CN109082075A - A kind of epoxy-resin systems and its application in composite material mould manufacture - Google Patents
A kind of epoxy-resin systems and its application in composite material mould manufacture Download PDFInfo
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- CN109082075A CN109082075A CN201810724311.0A CN201810724311A CN109082075A CN 109082075 A CN109082075 A CN 109082075A CN 201810724311 A CN201810724311 A CN 201810724311A CN 109082075 A CN109082075 A CN 109082075A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
- C08G59/502—Polyalkylene polyamines
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
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- Health & Medical Sciences (AREA)
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- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to a kind of epoxy-resin systems and its applications in composite material mould manufacture.Epoxy-resin systems of the invention include: component A, and the component A includes epoxy resin or is made of epoxy resin；It include the first curing agent and the second curing agent with component B, the component B, first curing agent is fatty amine, and second curing agent is aromatic amine or anhydride curing agent.The present invention also provides application of the epoxy-resin systems in composite material mould manufacture.Epoxy-resin systems of the invention have the advantages that room temperature initial viscosity is low, and technique working life is long, reduce the manufacture difficulty of composite material mould；Solidification temperature is low, reduces the manufacturing cost of composite material mould；Glass transition temperature is high, and shrinking percentage is low, and mechanical property is good, improves the service performance of composite material mould.Therefore, the manufacture of epoxy-resin systems of the invention especially suitable for high temperature resistant type composite material mould.
Description
Technical field
The present invention relates to composite material mould manufacturing fields, more particularly, to manufacture the epoxy resin of composite material mould
System and its application.
Background technique
Composite material is by new material made of material component optimum organization of different nature.The development of modern high technology from
Composite material is not opened, and composite material also has highly important effect to the development of modern science and technology.Composite material is ground
Study carefully depth and application range and its speed and scale of production development have become and measures the technologically advanced level of a national science
One of the important signs that.It is especially grown rapidly recently as industries such as aerospace, weapons, ship, high-speed rails, composite material replaces
Have become for traditional metal materials and switches from manufacturing military products to goods for civilian use and an important development direction of civil-military inosculation.
Composite material mould is the mold for preparing composite product by molding using composite material.In recent years,
By the tide of wind electricity blade, composite material mould technology obtained adequately after at and significant progress.With traditional metal
Material Tool and Die Technology is compared, and composite material mould technology has overwhelming advantage when processing large scale Complex Mold,
Has huge application potential in fields such as aerospace, ship, rail traffic, electronic systems.
Composite material mould generally uses two-step method to manufacture: firstly, it is necessary to for example being formed and being processed for wood gum,
Secondly, for the laying of progress precast body, the priming by vacuum of composite material mould resin and composite material mould on wood gum
Processing.Due to for example for the use demand of wood gum and vacuum infusion molding process for compound itself the characteristics of, to priming by vacuum
The requirement of composite material mould resin used in process is high.Currently, there is also initial viscosities for composite material mould resin
Greatly, the problems such as mechanical property is insufficient, solidification temperature is high, technique working life is short.Moreover, because the raising that temperature tolerance requires, therefore
Need to improve temperature resistant grade (when being more than 120 DEG C especially with temperature), and the raising of temperature resistant grade often increases composite material
The initial viscosity of mold resin improves filling temperature and solidification temperature, so as to cause cannot achieve normal temperature cure, extends solidification
Time considerably increases the manufacture difficulty and cost of composite material mould, reduces its service performance, it is difficult to realize low-temperature setting and
Applied at elevated temperature being taken into account and balancing.Therefore, increasingly harsh to the performance requirement of composite material mould, make especially as composite die
With the raising of temperature requirement, composite material mould technology encounters the technical bottleneck for being difficult to overcome.
Therefore, there is an urgent need in the art to be able to solve the composite material mould resin of the above problem.
Summary of the invention
The applicant is directed to the characteristics of use demand and vacuum infusion molding process for compound itself for wood gum, develops one kind
It is able to solve the epoxy-resin systems as composite material mould resin of one or more above problem in the prior art.
First aspect present invention provides a kind of epoxy-resin systems, which is characterized in that the epoxy-resin systems include:
Component A, the component A include epoxy resin or are made of epoxy resin；With
Component B, the component B are comprising the first curing agent and the second curing agent or by the first curing agent and the second curing agent
Composition, first curing agent are fatty amine, and second curing agent is aromatic amine or anhydride curing agent.
