 is the overlooking structure diagram of tabletting in the present invention；
Fig. 8 is the schematic view of the front view that pin channel is bent in the present invention；
Fig. 9 is the present invention looks up structural representation of upper mold in the present invention；
Figure 10 is schematic diagram of main cross-sectional structure that pin briquetting is bent in the present invention；
Description of symbols in figure:
1-metal base plate, 2-grounding pins, 3-bending pins, 4-glass insulators, 5-bed dies, 6-middle moulds, 7-
Tabletting, 8-upper molds, 9-location holes, 10-grooves, 11-product orientation blocks, the 12-the first metal base plate positioning chamber, 13-connect
Ground pin positioning chamber, 14-bending pin positioning chambers, the 15-the second metal base plate positioning chamber, 16-bending pin channels, 17-
Bend pin briquetting, 18-positioning pins.
Specific embodiment
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.The present embodiment is with technical solution of the present invention
Premised on implemented, the detailed implementation method and specific operation process are given, but protection scope of the present invention is not limited to
Following embodiments.
Embodiment:
The TO shell of the pin as shown in Figure 1 and Figure 2 containing bending, including metal base plate 1, is plugged in connecing on metal base plate 1
Ground pin 2, the bending pin 3 being plugged on metal base plate 1 and the glass being arranged between bending pin 3 and metal base plate 1
Insulator 4.
For the sintering mold of above-mentioned TO shell, including bed die 5, it is arranged on bed die 5 and compatible with TO shell
Mould 6, the tabletting 7 being arranged on middle mould 6 and be arranged in tabletting 7 and can vertical motion upper mold 8, which draws with bending
The top of foot 3 is adapted.
As shown in Figure 3, Figure 4, bed die 5 is equipped with positioning pin 18, is equipped in middle mould 6, tabletting 7 and upper mold 8 and positioning pin
18 compatible location holes 9.Groove 10 is offered on bed die 5, middle mould 6 is equipped with product orientation block compatible with groove 10
11。
As shown in Figure 5, Figure 6, the top of product orientation block 11 offers the first metal base plate positioning chamber 12, the first metal bottom
The bottom of plate positioning chamber 12 is equipped with grounding pin positioning chamber 13 and bending pin positioning chamber 14.
As shown in Figure 7, Figure 8, second metal base plate positioning compatible with the top of metal base plate 1 is offered in tabletting 7
Chamber 15, the top of the second metal base plate positioning chamber 15 are equipped with bending pin channel 16 compatible with the bending top of pin 3.
The top for bending pin channel 16 is equipped with guide section.
As shown in Figure 9, Figure 10, upper mold 8 is equipped with bending pin briquetting 17 compatible with the bending top of pin 3.
In practical application, first middle mould 6 is placed on bed die 5, and match positioning pin 18 with location hole 9, then will
Grounding pin 2, metal base plate 1, glass insulator 4 assemble；Tabletting 7 is covered, tabletting at this time 7 is close to glass insulator 4
Together, and between tabletting 7 and middle mould 6 there are gap, (gap is because 4 manufactured size of glass insulator is larger, to mend
Repay the volume reduced when softening), then will bending pin 3 by bend pin channel 16 is fitted into mould 6, and bending pin 3
Top is located in bending pin channel 16；Upper mold 8 is covered, mold is integrally put into later on the mesh belt of sintering furnace, is burnt
Knot, in sintering high temperature, glass insulator 4 starts to soften, simultaneously because the weight of upper mold 8 itself, bending pin briquetting 17 will
3 top of bending pin is gradually extruded out of bending pin channel 16, and glass insulator 4 has also filled up metal when extruding completely
Corresponding region on bottom plate 1, the position and direction for bending pin 3 at this time are held essentially constant in cooling, to ensure that curved
Roll over the concentricity of pin 3.
The above description of the embodiments is intended to facilitate ordinary skill in the art to understand and use the invention.
Person skilled in the art obviously easily can make various modifications to these embodiments, and described herein general
Principle is applied in other embodiments without having to go through creative labor.Therefore, the present invention is not limited to the above embodiments, ability
Field technique personnel announcement according to the present invention, improvement and modification made without departing from the scope of the present invention all should be of the invention
Within protection scope.
Claims (10)
1. a kind of sintering mold for the pin TO shell containing bending, the TO shell include metal base plate (1), are plugged in gold
Belong to the grounding pin (2) on bottom plate (1), the bending pin (3) being plugged on metal base plate (1) and setting in bending pin
(3) glass insulator (4) between metal base plate (1), which is characterized in that the sintering mold includes bed die (5), setting
On bed die (5) and the tabletting (7) and setting of middle mould (6) compatible with TO shell, setting on middle mould (6) are in tabletting
(7) on and can vertical motion upper mold (8), the upper mold (8) and bending pin (3) at the top of be adapted.
2. a kind of sintering mold for the pin TO shell containing bending according to claim 1, which is characterized in that described
Bed die (5) is equipped with positioning pin (18), is equipped with and positioning pin (18) phase in the middle mould (6), tabletting (7) and upper mold (8)
The location hole (9) of adaptation.
3. a kind of sintering mold for the pin TO shell containing bending according to claim 1, which is characterized in that described
Groove (10) are offered on bed die (5).
4. a kind of sintering mold for the pin TO shell containing bending according to claim 3, which is characterized in that described
Middle mould (6) is equipped with groove (10) compatible product orientation block (11).
5. a kind of sintering mold for the pin TO shell containing bending according to claim 4, which is characterized in that described
The first metal base plate positioning chamber (12) is offered at the top of product orientation block (11).
