CN109082640B - Nitrogen-doped high-adhesion high-hardness nano-structure W-based coating and preparation method thereof - Google Patents

Nitrogen-doped high-adhesion high-hardness nano-structure W-based coating and preparation method thereof Download PDF

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CN109082640B
CN109082640B CN201810850006.6A CN201810850006A CN109082640B CN 109082640 B CN109082640 B CN 109082640B CN 201810850006 A CN201810850006 A CN 201810850006A CN 109082640 B CN109082640 B CN 109082640B
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hard alloy
based coating
nitrogen
chamber
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CN109082640A (en
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匡同春
彭小珊
张子威
黎毓灵
邓阳
王毅
陈灵
雷淑梅
周克崧
钟喜春
曾德长
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South China University of Technology SCUT
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0688—Cermets, e.g. mixtures of metal and one or more of carbides, nitrides, oxides or borides

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  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
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Abstract

The invention discloses a nitrogen-doped high-adhesiveness high-hardness nano-structure W-based coating and a preparation method thereof, wherein the atomic percentages of elements in the nano-structure W-based coating are as follows: n: 1% -6%; w: 94% -99%, the coating is prepared by a high-power pulse magnetron sputtering technology and is suitable for the surface of a hard alloy cutter. By doping small atom N element, the grain size and the defect number of the coating are regulated and controlled, and the nano-structure W-based coating with strong adhesiveness and high hardness on the hard alloy is obtained.

Description

Nitrogen-doped high-adhesion high-hardness nano-structure W-based coating and preparation method thereof
Technical Field
The invention relates to the field of material surface processing, in particular to a nitrogen-doped high-adhesiveness high-hardness nano-structure W-based coating and a preparation method thereof.
Background
The development of cutter materials is of great importance in human life and production. The conventional hard alloy is formed by sintering hard phase WC and binder phase Co, has normal temperature hardness of 89-93 HRA, can bear cutting temperature of above 800-900 ℃, and is widely used as a cutter material. The mechanical and physical properties of the non-coating hard alloy cutter are the comprehensive properties of a hard phase and a binding phase, so the hardness and the wear resistance of the non-coating hard alloy cutter are lower than the properties of the hard phase.
The coating treatment of the hard alloy cutter is an important means for improving the comprehensive performance and the service life of the cutter. A hard coating is deposited on the surface of the hard alloy, which can meet the requirements of high toughness of the matrix, high hardness of the surface and high wear resistance.
Failure of the coated cutting tool originates from the surface and coating spalling is a common failure mode. The tool base body and the coating belong to different substances, and the interaction force between the two substances is called adhesion force, namely the bonding strength of the coating and the base body under the action of chemical bonding force or physical biting force. Generally, two substances having different chemical bond types and low compatibility have the lowest binding property. The prior industrially applied hard alloy cutter has widely applied coatings of TiN, TiCN, TiAlN, TiC/TiN/A12O3And the like. The large amount of heat generated during cutting causes stress due to the inconsistency of the thermal expansion coefficients of the substrate and the coating, and cracks are generated and the coating falls off when the stress is serious, so that the cutter fails; the processed material continuously impacts and rubs the surface material of the cutter, and the coating material with poor bonding performance is peeled off. The multi-component and multi-layer coating with reasonable design can integrate the advantages of different components and different single layers, and achieves excellent bonding performance, hardness and wear resistance. But due to the complexity of the process, expensive equipment costs, high industrial costs, not suitable for a wide range of industrial applications.
WN is a refractory metal compound having the same crystal system and very similar unit cell parameters as the hard phase WC of cemented carbide. Because the chemical properties, the physical characteristics and the mechanical properties of the two are very similar, the W-N coating deposited on the hard alloy cutter can be epitaxially grown under certain process conditions, elements on two sides of the interface are mutually diffused, and the components are changed in a gradient manner, so that an interface structure with good bonding performance is formed. The interface structure has excellent adhesive force and can resist thermal impact and mechanical impact during processing. The phase structure and composition of the W-N coating determine the coatingThe performance of the coating is strongly dependent on the preparation process. There are three main phases in the W-N system: w, W2N, WN are provided. WN is a hard phase, the reactivity of W and N is low, and a WN phase with high nitrogen content is difficult to prepare by a Physical Vapor Deposition (PVD) method.
