CN109068556A - A kind of electromagnetic shielding bag - Google Patents
A kind of electromagnetic shielding bag Download PDFInfo
- Publication number
- CN109068556A CN109068556A CN201811088166.8A CN201811088166A CN109068556A CN 109068556 A CN109068556 A CN 109068556A CN 201811088166 A CN201811088166 A CN 201811088166A CN 109068556 A CN109068556 A CN 109068556A
- Authority
- CN
- China
- Prior art keywords
- layer
- conductive
- electromagnetic shielding
- bag body
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims abstract description 169
- 229910052751 metal Inorganic materials 0.000 claims abstract description 67
- 239000002184 metal Substances 0.000 claims abstract description 67
- 239000000945 filler Substances 0.000 claims abstract description 64
- 239000002131 composite material Substances 0.000 claims abstract description 49
- 239000012790 adhesive layer Substances 0.000 claims abstract description 16
- 229920006305 unsaturated polyester Polymers 0.000 claims description 16
- 229920002635 polyurethane Polymers 0.000 claims description 14
- 239000004814 polyurethane Substances 0.000 claims description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- -1 polytetrafluoroethylene Polymers 0.000 claims description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 8
- 229920000728 polyester Polymers 0.000 claims description 7
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229920002125 Sokalan® Polymers 0.000 claims description 6
- 229920006026 co-polymeric resin Polymers 0.000 claims description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 6
- 230000005684 electric field Effects 0.000 claims description 6
- ZHPNWZCWUUJAJC-UHFFFAOYSA-N fluorosilicon Chemical compound [Si]F ZHPNWZCWUUJAJC-UHFFFAOYSA-N 0.000 claims description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 6
- 239000004584 polyacrylic acid Substances 0.000 claims description 6
- 229920000570 polyether Polymers 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 5
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 5
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 2
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 claims 1
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical compound [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- 238000001228 spectrum Methods 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000005670 electromagnetic radiation Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910000889 permalloy Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 3
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 3
- 239000010974 bronze Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 210000000748 cardiovascular system Anatomy 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 210000000987 immune system Anatomy 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 210000005036 nerve Anatomy 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920006316 polyvinylpyrrolidine Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002910 solid waste Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 238000003911 water pollution Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0043—Casings being flexible containers, e.g. pouch, pocket, bag
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
Abstract
The present invention provides a kind of electromagnetic shielding bag, is related to electromangnetic spectrum field.Electromagnetic shielding bag provided by the invention includes bag body, shielded layer and encapsulated layer, wherein, the shielded layer is located at the inside of the bag body, the encapsulated layer is located at side of the shielded layer far from the bag body, the shielded layer includes along the adhesive layer and composite layer set gradually far from the bag body direction, the composite layer includes the filler in conductive silk screen and the gap for being filled in the conductive silk screen, and the filler includes low-melting-point metal.Technical solution of the present invention can effectively be electromagnetically shielded the article in bag.
Description
Technical field
The present invention relates to electromangnetic spectrum field more particularly to a kind of electromagnetic shielding bags.
Background technique
With the fast development of modern electronics industry, wireless communication and digitizing technique, electronic electric equipment is more and more general
And the quality of life is substantially increased, but these equipment can all generate electromagnetic radiation to some extent.Currently, electromagnetic radiation is
As the another big public hazards after noise pollution, atmosphere pollution, water pollution, solid waste pollution, electromagnetic radiation is not only caused
Interfering with each other between radiation source, but also the space of human survival is polluted, scientific research confirms that electromagnetic radiation reaches certain
Intensity just will affect nerve, reproduction, the immune and cardiovascular system of people, to induce various diseases.Therefore, it is badly in need of various
Electromagnetic shielded product.
Summary of the invention
The present invention provides a kind of electromagnetic shielding bag, can be effectively electromagnetically shielded to the article in bag.
