CN109014488A - A kind of forced cooling device for vertical reflow ovens and vertical reflow ovens - Google Patents
A kind of forced cooling device for vertical reflow ovens and vertical reflow ovens Download PDFInfo
- Publication number
- CN109014488A CN109014488A CN201811061644.6A CN201811061644A CN109014488A CN 109014488 A CN109014488 A CN 109014488A CN 201811061644 A CN201811061644 A CN 201811061644A CN 109014488 A CN109014488 A CN 109014488A
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- China
- Prior art keywords
- pcb board
- plate
- cooling device
- reflow ovens
- forced cooling
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
Abstract
The invention discloses a kind of forced cooling devices for vertical reflow ovens, comprising: the several layers for accepting the pcb board exported from the ejecting plate position in the decline storehouse of vertical reflow ovens deposit plate support item；Cooling device for being cooled down to pcb board；It is connected with plate support item is deposited, deposits the lifting of plate support item so as to deposit the lifting drive that plate support item is selectively directed at the plate outlet of ejecting plate position or forced cooling device for drive；Discharging device for exporting pcb board from plate outlet.The forced cooling device is mainly used for that the ejecting plate position in the decline storehouse of vertical reflow ovens is arranged in, directly cooling to the pcb board exported from ejecting plate position, has shortened the length of the entire production line, has saved a cooling caching machine, has optimized producing line device layout；The forced cooling device is compact-sized, adapts to intensive manufacture.The invention also discloses a kind of vertical reflow ovens including above-mentioned forced cooling device.
Description
Technical field
The present invention relates to electronic production equipment technical fields, more specifically to a kind of for the strong of vertical reflow ovens
Cooling device.Moreover, it relates to a kind of vertical reflow ovens including above-mentioned forced cooling device.
Background technique
In electronics manufacturing area, vertical reflow ovens are widely used in the (surface Surface Mount Technology SMT
Package technique) production line.
One basic SMT production line generally includes chip mounter (or dispenser), vertical reflow ovens, cooling caching machine, AOI
(automatic optics inspection) equipment and discharging machine etc..Vertical reflow ovens are arranged after chip mounter (or dispenser), cooling caching
Before machine, for each electronic component on pcb board to be welded and is solidified.
It is understood that since pcb board is welded higher with temperature after solidifying in vertical reflow ovens, it is
It avoids impacting the production technology of follow-up equipment, needs to connect cooling caching machine pair in the plate outlet of vertical reflow ovens
Pcb board is cooled down.
In the prior art, pcb board carries out pcb board by the plate outlet setting chain structure in vertical reflow ovens horizontal defeated
It send, and the conveying stroke of chain structure under normal conditions is longer, with what is conveyed by the delivered length for increasing PCB in pcb board
The temperature of pcb board is reduced in the process.In addition, it is desirable to the cooling buffer memory device of setting additional behind vertical reflow ovens, that is,
Entire PCB production line can increase a cooling buffer memory device more, increase production cost and producing line space.Therefore, it causes entire
Production line is too long, keeps production site space larger, influences intensive manufacture.
In conclusion how to provide it is a kind of compact-sized and can reduce producing line device layout for vertical reflow ovens
Forced cooling device is a problem to be solved by those skilled in the art.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of forced cooling device for vertical reflow ovens, the pressure is cold
But device compact-sized and producing line device layout can be reduced.
It is a further object of the present invention to provide a kind of vertical reflow ovens including above-mentioned forced cooling device, the vertical reflux
Furnace carries forced cooling device, has shortened the length of the entire production line, and saves a cooling buffer memory device.
To achieve the goals above, the invention provides the following technical scheme:
A kind of forced cooling device for vertical reflow ovens, comprising:
Several layers for accepting the pcb board exported from the ejecting plate position in the decline storehouse of vertical reflow ovens deposit plate support item；
Cooling device for being cooled down to the pcb board；
It is connected, with the plate support item of depositing for driving the plate support item of depositing to go up and down so that described to deposit plate support item selectively right
The lifting drive of the plate outlet of the quasi- ejecting plate position or the forced cooling device；
Discharging device for exporting the pcb board from the plate outlet.
