CN108997952A - Low temperature high adhesion force conductive silver paste - Google Patents
Low temperature high adhesion force conductive silver paste Download PDFInfo
- Publication number
- CN108997952A CN108997952A CN201710420253.8A CN201710420253A CN108997952A CN 108997952 A CN108997952 A CN 108997952A CN 201710420253 A CN201710420253 A CN 201710420253A CN 108997952 A CN108997952 A CN 108997952A
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- parts
- silver
- low temperature
- high adhesion
- adhesion force
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention discloses a kind of low temperature high adhesion force conductive silver paste, it is grouped as by the group of following parts by weight: conductive filler, polyurethane resin, glycerin ether epoxy resin, polyethers, rilanit special, dicyandiamide, hexahydrophthalic acid anhydride, N, N- dipropyl -1- propylamine, neopentyl glycol glycidol ether, gamma-aminopropyl-triethoxy-silane, defoaming agent, methyl second butanone, cyclohexanone；The conductive filler is silver powder and silver nanowires according to 100:(25 ~ 40) mixture that the ratios of parts by weight is mixed to form, the diameter of the silver powder is 2 ~ 8 μm, and the silver nanowires length is 20 ~ 200 μm, and diameter is 20 ~ 100nm.Low temperature high adhesion force conductive silver paste of the present invention at 15 DEG C of environment temperature or less can be reserved for 12 months, storage stability is good, under the conditions of 120 DEG C, 100 seconds can dry solidification, to improve production efficiency and yield.
Description
Technical field
The present invention relates to conductive silver glue fields, and in particular to a kind of low temperature high adhesion force conductive silver paste.
Background technique
Conductive silver glue has been widely used in electronics industry, is mainly used for the viscous of the conductive body between unlike material
It connects.Currently, in the market it is visible it is most of be using epoxy resin be that basic resin is aided with different types of amino resins as solidification
The two-component system of agent, and the conductive silver glue formed using super fine silver powder as conducting medium, silver content is between 60 ~ 70%, cost
Also higher, there is also two big defects for this kind of elargol, first is that needing stringent storage condition, stability is poor, and the shelf-life is short；Second is that solid
It is high to change temperature, the time is long, and generally requiring 130 ~ 150 DEG C, 20 ~ 30 minutes or longer time could solidify, and is unfavorable for production effect
The promotion of rate；Therefore, above-mentioned technical problem how to be overcome to become the direction that those of ordinary skill in the art make great efforts.
Summary of the invention
The object of the present invention is to provide a kind of low temperature high adhesion force conductive silver paste, which exists
It can be reserved for 12 months at 15 DEG C of environment temperature or less, storage stability is good, under the conditions of 120 DEG C, can dry within 100 seconds solid
Change, to improve production efficiency and yield.
In order to achieve the above objectives, the technical solution adopted by the present invention is that: a kind of low temperature high adhesion force conductive silver paste, by following
The group of parts by weight is grouped as:
80 parts of conductive filler,
8 ~ 12 parts of polyurethane resin,
3 ~ 5 parts of glycerin ether epoxy resin,
6 ~ 9 parts of polyethers,
0.1 ~ 0.4 part of rilanit special,
0.6 ~ 1.5 part of dicyandiamide,
0.3 ~ 0.5 part of hexahydrophthalic acid anhydride,
0.1 ~ 0.25 part of propylamine of N, N- dipropyl -1-,
10 ~ 15 parts of neopentyl glycol glycidol ether,
0.5 ~ 1 part of gamma-aminopropyl-triethoxy-silane,
0.2 ~ 0.4 part of defoaming agent,
4 ~ 7 parts of methyl second butanone,
2 ~ 3 parts of cyclohexanone；
The conductive filler is silver powder and silver nanowires according to 100:(25 ~ 40) mixture that is mixed to form of the ratios of parts by weight,
The diameter of the silver powder is 2 ~ 8 μm, and the silver nanowires length is 20 ~ 200 μm, and diameter is 20 ~ 100nm.
