CN109029569A - A kind of high-throughput forging data collection system and method - Google Patents
A kind of high-throughput forging data collection system and method Download PDFInfo
- Publication number
- CN109029569A CN109029569A CN201810814360.3A CN201810814360A CN109029569A CN 109029569 A CN109029569 A CN 109029569A CN 201810814360 A CN201810814360 A CN 201810814360A CN 109029569 A CN109029569 A CN 109029569A
- Authority
- CN
- China
- Prior art keywords
- throughput
- forging
- sample
- sensor
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
Abstract
The present invention relates to the intelligent data acqusition systems and method of a kind of high-throughput forging, belong to material data acquisition field.The system includes multiple temperature sensors, multiple pressure sensors, displacement sensor, signal processing module, signal acquisition module and acquisition monitoring computer.Through the invention, the real-time data acquisition of high-throughput forging experiment is achieved.
Description
Technical field
The invention belongs to material datas to acquire field, more particularly to a kind of intelligent data acqusition system of high-throughput forging
And method.
Technical background
In scientific research field, the theory of big data is changing scientific research personnel to the exploring mode of outfield.Correspondingly,
Propose material genome project, it is desirable that researcher accelerates the R&D process of material, wherein a kind of critically important research method
It is exactly the high-throughput experiment of material.The characteristics of material high throughput is tested is short time, Multi-example, can be by once testing acquisition
A large amount of data information, and it is screened out from it valuable data.It can be not only that material gene database is filled by experiment
Real data can also calculate with sunykatuib analysis and combine common reflection material property, the screening and optimization of accelerated material.Therefore,
High throughput experiment plays more and more crucial effect in material development.
Intelligence manufacture be unable to do without data acquisition, and data finally instruct processed again by acquisition, analysis, statistics and feedback
Journey, this is the inexorable trend of era development.Data acquisition, it is the bridge that computer is connect with the external physical world, is to utilize
The devices such as sensor acquire data from exterior and are input to internal system, data acquisition technology it be widely used in
In every field, and more and more significant effect is played commonly used today in computer.
Its temperature, pressure and deformation are controlled in forging process in order to make forging obtain preferably tissue and performance, forging
Degree is particularly important, it is therefore desirable to provide a kind of real-time pressure that can observe directly sample in forging process, position
It moves and the high-throughput of the states such as temperature forges data collection system, better meet the requirement of high-throughput experiment.
Summary of the invention
In order to achieve the goal above, the present invention provides a kind of high-throughput forging data collection system and method, by
Mounting temperature sensor, pressure sensor and displacement sensor, signal processing module, signal acquisition mould in high-throughput forging apparatus
Block etc., the primary temperature, pressure and displacement data for acquiring multiple samples simultaneously, converts digital signal for these physical quantitys in real time
Amount, and data are finally transferred to acquisition monitoring computer and are analyzed and processed.
High-throughput forging data collection system according to the present invention, comprising: multiple temperature sensors, multiple pressure sensings
Device, displacement sensor, signal processing module, signal acquisition module and acquisition monitoring computer,
Temperature sensor is connect with forging sample, for acquiring multiple groups sample temperature in high-throughput experiment in real time;
Pressure sensor is fixed on on compression bar corresponding to each sample, and installation site is the mold card of high-throughput experiment
Electric signal in slot, for converting the pressure to that transmission can be collected;
Displacement sensor is mounted on the guide sleeve of high-throughput forging apparatus, and is fixed by clip and guide sleeve, is used for position
Shifting amount is converted into the electric signal that can be collected transmission;
The signal processing module and the temperature sensor, the pressure sensor and institute's displacement sensors connect
It connects, for being filtered, amplifying by the electric signal acquired from sensor, being converted into can be received by the signal acquisition module
Signal, and it is sent to the signal acquisition module module;
The signal acquisition module has N number of channel, can be connected with N number of signal processing port, for will be from described
Signal processing module received signal is transferred to the acquisition monitoring computer, and the value of N is 4,8,16 or 32;
The acquisition monitoring computer stores temperature data, pressure data and displacement data, analyzes processing simultaneously
For showing.
Further, stuffed heat insulated ceramic fibre between mold card slot gap, for being carried out to the pressure sensor
It is heat-insulated.