The present invention provides a kind of electromagnetic shielding bag, adopts the following technical scheme that
The electromagnetic shielding bag includes bag body, shielded layer and encapsulated layer, wherein the shielded layer is located at the interior of the bag body
Side, the encapsulated layer are located at side of the shielded layer far from the bag body, and the shielded layer includes along far from the bag body side
To the adhesive layer and composite layer set gradually, the composite layer includes conductive silk screen and the gap for being filled in the conductive silk screen
In filler, the filler includes low-melting-point metal.
Optionally, be provided with velcro on the inside of the sack of the bag body, wherein the velcro include hook surface and with institute
The hair side that hook surface matches is stated, along the circumferential direction of the sack, the hook surface and hair side head and the tail are connected.
Optionally, opening is provided on the encapsulated layer, the opening is corresponding with the velcro position, and institute
Stating the low-melting-point metal at aperture position in the composite layer is solid-state；The velcro is conductive velcro.
Optionally, the edge of the sack of the bag body is provided with conductive zippers, and the conductive zippers include two panels conduction
Chain belt, in the edge of the sack, the composite layer has the part that exceeds beyond the encapsulated layer, described beyond in part
Low-melting-point metal be solid-state, the every conductive chain band with it is corresponding it is described beyond part connect.
Optionally, the shielded layer further includes the first conductive layer between the adhesive layer and the composite layer,
And/or the second conductive layer between the encapsulated layer and the composite layer.
Optionally, the filler further includes shielding filler, and the shielding filler is used for armoured magnetic field and/or electric field.
Optionally, the bag body includes the first film layer and the second film layer that edge mutually bonds, first film layer and institute
It states between the second film layer filled with metal layer, the material of the metal layer is that fusing point is higher than room temperature and low lower than 100 degrees Celsius
Melting point metals.
Optionally, the ratio between the thickness of the metal layer and the thickness of first film layer is 1: 3~1: 1；It is described
Metal layer with a thickness of 1~2mm.
Optionally, the material of first film layer is silica gel, UV epoxy acrylate, UV urethane acrylate, UV gather
Ether acrylate, UV polyester acrylate, UV unsaturated polyester (UP), polydimethylsiloxane, flexibility polyacrylic acid, the poly- ammonia of flexibility
One of ester, acrylic acid-polyurethane, polytetrafluoroethylene (PTFE), fluoroolefins and vinyl ethers copolymer resins, fluorine silicon resin；Described
The material of two film layers is silica gel, UV epoxy acrylate, UV urethane acrylate, UV polyether acrylate, UV polyester
Acid esters, UV unsaturated polyester (UP), polydimethylsiloxane, flexibility polyacrylic acid, flexibility polyurethane, acrylic acid-polyurethane, poly- four
One of vinyl fluoride, fluoroolefins and vinyl ethers copolymer resins, fluorine silicon resin.
Optionally, the bag body includes substrate, and is detachably set to multiple flexible pipes on the inside of the substrate, described
Low-melting-point metal of the fusing point higher than room temperature and lower than 100 degrees Celsius is filled in flexible pipe.
A kind of electromagnetic shielding bag provided by the invention, the electromagnetic shielding bag include bag body, shielded layer and encapsulated layer, shielded layer
Including along the adhesive layer and composite layer set gradually far from bag body direction, composite layer includes conductive silk screen and is filled in conductive filament
Filler in the gap of net, filler include low-melting-point metal, and the conductive silk screen in composite layer can effectively shield electromagnetic wave
In low frequency signal and intermediate-freuqncy signal, the specially signal of 10kHz~30MHz rank, low-melting-point metal in filler can be with
Intermediate-freuqncy signal and high-frequency signal effectively in shielding electromagnetic wave, the specially signal of 30MHz~40GHz, and shielding electromagnetic wave
In low frequency signal and intermediate-freuqncy signal, allow electromagnetic shielding bag the article in bag is effectively electromagnetically shielded.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of electromagnetic shielding bag provided in an embodiment of the present invention；
Fig. 2 is schematic cross-section one of the Fig. 1 provided in an embodiment of the present invention along the direction AA '；
Fig. 3 is the structural schematic diagram one of sack provided in an embodiment of the present invention；
Fig. 4 is the structural schematic diagram two of sack provided in an embodiment of the present invention；
Fig. 5 is schematic cross-section two of the Fig. 1 provided in an embodiment of the present invention along the direction AA '；
Fig. 6 is the structural schematic diagram one of bag body provided in an embodiment of the present invention；
Fig. 7 is the structural schematic diagram two of bag body provided in an embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
It should be noted that each technical characteristic in the embodiment of the present invention can be tied mutually in the absence of conflict
It closes.