The further improved technical solution of above-mentioned technical proposal is as follows:
In above scheme, the defoaming agent is dodecyl sodium sulfate or 4,4- diaminodiphenylmethane.
Due to the application of the above technical scheme, compared with the prior art, the invention has the following advantages:
1. low temperature high adhesion force conductive silver paste of the present invention uses 8 ~ 12 parts of polyurethane resin, 3 ~ 5 parts of glycerin ether epoxy resin
It is equipped with rilanit special, N, N- dipropyl -1- propylamine can be reserved for 12 months at 15 DEG C of environment temperature or less, storage stability
It is good；Conductive filler is silver powder and silver nanowires according to 100:(25 ~ 40) mixture that is mixed to form of the ratios of parts by weight, the silver
The diameter of powder is 2 ~ 8 μm, and the silver nanowires length is 20 ~ 200 μm, and diameter is 20 ~ 100nm, is improved between conductive filler
Contact area, conductive channel can be more readily formed in conducting resinl, also by silver content be reduced to 50% hereinafter, conductive silver glue body
Product resistivity is≤1.2 × 10-4Ω cm, thus the conductive effect that colloid can also be got well in the smaller situation of Ag doping amount.
2. low temperature high adhesion force conductive silver paste of the present invention, 10 ~ 15 parts of neopentyl glycol glycidol ether, 6 ~ 9 parts of polyethers,
0.6 ~ 1.5 part of dicyandiamide, 0.3 ~ 0.5 part of hexahydrophthalic acid anhydride, the dry solidification time is short, and elargol is in 90 DEG C of conditions when use
Under, 9 minutes can dry solidification, under the conditions of 120 DEG C, 100 seconds can dry solidification, to improve production efficiency and good
Rate.
Specific embodiment
Embodiment 1 ~ 4: a kind of low temperature high adhesion force conductive silver paste is grouped as by the group of following parts by weight, as shown in table 1:
Table 1
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | |
| Conductive filler | 80 parts | 80 parts | 80 parts | 80 parts |
| Polyurethane resin | 9 parts | 12 parts | 10 parts | 8 parts |
| Glycerin ether epoxy resin | 4 parts | 3.8 part | 3.5 part | 5 parts |
| Polyethers | 8 parts | 6 parts | 9 parts | 8.5 part |
| Rilanit special | 0.3 part | 0.1 part | 0.4 part | 0.2 part |
| Dicyandiamide | 0.9 part | 1.2 part | 0.6 part | 1.4 part |
| Hexahydrophthalic acid anhydride | 0.5 part | 0.35 part | 0.32 part | 0.4 part |
| N, N- dipropyl -1- propylamine | 0.12 part | 0.2 part | 0.18 part | 0.15 part |
| Neopentyl glycol glycidol ether | 13 parts | 15 parts | 12 parts | 14 parts |
| Gamma-aminopropyl-triethoxy-silane | 0.8 part | 0.6 part | 1 part | 0.5 part |
| Defoaming agent | 0.2 part | 0.3 part | 0.25 part | 0.4 part |
| Methyl second butanone | 5 parts | 7 parts | 6 parts | 5.4 part |
| Cyclohexanone | 2.2 part | 2 parts | 3 parts | 2.8 part |
Conductive filler is silver powder and the mixture that silver nanowires is mixed to form according to the ratio of 100:30 parts by weight in embodiment 1；
Conductive filler is silver powder and the mixture that silver nanowires is mixed to form according to the ratio of 100:28 parts by weight in embodiment 2；Implement
Conductive filler is silver powder and the mixture that silver nanowires is mixed to form according to the ratio of 100:32 parts by weight in example 3；In embodiment 4
Conductive filler is silver powder and the mixture that silver nanowires is mixed to form according to the ratio of 100:38 parts by weight；
The diameter of the silver powder is 2 ~ 8 μm, and the silver nanowires length is 20 ~ 200 μm, and diameter is 20 ~ 100nm.