Further, the Thermal Insulating Ceramic Fibers are the polycrystalline mullite ceramic fibre of alumina content 70-80%, heat-resisting
Temperature upper limit is 1500 DEG C, thermal coefficient 0.03-0.3W/m.K.
Further, the compression bar processes hole corresponding with the pressure sensor in upper surface, is connected through a screw thread
The pressure sensor.
Further, when the guide sleeve, which is moved downwardly to compression bar, just touches sample, institute's displacement sensors are installed,
So that displacement sensor feeler lever part just touches following cushion block.
Further, institute's displacement sensors are in the insulated wall isolation of the high-throughput forging apparatus of surrounding.
Further, the signal acquisition module is based on high speed USB read-write technology and realizes high band wide data transmission.
High-throughput forging collecting method according to the present invention, comprising the following steps:
According to sample size with deflection size, pressure sensor is chosen, selected pressure sensor is passed through into bolt and pressure
Bar connects, and is fixed in the card slot in upper mold, the stuffed heat insulated ceramic fibre of surrounding;
Sample is placed on sample stage;
According to sample size with deflection size, displacement sensor is selected, leading for high-throughput forging apparatus is installed in
It puts on, is fixed with clip and guide sleeve, displacement sensor is in the insulated wall isolation of the high-throughput forging apparatus of surrounding, adjusts position
Displacement sensor dead-center position, so that the measurement distance of sensor is consistent with the deflection of sample;
The Wiring port of sensor I/O channel corresponding with signal processing module is connected, and by signal processing mould
Block is connect with signal acquisition module;
Temperature sensor is connect with forging sample, real-time monitoring simultaneously acquires sample temperature, and multiple temperature sensors are simultaneously
Acquire the real time temperature of multiple groups sample;
Acquisition monitoring computer outside signal acquisition module connection is opened press power supply after reaching preset temperature, is carried out
High throughput forging experiment, corresponding acquisition software by the data real-time display of high-throughput forging process on the screen.
The beneficial effects of the present invention are: by using above-mentioned technical proposal, the real-time data acquisition of high throughput forging experiment
It is achieved.Further, since high-throughput experiment uses multiple groups laboratory sample, include the real-time number in multiple sample forging processes
According to acquisition, the installation site and interconnection method of various kinds of sensors and acquisition module are devised, sample can be observed directly
The states such as real-time pressure, displacement and temperature in forging process, and then be conducive to quickly to high throughput analysis of samples and sieve
Choosing.
Detailed description of the invention
Fig. 1 is high-throughput forging data collection system schematic diagram according to the present invention;
Fig. 2 is high-throughput forging collecting method flow chart according to the present invention.
Specific embodiment
Below in conjunction with specific attached drawing the present invention is described in detail specific embodiment.It should be noted that in following embodiments
The combination of the technical characteristic or technical characteristic of description is not construed as isolated, they can be combined with each other to reaching
To superior technique effect.In the drawings of the following embodiments, the identical label that each attached drawing occurs represent identical feature or
Person's component, can be apply to different embodiments.
General pressure sensor is all to use at normal temperature, and pressure sensor is connected directly with testee, is measured tested
Object pressure, since sample temperature reaches 1000 DEG C of high temperature in high-throughput forging thermal simulation experiment, pressure sensor without
Method is directly connect with object, so design connects pressure sensor with the lower compression bar of temperature, compression bar stress and object receiving force
It is equal in magnitude, it is interaction force.
Similarly, general displacement sensor uses at normal temperature, and the probe of displacement sensor is directly connected with testee,
Ohject displacement variation is measured, since sample temperature reaches 1000 DEG C of high temperature, displacement sensing in high-throughput forging thermal simulation experiment
Device can not be connected directly with object, so design displacement sensor is mounted on the guide sleeve of side, guide sleeve is moved downwardly to compression bar
When just touching sample, displacement sensor is installed, displacement sensor feeler lever part has also just been touched with sample with height at this time
And the lower cushion block of temperature, compression bar depress sample how many distance, displacement sensor feeler lever then shrinks how much length, to survey indirectly
It must be displaced.
Referring to Fig.1, high-throughput forging data collection system according to the present invention includes multiple pressure sensors 1, displacement biography
Sensor 5, signal acquisition module 6, signal processing module 7, multiple temperature sensors 8, acquisition monitoring computer 9.
