CN109060872A - A kind of device for simulating heat source for misting cooling experimental system measuring and calculating heat flow density - Google Patents
A kind of device for simulating heat source for misting cooling experimental system measuring and calculating heat flow density Download PDFInfo
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- CN109060872A CN109060872A CN201810794897.8A CN201810794897A CN109060872A CN 109060872 A CN109060872 A CN 109060872A CN 201810794897 A CN201810794897 A CN 201810794897A CN 109060872 A CN109060872 A CN 109060872A
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- heat
- heat source
- simulating
- flow density
- heating column
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- 238000001816 cooling Methods 0.000 title claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 42
- 239000000919 ceramic Substances 0.000 claims abstract description 28
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 15
- 239000010951 brass Substances 0.000 claims abstract description 15
- 238000012546 transfer Methods 0.000 claims abstract description 12
- 238000002474 experimental method Methods 0.000 claims abstract description 11
- 239000002937 thermal insulation foam Substances 0.000 claims abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000005259 measurement Methods 0.000 claims abstract description 8
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 8
- 239000010703 silicon Substances 0.000 claims abstract description 8
- 238000005507 spraying Methods 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229920000742 Cotton Polymers 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 230000005619 thermoelectricity Effects 0.000 claims 1
- 238000004088 simulation Methods 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 abstract description 3
- 230000033228 biological regulation Effects 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000012271 agricultural production Methods 0.000 description 1
- 230000003026 anti-oxygenic effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
Abstract
The invention proposes a kind of device for simulating heat source for misting cooling experimental system measuring and calculating heat flow density, are mainly used in misting cooling or the cooling experimental bench of jet stream, belong to heat dissipation fields of measurement.The present invention misting cooling test or the cooling experiment of jet stream in the bad measuring and calculating of the heat flow density that radiates aiming at the problem that, heat flow density is calculated by changing input voltage regulation simulation power of heat source with One-dimensional heat transfer different cross section temperature on acquisition heating column, devises a set of reliable device for simulating heat source.The device mainly includes two parts: ceramic heat part and heating column calculate heat flow density part.Ceramic heat part is mainly made of silicon electronic pressure controller, electrical parameter measuring instrument, ceramic heat circle, heat insulation foam, sheet radiator etc..Heating column measuring and calculating heat flow density part is mainly made of thermally conductive brass column, thermocouple and heat insulation foam etc..Apparatus of the present invention have many advantages, such as that simulation context is wide, measuring and calculating is stable, easy to operate safe.
Description
Technical field
The invention belongs to misting cooling experiment or the cooling experimental fields of jet stream, are more specifically applied to cooling
The simulation heat power supply device that can calculate heat flow density that experiment porch is built.
Background technique
Science and technology rapidly develops, the power density of the electronic components such as electronics high performance chips, Large Radar, high-end server
Increase year by year, the following heat build-up and temperature, which increase, has very big disappear to the service life and stability of equipment
Pole influences.Therefore the high efficiency and heat radiation in the confined space becomes the bottleneck of high-performance, the development of highly integrated electronic equipment.High power
The heat that electronic equipment generates mainly passes through heat transfer and is transmitted to package outside from encapsulation is internal, then by being forced to air-cooled and liquid
The types of cooling such as cold are discharged into environment.The advantages of these conventional radiating treatments, is that principle is simple, convenient reliable, but in face
When to high fever stream electronic equipment, exchange capability of heat, heat dissipation uniformity are slightly inadequate.
Misting cooling is a kind of emerging, efficient heat dissipation solution.Compared to more traditional thermal control method, misting cooling tool
Have many merits: heat-sinking capability is strong, temperature control response is fast, thermal contact resistance is small, working medium demand is few low with the degree of superheat.According to open source information,
The maximum heat dissipation hot-fluid of misting cooling even can achieve 1000W/cm2More than, application potential can satisfy next-generation Gao Xing
The thermal control demand of energy high-power electronic device.