6. a kind of sintering mold for the pin TO shell containing bending according to claim 5, which is characterized in that described
The bottom of first metal base plate positioning chamber (12) is equipped with grounding pin positioning chamber (13) and bending pin positioning chamber (14).
7. a kind of sintering mold for the pin TO shell containing bending according to claim 1, which is characterized in that described
The second metal base plate positioning chamber (15) compatible with the top of metal base plate (1) is offered in tabletting (7).
8. a kind of sintering mold for the pin TO shell containing bending according to claim 7, which is characterized in that described
The top of second metal base plate positioning chamber (15) is equipped with bending pin channel (16) compatible with the bending top of pin (3).
9. a kind of sintering mold for the pin TO shell containing bending according to claim 8, which is characterized in that described
Upper mold (8) is equipped with bending pin briquetting (17) compatible with the bending top of pin (3).
10. a kind of sintering mold for the pin TO shell containing bending according to claim 8, which is characterized in that described
Bending pin channel (16) top be equipped with guide section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811117572.2A CN109087847B (en) | 2018-09-20 | 2018-09-20 | Sintering mold for TO tube shell containing bending pins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811117572.2A CN109087847B (en) | 2018-09-20 | 2018-09-20 | Sintering mold for TO tube shell containing bending pins |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109087847A true CN109087847A (en) | 2018-12-25 |
| CN109087847B CN109087847B (en) | 2024-03-15 |
Family
ID=64842348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811117572.2A Active CN109087847B (en) | 2018-09-20 | 2018-09-20 | Sintering mold for TO tube shell containing bending pins |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109087847B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5243492A (en) * | 1992-08-27 | 1993-09-07 | Coors Ceramics Company | Process for fabricating a hermetic coaxial feedthrough |
| JPH06215698A (en) * | 1993-01-19 | 1994-08-05 | Toshiba Corp | Manufacture of electronic tube stem |
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| JPH1092855A (en) * | 1996-09-12 | 1998-04-10 | Nec Corp | Die for resin sealing |
| JP2000012720A (en) * | 1998-06-25 | 2000-01-14 | Kyocera Corp | Manufacture of package for containing semiconductor element |
| JP2001168257A (en) * | 1999-12-10 | 2001-06-22 | Seiko Epson Corp | Semiconductor device and manufacturing method thereof, manufacturing device, circuit board and electronics |
| US20040079545A1 (en) * | 2002-10-21 | 2004-04-29 | Neil Heeke | Hermetically sealed electrical feed-through device with a bent isolated pin in a circular glass seal |
| KR101042816B1 (en) * | 2010-01-27 | 2011-06-20 | 주식회사 성평 | Movable type bending mold for connector pin's bending |
| KR20150069451A (en) * | 2013-12-13 | 2015-06-23 | 나라엠앤디(주) | Transfer molding apparatus of plunger type |
| CN104942142A (en) * | 2015-06-06 | 2015-09-30 | 安徽美吉汽车零部件有限公司 | Forming die of left reinforced vertical plates |
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| EP3338987A1 (en) * | 2016-12-23 | 2018-06-27 | Faurecia Innenraum Systeme GmbH | Molding tool and method for forming and back-injecting a bendable sheet |
| CN108551074A (en) * | 2018-05-29 | 2018-09-18 | 上海科发电子产品有限公司 | A kind of sintering mold for connector |
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-
2018
- 2018-09-20 CN CN201811117572.2A patent/CN109087847B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5243492A (en) * | 1992-08-27 | 1993-09-07 | Coors Ceramics Company | Process for fabricating a hermetic coaxial feedthrough |
| JPH06215698A (en) * | 1993-01-19 | 1994-08-05 | Toshiba Corp | Manufacture of electronic tube stem |
| JPH08236653A (en) * | 1995-02-27 | 1996-09-13 | Nec Corp | Package of electronic device |
| JPH09169386A (en) * | 1995-12-20 | 1997-06-30 | Hitachi Ltd | Carrier tape and its manufacture |
| JPH1092855A (en) * | 1996-09-12 | 1998-04-10 | Nec Corp | Die for resin sealing |
| JP2000012720A (en) * | 1998-06-25 | 2000-01-14 | Kyocera Corp | Manufacture of package for containing semiconductor element |
| JP2001168257A (en) * | 1999-12-10 | 2001-06-22 | Seiko Epson Corp | Semiconductor device and manufacturing method thereof, manufacturing device, circuit board and electronics |
| US20040079545A1 (en) * | 2002-10-21 | 2004-04-29 | Neil Heeke | Hermetically sealed electrical feed-through device with a bent isolated pin in a circular glass seal |
| KR101042816B1 (en) * | 2010-01-27 | 2011-06-20 | 주식회사 성평 | Movable type bending mold for connector pin's bending |
| KR20150069451A (en) * | 2013-12-13 | 2015-06-23 | 나라엠앤디(주) | Transfer molding apparatus of plunger type |
| CN104942142A (en) * | 2015-06-06 | 2015-09-30 | 安徽美吉汽车零部件有限公司 | Forming die of left reinforced vertical plates |
| EP3338987A1 (en) * | 2016-12-23 | 2018-06-27 | Faurecia Innenraum Systeme GmbH | Molding tool and method for forming and back-injecting a bendable sheet |
| CN107350386A (en) * | 2017-08-18 | 2017-11-17 | 天津赛柯睿科技有限公司 | A kind of quick bending device of electronic component pin |
| CN108551074A (en) * | 2018-05-29 | 2018-09-18 | 上海科发电子产品有限公司 | A kind of sintering mold for connector |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN109087847B (en) | 2024-03-15 |
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