Disclosure of Invention
The invention aims to overcome the defect that high adhesiveness and high hardness are difficult to combine in the prior art, and provides a nitrogen-doped high-adhesiveness high-hardness nano-structure W-based coating which is applied to the surface of a hard alloy cutter.
Another object of the present invention is to provide a method for preparing the nitrogen-doped, highly adherent, highly hard nanostructured W-based coating described above.
The purpose of the invention is realized by the following technical scheme.
A nitrogen-doped high-adhesion high-hardness nano-structure W-based coating is composed of a nano-structure W (N) coating; the atomic percentages of elements in the nanostructure W (N) coating are N: 1% -6%; w: 94% -99%; the nano-structure W-based coating is deposited by a high-power pulse magnetron sputtering technology.
Preferably, the thickness of the W-based coating with the nano structure is 1-5 μm, and the average grain size is 5-15 nm.
The preparation method of the nitrogen-doped high-adhesiveness high-hardness nano-structure W-based coating comprises the following steps of:
(1) surface pretreatment of a hard alloy substrate: carrying out abrasive paper grinding treatment, polishing, ultrasonic cleaning and blow-drying on the hard alloy matrix, and then sending the hard alloy matrix into a chamber;
(2) vacuumizing and heating a cavity: vacuumizing the chamber, and heating at 500-600 ℃; vacuumizing again, and heating at 500-550 ℃; residual gas of the chamber and the chamber wall is removed to the maximum extent by twice vacuum pumping and high-temperature heating, and the quality of the film layer is ensured;
(3) and (3) Ar ion etching and cleaning the hard alloy substrate: heating the chamber to 300-600 ℃, introducing argon, controlling the flow of the argon, and controlling the pressure of the chamber to be 4 multiplied by 10-4~4×10-2mbar, setting workpiece support bias voltage of-200V to-300V, triggering arc ignition by using an electric arc target to ionize Ar ions, and carrying out sputtering cleaning on the surface of the hard alloy substrate;
(4) pre-cleaning a tungsten target material: introducing 140-165 sccm argon gas, and carrying out sputtering cleaning on the tungsten target by 5-30 sccm nitrogen gas to remove oxides and pollutants on the surface of the target material;
(5) depositing a nanostructure W-based coating: continuously introducing N into the chamber2And Ar, simultaneously keeping the temperature of the heater in the cavity constant, applying negative bias to the substrate, and performing film coating treatment for 60-180 min by adopting a high-power pulse magnetron sputtering technology;
(6) and (5) after the step (5) is finished, turning off the power supply, opening the chamber after the temperature of the chamber is reduced, and taking out the sample, wherein the coating on the surface of the sample is the nitrogen-doped high-adhesiveness high-hardness nano-structure W-based coating.
Preferably, in the step (1), the hard alloy substrate is polished by using diamond polishing agents with the particle sizes of 5 micrometers and 2.5 micrometers in sequence until the roughness Ra is less than 0.4 micrometer, and then the hard alloy substrate is ultrasonically cleaned in ethanol for 20-40 minutes.
Preferably, in the step (2), the vacuum degree of the chamber is pumped to 4.0 × 10-5mbar below; the heating time is 30-60 min.
Preferably, in the step (3), the bombardment time of the sputtering cleaning is 5-30 min.
Preferably, in the step (4), the introduced argon is 140-165 sccm, and the nitrogen is 5-30 sccm; the time for sputtering and cleaning is 0.5-2 min.
Preferably, in the step (5), the bias voltage of the hard alloy matrix is set to be-100V to-400V, and the deposition temperature is 200 to 600 ℃; the target power supply adopts bipolar pulse, the frequency is 25-35kHz, the duty ratio is 2% -10%, the negative bias is-700V to-1000V, and the power is 4-7 kW; introducing 5 to 20sccm N2120-135 sccm Ar, and the deposition time is 60-180 min.
Preferably, in step (5), N is2The volume ratio of the total gas is 3.5-14%, and the total gas comprises Ar and N2。
Preferably, in step (6), the chamber is opened to take out the sample when the temperature of the chamber is reduced to below 70 ℃.