But the effect of misting cooling is affected by various factors in actual application, such as spray angle, spraying height
Degree, different spraying mediums, spraying flow etc..In order to which preferably more rationally misting cooling is applied in industrial and agricultural production
It goes, building experimental bench, to study influence of the different factors to misting cooling effect particularly significant, and measures cooling effect largely
It is upper to the measuring and calculating of heat dissipation heat flow density and to meet the design of the simulation heat source in the case of different capacity depending on experimental bench.
Summary of the invention
In order to which misting cooling is preferably applied to production reality, meet in misting cooling experiment to different capacity heat source
The experiment demand of simulation demand and heat dissipation heat conduction heat flux density measuring and calculating, overcomes the simulation heat source situation in previous scheme single, steady
Qualitative inadequate, the insufficient defect of safety alarm keeps experimental bench design more secure and reliable more stable simultaneously, and the present invention provides one kind
The simulation heat power supply device design scheme of heat flow density can be calculated.
A kind of device for simulating heat source for misting cooling experimental system measuring and calculating heat flow density, the device for simulating heat source
Entirety is a composite structure body comprising heating part and thermally conductive measurement part；Heating part includes silicon electronic pressure controller, electricity
Parameter measurement instrument, ceramic heat circle, heat insulation foam, sheet radiator；Alternating current is added by the silicon electronic pressure controller to the ceramics
Gas ket power supply, electronic pressure controller and ceramic heat circle are series at the current detecting part of the electric parameter tester, while ceramics add
Gas ket is in parallel with the voltage detection department of the electric parameter tester；Thermally conductive measurement portion point includes heating column, thermocouple and heat-insulated
Cotton；The heat that the ceramic heat circle generates is transmitted to heating column by heat transfer by the sheet radiator, described thermally conductive
Column and heating resistor are heat-insulated by multi-layer ceramics fibrous insulant package, and the heat transfer inside heating column can be considered as one-dimensional biography
Heat, three different cross section temperature of heating column are by the thermocouple measurement in heating column, to obtain the temperature of three different cross sections, then
Heat flow density is calculated using Fourier Heat Conduction law.
As a further improvement of the present invention, the ceramic heat circle is presented vertical circumferential order and places, and centre is sheet
It is filled between radiator, and the pot body of stainless steel with heat insulation foam.
As a further improvement of the present invention, there is a circular pit in the upper end of the ceramic heat circle, in order to heating column
In conjunction with
As a further improvement of the present invention, the voltage of the adjustable input of the electronic pressure controller is to adapt to different experiments
Need, on electric parameter tester can read current, voltage parameter, and certain electric current, voltage, electrical power safety alarm are set
Value.
As a further improvement of the present invention, the heating column is boss structure, and outside diameter 36mm is highly
96mm, end diameter 10mm are highly 5mm, material be thermal coefficient it is higher and with certain antioxygenic property brass；
Sheet radiator among its structure small end and heating sheet contacts, and structure big end is heating surface, in the experiment of spraying or jet stream
Receive the spraying or impact of working fluid.
As a further improvement of the present invention, three different cross sections of heating column be respectively at a distance from big end heating surface 2mm,
37mm, 72mm, the hole diameter on each section is 2mm, and depth is respectively 6mm, 12mm, 18mm, the aperture on each section
It is distributed at 120 ° of angles, thermocouple is placed in these apertures, to acquire three different location temperature in each section in real time.
As a further improvement of the present invention, it is wrapped around the heating column with adiabatic cotton, to guarantee leading for heating column
Heat is one dimensional heat transfer.
As a further improvement of the present invention, the thermocouple is three layers of T-type thermocouple.
As a further improvement of the present invention, heat flow density calculates formula are as follows:Wherein t1、t2
It is the mean temperature of different cross section, δ is the distance between different cross section, and λ is that the thermal coefficient of brass is λ=118W/ (mK).