Preferably, the cooling device includes for pcb board condenser for convection heat dissipation and for accelerating
The cooling fan of convection circulation.
Preferably, plate support item is deposited described in several layers to be installed on supporting bar frame, the lifting drive and the support
Frame is connected, and all described deposits plate support synchronization lifting to drive.
Preferably, the lifting drive include lifting motor, the lead screw being connected with the output shaft of the lifting motor,
Be sheathed on the lead screw nut and with lead screw guide rod disposed in parallel, the nut passes through connecting plate and the supporting bar
Frame is connected, and the bearing holder (housing, cover) being slideably socketed with the guide rod is installed on the connecting plate.
Preferably, it includes two supporting plates being oppositely arranged that plate support item is deposited described in every layer, and the supporting plate includes for institute
Pcb board is stated to carry out the side plate of lateral Displacement and be vertically connected with the both ends of the side plate respectively and be used to support the pcb board
Two support rims.
Preferably, the discharging device includes and the linear drive apparatus depositing plate support item described in every layer and be arranged in a one-to-one correspondence.
Preferably, the linear drive apparatus includes two and is arranged in a one-to-one correspondence respectively with two supporting plates of same layer
Horizontal transferring device, the horizontal transferring device include stepper motor and the toothed belt transmission being connected with stepper motor dress
It sets, the synchronous belt of the synchronous belt transmission device is set between two support rims, and the transporting flat of the synchronous belt
It is arranged in parallel with the supporting surface of the support rim.
Preferably, further includes:
Whether the temperature for detecting the pcb board reaches the temperature sensor of preset temperature；
The first controller being connected with the temperature sensor, first controller respectively with the lifting drive
It is connected with the discharging device, the lifting drive driving temperature is controlled with the signal detected according to the temperature sensor
Pcb board up to standard is corresponding to be deposited plate support item and is directed at the plate outlet, and is controlled the discharging device and driven the pcb board from described
Plate outlet output.
Preferably, further includes:
Whether meet the timing that preset time requires in the residence time deposited on plate support item for calculating the pcb board
Device；
The second controller being connected with the timer, the second controller respectively with the lifting drive and institute
It states discharging device to be connected, it is up to standard to control the lifting drive driving residence time with the signal transmitted according to the timer
The corresponding plate support item of depositing of pcb board be directed at the plate outlet, and control the discharging device and drive the pcb board from the ejecting plate
Mouth output.
A kind of vertical reflow ovens, including reflux furnace body, further include the pressure that any one of the above is used for vertical reflow ovens
The rear of the ejecting plate position in the decline storehouse of the reflux furnace body is arranged in cooling device, the forced cooling device.
Provided by the present invention for the forced cooling device of vertical reflow ovens, in use, being driven using lifting drive
The ejecting plate position in the decline storehouse of plate support aligned perpendicular reflow ovens is deposited, so that depositing plate support item accepts the pcb board exported from ejecting plate position, when
After pcb board positions on depositing plate support item, cooling device cools down the pcb board deposited on plate support item, when pcb board has cooled down
Cheng Hou, then plate support item is deposited using lifting drive drive and is gone up and down to the plate outlet of forced cooling device, and uses discharging device
Pcb board is exported from plate outlet.
The forced cooling device can directly carry out the pcb board exported from the ejecting plate position in the decline storehouse of vertical reflow ovens cold
But, it avoids the pcb board horizontal feed after welding solidifies in vertical reflow ovens using chain structure in the prior art to cold
But it is cooled down in caching machine, has shortened the length of the entire production line, and save a cooling buffer memory device, optimize producing line
The layout of equipment；And the forced cooling device deposits plate support item using multilayer and cooling is laminated in the vertical direction to multiple pcb boards, ties
Structure is compact, adapts to intensive manufacture.
