CN109032988B - Network straight-through board card applied to server - Google Patents
Network straight-through board card applied to server Download PDFInfo
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- CN109032988B CN109032988B CN201810770929.0A CN201810770929A CN109032988B CN 109032988 B CN109032988 B CN 109032988B CN 201810770929 A CN201810770929 A CN 201810770929A CN 109032988 B CN109032988 B CN 109032988B
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- 238000004891 communication Methods 0.000 claims abstract description 6
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- 230000003287 optical effect Effects 0.000 claims abstract description 6
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 230000010354 integration Effects 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
- G06F13/4204—Bus transfer protocol, e.g. handshake; Synchronisation on a parallel bus
- G06F13/4221—Bus transfer protocol, e.g. handshake; Synchronisation on a parallel bus being an input/output bus, e.g. ISA bus, EISA bus, PCI bus, SCSI bus
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4004—Coupling between buses
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/27—Arrangements for networking
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/028—Subscriber network interface devices
Abstract
The invention relates to the technical field of servers, and provides a network straight-through board card applied to a server, which comprises a high-speed connector, a network signal conversion chip and an SFP + interface; the high-speed connector is used for acquiring a 10GBASE-KR signal from a network card node of the middle back plate and transmitting the acquired 10GBASE-KR signal to a corresponding network signal conversion chip; the network signal conversion chip is correspondingly connected with the four SFP + interfaces and is used for converting the 10GBASE-KR signal transmitted to the high-speed connector into an SFI signal and transmitting the SFI signal generated by conversion to the corresponding SFP + interface; the SFP + interface is used for carrying out communication interaction with the outside through the inserted SFP + optical module, thereby realizing reasonable and flexible utilization of system network resources in a server system with higher integration level and improving network bandwidth and transmission rate.
Description
Technical Field
The invention belongs to the technical field of servers, and particularly relates to a network through board card applied to a server.
Background
With the rapid development of the server field, the requirements on the network capacity and the data transmission rate of a general product are increased, and the configuration flexibility is increased, meanwhile, the system design density is higher and higher, and particularly for a high-end server, the phenomenon is more obvious.
At present, the configuration of a server network system is generally realized by adopting a switch, the switch is set to provide corresponding network resources for each network interface, but the network configuration flexibility of the existing switch is poor, the data transmission rate and the bandwidth can not meet the basic requirements of the rapid development of the existing server, and the provided network interface has a single type and can not meet various design requirements of server products.
Disclosure of Invention
The invention aims to provide a network through board card applied to a server, and aims to solve the problems that in the prior art, the network configuration flexibility of a switch is poor, the data transmission rate and the bandwidth cannot meet the basic requirements of rapid development of the existing server, and the provided network interface is single in type and cannot meet various design requirements of server products.
The invention is realized in this way, a network straight-through board card applied in the server, including several high-speed connectors, several network signal conversion chips and several SFP + interfaces connected with each network signal conversion chip;
the high-speed connector is respectively connected with a network card and a network signal conversion chip of a back plate in the server and is used for acquiring a 10GBASE-KR signal from a network card node of the back plate and transmitting the acquired 10GBASE-KR signal to the corresponding network signal conversion chip;
the network signal conversion chip is correspondingly connected with the four SFP + interfaces and is used for converting the 10GBASE-KR signal transmitted by the high-speed connector into an SFI signal and transmitting the SFI signal generated by conversion to the corresponding SFP + interface;
the SFP + interface is used for carrying out communication interaction with the outside through the inserted SFP + optical module.
As a further development of the solution,
the number of the network signal conversion chips is four, and the network signal conversion chips are respectively marked as a first network signal conversion chip, a second network signal conversion chip, a third network signal conversion chip and a fourth network signal conversion chip, and each network signal conversion chip is internally provided with a port1 interface, a port2 interface, a port3 interface and a port4 interface;
the number of the high-speed connectors is 8, and the high-speed connectors are respectively marked as a first high-speed connector, a second high-speed connector, a third high-speed connector, a fourth high-speed connector, a fifth high-speed connector, a sixth high-speed connector, a seventh high-speed connector and an eighth high-speed connector;
wherein, a network signal conversion chip corresponds to two high-speed connectors.
