CN109054022A - Low-temperature fast-curing additional organosilicon tackifier and preparation method thereof in one kind - Google Patents
Low-temperature fast-curing additional organosilicon tackifier and preparation method thereof in one kind Download PDFInfo
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- CN109054022A CN109054022A CN201810802371.XA CN201810802371A CN109054022A CN 109054022 A CN109054022 A CN 109054022A CN 201810802371 A CN201810802371 A CN 201810802371A CN 109054022 A CN109054022 A CN 109054022A
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- low
- tackifier
- temperature fast
- additional organosilicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
Low-temperature fast-curing additional organosilicon tackifier in one kind have (R1SiO3/2)x(R2 2SiO2/2)y(Me2ViSiO1/2) z structure, wherein x+y+z=1；R1And R2For functional groups, it is selected from one of phenyl, epoxy group, glycidol ether oxygroup and amino or a variety of.Low-temperature fast-curing additional organosilicon tackifier are using phenyl silane, epoxy radicals silicone hydride, vinyl silanes as raw material in described, through obtained from hydrolysis, end capping reaction, the wherein reaction molar ratio of phenyl silane, epoxy radicals silicone hydride, vinyl silanes are as follows: 1:(0~1.4): (0.05~0.45).It is appropriate that low-temperature fast-curing additional organosilicon tackifier in the present invention are added, it is remarkably improved the shear strength of additivity liquid silastic, the tackifier for showing that the present invention synthesizes can increase substantially organosilicon sealant adhesive property.
Description
Technical field
The invention belongs to technical field of rubber material, in particular to low-temperature fast-curing additional organosilicon thickening in one kind
Agent.
Background technique
Additional organosilicon adhering and sealing material has excellent high and low temperature resistance, weather resistance, electrical insulation capability, life
Object medical performance, the feature of environmental protection and performances, the difficult point such as moisture-proof are curing rate and adhesion strength.Addition is containing N, S, P group
Tackifier can make catalyst poisoning, and system does not solidify or solidifies not exclusively.Addition contain active group, such as: OH, COOH, epoxy group,
The reactant of ester group, methacryloxy, boric acid or borate and silane coupling agent can be such that addition-type silicon rubber is glued
Effect is connect, in view of these situations, is had such as by synthesis: containing epoxy group (I), methacryloxy (II) and (III) containing hydrogen-based
The special silicone resin of sealing end and functional vinylite (containing functional groups IV, V) carry out concerted reaction, improve to work
The adhesive effect of engineering plastics substrate and metal.
Summary of the invention
The technical problem to be solved in the present invention is that: it overcomes the deficiencies of existing technologies, provides low-temperature fast-curing in one kind
Additional organosilicon tackifier.
In order to solve the above-mentioned technical problem, the present invention proposes following technical proposal: low-temperature fast-curing add-on type in one kind
Organic silicon rigidity-increasing stick has (R1SiO3/2)x(R2 2SiO2/2)y(Me2ViSiO1/2) z structure, wherein x+y+z=1；R1And R2
For functional groups, it is selected from one of phenyl, epoxy group, glycidol ether oxygroup and amino or a variety of.
The above technical solution is further limited in that in described low-temperature fast-curing additional organosilicon tackifier be with
Phenyl silane, epoxy radicals silicone hydride, vinyl silanes are raw material, through obtained from hydrolysis, end capping reaction, wherein phenyl silicon
The reaction molar ratio of alkane, epoxy radicals silicone hydride, vinyl silanes are as follows: 1:(0~1.4): (0.05~0.45).
In order to solve the above-mentioned technical problem, the present invention proposes following technical proposal: low-temperature fast-curing addition in described
The preparation method of type organic silicon rigidity-increasing stick, includes the following steps:
Step 1: hydrolysis: being added ethyl alcohol, phenyl silane, epoxy radicals silicone hydride, vinyl silanes and hydrochloric acid in flask,
68~80 DEG C are warming up to, water is added dropwise, 2~5h is reacted, system is down to room temperature after reaction, is neutralized using sodium bicarbonate, is taken off
Except ethyl alcohol and water；
Step 2: end capping reaction: step 1 synthesize product under tetramethylammonium hydroxide catalyst action with end-capping reagent six
Tetramethyldisiloxane reacts, and reaction temperature is 80-100 DEG C, time 1-2 hour.
Compared with prior art, the present invention has following the utility model has the advantages that appropriate be added low-temperature fast-curing in the present invention add
Organosilicon tackifier are formed, the shear strength of additivity liquid silastic is remarkably improved, show the tackifier that the present invention synthesizes
Organosilicon sealant adhesive property can be increased substantially.