Second aspect of the present invention additionally provides epoxy-resin systems described in first aspect present invention in composite material mould
Application in manufacture.
Epoxy-resin systems of the invention have the advantages that (1) room temperature initial viscosity is low, and technique working life is long, thus
It can sufficiently infiltrate in fibre gap, reduce the manufacture difficulty of composite material mould.(2) solidification temperature is low, can be normal
The lower perfusion of temperature and solidification, reduce the manufacturing cost of composite material mould.(3) glass transition temperature is high, can high temperature resistant, receive
Shrinkage is low, and mechanical property is good, improves service performance.Therefore, epoxy-resin systems of the invention are especially suitable for composite material
Mold manufacture, the especially manufacture of high temperature resistant type composite material mould.The composite wood as made from epoxy-resin systems of the invention
Expect that mold has excellent mechanical performance, chemical corrosion resistance, electrical insulating property, processing performance, adhesive property, and shrinking percentage
It is low, it can be widely applied to the manufacture of various composite material moulds.
Detailed description of the invention
Fig. 1 is DSC (the Differential Scanning of epoxy-resin systems made from the application preparation example 1
Calorimeter) curve graph.
Fig. 2 is the modulus curve figure (E') and damage curve figure (tan of epoxy-resin systems made from the application preparation example 1
δ)。
Perfusion scene when Fig. 3 display manufactures high-speed rail large-scale composite material mold using epoxy-resin systems of the invention is shone
Piece.
The large-scale composite material mould product photo that Fig. 4 display is manufactured using epoxy-resin systems of the invention.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the embodiment of the present invention to this hair
Bright technical solution is more clearly and completely described.But provided embodiment is only that a part of the invention is real
Example is applied, instead of all the embodiments.Based on content disclosed in the present application, those of ordinary skill in the art are not paying creation
Property labour under the premise of the technical solution that can expect, shall fall within the protection scope of the present invention.
As described above, first aspect present invention provides a kind of epoxy-resin systems, the epoxy-resin systems include: group
A, the component A is divided to include epoxy resin or be made of epoxy resin；Component B, the component B include the first curing agent and the
Two curing agent are made of the first curing agent and the second curing agent, and first curing agent is fatty amine, second solidification
Agent is aromatic amine or anhydride curing agent.
Epoxy resin has excellent mechanical performance, chemical corrosion resistance, electrical insulating property, processing performance, adhesive property, and
And shrinking percentage is low, is widely used in social all trades and professions.In order to obtain high temperature resistant (150 DEG C of Tg >) composite material mould, need
Composite material mould resin has good mechanical property and lower cure shrinkage.The present inventor is by deep for a long time
Research, discovery select epoxy resin as system bulk composition, and with curing agent appropriate cooperation, can have at normal temperature compared with
Low initial viscosity and longer technique working life, so as to abundant wetting fibre, and it is resistant to high temperature, had good
Mechanical property and lower cure shrinkage, and resin cost can be reduced, cannot achieve low-temperature solid to overcome over
Change the problem of taking into account with applied at elevated temperature.
Epoxy curing agent is chemically reacted with epoxy resin, netted space polymers is formed, composite material
Aggregate envelope is among reticulate body, therefore epoxy curing agent is indispensable a part, epoxy in epoxy-resin systems
Resin must be reacted with curing agent to generate three dimensional stereo structure and just have practical value.
Epoxy curing agent is various in style currently on the market, different properties.Foreign countries are remote to the research and development of curing agent
More active than epoxy resin, compared with epoxy resin kind, curing agent kind is more, and confidentiality is very strong.It is every develop it is a kind of new
Curing agent can solve the problems, such as one aspect, be equivalent to develop the new epoxy resin of one kind or open epoxy resin one
A new purposes.More than developing, neo-epoxy resin is even more important to have become common recognition to exploitation Novel curing agent.The inventors discovered that single
One selection fatty amine curing agent can reduce solidify after resin heat resistance, and aromatic amine curing agent, anhydride curing agent are more difficult normal
Temperature is lower to realize solidification；But if select fatty amine curing agent with it is any in aromatic amine curing agent and anhydride curing agent
Curing agent is used cooperatively, and can meet the requirement for taking into account low-temperature setting and applied at elevated temperature simultaneously.
