CN109021900A - A kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery - Google Patents
A kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery Download PDFInfo
- Publication number
- CN109021900A CN109021900A CN201810705518.3A CN201810705518A CN109021900A CN 109021900 A CN109021900 A CN 109021900A CN 201810705518 A CN201810705518 A CN 201810705518A CN 109021900 A CN109021900 A CN 109021900A
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- China
- Prior art keywords
- epoxy resin
- preparation
- organosilicon
- encapsulation
- solar battery
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- HLWRJUZDZZVDCL-UHFFFAOYSA-N CC(C)(C1C=CC(Pc(cc2)ccc2OC)=CC1)ONC Chemical compound CC(C)(C1C=CC(Pc(cc2)ccc2OC)=CC1)ONC HLWRJUZDZZVDCL-UHFFFAOYSA-N 0.000 description 1
- 0 CC(C)(c1ccc(*c(cc2)ccc2OC)cc1)O* Chemical compound CC(C)(c1ccc(*c(cc2)ccc2OC)cc1)O* 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1477—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing nitrogen
Abstract
A kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery, the method stirs evenly epoxy resin and silane coupling agent machinery, it is warming up to 70 ~ 90 DEG C, catalyst is added, isothermal reaction 2 ~ 4 hours, obtain modifying epoxy resin by organosilicon, the mass ratio of epoxy resin and silane coupling agent is 0.67 ~ 4.1 ︰ 1；2) filler, crosslinking agent, plasticizer are added in resulting modifying epoxy resin by organosilicon at 20 ~ 30 DEG C, are dispersed with stirring 30 ~ 150 minutes, obtain epoxy adhesive.The present invention uses silane coupler modified epoxy resin, and epoxy adhesive self-crosslinkable obtained solidification is not required to additionally add curing agent, can one-component it is filling.Prepared modifying epoxy resin by organosilicon adhesive, under room temperature can rapid curing, adhesive property is good, and glue film toughness, waterproofness are improved.Preparation method is easy to operate, at low cost, easy to use.
Description
Technical field
The present invention relates to a kind of preparation methods of single-component epoxy adhesive used for encapsulation of solar battery, belong to epoxy gluing
Agent technical field.
Background technique
As cleaning, the solar battery of abundance and sustainable development new energy, in recent years in practical applications rapidly into
Exhibition, wherein the application of silicon wafer solar cells is especially extensive.The adhesive used when integrated use, due to being exposed to air
In, easily burn into destroys, so that the photoelectric conversion efficiency of solar battery reduces.Therefore, the photoelectricity to keep solar battery
Transfer efficiency is stablized, and the encapsulation adhesive of good performance such as novel caking property, the transparency, weatherability is called.Publication number
CN107129764A discloses a kind of preparation method of solar cell backboard adhesive, using polyalcohol and hexa-methylene two
The polyurethane that isocyanate polymeric obtains is base-material, and cellulose, chlorosulfonated polyethylene, polylactic acid, hydroxy silicon oil, lecithin is added
With adhesive made from triethanolamine, sodium metasilicate, Aluminum sol etc., there is preferable ageing-resistant, anti-hydrolytic performance, but polyurethane
Adhesive solidifies relatively slowly at room temperature, and raw material has certain toxicity.
Epoxy resin adhesive is a kind of with aromatic series, aliphatic and alicyclic etc. for main chain, and containing there are two or two
The material of a above epoxy group has excellent adhesive property, thermal stability, electric insulating quality in encapsulating material field
And weatherability.Solar battery is packaged using epoxy resin adhesive, the side that form of construction work takes encapsulating to encapsulate mostly
Formula fills enough liquid epoxy adhesives that is, in the gap for the battery for being fixed with silicon wafer, completely solid to epoxy resin
Change, then encapsulation work is completed.