The embodiment of the present invention provides a kind of electromagnetic shielding bag, and specifically, as depicted in figs. 1 and 2, Fig. 1 is that the present invention is implemented
The structural schematic diagram for the electromagnetic shielding bag that example provides, Fig. 2 are that Fig. 1 provided in an embodiment of the present invention illustrates along the section in the direction AA '
Figure one, electromagnetic shielding bag includes bag body 1, shielded layer 2 and encapsulated layer 3, wherein shielded layer 2 is located at the inside of bag body 1, encapsulated layer 3
Side positioned at shielded layer 2 far from bag body 1, shielded layer 2 include along the adhesive layer 21 set gradually far from 1 direction of bag body and answering
Layer 22 is closed, composite layer 22 includes the filler 222 that conduction silk screen 221 and is filled in the gap of conductive silk screen 221, filler
222 include low-melting-point metal.Encapsulated layer 3 is not shown in Fig. 1.
It should be noted that unless otherwise specified, the fusing point of low-melting-point metal is Celsius lower than 300 in the embodiment of the present invention
Degree.
Wherein, bag body 1 mainly plays carrying；Adhesive layer 21 is mainly used for improving the attachment of composite layer 22 and bag body 1
Power；Composite layer 22 is mainly used for shielding electromagnetic wave；Encapsulated layer 3 is mainly used for being packaged composite layer 22, prevents conductive silk screen
221 and filler 222 because with the external world contact due to caused by oxidation, corrosion or damage.
In the electromagnetic shielding bag, the conductive silk screen 221 in composite layer 22 can effectively shield the low frequency signal in electromagnetic wave
And intermediate-freuqncy signal, the specially signal of 10kHz~30MHz rank, the low-melting-point metal in filler 222 can effectively shield electricity
Low frequency letter in intermediate-freuqncy signal and high-frequency signal in magnetic wave, the specially signal of 30MHz~40GHz, and shielding electromagnetic wave
Number and intermediate-freuqncy signal, allow electromagnetic shielding bag the article in bag is effectively electromagnetically shielded.
Electromagnetic shielding bag in the embodiment of the present invention can be applied to mobile phone, electronic component (such as printed circuit board, hair
Optical diode etc.) etc. packaging or storage.
In actual use, the sack of bag body 1 can be sealed, to prevent from being placed in electromagnetic shielding bag
Article drops out, and the embodiment of the present invention provides the mode of following two sack sealing:
In one example, as shown in figure 3, Fig. 3 is the structural schematic diagram one of sack provided in an embodiment of the present invention, bag body
Velcro 4 is provided on the inside of 1 sack, wherein velcro 4 includes hook surface 41 and the hair side 42 to match with hook surface 41, with
So that sealing by the hook surface 41 of velcro 4 and the fitting of hair side 42, and then to electromagnetic shielding bag, the article in bag is prevented
It drops out.Further, it is selected in the embodiment of the present invention, along the circumferential direction of sack, hook surface 41 and hair side 42 connect from beginning to end, so that bag
All positions of mouth can be sealed, and sealing effect is good.