Pressure sensor 1 converts the pressure to the electric signal that can be collected transmission, the sample stress size and compression bar 3 of acquisition
Stress is equal in magnitude, is interaction force, and it is loaded to acquire sample institute in real time by measurement 3 stress of compression bar.According to sample by
The range of pressure sensor is selected to pressure size, range ability is 250kg to 1000kg, and operating temperature range is -20
DEG C to 65 DEG C.
Multiple groups pressure sensor is respectively fixedly connected on compression bar 3 corresponding with each sample, and installation position selection exists
In the mold card slot of high throughput experiment, in order to reduce heat affecting, it is specifically designed mold card slot and places multiple pressure sensors, card slot
Stuffed heat insulated ceramic fibre 2, the heat-proof device as the pressure sensor between gap.2 main component of Thermal Insulating Ceramic Fibers
For the polycrystalline mullite ceramic fibre of alumina content 75%, with heat-resisting 1500 DEG C and there can be low thermal conductivity.
The compression bar 3 processes hole corresponding with pressure sensor in upper surface, is connected through a screw thread pressure sensor, presses
The pressing surface of the lower surface pressing sample of bar.
Institute's displacement sensors 5 convert displacement to the electric signal that can be collected transmission, real-time displacement amount collected
Realtime deformation after being pressurized with sample is identical, and the movement of displacement sensor is synchronous with compression bar movement to be carried out, and compression bar compresses downwards
The deflection of sample can be displaced by sensor and acquire in real time, select its range with deflection according to sample size, make its number
More accurate according to exporting, temperature drift is smaller.
On the guide sleeve 4 for the 25*120*35 that the design of institute's displacement sensors is mounted on high-throughput forging apparatus, and pass through clip
It is fixed with guide sleeve 4, when guide sleeve 4 is moved downwardly to compression bar and just touches sample, displacement sensor 5 is installed, at this time displacement sensing
The feeler lever part of device 5 just touches following cushion block, and compression bar depresses sample how many distance, and the feeler lever of displacement sensor 5 is then received
Contract how much length, to measure displacement;Simultaneous displacement sensor is in the insulated wall isolation of the high-throughput forging apparatus of surrounding,
It reduces displacement sensor to be influenced by heat, keeps data result more accurate.
The signal acquisition module 6 is based on high speed USB read-write technology and realizes high band wide data transmission, passes through multichannel, height
Sample rate realizes the precise acquisitions of data.Signal acquisition module 6 has 16 channels, can be connected with 16 signal processing ports
It connects, sample rate may be up to 1MSa/s, and with 16 vertical resolutions.
The electric signal that sensor acquires the processing such as is filtered, is amplified by the signal processing module 7, and being converted into can be by
Signal acquisition module received signal.
The temperature sensor 8 is connect with forging sample, and real-time monitoring simultaneously acquires sample temperature, and multiple temperature sensors are same
When acquire the real time temperature of multiple groups sample, and temperature results are fed back into signal processing module and signal acquisition module, and show
In screen.Sample temperature range is between 20 DEG C to 1100 DEG C.
As shown in Fig. 2, high-throughput forging collecting method according to the present invention includes: according to sample size and deflection
Size is chosen pressure sensor, selected pressure sensor is connected by bolt and compression bar, the card slot being fixed in upper mold
In, the stuffed heat insulated ceramic fibre of surrounding;Sample is placed on sample stage;According to sample size with deflection size, select
Displacement sensor is selected, is installed on the guide sleeve of high-throughput forging apparatus, is fixed with clip and guide sleeve, displacement sensor is located
In surrounding high-throughput forging apparatus insulated wall isolation, adjust displacement sensor zero point position so that the measurement of sensor away from
It is consistent from the deflection of sample;The Wiring port of sensor I/O channel corresponding with signal processing module is connected,
And signal processing module is connect with signal acquisition module;Temperature sensor is connect with forging sample, real-time monitoring simultaneously acquires
Sample temperature, multiple temperature sensors acquire the real time temperature of multiple groups sample simultaneously;Acquisition outside signal acquisition module connection
Monitoring computer opens press power supply after reaching preset temperature, carries out high-throughput forging experiment, corresponding acquisition software will be high
The data real-time display of flux forging process is on the screen.