Compared with the prior art, the invention has the following technical advantages and effects:
(1) according to the invention, the nano-structure W-based coating with high adhesiveness, high hardness and good toughness, which is suitable for the hard alloy cutter, can be obtained by doping a small amount of small atom N. Compared with other multi-component and multi-layer coatings, the method disclosed by the invention is simple, strong in controllability and low in economic cost.
(2) The nano-structure W-based coating is deposited on the hard alloy, the chemical properties, physical characteristics and mechanical properties of the substrate and the coating are very similar, and the coating can be epitaxially grown under certain process conditions to form the W-based coating with excellent adhesion property.
(3) The invention adopts a high-power pulse magnetron sputtering technology, and high-density ion beams generated by the technology bombard the surface of the matrix, so that the ion is injected into the matrix while the pollution on the surface of the matrix is removed, and the adhesiveness of the coating is greatly enhanced.
(4) The invention pre-cleans the target, can remove the oxide and the pollutant on the surface of the target, and improves the coating quality.
Drawings
Fig. 1 is an XRD pattern of the nitrogen-doped, high-adhesion, high-hardness nanostructured W-based coating prepared in example 1.
Fig. 2 is a spectrum of a nitrogen-doped, high adhesion, high hardness, nanostructured W-based coating prepared in example 1.
Fig. 3 is a surface topography map of the nitrogen-doped, high adhesion, high hardness nanostructured W-based coating prepared in example 1.
Fig. 4 is a cross-sectional topography of the nitrogen-doped, high adhesion, high hardness nanostructured W-based coating prepared in example 1.
Fig. 5 is a scratch pattern of a high adhesion and high hardness nanostructure W-based coating prepared on YG6 substrate in example 1.
Fig. 6 is a nano-indentation load-depth profile of the high adhesion high hardness nano-structured W-based coating prepared in example 2.
Fig. 7 is a scratch pattern of a high adhesion and high hardness nanostructure W-based coating prepared on YG12 substrate in example 3.
Detailed Description
The present invention will be described in further detail with reference to examples, but the embodiments of the present invention are not limited thereto.
Example 1
A nitrogen-doped high-adhesiveness high-hardness nano-structure W-based coating comprises the following elements in atomic percentage: n: 5.46%, W: 94.54 percent. The coating thickness was 1.4 μm and the average grain size was 7.5 nm. The preparation method comprises the following steps:
(1) carrying out abrasive paper grinding on YG6 hard alloy, sequentially polishing a substrate by using diamond polishing agents with the particle sizes of 5 micrometers and 2.5 micrometers until the roughness Ra is less than 0.4 micrometer, ultrasonically cleaning the substrate in ethanol for 20 minutes, drying the substrate by using a hair dryer, and sending the substrate into a chamber;
(2) the vacuum degree of the chamber is pumped to 4.0 multiplied by 10-5Heating at below mbar for 45min at 500 deg.C; vacuum-pumping again to 4.0X 10-5Heating at below mbar for 45min at 500 deg.C; residual gas of the chamber and the chamber wall is removed to the maximum extent by twice vacuum pumping and high-temperature heating, and the quality of the film layer is ensured;
(3) the chamber is kept at a constant temperature of 500 ℃ and the total air pressure is 1 multiplied by 10-2mbar, partial pressure of argon 2X 10-3mbar, setting workpiece holder bias voltage of-300V, and carrying out sputtering cleaning on the surface of YG6 hard alloy for 30 min;
(4) introducing 150sccm argon gas, and carrying out sputtering cleaning on the tungsten target for 0.5min by 10sccm nitrogen gas to remove oxides and pollutants on the surface of the target material;
(5) the bias voltage of the matrix is set to-150V, and the deposition temperature is 450 ℃; the target power supply adopts bipolar pulse, the frequency is 30kHz, the duty ratio is 4%, the negative bias is-1000V, and the power is 6 kW; introducing 10sccmN2130sccmAr, deposition time 120 min;
(6) and (5) after the step (5) is finished, turning off the power supply, opening the chamber to take out the sample when the temperature of the chamber is reduced to below 70 ℃, wherein the coating on the surface of the sample is the nitrogen-doped high-adhesiveness high-hardness nano-structure W-based coating.