As an improved scheme, 16 nodes of the network card are respectively marked as node 1, node 2, node 3, node 4, node 5, node 6, node 7, node 8, node 9, node 10, node 11, node 12, node 13, node 14, node 15 and node 16;
wherein, the node 1 and the node 9 are correspondingly connected with the first high-speed connector through corresponding 10G-KR signal lines, the node 2 and the node 10 are correspondingly connected with the second high-speed connector through corresponding 10G-KR signal lines, the node 3 and the node 11 are correspondingly connected with the third high-speed connector through corresponding 10G-KR signal lines, the node 4 and the node 12 are correspondingly connected with the fourth high-speed connector through corresponding 10G-KR signal lines, the node 5 and the node 13 are correspondingly connected with the fifth high-speed connector through corresponding 10G-KR signal lines, the node 6 and the node 14 are correspondingly connected with the sixth high-speed connector through corresponding 10G-KR signal lines, and the node 7 and the node 15 are correspondingly connected with the seventh high-speed connector through corresponding 10G-KR signal lines, the node 8 and the node 16 are correspondingly connected with the eighth high-speed connector through corresponding 10G-KR signal lines respectively.
As an improved solution, each node of the network card comprises a first intermediate layer connector and a second intermediate layer connector, wherein the first intermediate layer connector and the second intermediate layer connector each comprise a P0 interface and a P1 interface.
As a modified solution, the P1 interface of the first intermediate layer connector of the node 1 is connected to the first high-speed connector through the 10G-KR signal line, and the P0 interface of the first intermediate layer connector of the node 9 is connected to the first high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 2 is connected with the second high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 10 is connected with the second high-speed connector through the 10G-KR signal line;
the P1 interface of the first intermediate layer connector of the node 3 is connected with the third high-speed connector through the 10G-KR signal line, and the P0 interface of the first intermediate layer connector of the node 11 is connected with the third high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 4 is connected to the fourth high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 12 is connected to the fourth high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 5 is connected with the fifth high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 13 is connected with the fifth high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 6 is connected with the sixth high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 14 is connected with the sixth high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 7 is connected with the seventh high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 15 is connected with the seventh high-speed connector through the 10G-KR signal line;
the P1 interface of the first intermediate layer connector of the node 8 is connected to the eighth high speed connector via the 10G-KR signal line, and the P0 interface of the first intermediate layer connector of the node 16 is connected to the eighth high speed connector via the 10G-KR signal line.
As an improved scheme, the network direct connection board card further comprises a first switching chip and a second switching chip, the first switching chip is connected with the second switching chip through an I2C signal line, the second switching chip is respectively connected with the first high-speed connector and the second high-speed connector through a first SMC-SMB signal line and a second SMC-SMB signal line, the first high-speed connector is connected with the first system controller, and the second high-speed connector is connected with the second system controller;
the first exchange chip is provided with a pin 0, a pin 1, a pin 2, a pin 3 and a pin 4, wherein a circuit led out from the pin 3 is respectively connected with a plurality of temperature sensors for detecting temperature parameters of the network signal conversion chip and the network through board card.
As an improved scheme, the pin 2 of the first exchange chip is connected with a plurality of fan rotating speed control chips.
As an improved scheme, a pin 1 of the first switching chip is connected with an LED indicator light for displaying a power state of the network through board card.
In the embodiment of the invention, the network through board card applied to the server comprises a plurality of high-speed connectors, a plurality of network signal conversion chips and a plurality of SFP + interfaces connected with each network signal conversion chip; the high-speed connector is respectively connected with a network card and a network signal conversion chip of a back plate in the server and is used for acquiring a 10GBASE-KR signal from a network card node of the back plate and transmitting the acquired 10GBASE-KR signal to the corresponding network signal conversion chip; the network signal conversion chip is correspondingly connected with the four SFP + interfaces and is used for converting the 10GBASE-KR signal transmitted to the high-speed connector into an SFI signal and transmitting the SFI signal generated by conversion to the corresponding SFP + interface; the SFP + interface is used for carrying out communication interaction with the outside through the inserted SFP + optical module, thereby realizing reasonable and flexible utilization of system network resources in a server system with higher integration level and improving network bandwidth and transmission rate.