Cross linking of epoxy resin degree height after solidification, internal stress are big, easily generation brittle failure, and impact resistance is poor.Publication number
CN104004483B discloses a kind of impact resistance, high tenacity, epoxy adhesive resistant to high temperature, by bisphenol-A epoxy base-material, toughening
Agent, the component A that coupling agent and filler are constituted and the polyamide synthesized by dimer fatty amine, polyamines, modified fat amine curing
The B component that agent, ATBN, coupling agent and filler are constituted mixes, Tg with higher and preferable toughness, impact strength.
Publication number CN105199081A discloses the curing agent that a kind of open loop aliphatic cyclic amine containing C=S key makees epoxy resin, introduces urea bond
The crosslink density of epoxy adhesive afterwards is lower than the crosslink density of the fatty amine curing agent only containing amino, epoxy adhesive brittleness
It reduces, toughness is improved.The branching type silicone-containing polyhydric aliphatic amine of synthesis is introduced into cross linking of epoxy resin network by Cao Jun
In, the introducing of flexible siloxanes segment is so that toughness, shock resistance, adhesive strength and the heat-resisting water resistance of epoxy resin obtain
To effectively improving (preparation of Cao Jun modifying epoxy resin by organosilicon and its performance study [D] Zhejiang University, 2017).It is above this
The preparation cost of a little epoxy adhesives is lower, and glue film toughness is improved, but in these preparation methods, and epoxy resin can not be autonomous
Solidification, it is necessary to use curing agent as the second component, assist epoxy resin to complete solidification, this makes troubles to practical application.Cause
This, develops the emphasis that one kind single-component epoxy adhesive that is cheap, easy to use, exempting from curing agent is people's research.
Summary of the invention
The object of the present invention is to overcome the deficiencies of the prior art and provide a kind of single-component epoxy used for encapsulation of solar battery
The preparation method of adhesive.
Technical scheme is as follows:
A kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery, includes the following steps:
(1) epoxy resin and silane coupling agent machinery are stirred evenly, is warming up to 70~90 DEG C, catalyst, isothermal reaction 2 is added
~4 hours, obtain modifying epoxy resin by organosilicon, the mass ratio of epoxy resin and silane coupling agent is 0.67~4.1 ︰ 1；
(2) at 20~30 DEG C, filler, crosslinking agent, plasticizer are added to the silicon-modified epoxy that step (1) obtains
It in resin, is dispersed with stirring 30~150 minutes, obtains epoxy adhesive.
Epoxy resin in step (1) of the present invention is bisphenol A epoxide resin, bisphenol-s epoxy resin, bisphenol F epoxy resin
One of；Silane coupling agent is 3- aminopropyl triethoxysilane, 3- (2- aminoethyl) aminopropyl triethoxysilane, 3- ammonia
One of hydroxypropyl methyl diethoxy silane, 3- (2- aminoethyl) aminopropyltriethoxy dimethoxysilane；Catalyst is February
Dilaurylate, stannous octoate, Mono-n-butyltin, catalyst amount are the 0.5~5% of epoxy resin quality；Organosilicon
The structural formula of modified epoxy are as follows:
Wherein
N=1~5, R1For C (CH3)2、CH2、SO2One of, R2For (CH2)3、H(CH2)2NH(CH2)3One of, R1', R2', R3'
For OC2H5、OCH3、CH3One or more of.
Filler in step (2) of the present invention is nano silica, modified clay, precipitated calcium carbonate, flake asbestos, carbon fiber
One or more of dimension, mica powder, packing quality is the 10~100% of modifying epoxy resin by organosilicon quality；Crosslinking agent is
One of positive esters of silicon acis, titanate esters, crosslinking agent quality is the 0.15~30% of modifying epoxy resin by organosilicon quality；Plasticizer
For one of Plexol 201, dioctyl adipate, dioctyl phthalate, dibutyl phthalate or several
Kind, plasticizer quality is the 5~45% of modifying epoxy resin by organosilicon quality.