Vertical reflow ovens provided by the invention, including reflux furnace body and the cooling dress of the above-mentioned pressure for vertical reflow ovens
It sets, which is arranged in the rear of the ejecting plate position in the decline storehouse of reflux furnace body.That is, the vertical reflow ovens are included
Forced cooling device has above-mentioned beneficial effect.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the structural schematic diagram of the forced cooling device specific embodiment provided by the present invention for vertical reflow ovens
(shell is not shown)；
Fig. 2 is the main view of Fig. 1；
Fig. 3 is the side view of Fig. 1；
Fig. 4 is the front view of vertical reflow ovens specific embodiment provided by the present invention；
Fig. 5 is that vertical reflow ovens shown in Fig. 4 hide the schematic diagram after the shell of forced cooling device；
Fig. 6 is the rearview of vertical reflow ovens shown in Fig. 4；
Fig. 7 is that vertical reflow ovens shown in Fig. 6 hide the schematic diagram after the shell of forced cooling device.
Appended drawing reference of the Fig. 1 into Fig. 7 is as follows:
11 for deposit plate support item, 111 be supporting plate, 12 be lifting drive, 121 be lifting motor, 122 be lead screw, 123 be
Nut, 124 be guide rod, 125 be connecting plate, 126 be bearing holder (housing, cover), 13 be condenser, 14 be cooling fan, 15 be supporting bar frame,
16 be horizontal transferring device, 161 be stepper motor, 162 be synchronous belt transmission device, 17 be temperature sensor, 18 be shell,
181 be exhaust outlet, 182 be condenser pipe relief hole, 2 be reflux furnace body.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Core of the invention is to provide a kind of forced cooling device for vertical reflow ovens, the knot of the forced cooling device
Structure is compact and can reduce producing line device layout.Another core of the invention is to provide a kind of including above-mentioned forced cooling device
Vertical reflow ovens, the vertical reflow ovens carry forced cooling device, have shortened the length of the entire production line, and save one it is cold
But buffer memory device.
Fig. 1-Fig. 7 is please referred to, Fig. 1 is that the forced cooling device provided by the present invention for vertical reflow ovens is embodied
The structural schematic diagram of example；Fig. 2 is the main view of Fig. 1；Fig. 3 is the side view of Fig. 1；Fig. 4 is vertical reflux provided by the present invention
The front view of hotplate body embodiment；Fig. 5 is that vertical reflow ovens shown in Fig. 4 hide the schematic diagram after the shell of forced cooling device；
Fig. 6 is the rearview of vertical reflow ovens shown in Fig. 4；Fig. 7 is after vertical reflow ovens shown in Fig. 6 hide the shell of forced cooling device
Schematic diagram.
The present invention provides a kind of forced cooling device for vertical reflow ovens, which is mainly used for setting
The rear in the ejecting plate position in the decline storehouse of vertical reflow ovens is set, including several layers deposit plate support item 11, cooling device, lifting driving dress
Set 12 and discharging device.
Plate support item 11 is deposited for accepting the pcb board exported from the ejecting plate position in the decline storehouse of vertical reflow ovens, pcb board is played
The effect of support.The present invention is to the specific number of plies of plate support item 11 is deposited without limitation, and the number of plies is more, then forced cooling device 1 can
The pcb board total amount of receiving is more, and it is more to simultaneously participate in cooling pcb board.It is understood that several layers deposit plate support item 11
Interval setting, that is, adjacent two layers, which are deposited, has certain gap between plate support item 11, in favor of the cooling of pcb board.This hair
It is bright that gap size between plate support item 11 is deposited without limitation to adjacent two layers.
It should be noted that individual pcb board can be accepted by depositing plate support item 11, pcb board and its carrier can also be accepted.
Cooling device is for cooling down the pcb board deposited on plate support item 11, to accelerate the cooling of pcb board.