Epoxy resin usually has high cementability, but at room temperature, initial viscosity is bigger, is unfavorable for infiltration to for example
In fiber and its fabric.In order to overcome this disadvantage, it usually needs diluent is added in use process to increase epoxy resin pair
The wetting capacity of fiber and its fabric improves building-up property, while can increase the dosage of filler.But invention human hair
It is existing, select epoxy resin and curing agent component epoxy system appropriate, it may not be necessary to use diluent, and so may be used
To improve the mechanical property and heat resistance of epoxy-resin systems, and reduce its cure shrinkage.Then, in some embodiments
In, the epoxy-resin systems of the invention do not include diluent.
In some embodiments, the epoxy resin includes bisphenol A type epoxy resin and/or bisphenol f type epoxy resin,
Or it is made of bisphenol A type epoxy resin and/or bisphenol f type epoxy resin.It is described in other preferred some embodiments
Epoxy resin is selected from the group being made of 830 epoxy resin, E51 epoxy resin, F51 epoxy resin and F44 epoxy resin.
In some embodiments, the fatty amine is selected from by hydrogenation diethylenetriamines, trien, second two
The group that amine, hexamethylene diamine, diethylenetriamine, triethylene tetramine, tetraethylenepentamine and diethylaminopropylamine form.
In some embodiments, the aromatic amine is selected from by diethyl toluene diamine, hydrogenation m-phenylene diamine (MPD), hydrogenation isophthalic
Dimethylamine, the group for hydrogenating adjacent methylresorcinol diamines, benzyl methyl amine, benzyl dimethylamine, m-phenylene diamine (MPD), m-xylene diamine composition.
In some embodiments, the anhydride curing agent is selected from by maleic anhydride, phthalic anhydride, methyl four
Hydrogenated phthalic anhydride (MTHPA), trimellitic anhydride (TMA), tetrabromophthalic anhydride, tetrachlorophthalic tetrachlorophthalic anhydrid,
The group of monochloro-benzene dicarboxylic acid anhydride and dichloro maleic anhydride composition.
In some more preferred embodiments, the epoxy resin includes bisphenol A type epoxy resin and Bisphenol F type ring
Oxygen resin is made of bisphenol A type epoxy resin and bisphenol f type epoxy resin, and bisphenol A type epoxy resin therein and
The mass ratio of bisphenol f type epoxy resin is 1:(1~5), for example, 1:1,1:2,1:3,1:4 or 1:5.The inventors discovered that adopting
With the combination of bisphenol A type epoxy resin and bisphenol f type epoxy resin and select curing agent combination appropriate that can prepare to obtain
It can guarantee that mechanical strength and durothermic while initial viscosity are even less than 300mpas, to be particularly conducive to resin infusion.
In some embodiments, the mass ratio of first curing agent and second curing agent is 1:(1~3), example
For example 1:1,1:2 or 1:3.
In some embodiments, the mass ratio of the component A and the component B are 20:(1~4), for example, 20:1,
20:2,20:3 or 20:4.
In some embodiments, the epoxy-resin systems 25 DEG C initial viscosity be less than 400mpa.s, such as
It is 50 to 400mpa.s；Technique working life (time that the viscosity i.e. after deployed to 25 DEG C is no more than 1000mpa.s)
It is 2 to 4 hours, such as 3 hours.
In some embodiments, the solidification temperature of the epoxy-resin systems is less than or equal to 40 DEG C, preferably
15 DEG C to 30 DEG C, for example, 25 DEG C；It is 12 to 24 hours, for example, 12,16,20 or 24 hours in 25 DEG C of curing times.It is low
Temperature solidify can reduce manufacture composite material mould needed for material and apparatus to durothermic requirement, it is possible to reduce energy disappears
Consumption, it is possible to reduce the generation and accumulation for causing internal stress in product is widely varied in temperature, to significantly reduce composite material
The manufacturing cost of mold improves the mechanical property of composite material mould.
After the priming, it needs to be post-processed at a higher temperature, so that epoxy-resin systems reaction is more abundant,
Improve the performance especially temperature tolerance of composite material mould.In the present invention, post-processing temperature is 100 DEG C to 140 DEG C, for example,
100,110,120,130 or 140 DEG C.
In some embodiments, the glass transition temperature of the epoxy-resin systems is 155 DEG C to 165 DEG C, such as
160℃.Glass transition temperature is the durothermic index of composite material mould, and epoxy-resin systems of the invention can expire simultaneously
The requirement of sufficient normal temperature cure and applied at elevated temperature solves the technical bottleneck of current high temperature resistant type composite material mould.