The beneficial effect of the present invention compared with the prior art is that the present invention uses silane coupler modified epoxy resin, system
Epoxy adhesive self-crosslinkable solidification, be not required to additionally add curing agent, can one-component it is filling.Prepared is organic-silicon-modified
Epoxy resin adhesive, under room temperature can rapid curing, adhesive property is good, and glue film toughness, waterproofness are improved.The preparation side
Method is easy to operate, at low cost, easy to use.
Detailed description of the invention
Fig. 1 is the preparation flow block diagram of epoxy adhesive of the present invention；
Fig. 2 is the glue-line contact angle picture after 1 adhesive film of table, and it is 91.73 ° that a, which is the contact angle figure for being formulated 1,；B is
The contact angle figure of formula 2 is 62.43 °；Bisphenol A epoxide resin is after silane coupler modified, the waterproof of gained epoxy adhesive
Performance is improved.
Specific embodiment
By following examples, the present invention is described in further detail:
Embodiment 1
2.9194 grams of bisphenol A epoxide resins and 3.4346 grams of (3- aminopropyl) triethoxysilane machinery are stirred evenly, are heated up
To 70 DEG C, 0.1460 gram of dibutyl tin dilaurate is added, isothermal reaction 2 hours, obtains modifying epoxy resin by organosilicon.
By 0.50 gram of nano silica, 1.50 grams of precipitated calcium carbonates at 25 DEG C, 1.95 grams of tetraethyl orthosilicates, 0.325
Gram Plexol 201 is added in above-mentioned modifying epoxy resin by organosilicon, is dispersed with stirring 60 minutes, and epoxy adhesive is obtained.
Table 1 is the formula table of the present embodiment epoxy resin adhesive, wherein being formulated 1 corresponding embodiment 1, base-material is organic
Silicon modified epoxy resin, the base-material for being formulated 2 is epoxy resin.
As shown in Fig. 2, a is the contact angle figure for being formulated 1, contact angle is 91.73 °；B is the contact angle figure for being formulated 2, contact angle
To be 62.43 °；As shown in Figure 2, bisphenol A epoxide resin is after silane coupler modified, the waterproof performance of gained epoxy adhesive
It is improved.
The formula table of 1 epoxy resin adhesive of table
Embodiment 2
4.6360 grams of bisphenol A epoxide resins and 2.3180 grams of 3- (2- aminoethyl) aminopropyl triethoxysilane machinery are stirred
It is even, 90 DEG C are warming up to, 0.0460 gram of stannous octoate is added, isothermal reaction 2 hours, obtains modifying epoxy resin by organosilicon.
By 3.50 grams of nano silicas, 3.50 grams of flake asbestos, 0.0105 gram of butyl titanate, 1.4 grams of adjacent benzene at 30 DEG C
Diformazan dioctyl phthalate is added in above-mentioned modifying epoxy resin by organosilicon, is dispersed with stirring 30 minutes, and epoxy adhesive is obtained.
Embodiment 3
4.8200 grams of bisphenol-s epoxy resins and 1.1560 grams of 3- aminopropyltriethoxy diethoxy silane machinery are stirred evenly, are risen
Temperature is added 0.0240 gram of Mono-n-butyltin, isothermal reaction 4 hours, obtains modifying epoxy resin by organosilicon to 80 DEG C.
By 0.30 gram of carbon fiber, 0.30 gram of modified clay, 0.60 gram of positive quanmethyl silicate, 2.70 grams of O-phthalics at 20 DEG C
Dibutyl phthalate is added in above-mentioned modifying epoxy resin by organosilicon, is dispersed with stirring 150 minutes, and epoxy adhesive is obtained.
Embodiment 4
2.5768 grams of bisphenol F epoxy resins and 3.8459 grams of 3- (2- aminoethyl) aminopropyl triethoxysilane machinery are stirred
It is even, 70 DEG C are warming up to, 0.0773 gram of dibutyl tin dilaurate is added, isothermal reaction 3 hours, obtains silicon-modified epoxy tree
Rouge.