The beneficial effects of the present invention are: input voltage regulation range is big it is an advantage of the invention that (1) apparatus structure is simple,
The heat source that different capacity can be simulated meets the experiment demand under different capacity；(2) apparatus structure arrangement is compact, electricity ginseng
Different alarming values can be set in number tester, guarantee the safety of laboratory technician, avoid due to parameter setting is unreasonable, operation is lack of standardization
Caused danger；(3) temperature of thermally conductive three different cross sections of brass column on device is acquired by T-type thermocouple, each section
The temperature aperture different from three depth can reduce the influence of materials variances bring to the full extent.(4) it is adopted in the present invention
Material be all it is common in market, be easily obtained, convenient for assembling.
Detailed description of the invention
Fig. 1 is that the upper half of the device for simulating heat source for misting cooling experimental system measuring and calculating heat flow density of the invention is led
Hot brass column 3-D view；
Fig. 2 is the working principle of the device for simulating heat source for misting cooling experimental system measuring and calculating heat flow density of the invention
Schematic diagram, wherein 1 is thermocouple, and 2 be multichannel temperature measuring instrument, and 3 be heat insulation foam, and 4 be heat generating ceramic piece, and 5 be silicon electronics tune
Depressor, 6 be electric parameter tester, and 7 be sheet radiator, and 8 be thermally conductive brass column.
Specific embodiment
The present invention is further described for explanation and specific embodiment with reference to the accompanying drawing.
The device for simulating heat source that can calculate heat flow density for misting cooling experimental system of the invention mainly includes
Two parts: ceramic heat part and heating column calculate heat flow density part.
Ceramic heat part is mainly by silicon electronic pressure controller, electrical parameter measuring instrument, ceramic heat circle, heat insulation foam, sheet
The composition such as radiator.Alternating current is powered by silicon electronic pressure controller to ceramic heat circle, electronic pressure controller and the series connection of ceramic heat circle
In the current detecting part of electric parameter tester, while ceramic heat circle is in parallel with the voltage detection department of electric parameter tester, ceramics
Heating coil is placed in vertical circumference, and centre is sheet radiator (upper end has a circular pit in order to heating column combination), periphery
For heat insulation foam, it is integrally placed in the pot body of stainless steel.
Heating column measuring and calculating heat flow density part is mainly made of thermally conductive brass column, thermocouple and heat insulation foam etc..Such as Fig. 1
Shown in thermally conductive brass column be boss structure, outside diameter 36mm is highly 96mm, and end diameter 10mm is highly
5mm, the small end protruded can be combined with sheet radiator；Big end surfaces are heating surface, receive spraying in experiment or penetrate
Stream impact；Three different cross sections of thermally conductive brass column are respectively 2mm, 37mm, 72mm at a distance from big end heating surface, on each section
Hole diameter be 2mm, depth is respectively 6mm, 12mm, 18mm, and the aperture on each section is distributed at 120 ° of angles.Thermocouple
It is placed in these apertures, three different location temperature in each section can be acquired in real time.It is thermally conductive due to thermally conductive brass column
It is considered as One-dimensional heat transfer, heat flow density can be obtained according to Fourier law.
Heat flow density in this device calculates formula are as follows:Wherein t1、t2It is the flat of different cross section
Equal temperature, δ are the distance between different cross sections, and λ is that the thermal coefficient of brass is λ=118W/ (mK).
As shown in Fig. 2, the present invention mainly utilizes One-dimensional heat transfer Fourier law to calculate heat flow density, electronics tune is utilized
Depressor changes input voltage and realizes the simulation of different capacity heat source to adjust simulation heat source.Heat source gives out heat, by can
Heating surface is passed to be regarded as the brass column of One-dimensional heat transfer.In spraying system, the medium fluid that nozzle sprays impacts fever
Heat is taken away on surface, and the fluid of heating flows away by drain inclined-plane, recovery port is returned to, into next cooling process, Zhi Houzai
Into next step process.
It completes to seal with elevated-temperature seal item in the gap on heating surface and drain inclined-plane.The probe of thermocouple and the gap of aperture
It is filled with brass wire to enhance stability.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to of the invention
Protection scope.