Second aspect of the present invention additionally provides epoxy-resin systems described in first aspect present invention and is preparing composite material
Application in mold.
Embodiment
It hereafter will be by the way that the present invention be further detailed in the form of embodiment.But protection scope of the present invention
It is not limited to these embodiments.
Fibrous composite used in embodiment is that (a kind of glass cloth reinforcing material, grinds SW220 purchased from Nanjing glass reinforced plastic
Institute is studied carefully, with a thickness of 3mm, having a size of 440mm X 240mm).Curing agent reaches chemical industry Co., Ltd from commercially available Jinan Huifeng.
Epoxy resin is purchased from SHANGHAI RESEARCH INSTITUTE OF SYNTHETIC RESINS.
Preparation example 1
According to ratio shown in the following table 1 830 epoxy resin as component A are weighed respectively, as the four of the first curing agent
Five amine of ethylene and diethyl toluene diamine as the second curing agent, are then blended in one for the first curing agent and the second curing agent
It rises, obtains component B.Component A is obtained into epoxy-resin systems E1 together with component B allotment again.
Compare preparation example 1
It is carried out in the way of preparation example 1, the difference is that tetraethylenepentamine is used only as curing agent, weight is
The summation of the first curing agent and the second curing agent in preparation example 1.Comparison epoxy-resin systems CE1 is made.
Resin process test
Then the resin process of epoxy-resin systems is measured, discovery room temperature (25 DEG C) initial viscosity is 356.4mPas,
Technique working life is 3 hours or so；The epoxy-resin systems are i.e. curable at room temperature (25 DEG C), in 25 DEG C of cured curing times
It is 12 hours；Best post-processing temperature is 110 DEG C (referring to Fig. 1), and finishing time is about 4 hours.
Heat resistance test
By measuring discovery to glass transition temperature (Tg), the average Tg of epoxy-resin systems E1 is 155.3 DEG C
(referring to fig. 2), the average Tg of epoxy-resin systems CE1 is 84.8 DEG C.
Pour mass Mechanics Performance Testing
It is poured using epoxy-resin systems, is then solidified 12 hours at 25 DEG C, and post-processed 4 hours at 120 DEG C, system
Obtain 18 pour mass (each pour mass includes 15g epoxy-resin systems).These pour mass are divided into 3 groups, one group for measuring
Tensile strength and stretch modulus, one group is used to measure bending strength and bending modulus, and another group for measuring cure shrinkage.Often
Group 6, wherein 5 are used to measure respective performances, 1 spare.As a result referring to the following table 2.
The Mechanics Performance Testing of composite material mould testpieces
It is logical using epoxy-resin systems CE1 obtained by epoxy-resin systems E1 obtained by preparation example 1 and comparison preparation example 1
It crosses priming by vacuum mode to be irrigated SW220 glass cloth (with a thickness of 3mm, having a size of 440mm X 240mm), then at 25 DEG C
Solidification 24 hours, and post-processed 5 hours at 100 DEG C, obtain 30 composite material mould testpieces plates.These testpieces are put down
Plate is divided into following 5 groups: (1) for measuring the group of tensile strength and stretch modulus, (2) are for measuring compressive strength and compression modulus
Group；(3) for measuring bending strength and bending modulus；(4) for measuring the group of interlaminar shear strength；(5) for measuring Tg
Value.Every group 6, wherein 5 are used to measure respective performances, 1 spare, and seeks the average value for calculating 5 measured values.As a result it is listed in table
In 3.As can be seen from Table 3, the mechanical property measured is suitable with (830 epoxy resin+tetraethylenepentamine) system, strong stretching
Degree, compressive strength and interlaminar shear strength are even also slightly better than (830 epoxy resin+tetraethylenepentamine) system, but are filled by E1
The Tg (161.2 DEG C) for infusing treadmill test part obtained is significantly higher than the Tg (89.8 DEG C) that treadmill test part obtained is perfused by CE1.
In addition, large-scale composite material mold (as shown in Figures 3 and 4) is manufactured using epoxy-resin systems made from preparation example 1,
The composite material mould has excellent performance, and surface roughness is about 0.8, and type face and dimensional accuracy are 0.2mm, porosity
Less than 0.1%, cost is the 45% of metal material mold, and the net period is 21 days.