Embodiment one
The present embodiment illustrates high-throughput forging data acquisition technology by taking 5CrNiMoV steel as an example.The specific steps of the present embodiment are such as
Under:
It will receive biggish stress in high throughput forging in view of 5CrNiMoV steel, so pressure sensor selection is relatively large
Journey, maximum range 1000kg are connected selected pressure sensor by bolt and compression bar, the card slot being fixed in upper mold
In, the stuffed heat insulated ceramic fibre of surrounding;
It is by 30 sizes of same ingredientSample be placed on sample stage according to 6 × 5;
According to sample size with deflection size, range is selected to be mounted on high-throughput forging dress for the displacement sensor of 5mm
It on the guide sleeve set, is fixed, is placed in outside high-throughput forging apparatus integral heat insulation wall with clip and guide sleeve, adjust displacement sensor zero
Point position, so that the measurement distance of sensor is consistent with the deflection of sample;
The Wiring port of sensor I/O channel corresponding with signal processing module is connected, and by signal processing mould
Block is connect with signal acquisition module;
Temperature sensor is connect with forging sample, real-time monitoring simultaneously acquires sample temperature, and multiple temperature sensors are simultaneously
Acquire the real time temperature of multiple groups sample;
Acquisition monitoring computer outside signal acquisition module connection is opened press power supply after reaching preset temperature, is carried out
High throughput forging experiment, built-in acquisition software by the data real-time display of high-throughput forging process on the screen.
Embodiment two
The present embodiment illustrates high-throughput forging data acquisition technology by taking 7075 aluminium alloys as an example.The specific steps of the present embodiment are such as
Under:
The stress being subject in view of 7075 aluminium alloys in high throughput forging is smaller, so pressure sensor selects small amount
Journey, maximum range 500kg are connected selected pressure sensor by bolt and compression bar, the card slot being fixed in upper mold
In, the stuffed heat insulated ceramic fibre of surrounding;
It is by 30 sizes of same ingredientSample be placed on sample stage according to 6 × 5;
According to sample size with deflection size, range is selected to be mounted on high-throughput forging dress for the displacement sensor of 10mm
On the guide sleeve set, with clamp connection, it is placed in outside high-throughput forging apparatus integral heat insulation wall, adjusts displacement sensor zero point position
It sets, so that the measurement distance of sensor is consistent with the deflection of sample;
The Wiring port of sensor I/O channel corresponding with signal processing module is connected, and by signal processing mould
Block is connect with signal acquisition module;
Temperature sensor is connect with forging sample, real-time monitoring simultaneously acquires sample temperature, and multiple temperature sensors are simultaneously
Acquire the real time temperature of multiple groups sample;
Acquisition monitoring computer outside signal acquisition module connection is opened press power supply after reaching preset temperature, is carried out
High throughput forging experiment, built-in acquisition software by the data real-time display of high-throughput forging process on the screen.
Particular embodiments described above carries out the technical problem to be solved in the present invention, technical scheme and beneficial effects
It is further described, it should be understood that above is only a specific embodiment of the present invention, be not limited to this hair
Bright, all within the spirits and principles of the present invention, any modification, equivalent substitution, improvement and etc. done should be included in the present invention
Protection scope within.
Claims (8)
1. a kind of high-throughput forging data collection system characterized by comprising multiple temperature sensors, multiple pressure sensings
Device, displacement sensor, signal processing module, signal acquisition module and acquisition monitoring computer,
The temperature sensor is connect with forging sample, for acquiring multiple groups sample temperature in high-throughput experiment in real time;
The pressure sensor is fixed on on compression bar corresponding to each sample, and installation site is the mold card of high-throughput experiment
Electric signal in slot, for converting the pressure to that transmission can be collected;
Institute's displacement sensors are mounted on the guide sleeve of high-throughput forging apparatus, and are fixed by clip and guide sleeve, are used for position
Shifting amount is converted into the electric signal that can be collected transmission;
The signal processing module is connect with the temperature sensor, the pressure sensor and institute's displacement sensors, is used
In the electric signal acquired from sensor is filtered, is amplified, be converted into can by the signal acquisition module received signal,
And it is sent to the signal acquisition module module;
The signal acquisition module has N number of channel, can be connected with N number of signal processing port, and being used for will be from the signal
Processing module received signal is transferred to the acquisition monitoring computer, and the value of N is 4,8,16 or 32;
The acquisition monitoring computer stores temperature data, pressure data and displacement data, analyzes processing and be used for
Display.