By 1.25 grams of mica powders, 2.0 grams of precipitated calcium carbonates, 1.3 grams of tetraethyl orthosilicates, 0.05 g of adipic acid two at 25 DEG C
Monooctyl ester, 0.60 gram of dibutyl phthalate are added in above-mentioned modifying epoxy resin by organosilicon, are dispersed with stirring 120 minutes, are obtained
Obtain epoxy adhesive.
Embodiment 5
By 4.4665 grams of bisphenol F epoxy resins and 1.4888 grams of 3- (2- aminoethyl) aminopropyltriethoxy dimethoxysilane machines
Tool stirs evenly, and is warming up to 80 DEG C, and 0.0447 gram of stannous octoate is added, isothermal reaction 3 hours, obtains modifying epoxy resin by organosilicon.
By 0.35 gram of nano silica, 0.25 gram of modified clay, 0.06 gram of butyl titanate, 0.80 gram of last of the ten Heavenly stems two at 30 DEG C
Sour di-isooctyl, 1.00 grams of dioctyl phthalates are added in above-mentioned modifying epoxy resin by organosilicon, are dispersed with stirring 90 points
Clock obtains epoxy adhesive.
Embodiment 6
3.4483 grams of bisphenol-s epoxy resins and 3.4483 grams of 3- aminopropyltriethoxy diethoxy silane machinery are stirred evenly, are risen
Temperature is added 0.1034 gram of Mono-n-butyltin, isothermal reaction 4 hours, obtains modifying epoxy resin by organosilicon to 90 DEG C.
By 1.50 grams of nano silicas, 1.30 grams of carbon fibers, 0.70 gram of positive quanmethyl silicate, 0.35 gram of last of the ten Heavenly stems two at 20 DEG C
Sour di-isooctyl is added in above-mentioned modifying epoxy resin by organosilicon, is dispersed with stirring 60 minutes, and epoxy adhesive is obtained.
Embodiment 7
4.1379 grams of bisphenol A epoxide resins and 1.6551 grams of 3- aminopropyl triethoxysilane machinery are stirred evenly, are warming up to
80 DEG C, 0.2070 gram of stannous octoate is added, isothermal reaction 2 hours, obtains modifying epoxy resin by organosilicon.
By 2.5 grams of nano silicas, 1.0 grams of flake asbestos, 0.009 gram of tetraethyl orthosilicate, 1.0 g of adipic acid at 20 DEG C
Dioctyl ester, 1.4 grams of dibutyl phthalates are added in above-mentioned modifying epoxy resin by organosilicon, are dispersed with stirring 60 minutes, are obtained
Obtain epoxy adhesive.
Embodiment 8
3.1863 grams of bisphenol-s epoxy resins and 3.1863 grams of 3- (2- aminoethyl) aminopropyl triethoxysilane machinery are stirred
It is even, 90 DEG C are warming up to, 0.1274 gram of dibutyl tin dilaurate is added, isothermal reaction 4 hours, obtains silicon-modified epoxy tree
Rouge.
By 0.13 gram of nano silica, 0.065 gram of mica powder, 0.975 gram of butyl titanate, 0.325 gram of neighbour at 30 DEG C
Dioctyl phthalate is added in above-mentioned modifying epoxy resin by organosilicon, is dispersed with stirring 150 minutes, and epoxy adhesive is obtained.
Claims (8)
1. a kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery, which is characterized in that the preparation method
The following steps are included:
(1) epoxy resin and silane coupling agent machinery are stirred evenly, is warming up to 70~90 DEG C, catalyst, isothermal reaction 2~4 is added
Hour, obtain modifying epoxy resin by organosilicon, the mass ratio of epoxy resin and silane coupling agent is 0.67~4.1 ︰ 1；
(2) at 20~30 DEG C, filler, crosslinking agent, plasticizer are added to the modifying epoxy resin by organosilicon that step (1) obtains
In, it is dispersed with stirring 30~150 minutes, obtains epoxy adhesive.