In this example, it is preferable that it is provided with opening on encapsulated layer 3, is open corresponding with 4 position of velcro, and
Low-melting-point metal at aperture position in composite layer 22 is solid-state, and velcro 4 is conductive velcro, so that the hook of velcro 4
After face 41 and hair side 42 are bonded to each other, each position of the composite layer 22 on the inside of sack is electrically connected to each other, can be to avoid electromagnetic wave
Enter in electromagnetic shielding bag from sack, helps to improve the shield effectiveness of electromagnetic shielding bag.Wherein, composite layer 22 at aperture position
Interior low-melting-point metal be it is solid the reason is that, solid low-melting-point metal will not be revealed from the opening of encapsulated layer 3, do not allow
Easily cause pollution and the decline of effectiveness.
In another example, as shown in figure 4, Fig. 4 is the structural schematic diagram two of sack provided in an embodiment of the present invention, bag
The edge of the sack of body 1 is provided with zipper 5, and then can simply and easily seal to electromagnetic shielding bag, prevents in bag
Article drop out.Further, it is selected in the embodiment of the present invention, zipper 5 is conductive zippers, and conductive zippers include two panels conductive chain
Band, in the edge of sack 1, composite layer 22, which has, exceeds part beyond encapsulated layer 3, is beyond the low-melting-point metal in part
Solid-state, every conductive chain band are connected with corresponding beyond part, so that after conductive zippers are pulled on, at sack marginal position
Each position of composite layer 22 be electrically connected to each other, can enter in electromagnetic shielding bag to avoid electromagnetic wave from sack, help to mention
The shield effectiveness of height electromagnetic shielding bag.It wherein, is solid the reason is that, solid eutectic beyond the low-melting-point metal in part
Point metal will not be revealed, it is not easy to pollute and the decline of effectiveness.
Optionally, the material of bag body 1 be textile, rubber, flexible plastic film, paper, non-woven fabrics, etc. one of.Glue
The material of adhensive layer 21 includes epoxy resin, unsaturated polyester (UP) class, polyurethanes, polyvinyl alcohol glue class, polyvinylpyrrolidine
One of ketone glue class, acrylic size class, vinyl acetate resin glue class are a variety of.In addition, inventor has found adhesive layer
21 thickness on electromagnetic shielding bag performance have certain influence, the thickness of adhesive layer 21 is too small, then can make composite layer 22 with
Attachment between bag body 1 is insecure, and the thickness of adhesive layer 21 is excessive, then can make flexible bad, the electromagnetism of adhesive layer 21
The flexibility of shielding bag is bad.Based on this, in the embodiment of the present invention select adhesive layer 21 with a thickness of 1~20 μm.
Optionally, the conductive silk screen 221 that composite layer 22 includes is brass screen, red copper net, stainless (steel) wire, nickel screen, iron net, silver
Net, tin net, permalloy net, tinning steel-in-copper net or tin-coated copper plated aluminium net etc..Optionally, the string diameter of conductive silk screen 221 is 5
μm~1000 μm.Conductive silk screen 221 with a thickness of 1O μm~2000 μm.The mesh number of conductive silk screen 221 is 2 mesh~2000 mesh.
Inventors have found that string diameter, mesh number and the thickness of conductive silk screen 221 also have a fixing to the performance of electromagnetic shielding bag
It rings.Specifically, the string diameter of conductive silk screen 221 is excessive, and the thickness of conductive silk screen 221 is excessive, and the thickness of composite layer 22 is excessive, electromagnetism
The flexibility of shielding bag filler more than 222 that is bad, and needing, at high cost, the string diameter of conductive silk screen 221 is too small, conductive silk screen 221
Thickness it is too small, the thickness of composite layer 22 is too small, and the effectiveness for being electromagnetically shielded bag is bad, be based on this, the present invention implement
The string diameter of conductive silk screen 221 is preferably 30 μm~200 μm in example.The thickness of conductive silk screen 221 is about the string diameter of conductive silk screen 221
2 times or so, the influence of the thickness of conductive silk screen 221 to the performance of electromagnetic shielding bag is identical as the conductive string diameter of silk screen 221,
The thickness of conductive silk screen 221 is preferably 60 μm~400 μm in inventive embodiments.The mesh number of conductive silk screen 221 is excessive, conductive silk screen
221 gap is too small, and the amount for the filler 222 that can be filled is very little, and effectiveness is bad, the mesh number of conductive silk screen 221
Too small, the gap of conductive silk screen 221 is excessive, bad to the shield effectiveness of low frequency signal, is based on this, conductive in the embodiment of the present invention
The mesh number of silk screen 221 is preferably 30 mesh~300 mesh.