Without limitation to the specific structure of cooling device, cooling device can be air cooling equipment to the present embodiment, or water cooling plant,
Designer can select according to actual needs.
Lifting drive 12 is connected with plate support item 11 is deposited, for drive deposit plate support item 11 go up and down so that deposit plate support item 11 can
Selectively it is directed at the plate outlet of ejecting plate position or forced cooling device 1.That is, forced cooling device 1 enters plate mouth and ejecting plate
Mouth position is fixed, and the ejecting plate position for entering plate mouth and decline storehouse is correspondingly arranged, after pcb board welds solidification in vertical reflow ovens, into
When entering forced cooling device 1, plate support item 11 is deposited using the driving of lifting drive 12 and is gone up and down, so as to deposit plate support item 11 right for a certain layer
Access plate mouth, to accept the pcb board exported from ejecting plate position；After pcb board positions on depositing plate support item 11, lifting drive 12
It is able to drive this and deposits the lifting of plate support item 11, in order to which other plate support items 11 of depositing are to access plate mouth, meanwhile, pcb board is corresponding at its
It deposits and carries out cooling on plate support item 11；After pcb board is cooling, the drive of lifting drive 12 deposits the lifting of plate support item 11 to alignment
The position of plate outlet, in order to which discharging device exports pcb board after cooling from plate outlet.
Preferably, forced cooling device 1 enter plate mouth and plate outlet is oppositely arranged, that is, it is coplanar with plate outlet to enter plate mouth.
Without limitation to the specific structure of lifting drive 12, lifting drive 12 can be deposited the present embodiment with every layer
Plate support item 11 is arranged correspondingly, and each lifting drive 12, which separately drives, individually deposits plate support item 11, can also be with
All plate support items 11 of depositing are driven to move integrally using lifting drive 12.
The present embodiment to the specific structure of discharging device without limitation, as long as can be by pcb board after cooling from plate outlet
Removal.
It should be noted that considering cooling efficiency, it is preferable that forced cooling device 1 includes being used to form cooling chamber
Shell 18, deposits plate support item 11 and cooling device is arranged in shell 18, to provide cooler environment for pcb board.
In conclusion provided by the present invention for the forced cooling device of vertical reflow ovens, in use, using lifting driving
Device 12 drives the ejecting plate position for depositing the decline storehouse of 11 aligned perpendicular reflow ovens of plate support item, accepts so as to deposit plate support item 11 from ejecting plate position
The pcb board of output, after pcb board positions on depositing plate support item 11, cooling device cools down the pcb board deposited on plate support item 11
Cooling deposits the lifting of plate support item 11 to forced cooling device 1 after the completion of pcb board is cooling, then using the drive of lifting drive 12
Plate outlet, and using discharging device by pcb board from plate outlet export.
The forced cooling device 1 can directly carry out the pcb board exported from the ejecting plate position in the decline storehouse of vertical reflow ovens
It is cooling, it avoids that the pcb board horizontal feed after solidifying will be welded in vertical reflow ovens extremely using chain structure in the prior art
It is cooled down in cooling caching machine, has shortened the length of the entire production line, and save a cooling buffer memory device, optimized production
The layout of line equipment；And the forced cooling device 1 using multilayer deposit plate support item 11 multiple pcb boards are laminated in the vertical direction it is cold
But, compact-sized, adapt to intensive manufacture.
It is on the basis of above-described embodiment, cold in view of simple and the being easy to implement property of the specific structure of cooling device
But device includes for the cooling fan 14 to pcb board condenser 13 for convection heat dissipation and for accelerating convection circulation.
It is understood that the side of condenser 13 is arranged in cooling fan 14, for against the side of condenser 13 into
Row blowing, to accelerate the hot-air near the cooling air and pcb board near condenser 13 to carry out convection current, to keep pcb board cold
But cool down.