Drawings
Fig. 1 is a schematic structural diagram of a network express card applied to a server according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Fig. 1 shows a schematic structural diagram of a network express card applied in a server according to the present invention, and for convenience of description, only the parts related to the present invention are shown in the diagram.
The network straight-through board card applied to the server comprises a plurality of high-speed connectors, a plurality of network signal conversion chips and a plurality of SFP + interfaces connected with each network signal conversion chip;
the high-speed connector is respectively connected with a network card and a network signal conversion chip of a back plate in the server and is used for acquiring a 10GBASE-KR signal from a network card node of the back plate and transmitting the acquired 10GBASE-KR signal to the corresponding network signal conversion chip, and the high-speed connector is an FCI HS;
the network signal conversion chip is correspondingly connected with the four SFP + interfaces and used for converting the 10GBASE-KR signal transmitted by the high-speed connector into an SFI signal and transmitting the SFI signal generated by conversion to the corresponding SFP + interface, wherein the model of the network signal conversion chip is CS4223_ A;
the SFP + interface is used for communication interaction with the outside through the inserted SFP + optical module, and 16 cases are shown in the figure.
Wherein the content of the first and second substances,
the number of the network signal conversion chips is four, and the network signal conversion chips are respectively marked as a first network signal conversion chip, a second network signal conversion chip, a third network signal conversion chip and a fourth network signal conversion chip, and each network signal conversion chip is internally provided with a port1 interface, a port2 interface, a port3 interface and a port4 interface;
the number of the high-speed connectors is 8, and the high-speed connectors are respectively marked as a first high-speed connector, a second high-speed connector, a third high-speed connector, a fourth high-speed connector, a fifth high-speed connector, a sixth high-speed connector, a seventh high-speed connector and an eighth high-speed connector;
wherein, a network signal conversion chip corresponds to two high-speed connectors.
In this embodiment, there are 16 nodes of the network card, which are respectively denoted as Node 1, Node 2, Node 3, Node 4, Node 5, Node 6, Node 7, Node 8, Node 9, Node 10, Node 11, Node 12, Node 13, Node 14, Node 15, and Node 16, where Node is expressed as Node in fig. 1;
wherein, the node 1 and the node 9 are correspondingly connected with the first high-speed connector through corresponding 10G-KR signal lines, the node 2 and the node 10 are correspondingly connected with the second high-speed connector through corresponding 10G-KR signal lines, the node 3 and the node 11 are correspondingly connected with the third high-speed connector through corresponding 10G-KR signal lines, the node 4 and the node 12 are correspondingly connected with the fourth high-speed connector through corresponding 10G-KR signal lines, the node 5 and the node 13 are correspondingly connected with the fifth high-speed connector through corresponding 10G-KR signal lines, the node 6 and the node 14 are correspondingly connected with the sixth high-speed connector through corresponding 10G-KR signal lines, and the node 7 and the node 15 are correspondingly connected with the seventh high-speed connector through corresponding 10G-KR signal lines, the node 8 and the node 16 are correspondingly connected with the eighth high-speed connector through corresponding 10G-KR signal lines respectively.
As shown in fig. 1, each node of the network card comprises a first intermediate layer connector (MEZZ1) and a second intermediate layer connector (MEZZ2), wherein the first intermediate layer connector and the second intermediate layer connector each comprise a P0 interface and a P1 interface;
the P1 interface of the first middle layer connector of the node 1 is connected with the first high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 9 is connected with the first high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 2 is connected with the second high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 10 is connected with the second high-speed connector through the 10G-KR signal line;
the P1 interface of the first intermediate layer connector of the node 3 is connected with the third high-speed connector through the 10G-KR signal line, and the P0 interface of the first intermediate layer connector of the node 11 is connected with the third high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 4 is connected to the fourth high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 12 is connected to the fourth high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 5 is connected with the fifth high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 13 is connected with the fifth high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 6 is connected with the sixth high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 14 is connected with the sixth high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 7 is connected with the seventh high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 15 is connected with the seventh high-speed connector through the 10G-KR signal line;
the P1 interface of the first intermediate layer connector of the node 8 is connected to the eighth high speed connector via the 10G-KR signal line, and the P0 interface of the first intermediate layer connector of the node 16 is connected to the eighth high speed connector via the 10G-KR signal line.