The coating thickness of the W-based coating deposited on YG6 cemented carbide was 1.43 μm, the lattice constant was 3.1983nm (the lattice constant of ICDD PDF2 card W was 3.1648 nm), the average grain size was 7.5nm, the hardness was up to 29.4GPa, and the elastic modulus was 458 GPa. The combination of higher hardness and lower elastic modulus indicates better toughness of the coating. Fig. 1 is the XRD pattern of the coating, with the phase consisting of W. Since the small atom N enters into the W atomic lattice, the lattice constant of W becomes large and the diffraction peak shifts to the left. The N atoms distort the W lattice, initiating coating point defects, resulting in increased hardness. Fig. 2 shows the electron probe spectrum of the coating, containing N5.46 at.%, and W94.54 at.%. FIG. 3 is an SEM surface topography of the coating, the surface is tough dimple-shaped, flat, dense and seamless. FIG. 4 is a SEM cross-sectional morphology, and the coating tissue is a composite structure of short and compact columnar crystals and no characteristic morphology, and has no defects such as voids, cracks and the like. The cross section is easy to form lamellar fracture, and further shows that the coating has better toughness. The coating is tightly combined with the interface of the substrate, and no obvious layering or stripping phenomenon exists. The adhesion performance of the coating is characterized by adopting a 0-100N continuous loading scratch test, the scratch length is 5mm, and the scratch appearance is shown in figure 5. The scratch becomes deeper and wider as the load is gradually increased, and the scratch edge still has no coating crack or peeling at the load of 100N, which indicates that the coating does not fail and has excellent adhesion performance.
Example 2
A nitrogen-doped high-adhesiveness high-hardness nano-structure W-based coating comprises the following elements in atomic percentage: n: 2%, W: 98 percent. The coating thickness was 1.56 μm and the average grain size was 10 nm. YG6 hard alloy is selected as a base material, and the preparation method comprises the following steps:
(1) carrying out abrasive paper grinding on YG6 hard alloy, polishing a substrate to the roughness of below 0.4 mu m by using diamond polishing agents of 5 mu m and 2.5 mu m in sequence, carrying out ultrasonic cleaning in ethanol for 20 minutes, drying by a blower, and sending into a chamber;
(2) the vacuum degree of the chamber is pumped to 4.0 multiplied by 10-5mbar, heating at 500 deg.C for 45 min; vacuum-pumping again to 4.0X 10-5mbar at 500 deg.CHeating for 45 min; residual substances and gases adsorbed on the chamber and the chamber wall are removed to the maximum extent by twice vacuum pumping and high-temperature heating, so that the quality of the film layer is ensured;
(3) the chamber is kept at a constant temperature of 500 ℃ and the total air pressure is 1 multiplied by 10-2mbar, partial pressure of argon 2X 10-3mbar, setting workpiece holder bias voltage of-300V, and carrying out sputtering cleaning on the surface of YG6 hard alloy for 30 min;
(4) introducing 150sccm argon gas, and carrying out sputtering cleaning on the tungsten target for 0.5min by 10sccm nitrogen gas to remove oxides and pollutants on the surface of the target material;
(5) the bias voltage of the matrix is set to-150V, and the deposition temperature is 600 ℃; the target power supply adopts bipolar pulse, the frequency is 30kHz, the duty ratio is 4%, the negative bias is-1000V, and the power is 6 kW; introducing 5sccmN2135sccmAr, deposition time 120 min;
(6) and (5) after the step (5) is finished, turning off the power supply, opening the chamber to take out the sample when the temperature of the chamber is reduced to below 70 ℃, wherein the coating on the surface of the sample is the nitrogen-doped high-adhesiveness high-hardness nano-structure W-based coating.
FIG. 6 is a nano indentation load-depth curve of the coating obtained in this example, the indentation depth is 93-99 nm, which is 1/10 below the coating thickness, and the dispersion of the 5-loading/unloading curve is small, so the measured nano hardness is effective hardness, and the value is 26 GPa. The scratch test results show that the coating still did not fail when the load was 100N.