Preferably, shell 18 is equipped with the exhaust outlet 181 for heat loss through convection.
Preferably, condenser 13 includes the condenser pipe being connected with external ice water；Shell 18 is equipped with for wearing condenser pipe
Condenser pipe relief hole 182.
In view of lifting drive 12 is to the action mode for depositing plate support item 11, on the basis of above-described embodiment, if
Dried layer is deposited plate support item 11 and is installed on supporting bar frame 15, and supporting bar frame 15 plays the role of fixed support to plate support item 11 is deposited,
Lifting drive 12 is connected with supporting bar frame 15, to drive all plate support items 11 of depositing same by the lifting of driving supporting bar frame 15
Step lifting.This can deposit between plate support item 11 to avoid each layer and interfere with each other, and influence the lifting for depositing plate support item 11.
In view of simple and the being easy to implement property of 12 structure of lifting drive, on the basis of above-described embodiment, rise
Drop driving device 12 include lifting motor 121, be connected with the output shaft of lifting motor 121 lead screw 122, be sheathed on lead screw 122
Nut 123 and with the guide rod 124 disposed in parallel of lead screw 122, nut 123 is connected by connecting plate 125 with supporting bar frame 15,
The bearing holder (housing, cover) 126 being slideably socketed with guide rod 124 is installed on connecting plate 125.
That is, the present embodiment drives lead screw 122 to rotate by lifting motor 121, so that lead screw 122 be made to drive spiral shell
Mother 123 moves along the axis direction of lead screw 122, and nut 123 drives 15 integral elevating of supporting bar frame by connecting plate 125, meanwhile,
Bearing holder (housing, cover) 126 is slided along guide rod 124, to guarantee the stationarity of 15 elevating movement of supporting bar frame.
In view of depositing the realization of the specific structure of plate support item 11, on the basis of above-described embodiment, every layer is deposited plate support item
11 include two supporting plates 111 being oppositely arranged, and supporting plate 111 includes the side plate and difference for carrying out lateral Displacement to pcb board
Two support rims of pcb board are vertically connected and are used to support with the both ends of side plate.
That is, the present embodiment is respectively used to the two sides of support pcb board using two supporting plates 111, supporting plate 111 is main
Play the supporting role to pcb board.
It is understood that two support rims and side plate form L-shaped support construction.
Pcb board edge part will be caused to draw in view of when pcb board misplaces on depositing plate support item 11, depositing when plate support item 11 is gone up and down
Wound etc., it is preferable that supporting plate 111 is equipped with the optoelectronic switch for incuding pcb board, optoelectronic switch and control close to the end of plate outlet
Device is connected, and controller is connected with warning device, when optoelectronic switch senses pcb board, shows that pcb board is wrong on depositing plate support item 11
Position, the signal that optoelectronic switch is detected are sent to controller, and controller sends control instruction to warning device, makes warning device
It sounds an alarm, in order to handle in time.
In view of the set-up mode of discharging device, on the basis of above-described embodiment, discharging device includes depositing with every layer
The linear drive apparatus that plate support item 11 is arranged in a one-to-one correspondence.
That is, every layer of pcb board deposited on plate support item 11 is respectively by depositing the corresponding straight line of plate support item 11 in the present embodiment
Driving device conveying.
It is understood that linear drive apparatus can be with depositing 11 synchronization lifting of plate support item.
In view of simple and the being easy to implement property of the specific structure of linear drive apparatus, on the basis of above-described embodiment
On, linear drive apparatus includes two horizontal transferring devices 16 being arranged in a one-to-one correspondence respectively with two supporting plates 111 of same layer, water
Flat conveying device 16 includes stepper motor 161 and the synchronous belt transmission device 162 being connected with stepper motor 161, toothed belt transmission
The synchronous belt of device 162 is set between two support rims, and the transporting flat of synchronous belt is parallel with the supporting surface of support rim
Setting.