Claims (9)
1. a kind of device for simulating heat source for misting cooling experimental system measuring and calculating heat flow density, it is characterised in that: the heat
Source simulator is integrally a composite structure body comprising heating part and thermally conductive measurement part；Heating part includes silicon electricity
Sub- pressure regulator, electrical parameter measuring instrument, ceramic heat circle, heat insulation foam, sheet radiator；Alternating current is given by the silicon electronic pressure controller
The ceramic heat circle power supply, electronic pressure controller and ceramic heat circle are series at the current detecting part of the electric parameter tester,
Ceramic heat circle is in parallel with the voltage detection department of the electric parameter tester simultaneously；Thermally conductive measurement portion point includes heating column, thermoelectricity
Idol and heat insulation foam；The heat that the ceramic heat circle generates is transmitted to by the sheet radiator by heat transfer thermally conductive
Column, the heating column and ceramic heat circle are heat-insulated by multi-layer ceramics fibrous insulant package, and the heat transfer inside heating column can quilt
It is considered one dimensional heat transfer, three different cross section temperature of heating column are by the thermocouple measurement in heating column, to obtain three differences
The temperature in section recycles Fourier Heat Conduction law to calculate heat flow density.
2. device for simulating heat source according to claim 1, it is characterised in that: it is suitable that vertical circumference is presented in the ceramic heat circle
Sequence is placed, and centre is sheet radiator, is filled between the pot body of stainless steel with heat insulation foam.
3. device for simulating heat source according to claim 2, it is characterised in that: there is a circle in the upper end of the ceramic heat circle
Pit, in order to heating column combination.
4. device for simulating heat source according to claim 2, it is characterised in that: the electricity of the adjustable input of the electronic pressure controller
Pressure to adapt to different experiment needs, on electric parameter tester can read current, voltage parameter, and certain electric current, electricity are set
Pressure, electrical power safety alarm value.
5. device for simulating heat source according to claim 1, it is characterised in that: the heating column is boss structure, and big end is straight
Diameter is 36mm, is highly 96mm, and end diameter 10mm is highly 5mm, and material is that thermal coefficient is higher and have certain anti-
The brass of oxidation susceptibility；Sheet radiator among its structure small end and heating sheet contacts, and structure big end is heating surface, spraying
Either receive the spraying or impact of working fluid in jet stream experiment.
6. device for simulating heat source according to claim 5, it is characterised in that: three different cross sections of heating column and big end are generated heat
The distance in face is respectively 2mm, 37mm, 72mm, and the hole diameter on each section is 2mm, depth be respectively 6mm, 12mm,
18mm, the aperture on each section are distributed at 120 ° of angles, and thermocouple is placed in these apertures, to acquire each section in real time
Three different location temperature.
7. device for simulating heat source according to claim 1, it is characterised in that: wrapped up around the heating column with adiabatic cotton
Firmly, to guarantee that the thermally conductive of heating column is one dimensional heat transfer.
8. device for simulating heat source according to claim 1, it is characterised in that: the thermocouple is three layers of T-type thermocouple.
9. device for simulating heat source according to claim 5, it is characterised in that: heat flow density calculates formula are as follows:Wherein t1、t2It is the mean temperature of different cross section, δ is the distance between different cross section, and λ is brass
Thermal coefficient be λ=118W/ (mK).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810794897.8A CN109060872A (en) | 2018-07-19 | 2018-07-19 | A kind of device for simulating heat source for misting cooling experimental system measuring and calculating heat flow density |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810794897.8A CN109060872A (en) | 2018-07-19 | 2018-07-19 | A kind of device for simulating heat source for misting cooling experimental system measuring and calculating heat flow density |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110167219A (en) * | 2019-05-28 | 2019-08-23 | 苏州工业园区服务外包职业学院 | A kind of device for simulating heat source and preparation method thereof |
| CN113141686A (en) * | 2021-03-31 | 2021-07-20 | 电子科技大学 | Device for manufacturing large-area high-heat-flux-density equivalent heat source by using heating rod |
| CN113970676A (en) * | 2021-09-30 | 2022-01-25 | 西安交通大学 | Heat source simulation device under space airborne environment |
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| CN113970676A (en) * | 2021-09-30 | 2022-01-25 | 西安交通大学 | Heat source simulation device under space airborne environment |
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