2. a kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery according to claim 1, special
Sign is that the epoxy resin is one of bisphenol A epoxide resin, bisphenol-s epoxy resin, bisphenol F epoxy resin.
3. a kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery according to claim 1, special
Sign is that the silane coupling agent is 3- aminopropyl triethoxysilane, 3- (2- aminoethyl) aminopropyl triethoxysilane, 3-
One of aminopropyltriethoxy diethoxy silane, 3- (2- aminoethyl) aminopropyltriethoxy dimethoxysilane.
4. a kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery according to claim 1, special
Sign is that the catalyst is dibutyl tin dilaurate, stannous octoate, Mono-n-butyltin；Catalyst amount is asphalt mixtures modified by epoxy resin
The 0.5~5% of lipid amount.
5. a kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery according to claim 1, special
Sign is, the structural formula of the modifying epoxy resin by organosilicon are as follows:
Wherein,
N=1~5；R1For C (CH3)2、CH2、SO2One of；R2For (CH2)3、H(CH2)2NH(CH2)3One of；R1',
R2', R3' is OC2H5、OCH3、CH3One or more of.
6. a kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery according to claim 1, special
Sign is, the filler is nano silica, modified clay, precipitated calcium carbonate, flake asbestos, carbon fiber, one in mica powder
Kind is several；Packing quality is the 10~100% of modifying epoxy resin by organosilicon quality.
7. a kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery according to claim 1, special
Sign is, the crosslinking agent is positive one of esters of silicon acis, titanate esters；Crosslinking agent quality is modifying epoxy resin by organosilicon quality
0.15~30%.
8. a kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery according to claim 1, special
Sign is that the plasticizer is Plexol 201, dioctyl adipate, dioctyl phthalate, phthalic acid two
One or more of butyl ester；Plasticizer quality is the 5~45% of modifying epoxy resin by organosilicon quality.
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Cited By (5)
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| CN110791174A (en) * | 2019-11-12 | 2020-02-14 | 成都硅宝科技股份有限公司 | Polyurethane primer and preparation method thereof |
| CN110804369A (en) * | 2019-11-18 | 2020-02-18 | 安徽圣达生物药业有限公司 | Synthetic method of solvent-type organic silicon modified epoxy resin coating |
| CN112961636A (en) * | 2021-03-10 | 2021-06-15 | 安徽扬子地板股份有限公司 | Aging-resistant adhesive for wall decoration plate and preparation method thereof |
| CN113088228A (en) * | 2021-04-12 | 2021-07-09 | 江西省科学院应用化学研究所 | Preparation method of single-component organic silicon modified epoxy adhesive for solar cell packaging |
| CN115851195A (en) * | 2022-12-13 | 2023-03-28 | 东莞市佳迪新材料有限公司 | Elastic epoxy adhesive applied to encapsulation of new energy photovoltaic inductor and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110791174A (en) * | 2019-11-12 | 2020-02-14 | 成都硅宝科技股份有限公司 | Polyurethane primer and preparation method thereof |
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| CN110804369A (en) * | 2019-11-18 | 2020-02-18 | 安徽圣达生物药业有限公司 | Synthetic method of solvent-type organic silicon modified epoxy resin coating |
| CN112961636A (en) * | 2021-03-10 | 2021-06-15 | 安徽扬子地板股份有限公司 | Aging-resistant adhesive for wall decoration plate and preparation method thereof |
| CN113088228A (en) * | 2021-04-12 | 2021-07-09 | 江西省科学院应用化学研究所 | Preparation method of single-component organic silicon modified epoxy adhesive for solar cell packaging |
| CN115851195A (en) * | 2022-12-13 | 2023-03-28 | 东莞市佳迪新材料有限公司 | Elastic epoxy adhesive applied to encapsulation of new energy photovoltaic inductor and preparation method thereof |
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Application publication date: 20181218 |