It is understood that synchronous belt transmission device 162 includes the main belt being connected with the output shaft of stepper motor 161
Wheel, the driven pulley cooperated with driving pulley and the synchronous belt being set on driving pulley and driven pulley.
That is, in the present embodiment, pcb board is conveyed by synchronous belt, every layer to deposit corresponding two levels of plate support item 11 defeated
Device 16 is sent, two horizontal transferring devices 16 are respectively used to the two sides of conveying pcb board.That is, pcb board is fixed on depositing plate support item 11
Behind position, four angles of pcb board are respectively supported on four support rims, and it is defeated that the two sides bottom surface of pcb board is bonded two levels respectively
The synchronous belt of device 16 is sent to be arranged, when pcb board is cooling on depositing plate support item 11, synchronous belt plays support to the side of pcb board
Effect, after the completion of pcb board is cooling, the synchronous belt synchronous transport pcb board of pcb board two sides exports pcb board from plate outlet.
It is understood that this setup of horizontal transferring device 16, when pcb board is entered by the ejecting plate position for declining storehouse
When entering plate mouth of forced cooling device 1, can star stepper motor 161, makes horizontal transferring device 16 that pcb board be driven to enter and deposits plate
Supporting bar 11 simultaneously positions on depositing plate support item 11.
In view of the gravity of pcb board is when synchronous belt, it is be easy to cause the sinking of upper layer synchronous belt, therefore, in order to keep away
Exempt from the sinking of upper layer synchronous belt, it is preferable that the bottom of synchronous belt is equipped with supporting plate on upper layer.It is further preferable that supporting plate and support
The side plate of plate is vertically connected, to form the L shape support plate of one.It is understood that the both ends difference of supporting plate is corresponding
Support rim between have certain gap, for driving pulley and driven pulley to be arranged.
In view of the opportunity that pcb board is exported from the plate outlet of forced cooling device 1, in the base of above-mentioned any one embodiment
It further include whether reaching the temperature sensor 17 and and temperature sensing of preset temperature for detecting the temperature of pcb board on plinth
The first connected controller of device 17, the first controller is connected with lifting drive 12 and discharging device respectively, according to temperature
The signal control lifting drive 12 that sensor 17 detects acts, so that the driving of lifting drive 12 and temperature are up to standard
The corresponding plate outlet deposited plate support item 11 and be directed at forced cooling device 1 of pcb board, and after depositing plate support item 11 and being directed at plate outlet, control
Material device action is produced, so that discharging device drives pcb board to export from plate outlet.
That is, the present embodiment judges whether pcb board cools down completion by the temperature of pcb board, when pcb board has cooled down
When the temperature of Cheng Shi namely pcb board reaches preset temperature, temperature sensor 17 detects pcb board temperature signal up to standard, and will
This signal is transferred to the first controller, and the first controller controls lifting according to received pcb board temperature signal up to standard
Driving device 12 acts, and the driving of lifting drive 12 is corresponding with temperature pcb board up to standard to deposit the lifting of plate support item 11, so that warm
The plate support item 11 of depositing for spending pcb board up to standard is directed at plate outlet, and then, the first controller controls discharging device movement, so that discharging
Device exports pcb board from plate outlet.
Preferably, temperature sensor 17 is arranged correspondingly with plate support item 11 is deposited.Temperature sensor 17 is preferably set
It on the side plate of supporting plate 111, also can be set in the bottom of upper layer synchronous belt, as long as the temperature of pcb board can be sensed.
It is understood that the preset temperature in the present invention, which refers to, meets the temperature that technique requires after pcb board cools down completely.
In view of pcb board is from the another embodiment on the plate outlet of forced cooling device 1 output opportunity, above-mentioned any
On the basis of one embodiment, further include for calculate pcb board deposit the residence time on plate support item 11 whether meet it is default
The timer of time requirement and the second controller being connected with timer, second controller and lifting drive 12 and discharging
Device is connected, and is acted with the signal control lifting drive 12 transmitted according to timer, so that lifting drive 12 drives
The dynamic pcb board corresponding plate outlet depositing plate support item 11 be directed at forced cooling device 1 up to standard with the residence time, and depositing plate support item
After 11 alignment plate outlets, control discharging device movement, so that discharging device drives pcb board to export from plate outlet.