Since composite layer 22 includes the filler 222 that conduction silk screen 221 and is filled in the gap of conductive silk screen 221, because
This, the consistency of thickness of the thickness of composite layer 22 and conductive silk screen 3, i.e., composite layer 22 with a thickness of 10 μm~2000 μm, preferably
60 μm~400 μm.
Optionally, the fusing point for the low-melting-point metal being electromagnetically shielded in the filler 222 that composite layer 22 includes in bag is taken the photograph 300
Within family name's degree, specifically, the fusing point of the low-melting-point metal in filler 222 can be in room temperature hereinafter, or in room temperature to 300
Between degree Celsius, when the fusing point of the low-melting-point metal in filler 222 is below room temperature, low-melting-point metal is liquid at room temperature
State so that the method for preparation electromagnetic shielding bag is relatively simple, and is electromagnetically shielded bag and can have preferable flexibility, and low melting point gold
The conductivity of category is high, and effectiveness is good, the fusing point of the low-melting-point metal in filler 222 room temperature to 300 degrees Celsius it
Between when, the selection of low-melting-point metal is relatively broad, and low-melting-point metal is solid-state at room temperature, low melting point can be made golden by heating
Category is molten into liquid, and then is used to prepare electromagnetic shielding bag.
Preferably, the low-melting-point metal in filler 222 is gallium-indium alloy or gallium-indium-tin alloy, and conductive silk screen 221 is
Brass screen or red copper net, at this point, the gallium and indium in low-melting-point metal in filler 222 can be with the copper in conductive silk screen 221
It reacts at room temperature, the compound layer with certain thickness (20nm~1000nm) is generated, so that filler 222 can be more preferable
Ground is attached on conductive silk screen 221, and is preferably filled in the gap of conductive silk screen 221.
Optionally, filler 222 further includes shielding filler, which is used for armoured magnetic field and/or electric field, that is, shields
Filler can be only used for armoured magnetic field, alternatively, shielding filler can be only used for shielding electric field, alternatively, shielding filler can be simultaneously
For armoured magnetic field and shielding electric field.
Wherein, the shielding filler in low-melting-point metal that filler 222 includes is excessive, and shielding filler can be made more difficult in liquid
It is uniformly dispersed in the low-melting-point metal of state, and cost is excessively high, the shielding filler mistake in the low-melting-point metal that filler 222 includes
It is few, shield effectiveness can be made bad, be based on this, shielded in the low-melting-point metal for selecting filler 222 to include in the embodiment of the present invention
The weight percent for covering filler is 5~40%.
Optionally, shielding filler includes iron powder, nickel powder, permalloy powder, ferrite powder, amorphous alloy powder, bronze, platinum
One or more of powder, silver powder, copper powder, conductive black, electrically conductive graphite, nickel coated graphite powder, silver-coated copper powder, silver coated nickel powder.Its
In, iron powder, nickel powder, permalloy powder, ferrite powder, amorphous alloy powder are mainly used for armoured magnetic field, bronze, platinum powder, silver powder, copper
Powder, conductive black, electrically conductive graphite, nickel coated graphite powder, silver-coated copper powder, silver coated nickel powder are mainly used for shielding electric field.Optionally, it shields
The partial size of filler is 1nm~100 μm.
In one example, filler is shielded as one in iron powder, nickel powder, permalloy powder, ferrite powder, amorphous alloy powder
Kind is several, and the weight percent that filler is shielded in the low-melting-point metal that filler 222 includes is 5~15%；In another example
In son, shielding filler is bronze, platinum powder, silver powder, copper powder, conductive black, electrically conductive graphite, nickel coated graphite powder, silver-coated copper powder, Yin Bao
One or more of nickel powder, the weight percent that filler is shielded in the low-melting-point metal that filler 222 includes is 10~40%.