Preparation example 2 to 7
It other than the content of table 1, carries out according to 1 substantially similar way of preparation example, and is measured using identical method
Whether epoxy-resin systems can solidify and by phase for 18 hours in 25 DEG C of initial viscosity, technique working life, in 25 DEG C of solidifications
The interlaminar shear strength of composite material mould treadmill test part made from the epoxy-resin systems answered (result is referring to table 4).
Compare preparation example 2 and 3
Other than the content of table 1, carried out according to 1 substantially similar way of preparation example.Moreover, being surveyed using identical method
Amount epoxy-resin systems 25 DEG C of initial viscosity, technique working life, solidify at 25 DEG C whether can solidify within 18 hours and by
The interlaminar shear strength of composite material mould testpieces plate made from corresponding epoxy-resin systems (result is referring to table 4).
Compare preparation example 4
It other than the content of table 1, is carried out according to 1 substantially similar way of preparation example, there are also the difference is that ring
It is added in epoxy resin system using the gross mass of epoxy-resin systems and is calculated as 5% diglycidyl ether as diluent.Moreover, adopting
With identical method measurement epoxy-resin systems 25 DEG C of initial viscosity, technique working life, 25 DEG C solidify 18 hours whether
It can solidify and the interlaminar shear strength of the composite material mould testpieces plate as made from corresponding epoxy-resin systems (is tied
Fruit is referring to table 4).
The formula of epoxy-resin systems in each preparation example of table 1..
The mechanical property for the pour mass that obtained epoxy-resin systems are poured in 2. preparation example 1 of table.
| Performance | 1 | 2 | 3 | 4 | 5 | Average value |
| Tensile strength/MPa | 74.2 | 73.9 | 75.4 | 75.1 | 74.4 | 74.6 |
| Stretch modulus/GPa | 2.8 | 2.9 | 3.1 | 3.0 | 2.9 | 2.9 |
| Bending strength/MPa | 115.2 | 112.5 | 114.7 | 114.5 | 116.7 | 114.7 |
| Bending modulus/GPa | 2.8 | 2.7 | 2.8 | 2.8 | 2.8 | 2.8 |
| Cure shrinkage % | 0.7 | 0.7 | 0.5 | 0.5 | 0.5 | 0.6 |
SW220 composite wood is perfused using epoxy-resin systems and 830 epoxy-resin systems obtained in preparation example 1 in table 3.
Expect the mechanical property of obtained composite material mould testpieces plate.
| Performance | SW220/ (830 epoxy resin+tetraethylenepentamine) | SW220/E1 |
| Tensile strength/MPa | 508 | 550 |
| Stretch modulus/GPa | 23.5 | 21.9 |
| Compressive strength/MPa | 378 | 385 |
| Compression modulus/GPa | 25.0 | 22.4 |
| Bending strength/MPa | 608 | 585 |
| Bending modulus/GPa | 18.2 | 17.1 |
| Interlaminar shear strength/MPa | 56.8 | 62.1 |
| Tg/℃ | 89.8 | 161.2 |
The performance of epoxy-resin systems made from each preparation example of table 4. and comparison preparation example.
As can be seen from the above table, the initial viscosity in preparation example 1 to 7 is all in 400mPas, and wherein preparation example 5 is initial
Viscosity is even less than 300mPas；Technique working life is 3 to 6 hours；Can normal temperature cure, and Tg be 155 DEG C or more,
Show good temperature tolerance.On the contrary, the comparison preparation example 2 and 3 using single curing agent can not solidify at normal temperature, comparison system
Although standby example 1 can solidify, Tg is too low, and less than 90 DEG C, temperature tolerance is poor.After preparation example 4 is compared due to having added diluent,
Although can reduce initial viscosity, Tg and interlaminar shear strength especially the latter are significantly reduced.