That is, the present embodiment is by pcb board, the residence time on depositing plate support item 11 judges whether pcb board cools down
It completes, it is preferable that pcb board can be obtained by many experiments in advance and deposit the residence time on plate support item 11 and the temperature of pcb board
Between corresponding relationship, so that it is determined that when the temperature of pcb board reaches preset temperature, pcb board needs stop on depositing plate support item 11
The preset time stayed.
When timer detect pcb board deposit the residence time on plate support item 11 meet preset time require when, by pcb board
The information that meets the requirements of residence time be sent to second controller, second controller according to this received information, to
Lifting drive 12 sends control instruction, makes the driving of lifting drive 12 is corresponding with residence time pcb board up to standard to deposit
Plate support item 11 is gone up and down, so that the plate support item 11 of depositing of the pcb board that meets the requirements of residence time is directed at plate outlet, then, the second control
Device sends control instruction to discharging device, exports discharging device pcb board from plate outlet.
It is understood that either still using time judgment criteria to determine pcb board using temperature judgment criteria
The ejecting plate time meets the principle of first in first out naturally.
It include that above-described embodiment is public the present invention also provides one kind in addition to the above-mentioned forced cooling device for vertical reflow ovens
The vertical reflow ovens for the forced cooling device 1 opened, including reflux furnace body 2, the setting of forced cooling device 1 is in reflux furnace body 2
Decline storehouse ejecting plate position rear.Refer to the prior art for the structure of other each sections of the vertical reflow ovens, herein no longer
It repeats.
It should also be noted that, in the present specification, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The forced cooling device provided by the present invention for vertical reflow ovens and vertical reflow ovens have been carried out in detail above
It is thin to introduce.Used herein a specific example illustrates the principle and implementation of the invention, and above embodiments are said
It is bright to be merely used to help understand method and its core concept of the invention.It should be pointed out that for the ordinary skill of the art
, without departing from the principle of the present invention, can be with several improvements and modifications are made to the present invention for personnel, these improvement
It is also fallen within the protection scope of the claims of the present invention with modification.
Claims (10)
1. a kind of forced cooling device for vertical reflow ovens characterized by comprising
Several layers for accepting the pcb board exported from the ejecting plate position in the decline storehouse of vertical reflow ovens deposit plate support item (11)；
Cooling device for being cooled down to the pcb board；
With it is described deposit plate support item (11) be connected, for drive it is described deposit plate support item (11) go up and down so that it is described deposit plate support item (11) can
Selectively it is directed at the lifting drive (12) of the plate outlet of the ejecting plate position or the forced cooling device (1)；
Discharging device for exporting the pcb board from the plate outlet.
2. the forced cooling device according to claim 1 for vertical reflow ovens, which is characterized in that the cooling device
Including for the cooling fan (14) to pcb board condenser for convection heat dissipation (13) and for accelerating convection circulation.
3. the forced cooling device according to claim 1 for vertical reflow ovens, which is characterized in that deposited described in several layers
Plate support item (11) is installed on supporting bar frame (15), and the lifting drive (12) is connected with the supporting bar frame (15),
All described plate support item (11) synchronization lifting is deposited to drive.
4. the forced cooling device according to claim 3 for vertical reflow ovens, which is characterized in that the lifting driving
Device (12) includes lifting motor (121), is connected with the output shaft of the lifting motor (121) lead screw (122) is sheathed on institute
State lead screw (122) nut (123) and with the lead screw (122) guide rod disposed in parallel (124), the nut (123) is logical
It crosses connecting plate (125) to be connected with the supporting bar frame (15), being installed on the connecting plate (125) can with the guide rod (124)
The bearing holder (housing, cover) (126) being slidably socketed.