2. high-throughput forging data collection system according to claim 1, which is characterized in that between mold card slot gap
Stuffed heat insulated ceramic fibre, for being thermally shielded to the pressure sensor.
3. high-throughput forging data collection system according to claim 2, which is characterized in that the Thermal Insulating Ceramic Fibers are
The polycrystalline mullite ceramic fibre of alumina content 70-80%, the heat resisting temperature upper limit are 1500 DEG C, thermal coefficient 0.03-
0.3W/m.K。
4. high-throughput forging data collection system according to claim 1, which is characterized in that the compression bar adds in upper surface
Work hole corresponding with the pressure sensor, is connected through a screw thread the pressure sensor.
5. high-throughput forging data collection system according to claim 1, which is characterized in that when the guide sleeve moves downward
When just touching sample to compression bar, institute's displacement sensors are installed, so that displacement sensor feeler lever part just touches down
The cushion block in face.
6. high-throughput forging data collection system according to claim 1, which is characterized in that institute's displacement sensors are located
In the insulated wall isolation of the high-throughput forging apparatus of surrounding.
7. high-throughput forging data collection system according to claim 1, which is characterized in that the signal acquisition module base
High band wide data transmission is realized in high speed USB read-write technology.
8. a kind of high-throughput forging collecting method, which comprises the following steps:
According to sample size with deflection size, pressure sensor is chosen, selected pressure sensor is connected by bolt and compression bar
It picks up and, be fixed in the card slot in upper mold, the stuffed heat insulated ceramic fibre of surrounding;
Sample is placed on sample stage;
According to sample size with deflection size, displacement sensor is selected, is installed on the guide sleeve of high-throughput forging apparatus,
It is fixed with clip and guide sleeve, displacement sensor is in the insulated wall isolation of the high-throughput forging apparatus of surrounding, adjusts displacement and passes
Sensor dead-center position, so that the measurement distance of sensor is consistent with the deflection of sample;
The Wiring port of sensor I/O channel corresponding with signal processing module is connected, and by signal processing module with
Signal acquisition module connection;
Temperature sensor is connect with forging sample, real-time monitoring simultaneously acquires sample temperature, and multiple temperature sensors acquire simultaneously
The real time temperature of multiple groups sample;
Acquisition monitoring computer outside signal acquisition module connection opens press power supply after reaching preset temperature, carries out high pass
Amount forging experiment, corresponding acquisition software by the data real-time display of high-throughput forging process on the screen.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810814360.3A CN109029569A (en) | 2018-07-23 | 2018-07-23 | A kind of high-throughput forging data collection system and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810814360.3A CN109029569A (en) | 2018-07-23 | 2018-07-23 | A kind of high-throughput forging data collection system and method |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109029569A true CN109029569A (en) | 2018-12-18 |
Family
ID=64645257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810814360.3A Pending CN109029569A (en) | 2018-07-23 | 2018-07-23 | A kind of high-throughput forging data collection system and method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109029569A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110686793A (en) * | 2019-11-15 | 2020-01-14 | 中国水稻研究所 | High-flux insect supercooling point detection system and detection method |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5275057A (en) * | 1992-08-20 | 1994-01-04 | Martin Marietta Energy Systems, Inc. | Clip gage attachment for frictionless measurement of displacement during high-temperature mechanical testing |
CN201522400U (en) * | 2009-09-18 | 2010-07-07 | 洛阳市谱瑞慷达耐热测试设备有限公司 | Loading device used for high temperature stress and strain gauge |
JP2011112544A (en) * | 2009-11-27 | 2011-06-09 | Shimadzu Corp | High-temperature compression testing apparatus |
CN102435225A (en) * | 2010-09-29 | 2012-05-02 | 西安市联智电子科技有限公司 | Memory alloy data-acquiring measurement apparatus |