It can be seen that epoxy-resin systems of the invention from the result of above each preparation example and comparison preparation example to be suitable for
High temperature resistant composite mold, processing performance and service performance are excellent, are a kind of perfusion of room temperature, solidification, applied at elevated temperature it is low
Shrinking percentage epoxy-resin systems.The epoxy-resin systems have been successfully applied to the composite material quality mold of high-speed rail, the ring
The successful development of epoxy resin system so that making a breakthrough property of high-temperature composite material material mold progress, overcome metal under high temperature
The problems such as product size caused by material and composite material line differential expansion changes.Moreover, composite material is also greatly lowered
It is significant to shorten the production cycle with the manufacturing cost of mold, cost performance is improved, technological operation is simple, excellent in mechanical performance, multiple
It is had a wide range of applications on the large-size components such as condensation material material mold and component especially aerospace, rail traffic, ship
Prospect.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (10)
1. a kind of epoxy-resin systems, which is characterized in that the epoxy-resin systems include:
Component A, the component A include epoxy resin or are made of epoxy resin；With
Component B, the component B are comprising the first curing agent and the second curing agent or by the first curing agent and the second curing agent group
At first curing agent is fatty amine, and second curing agent is aromatic amine or anhydride curing agent.
2. epoxy-resin systems according to claim 1, which is characterized in that the epoxy-resin systems do not include dilution
Agent.
3. epoxy-resin systems according to claim 1, it is characterised in that:
The epoxy resin includes bisphenol A type epoxy resin and/or bisphenol f type epoxy resin；Also it is preferred that the epoxy
Resin is selected from the group being made of 830 epoxy resin, E51 epoxy resin, F51 epoxy resin and F44 epoxy resin；
The fatty amine is selected from by hydrogenation diethylenetriamines, trien, ethylenediamine, hexamethylene diamine, diethylenetriamine, three
The group of ethylene tetramine, tetraethylenepentamine and diethylaminopropylamine composition；
The aromatic amine is selected from by diethyl toluene diamine, hydrogenation m-phenylene diamine (MPD), hydrogenation m-xylene diamine, hydrogenates adjacent methylresorcinol
Diamines, benzyl methyl amine, the group of benzyl dimethylamine, m-phenylene diamine (MPD), m-xylene diamine composition；And/or
The anhydride curing agent is selected from by maleic anhydride, phthalic anhydride, methyl nadic anhydride, inclined benzene
Front three acid anhydrides, tetrabromophthalic anhydride, tetrachlorophthalic tetrachlorophthalic anhydrid, monochloro-benzene dicarboxylic acid anhydride and dichloro maleic anhydride group
At group.
4. epoxy-resin systems according to claim 1, which is characterized in that the epoxy resin includes bisphenol type epoxy
Resin and bisphenol f type epoxy resin are made of bisphenol A type epoxy resin and bisphenol f type epoxy resin；It is further preferred that described
The mass ratio of bisphenol A type epoxy resin and bisphenol f type epoxy resin is 1:(1~5).
5. epoxy-resin systems according to claim 1, which is characterized in that first curing agent and second solidification
The mass ratio of agent is 1:(1~3).
6. epoxy-resin systems according to claim 1, which is characterized in that the mass ratio of the component A and the component B
For 20:(1~4).
7. epoxy-resin systems according to claim 1, which is characterized in that the epoxy-resin systems are initial at 25 DEG C
Viscosity is less than 400mpa.s for example, 50 to 400mpa.s；Technique working life is 2 to 6 hours.
8. epoxy-resin systems according to claim 1, it is characterised in that:
The solidification temperature of the epoxy-resin systems is less than or equal to 40 DEG C, preferably 15 to 30 DEG C；
It is 12 to 24 hours in 25 DEG C of curing times；And/or
Post-processing temperature is 100 DEG C to 140 DEG C, and finishing time is 2 to 5 hours.
9. epoxy-resin systems according to claim 1, which is characterized in that the glass transition of the epoxy-resin systems
Temperature is 155 DEG C to 165 DEG C.
10. application of the epoxy-resin systems described in any one of claims 1 to 9 in composite material mould manufacture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810724311.0A CN109082075A (en) | 2018-07-04 | 2018-07-04 | A kind of epoxy-resin systems and its application in composite material mould manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810724311.0A CN109082075A (en) | 2018-07-04 | 2018-07-04 | A kind of epoxy-resin systems and its application in composite material mould manufacture |
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| CN113549302A (en) * | 2021-08-14 | 2021-10-26 | 东莞市德鸿家居用品有限公司 | Forming mold for bathroom product and preparation method thereof |
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| CN103946264A (en) * | 2012-02-27 | 2014-07-23 | 氰特科技股份有限公司 | Curable epoxy composition and short-cure method |
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| CN113549302A (en) * | 2021-08-14 | 2021-10-26 | 东莞市德鸿家居用品有限公司 | Forming mold for bathroom product and preparation method thereof |
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