In addition, the addition of shielding filler (such as nickel powder) can also improve the viscosity of filler 222, help to prevent filler
222 along conductive silk screen 221 to flow down.
Optionally, in the embodiment of the present invention, the material of encapsulated layer 3 includes UV epoxy acrylate, UV polyurethane acroleic acid
It is ester, UV polyether acrylate, UV polyester acrylate, UV unsaturated polyester (UP), polydimethylsiloxane, flexibility polyacrylic acid, soft
One or more of soft polyurethane ester, so that encapsulated layer 3 has preferable packaging effect and preferable flexibility.Optionally,
Encapsulated layer 3 with a thickness of 100 μm hereinafter, so that encapsulated layer 3 have it is preferable flexible.
Optionally, as shown in figure 5, Fig. 5 is schematic cross-section two of the Fig. 1 provided in an embodiment of the present invention along the direction AA ', screen
Covering layer 2 further includes the first conductive layer 23 between adhesive layer 21 and composite layer 22, and/or, it is located at encapsulated layer 3 and compound
The second conductive layer 24 between layer 22, i.e. shielded layer 2 further include the first conduction between adhesive layer 21 and composite layer 22
Layer 23, alternatively, shielded layer 2 further includes the second conductive layer 24 between encapsulated layer 3 and composite layer 22, alternatively, shielded layer 2 is also
Including the first conductive layer 23 between adhesive layer 21 and composite layer 22, and between encapsulated layer 3 and composite layer 22
The second conductive layer 24.
Inventors have found that may be fully filled in the presence of object 222 is not filled in the conductive silk screen 221 of composite layer 22
Gap influences the shield effectiveness for being electromagnetically shielded bag, and the first conductive layer 23 and/or the second conductive layer 24 not only can inherently rise
To the effect of electromagnetic shielding, and above-mentioned gap can also be adequately filled up, further improve the shield effectiveness of electromagnetic shielding bag.
Illustratively, the first conductive layer 23 can be by conductive silver paste, conductive copper paste, conductive carbon paste, conductive silicone grease, low melting point gold
It is formed after the composite material solidification of category or low-melting-point metal and shielding filler；Second conductive layer 24 can also by conductive silver paste, lead
Shape after the composite material solidification of electrolytic copper slurry, conductive carbon paste, conductive silicone grease, low-melting-point metal or low-melting-point metal and shielding filler
At.The particular content of the above shielding filler can be found in the particular content for the shielding filler that filler 222 includes, herein no longer into
Row repeats.
Preferably, the first conductive layer 23 is solidified by the composite material of low-melting-point metal or low-melting-point metal and shielding filler
After formed, and the low-melting-point metal in the first conductive layer 23 is identical as the low-melting-point metal that filler 222 includes, similarly,
Two conductive layers 24 after low-melting-point metal or low-melting-point metal and the composite material solidification of shielding filler by forming, and second is conductive
Low-melting-point metal in layer 24 is identical as the low-melting-point metal that filler 222 includes, so that the first conductive layer 23 and/or second
Good compatibility between conductive layer 24 and composite layer 22, almost without the functional of contact interface or contact interface, so that electric
The structural stability of magnetic screen bag is good.
Optionally, the thickness of the first conductive layer 23 and the second conductive layer 24 is at 200 μm or less.Wherein, the first conductive layer
23 and second conductive layer 24 thickness also can to electromagnetic shielding bag performance have an impact, specifically, the first conductive layer 23 or the
The thickness of two conductive layers 24 is too small, the effectiveness for being electromagnetically shielded bag can be made bad, the first conductive layer 23 or the second is led
The thickness of electric layer 24 is excessive, and the thickness for being electromagnetically shielded bag can be made larger, flexible bad, and higher cost, is based on this, first leads
The thickness of electric layer 23 is preferably 20~100 μm；The thickness of second conductive layer 24 is preferably 20~100 μm.