In the embodiment of the present invention, the network direct connection board further includes a first switch chip and a second switch chip, the first switch chip is connected to the second switch chip through an I2C signal line, the second switch chip is connected to the first high-speed connector and the second high-speed connector through a first SMC-SMB signal line and a second SMC-SMB signal line, respectively, the first high-speed connector is connected to a first system controller (BMC1), and the second high-speed connector is connected to a second system controller (BMC 2);
the first exchange chip is provided with a pin 0, a pin 1, a pin 2, a pin 3 and a pin 4, wherein a circuit led out from the pin 3 is respectively connected with a plurality of temperature sensors for detecting temperature parameters of the network signal conversion chip and the network through board card, and the number of the temperature sensors is four as shown in the figure;
the pins 2 of the first switching chip are connected with a plurality of fan rotating speed control chips (two conditions are shown in the figure), and the fan rotating speed is adjusted to control the temperature of the network through board card and the network signal conversion chip according to the obtained temperature parameters of the network through board card and the network signal conversion chip;
a pin 1 of the first switching chip is connected with an LED indicator lamp for displaying the power state of the network through board card, wherein the power-on state is on, and the power-off state is off;
in this embodiment, the first switching chip is of the type PCA9548, the second switching chip is of the type PCA9541, the temperature sensor is of the type EMC1413, and the fan speed control chip PCA 9554.
In the embodiment of the invention, the network through board card applied to the server comprises a plurality of high-speed connectors, a plurality of network signal conversion chips and a plurality of SFP + interfaces connected with each network signal conversion chip; the high-speed connector is respectively connected with a network card and a network signal conversion chip of a back plate in the server and is used for acquiring a 10GBASE-KR signal from a network card node of the back plate and transmitting the acquired 10GBASE-KR signal to the corresponding network signal conversion chip; the network signal conversion chip is correspondingly connected with the four SFP + interfaces and is used for converting the 10GBASE-KR signal transmitted to the high-speed connector into an SFI signal and transmitting the SFI signal generated by conversion to the corresponding SFP + interface; the SFP + interface is used for carrying out communication interaction with the outside through the inserted SFP + optical module, and has the following technical effects:
(1) the reasonable and flexible utilization of system network resources is realized in a server system with higher integration level, and the network bandwidth and the transmission rate are improved;
(2) the connection mode is flexible, and the method has advantages in system design layout;
(3) the cost is reduced, the marketing process of the product is accelerated, and the product competitiveness is favorably improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. A network through board card applied to a server is characterized by comprising a plurality of high-speed connectors, a plurality of network signal conversion chips and a plurality of SFP + interfaces connected with each network signal conversion chip;
the high-speed connector is respectively connected with a network card and a network signal conversion chip of a back plate in the server and is used for acquiring a 10GBASE-KR signal from a network card node of the back plate and transmitting the acquired 10GBASE-KR signal to the corresponding network signal conversion chip;
the network signal conversion chip is correspondingly connected with the four SFP + interfaces and is used for converting the 10GBASE-KR signal transmitted by the high-speed connector into an SFI signal and transmitting the SFI signal generated by conversion to the corresponding SFP + interface;
the SFP + interface is used for carrying out communication interaction with the outside through the inserted SFP + optical module;
the number of the network signal conversion chips is four, and the network signal conversion chips are respectively marked as a first network signal conversion chip, a second network signal conversion chip, a third network signal conversion chip and a fourth network signal conversion chip, and each network signal conversion chip is internally provided with a port1 interface, a port2 interface, a port3 interface and a port4 interface;
the number of the high-speed connectors is 8, and the high-speed connectors are respectively marked as a first high-speed connector, a second high-speed connector, a third high-speed connector, a fourth high-speed connector, a fifth high-speed connector, a sixth high-speed connector, a seventh high-speed connector and an eighth high-speed connector;
wherein, one network signal conversion chip corresponds to two high-speed connectors; the number of the network card nodes is 16, and the nodes are respectively marked as node 1, node 2, node 3, node 4, node 5, node 6, node 7, node 8, node 9, node 10, node 11, node 12, node 13, node 14, node 15 and node 16;
wherein, the node 1 and the node 9 are correspondingly connected with the first high-speed connector through corresponding 10G-KR signal lines, the node 2 and the node 10 are correspondingly connected with the second high-speed connector through corresponding 10G-KR signal lines, the node 3 and the node 11 are correspondingly connected with the third high-speed connector through corresponding 10G-KR signal lines, the node 4 and the node 12 are correspondingly connected with the fourth high-speed connector through corresponding 10G-KR signal lines, the node 5 and the node 13 are correspondingly connected with the fifth high-speed connector through corresponding 10G-KR signal lines, the node 6 and the node 14 are correspondingly connected with the sixth high-speed connector through corresponding 10G-KR signal lines, and the node 7 and the node 15 are correspondingly connected with the seventh high-speed connector through corresponding 10G-KR signal lines, the node 8 and the node 16 are correspondingly connected with the eighth high-speed connector through corresponding 10G-KR signal lines respectively.