Example 3
The implementation steps of this example are the same as those of example 1, except that three types of hard alloys, i.e., YG10X, YG12, and YG15, were selected as the matrix material.
The atomic percentages of the elements in the coating obtained in this example are: n: 5.46%, W: 94.54 percent. The coating thickness is 1.4 μm, the average grain size is 7.5nm, and the hardness reaches 29.4 GPa. The bonding force of the W-based coating on the three hard alloys exceeds 120N. The adhesion performance of the coating is characterized by a 0-120N continuous loading scratch test, the scratch length is 5mm, and fig. 7 is a scratch morphology diagram of a W-based coating on a YG12 substrate. When the load is increased to 101N, the coating starts to crack a little, this time at a low critical load Lc 1; when the load is increased to 120N, the coating has not yet peeled off, indicating that the critical load Lc2 is greater than 120N, i.e. the coating cohesion is greater than 120N.

Claims (2)

1. A method for preparing a nitrogen-doped, high-adhesion, high-hardness nanostructured W-based coating, comprising the steps of:
(1) surface pretreatment of a hard alloy substrate: carrying out abrasive paper grinding treatment on the hard alloy substrate, sequentially polishing the hard alloy substrate by using diamond polishing agents with the particle sizes of 5 micrometers and 2.5 micrometers until the roughness Ra is less than 0.4 micrometer, then ultrasonically cleaning the hard alloy substrate in ethanol for 20-40 minutes, and blowing the hard alloy substrate to dry and then sending the hard alloy substrate into a cavity;
(2) vacuumizing and heating a cavity: vacuumizing the chamber to 4.0 x 10-5Below mbar, heating at 500-600 ℃, wherein the heating time is 30-60 min; vacuumizing again, and heating at 500-550 ℃;
(3) and (3) Ar ion etching and cleaning the hard alloy substrate: heating the chamber to 300-600 ℃, introducing argon, controlling the flow of the argon, and controlling the pressure of the chamber to be 4 multiplied by 10-4~4×10-2mbar, setting workpiece support bias voltage of-200V to-300V, triggering arc ignition by using an arc target to ionize Ar ions, and carrying out sputtering cleaning on the surface of the hard alloy substrate, wherein the bombardment time of the sputtering cleaning is 5-30 min;
(4) pre-cleaning a tungsten target material: introducing argon and nitrogen to carry out sputtering cleaning on the tungsten target, wherein the introduced argon is 140-165 sccm, the introduced nitrogen is 5-30 sccm, and the sputtering cleaning time is 0.5-2 min so as to remove oxides and pollutants on the surface of the target;
(5) depositing a nanostructure W-based coating: continuously introducing N into the chamber2And Ar, N2The volume ratio of the total gas is 3.5-14%, and the total gas comprises Ar and N2Simultaneously keeping the temperature of a heater in the cavity constant, applying negative bias to the substrate, and performing film coating treatment for 60-180 min by adopting a high-power pulse magnetron sputtering technology, wherein the bias of the hard alloy substrate is set to-100V-400V, and the deposition temperature is 200-600 ℃; the target material power source adopts bipolar pulseThe punching frequency is 25-35kHz, the duty ratio is 2% -10%, the negative bias is-700V-1000V, and the power is 4-7 kW; introducing 5 to 20sccm N2120-135 sccm Ar, and the deposition time is 60-180 min;
(6) and (5) after the step (5) is finished, turning off the power supply, opening the chamber to take out the sample when the temperature of the chamber is reduced to below 70 ℃, wherein the coating on the surface of the sample is the nitrogen-doped high-adhesiveness high-hardness nano-structure W-based coating.
2. A nitrogen-doped high-adhesion high-hardness nanostructure W-based coating prepared by the preparation method of claim 1, characterized by consisting of a nanostructure W (n) coating; the atomic percentages of elements in the nanostructure W (N) coating are N: 1% -6%, W: 94% -99%; the nano-structure W-based coating is deposited by a high-power pulse magnetron sputtering technology; the thickness of the W-based coating with the nano structure is 1-5 mu m, and the average grain size is 5-15 nm.
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