Optionally, as shown in fig. 6, Fig. 6 is the structural schematic diagram one of bag body provided in an embodiment of the present invention, bag body 1 includes
The first film layer 11 and the second film layer 12 that edge mutually bonds are filled with metal layer between the first film layer 11 and the second film layer 12
13, the material of metal layer 13 is that fusing point is higher than room temperature and is lower than 100 degrees Celsius of low-melting-point metal, so that the shape of bag body 1 can
To be changed according to actual needs.It is specific that change process as follows: bag body 1 is heated (such as blown with hair dryer or will
Bag body 1 is placed in hot water), so that the fusing of metal layer 13 therein is in a liquid state, the shape of bag body 1 is changed into target shape, so
After keep bag body 1 cooling, bag body 1 after cooling has required target shape.
Optionally, the ratio between the thickness of metal layer 13 and the thickness of the first film layer 11 is 1: 3~1: 1, metal layer 13
With a thickness of 1~2mm so that the intensity of metal layer 13 can maintain bag body 1 to have a target shape, and the thickness of bag body 1 and
Cost is smaller.
Optionally, the material of the first film layer 11 is silica gel, UV epoxy acrylate, UV urethane acrylate, UV polyethers
Acrylate, UV polyester acrylate, UV unsaturated polyester (UP), polydimethylsiloxane, flexibility polyacrylic acid, the poly- ammonia of flexibility
One of ester, acrylic acid-polyurethane, polytetrafluoroethylene (PTFE), fluoroolefins and vinyl ethers copolymer resins, fluorine silicon resin；Second film
The material of layer 12 is silica gel, UV epoxy acrylate, UV urethane acrylate, UV polyether acrylate, UV polyester acrylic
Ester, UV unsaturated polyester (UP), polydimethylsiloxane, flexibility polyacrylic acid, flexibility polyurethane, acrylic acid-polyurethane, polytetrafluoro
One of ethylene, fluoroolefins and vinyl ethers copolymer resins, fluorine silicon resin.
Optionally, as shown in fig. 7, Fig. 7 is the structural schematic diagram two of bag body provided in an embodiment of the present invention, bag body 1 includes
Substrate 14, and be detachably set to multiple flexible pipes 15 on the inside of substrate, fusing point is filled in flexible pipe 15 higher than room temperature and
Low-melting-point metal lower than 100 degrees Celsius can also be such that the shape of bag body 1 is changed according to actual needs.Specifically change
Change process is as follows: being heated (such as blown with hair dryer or bag body 1 is placed in hot water) to bag body 1, makes flexible pipe 15
In low-melting-point metal fusing be in a liquid state, the shape of flexible pipe 15 is changed, makes the shape target shape of bag body 1, so
After keep bag body 1 cooling, the low-melting-point metal solidification in flexible pipe 15, bag body 1 after cooling has required target shape.This
Kind of mode is compared with the mode of the change shape of the foregoing description, and the structure of bag body is relatively simple, lighter in weight, but shape is changeable
Property mode not as described above, those skilled in the art can select according to actual needs.
The embodiment of the invention provides a kind of electromagnetic shielding bag, which includes bag body, shielded layer and encapsulated layer,
Shielded layer includes along the adhesive layer and composite layer set gradually far from bag body direction, and composite layer includes conductive silk screen and is filled in
Filler in the gap of conductive silk screen, filler include low-melting-point metal, and the conductive silk screen in composite layer can be shielded effectively
Low frequency signal and intermediate-freuqncy signal in electromagnetic wave, the specially signal of 10kHz~30MHz rank, the low melting point gold in filler
Belong to the intermediate-freuqncy signal and high-frequency signal that can effectively shield in electromagnetic wave, the specially signal of 30MHz~40GHz, and shielding
Low frequency signal and intermediate-freuqncy signal in electromagnetic wave allow electromagnetic shielding bag to carry out effectively electromagnetic screen to the article in bag
It covers.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of electromagnetic shielding bag, which is characterized in that including bag body, shielded layer and encapsulated layer, wherein the shielded layer is located at institute
The inside of bag body is stated, the encapsulated layer is located at side of the shielded layer far from the bag body, and the shielded layer includes along separate
The adhesive layer and composite layer that the bag body direction is set gradually, the composite layer include conductive silk screen and are filled in the conduction
Filler in the gap of silk screen, the filler include low-melting-point metal.