5. the forced cooling device according to claim 1 for vertical reflow ovens, which is characterized in that deposit plate described in every layer
Supporting bar (11) includes two supporting plates (111) being oppositely arranged, and the supporting plate (111) includes for carrying out side to the pcb board
To limit side plate and two support rims of the pcb board are vertically connected and are used to support with the both ends of the side plate respectively.
6. the forced cooling device according to claim 5 for vertical reflow ovens, which is characterized in that the discharging device
Including with the linear drive apparatus depositing plate support item (11) described in every layer and be arranged in a one-to-one correspondence.
7. the forced cooling device according to claim 6 for vertical reflow ovens, which is characterized in that the linear drives
Device includes two horizontal transferring devices (16) being arranged in a one-to-one correspondence respectively with two supporting plates (111) of same layer, described
Horizontal transferring device (16) includes stepper motor (161) and the synchronous belt transmission device that is connected with the stepper motor (161)
(162), the synchronous belt of the synchronous belt transmission device (162) is set between two support rims, and the synchronous belt
The supporting surface of transporting flat and the support rim is arranged in parallel.
8. the forced cooling device according to claim 1-7 for vertical reflow ovens, which is characterized in that also wrap
It includes:
Whether the temperature for detecting the pcb board reaches the temperature sensor (17) of preset temperature；
The first controller being connected with the temperature sensor (17), first controller respectively with the lifting drive
(12) it is connected with the discharging device, the lifting drive is controlled with the signal detected according to the temperature sensor (17)
(12) corresponding deposit plate support item (11) of driving temperature pcb board up to standard are directed at the plate outlet, and control the discharging device and drive
The pcb board is moved to export from the plate outlet.
9. the forced cooling device according to claim 1-7 for vertical reflow ovens, which is characterized in that also wrap
It includes:
Whether meet the timing that preset time requires in the residence time deposited on plate support item (11) for calculating the pcb board
Device；
The second controller being connected with the timer, the second controller respectively with the lifting drive (12) and institute
It states discharging device to be connected, lifting drive (12) the driving residence time is controlled with the signal transmitted according to the timer
Pcb board up to standard is corresponding to be deposited plate support item (11) and is directed at the plate outlet, and control the discharging device drive the pcb board from
The plate outlet output.
10. a kind of vertical reflow ovens, including reflux furnace body (2), which is characterized in that further include any one of claim 1-9 institute
The forced cooling device (1) for vertical reflow ovens stated, the forced cooling device (1) are arranged in the reflux furnace body
(2) rear of the ejecting plate position in decline storehouse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811061644.6A CN109014488A (en) | 2018-09-12 | 2018-09-12 | A kind of forced cooling device for vertical reflow ovens and vertical reflow ovens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811061644.6A CN109014488A (en) | 2018-09-12 | 2018-09-12 | A kind of forced cooling device for vertical reflow ovens and vertical reflow ovens |
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| Publication Number | Publication Date |
|---|---|
| CN109014488A true CN109014488A (en) | 2018-12-18 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811061644.6A Pending CN109014488A (en) | 2018-09-12 | 2018-09-12 | A kind of forced cooling device for vertical reflow ovens and vertical reflow ovens |
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| Country | Link |
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| CN (1) | CN109014488A (en) |
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| CN208977023U (en) * | 2018-09-12 | 2019-06-14 | 深圳市劲拓自动化设备股份有限公司 | A kind of forced cooling device for vertical reflow ovens and vertical reflow ovens |
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| JPH0330493A (en) * | 1989-06-28 | 1991-02-08 | Matsushita Electric Ind Co Ltd | Reflow soldering device |
| JPH03214687A (en) * | 1990-01-18 | 1991-09-19 | Matsushita Electric Ind Co Ltd | Reflow soldering device and method of heating reflow soldering device |
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