2. The network pass-through board applied to a server of claim 1, wherein the nodes of each of the network cards comprise a first and second middle layer connector, wherein the first and second middle layer connectors each comprise a P0 interface and a P1 interface.
3. The network express card applied to the server according to claim 2, wherein the P1 interface of the first middle layer connector of the node 1 is connected to the first high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 9 is connected to the first high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 2 is connected with the second high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 10 is connected with the second high-speed connector through the 10G-KR signal line;
the P1 interface of the first intermediate layer connector of the node 3 is connected with the third high-speed connector through the 10G-KR signal line, and the P0 interface of the first intermediate layer connector of the node 11 is connected with the third high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 4 is connected to the fourth high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 12 is connected to the fourth high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 5 is connected with the fifth high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 13 is connected with the fifth high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 6 is connected with the sixth high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 14 is connected with the sixth high-speed connector through the 10G-KR signal line;
the P1 interface of the first middle layer connector of the node 7 is connected with the seventh high-speed connector through the 10G-KR signal line, and the P0 interface of the first middle layer connector of the node 15 is connected with the seventh high-speed connector through the 10G-KR signal line;
the P1 interface of the first intermediate layer connector of the node 8 is connected to the eighth high speed connector via the 10G-KR signal line, and the P0 interface of the first intermediate layer connector of the node 16 is connected to the eighth high speed connector via the 10G-KR signal line.
4. The network direct connection board applied to the server according to claim 3, further comprising a first switch chip and a second switch chip, wherein the first switch chip is connected to the second switch chip through an I2C signal line, the second switch chip is connected to the first high-speed connector and the second high-speed connector through a first SMC-SMB signal line and a second SMC-SMB signal line, respectively, the first high-speed connector is connected to a first system controller, and the second high-speed connector is connected to a second system controller;
the first exchange chip is provided with a pin 0, a pin 1, a pin 2, a pin 3 and a pin 4, wherein a circuit led out from the pin 3 is respectively connected with a plurality of temperature sensors for detecting temperature parameters of the network signal conversion chip and the network through board card.
5. The network through board card applied to the server according to claim 4, wherein the pin 2 of the first switch chip is connected to a plurality of fan speed control chips.
6. The network through board applied to the server as claimed in claim 5, wherein the pin 1 of the first switch chip is connected to an LED indicator for displaying the power status of the network through board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810770929.0A CN109032988B (en) | 2018-07-13 | 2018-07-13 | Network straight-through board card applied to server |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810770929.0A CN109032988B (en) | 2018-07-13 | 2018-07-13 | Network straight-through board card applied to server |
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| CN109032988A CN109032988A (en) | 2018-12-18 |
| CN109032988B true CN109032988B (en) | 2021-07-27 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203840374U (en) * | 2014-05-12 | 2014-09-17 | 浪潮电子信息产业股份有限公司 | Multi-plane integrated network exchange module |
| CN206332674U (en) * | 2016-10-31 | 2017-07-14 | 武汉烽火网络有限责任公司 | A kind of Ethernet switch wiring board |
-
2018
- 2018-07-13 CN CN201810770929.0A patent/CN109032988B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203840374U (en) * | 2014-05-12 | 2014-09-17 | 浪潮电子信息产业股份有限公司 | Multi-plane integrated network exchange module |
| CN206332674U (en) * | 2016-10-31 | 2017-07-14 | 武汉烽火网络有限责任公司 | A kind of Ethernet switch wiring board |
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