CN102967508A (en) * | 2012-11-27 | 2013-03-13 | 北京大学 | Device and method for testing ultrahigh-temperature indentation load-displacement curve |
CN203502307U (en) * | 2013-09-24 | 2014-03-26 | 钢铁研究总院 | High-temperature compressive strength test device for pellets |
CN106124337A (en) * | 2016-08-08 | 2016-11-16 | 浙江工业大学 | A kind of for the test of rubber elastomer high-temerature creep and the device of stress relaxation test |
CN107101868A (en) * | 2017-06-14 | 2017-08-29 | 北京科技大学 | A kind of high flux forging thermal cycle simulation and method |
CN107607411A (en) * | 2017-10-26 | 2018-01-19 | 新疆大学 | A kind of high-temperature tensile testing machine |
-
2018
- 2018-07-23 CN CN201810814360.3A patent/CN109029569A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5275057A (en) * | 1992-08-20 | 1994-01-04 | Martin Marietta Energy Systems, Inc. | Clip gage attachment for frictionless measurement of displacement during high-temperature mechanical testing |
CN201522400U (en) * | 2009-09-18 | 2010-07-07 | 洛阳市谱瑞慷达耐热测试设备有限公司 | Loading device used for high temperature stress and strain gauge |
JP2011112544A (en) * | 2009-11-27 | 2011-06-09 | Shimadzu Corp | High-temperature compression testing apparatus |
CN102435225A (en) * | 2010-09-29 | 2012-05-02 | 西安市联智电子科技有限公司 | Memory alloy data-acquiring measurement apparatus |
CN102967508A (en) * | 2012-11-27 | 2013-03-13 | 北京大学 | Device and method for testing ultrahigh-temperature indentation load-displacement curve |
CN203502307U (en) * | 2013-09-24 | 2014-03-26 | 钢铁研究总院 | High-temperature compressive strength test device for pellets |
CN106124337A (en) * | 2016-08-08 | 2016-11-16 | 浙江工业大学 | A kind of for the test of rubber elastomer high-temerature creep and the device of stress relaxation test |
CN107101868A (en) * | 2017-06-14 | 2017-08-29 | 北京科技大学 | A kind of high flux forging thermal cycle simulation and method |
CN107607411A (en) * | 2017-10-26 | 2018-01-19 | 新疆大学 | A kind of high-temperature tensile testing machine |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110686793A (en) * | 2019-11-15 | 2020-01-14 | 中国水稻研究所 | High-flux insect supercooling point detection system and detection method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201488984U (en) | Automatic analysis gas chromatograph | |
EP1975625A3 (en) | Sample analyzer, sample analyzing method, and computer program product | |
CN104833631B (en) | Self-balancing type armored concrete bond and anchor property tester | |
CN109029569A (en) | A kind of high-throughput forging data collection system and method | |
CN101178396B (en) | Cashmere fibre, fleece fibre blended spinning quantitative determination instrument and method | |
CN108627468B (en) | Method for predicting content of crude fibers in feeding ramie leaves | |
CN1740790A (en) | Automatic measuring system for concrete temperature linear deformation | |
CN1776358A (en) | Newmethod for contactless measuring displacement and deformation of object in three-dimensional space | |
CN107588890A (en) | Pressure sensor test system | |
WO2004013627A1 (en) | System and method for analyzing signals in a multi-markers protein chip | |
CN205262878U (en) | Bending test machine in concrete material high temperature | |
CN202770717U (en) | Strain control device for high-temperature tension test of foil strips | |
CN207649997U (en) | Combined type determines stress/determine strain detection testing device | |
CN208695659U (en) | A kind of bearing measuring screening plant | |
CN106568648A (en) | Meso-scale experimental method for mechanical properties of material | |
CN109540671A (en) | A kind of the lever device for measuring force and purposes of bundle fiber tension and compression | |
CN201348616Y (en) | Non-combustibility test control system | |
CN102506694B (en) | Dynamic strain field observation system | |
CN109444150A (en) | Contactless crackle measurement method and its device | |
CN201637737U (en) | Cement-based material contraction and cracking performance detector | |
CN210604315U (en) | System for testing working performance of wall insulation board | |
CN106896129B (en) | A kind of device based on Displacement Saltation detection Iron Ore Powder assimilation temperature | |
CN208872210U (en) | Device for pressure measurement between a kind of elastic slice | |
CN209727616U (en) | A kind of foil gauge of test specimen elasticity modulus test is connected and fixed device | |
CN208270114U (en) | A kind of platinum resistance thermometer calibrating installation |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181218 |
|
RJ01 | Rejection of invention patent application after publication |