Specific embodiment
The present invention proposes low-temperature fast-curing additional organosilicon tackifier in one kind, is added to additional organosilicon gluing
In agent, it is organic at the add-on type of high-adhesive-strength elastomer to can satisfy 3-5min rapid curing under the conditions of 100 DEG C -120 DEG C
Silicon is bonded the job requirement in the range of silicon rubber.
Low-temperature fast-curing additional organosilicon tackifier have (R in described1SiO3/2)x(R2 2SiO2/2)y
(Me2ViSiO1/2) z structure, wherein x+y+z=1；R1And R2For functional groups, it is selected from phenyl, epoxy group, glycidol
One of ether oxygen base and amino are a variety of.
The preparation method of low-temperature fast-curing additional organosilicon tackifier is with phenyl silane, epoxy group silicon in described
Alkane, vinyl silanes are raw material, through obtained from hydrolysis, end capping reaction.Wherein phenyl silane, epoxy radicals silicone hydride, ethylene
The reaction molar ratio of base silane are as follows: 1:(0~1.4): (0.05~0.45).
The preparation method of low-temperature fast-curing additional organosilicon tackifier includes the following steps: in described
Step 1: hydrolysis: being added ethyl alcohol, phenyl silane, epoxy radicals silicone hydride, vinyl silanes and hydrochloric acid in flask,
68~80 DEG C are warming up to, water is added dropwise, 2~5h is reacted, system is down to room temperature after reaction, is neutralized using sodium bicarbonate, is taken off
Except ethyl alcohol and water；
Step 2: end capping reaction: step 1 synthesize product under tetramethylammonium hydroxide catalyst action with end-capping reagent six
Tetramethyldisiloxane reacts, and reaction temperature is 80-100 DEG C, time 1-2 hour.
Prepare embodiment 1
By 202g dimethoxydiphenylsilane, 25g γ-(methacryloxypropyl) propyl trimethoxy silicane, 28g γ-
Glycidyl ether oxygen propyl trimethoxy silicane is added in the there-necked flask containing 500g isopropanol, and the dense salt of 0.2g is added dropwise in stirring
Acid is warming up to 70 DEG C, and 130g water is added dropwise, and flow back 3.5h, is down to room temperature, and 4g sodium bicarbonate is added and neutralizes, depressurizes 100 DEG C of removing water
And isopropanol, it is down to room temperature and 2g hexamethyldisiloxane is added, 0.02g tetramethylammonium hydroxide obtains after 100 DEG C of reaction 2h
Product.
Prepare embodiment 2
181g dimethoxydiphenylsilane, 15g γ-glycidyl ether oxygen propyl trimethoxy silicane is (silane coupled
Agent, 11g γ-(methacryloxypropyl) propyl trimethoxy silicane are added in the there-necked flask containing 420g isopropanol, are stirred, drop
Add 0.2g concentrated hydrochloric acid, be warming up to 70 DEG C, 111g water is added dropwise, maintain reflux temperature 3h, be down to room temperature, 4g sodium bicarbonate is added and neutralizes,
Depressurize 100 DEG C of removing water and isopropanol, be down to room temperature be added 2g hexamethyldisiloxane, 0.02g tetramethylammonium hydroxide,
After 100 DEG C of reaction 1.5h, product is obtained.
Product characteristics and compliance test result
The vinyl silicone oil of same amount, containing hydrogen silicone oil, inhibitor, platinum catalyst are configured to add-on type liquid silicon rubber
Sizing is divided into 3 parts and the tackifier synthesized in example is added, is applied on PC plate substrate, solidifies 5min in 100 DEG C of reactions
Afterwards, bond strength test is carried out to various kinds using Material Testing Machine.Test result such as table 1:
| Performance | Blank | Prepare embodiment 1 | Prepare embodiment 2 |
| Appearance | It is colorless and transparent | It is colorless and transparent | |
| Viscosity cp | 30 | 25 | |
| Adhesive strength Mpa | 0.25 | 1.8 | 1.7 |
By above table it is found that tackifier of the present invention are added in right amount, it is remarkably improved cutting for additivity liquid silastic
Shearing stress, the tackifier for showing that the present invention synthesizes can increase substantially organosilicon sealant adhesive property.
Claims (3)
1. low-temperature fast-curing additional organosilicon tackifier in one kind, which is characterized in that it has (R1SiO3/2)x
(R2 2SiO2/2)y(Me2ViSiO1/2) z structure, wherein x+y+z=1； R1And R2For functional groups, it is selected from phenyl, epoxy
One of base, glycidol ether oxygroup and amino are a variety of.