2. electromagnetic shielding bag according to claim 1, which is characterized in that be provided with magic on the inside of the sack of the bag body
Patch, wherein the velcro includes hook surface and the hair side that matches with the hook surface, along the circumferential direction of the sack, the hook surface
It is connected with the hair side head and the tail.
3. electromagnetic shielding bag according to claim 2, which is characterized in that opening is provided on the encapsulated layer, it is described to open
Mouth is corresponding with the velcro position, and the low-melting-point metal at the aperture position in the composite layer is solid-state；
The velcro is conductive velcro.
4. electromagnetic shielding bag according to claim 1, which is characterized in that the edge of the sack of the bag body, which is provided with, leads
Electric zipper, the conductive zippers include two panels conductive chain band, and in the edge of the sack, the composite layer has beyond described
Encapsulated layer exceeds part, and the low-melting-point metal beyond in part is solid-state, the every conductive chain band with it is corresponding
It is described to be connected beyond part.
5. electromagnetic shielding bag according to claim 1, which is characterized in that the shielded layer further includes being located at the adhesive
The first conductive layer between layer and the composite layer, and/or, second between the encapsulated layer and the composite layer is conductive
Layer.
6. electromagnetic shielding bag according to claim 1, which is characterized in that the filler further includes shielding filler, described
It shields filler and is used for armoured magnetic field and/or electric field.
7. electromagnetic shielding bag according to claim 1, which is characterized in that the bag body includes first that edge mutually bonds
Film layer and the second film layer, are filled with metal layer between first film layer and second film layer, the material of the metal layer is
Fusing point is higher than room temperature and is lower than 100 degrees Celsius of low-melting-point metal.
8. electromagnetic shielding bag according to claim 7, which is characterized in that the thickness of the metal layer and first film layer
Thickness between ratio be 1: 3~1: 1；The metal layer with a thickness of 1~2mm.
9. electromagnetic shielding bag according to claim 7 or 8, which is characterized in that the material of first film layer is silica gel, UV
Epoxy acrylate, UV urethane acrylate, UV polyether acrylate, UV polyester acrylate, UV unsaturated polyester (UP), poly- two
Methyl-monosilane, flexibility polyacrylic acid, flexibility polyurethane, acrylic acid-polyurethane, polytetrafluoroethylene (PTFE), fluoroolefins and vinyl
One of ether copolymer resins, fluorine silicon resin；The material of second film layer is silica gel, UV epoxy acrylate, UV polyurethane
Acrylate, UV polyether acrylate, UV polyester acrylate, UV unsaturated polyester (UP), polydimethylsiloxane, flexibility polypropylene
In acid, flexibility polyurethane, acrylic acid-polyurethane, polytetrafluoroethylene (PTFE), fluoroolefins and vinyl ethers copolymer resins, fluorine silicon resin
One kind.
10. electromagnetic shielding bag according to claim 1, which is characterized in that the bag body includes substrate, and is detachably set
The multiple flexible pipes being placed on the inside of the substrate are filled with fusing point in the flexible pipe higher than room temperature and lower than 100 degrees Celsius
Low-melting-point metal.
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|---|---|---|---|
| CN201811088166.8A CN109068556A (en) | 2018-09-18 | 2018-09-18 | A kind of electromagnetic shielding bag |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811088166.8A CN109068556A (en) | 2018-09-18 | 2018-09-18 | A kind of electromagnetic shielding bag |
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| CN109068556A true CN109068556A (en) | 2018-12-21 |
Family
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