2. low-temperature fast-curing additional organosilicon tackifier according to claim 1, which is characterized in that low in described
Warm rapid curing additional organosilicon tackifier are using phenyl silane, epoxy radicals silicone hydride, vinyl silanes as raw material, through hydrolyzing instead
It answers, obtained from end capping reaction, wherein the reaction molar ratio of phenyl silane, epoxy radicals silicone hydride, vinyl silanes are as follows: 1:(0~1
.4): (.45 of 0 .05~0).
3. the preparation method of low-temperature fast-curing additional organosilicon tackifier, feature according to claim 1 or 2
It is, the preparation method includes the following steps:
Step 1: ethyl alcohol, phenyl silane, epoxy radicals silicone hydride, vinyl silanes and hydrochloric acid, heating hydrolysis: being added in flask
To 68~80 DEG C, water is added dropwise, reacts 2~5h, system is down to room temperature after reaction, is neutralized using sodium bicarbonate, removes second
Alcohol and water；
Step 2: end capping reaction: step 1 synthesize product under tetramethylammonium hydroxide catalyst action with end-capping reagent hexamethyl
Disiloxane reacts, and reaction temperature is 80-100 DEG C, time 1-2 hour.
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| CN201810802371.XA CN109054022A (en) | 2018-07-19 | 2018-07-19 | Low-temperature fast-curing additional organosilicon tackifier and preparation method thereof in one kind |
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| CN201810802371.XA CN109054022A (en) | 2018-07-19 | 2018-07-19 | Low-temperature fast-curing additional organosilicon tackifier and preparation method thereof in one kind |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109796595A (en) * | 2019-02-27 | 2019-05-24 | 华南理工大学 | A kind of high refractive index phenolic hydroxy group organic silicon rigidity-increasing stick and preparation method thereof |
| CN110256974A (en) * | 2019-07-19 | 2019-09-20 | 广州市高士实业有限公司 | A kind of silane modified polyether seal glue and the preparation method and application thereof |
| CN111004605A (en) * | 2019-12-21 | 2020-04-14 | 东莞市贝特利新材料有限公司 | Self-adhesive organic silicon liquid silicone rubber for bonding glass substrate and forming process thereof |
| CN111117479A (en) * | 2019-12-26 | 2020-05-08 | 江西贝特利新材料有限公司 | Special organic silicon explosion-proof protective coating applied to glass material and preparation and use methods thereof |
| CN111793210A (en) * | 2020-07-28 | 2020-10-20 | 荆州市江汉精细化工有限公司 | Preparation method of RTV (room temperature vulcanized) silicone rubber tackifier |
| CN114231247A (en) * | 2021-11-30 | 2022-03-25 | 湖北双键精细化工有限公司 | Room-temperature-curing two-component addition-type self-adhesive high-temperature-resistant silica gel and preparation method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109796595A (en) * | 2019-02-27 | 2019-05-24 | 华南理工大学 | A kind of high refractive index phenolic hydroxy group organic silicon rigidity-increasing stick and preparation method thereof |
| CN110256974A (en) * | 2019-07-19 | 2019-09-20 | 广州市高士实业有限公司 | A kind of silane modified polyether seal glue and the preparation method and application thereof |
| CN111004605A (en) * | 2019-12-21 | 2020-04-14 | 东莞市贝特利新材料有限公司 | Self-adhesive organic silicon liquid silicone rubber for bonding glass substrate and forming process thereof |
| CN111117479A (en) * | 2019-12-26 | 2020-05-08 | 江西贝特利新材料有限公司 | Special organic silicon explosion-proof protective coating applied to glass material and preparation and use methods thereof |
| CN111793210A (en) * | 2020-07-28 | 2020-10-20 | 荆州市江汉精细化工有限公司 | Preparation method of RTV (room temperature vulcanized) silicone rubber tackifier |
| CN111793210B (en) * | 2020-07-28 | 2022-06-07 | 湖北江瀚新材料股份有限公司 | Preparation method of RTV (room temperature vulcanized) silicone rubber tackifier |
| CN114231247A (en) * | 2021-11-30 | 2022-03-25 | 湖北双键精细化工有限公司 | Room-temperature-curing two-component addition-type self-adhesive high-temperature-resistant silica gel and preparation method thereof |
| CN114231247B (en) * | 2021-11-30 | 2023-04-07 | 湖北双键精细化工有限公司 | Room-temperature-curing two-component addition-type self-adhesive high-temperature-resistant silica gel and preparation method thereof |
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Application publication date: 20181221 |