The defoaming agent of Examples 1 and 2 is dodecyl sodium sulfate, and the defoaming agent of embodiment 3 and 4 is 4,4- diamino hexichol
Methane.
A kind of preparation process of above-mentioned low temperature high adhesion force conductive silver paste, comprising the following steps:
Step 1: 8 ~ 12 parts of polyurethane resin, 3 ~ 5 parts of glycerin ether epoxy resin, N, 0.1 ~ 0.25 part of N- dipropyl -1- propylamine,
10 ~ 15 parts of neopentyl glycol glycidol ether, 0.2 ~ 0.4 part of defoaming agent, 4 ~ 7 parts of methyl second butanone, 2 ~ 3 parts of cyclohexanone, at 120 DEG C
Mixture after carrying out pre-dispersed formation dispersion for 10 ~ 30 minutes is stirred at a temperature of ~ 150 DEG C；
Step 2: again by 6 ~ 9 parts of polyethers, 0.1 ~ 0.4 part of rilanit special, 0.6 ~ 1.5 part of dicyandiamide, hexahydrophthalic acid anhydride
0.3 ~ 0.5 part, 0.5 ~ 1 part of gamma-aminopropyl-triethoxy-silane is added mixture after the dispersion that step 1 obtains, to obtain base
Body；
It is sufficiently stirred Step 3: 80 parts of addition step 2 of conductive filler are obtained in matrix, is then placed in three-roller and grinds, obtain
The low temperature high adhesion force conductive silver paste is obtained, the conductive filler is silver powder and silver nanowires according to 100:(25 ~ 40) parts by weight
The mixture that is mixed to form of ratio, the diameter of the silver powder is 2 ~ 8 μm, and the silver nanowires length is 20 ~ 200 μm, diameter
For 20 ~ 100nm.
Mixture re-ultrasonic dispersion 10 ~ 30 minutes after the dispersion that above-mentioned steps one obtain.
The whipping temp of above-mentioned steps one is 130 DEG C.
When using above-mentioned low temperature high adhesion force conductive silver paste, 8 ~ 12 parts of polyurethane resin, glycerin ether epoxy resin 3 are used
~ 5 parts are equipped with rilanit special, N, and N- dipropyl -1- propylamine can be reserved for 12 months at 15 DEG C of environment temperature or less, and storage is steady
It is qualitative good；Conductive filler is silver powder and silver nanowires according to 100:(25 ~ 40) mixture that is mixed to form of the ratios of parts by weight, institute
The diameter for stating silver powder is 2 ~ 8 μm, and the silver nanowires length is 20 ~ 200 μm, and diameter is 20 ~ 100nm, improves conductive filler
Between contact area, conductive channel can be more readily formed in conducting resinl, silver content is also reduced to 50% hereinafter, conductive silver glue
Volume resistivity be≤1.2 × 10-4Ω cm, thus the conductive effect that colloid can also be got well in the smaller situation of Ag doping amount
Fruit；Again, 10 ~ 15 parts of neopentyl glycol glycidol ether, 6 ~ 9 parts of polyethers, 0.6 ~ 1.5 part of dicyandiamide, hexahydrophthalic acid anhydride
0.3 ~ 0.5 part, the dry solidification time is short, when use elargol under the conditions of 90 DEG C, 9 minutes can dry solidification, in 120 DEG C of conditions
Under, 100 seconds can dry solidification, to improve production efficiency and yield.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention.It is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (2)
1. a kind of low temperature high adhesion force conductive silver paste, it is characterised in that: be grouped as by the group of following parts by weight:
80 parts of conductive filler,
8 ~ 12 parts of polyurethane resin,
3 ~ 5 parts of glycerin ether epoxy resin,
6 ~ 9 parts of polyethers,
0.1 ~ 0.4 part of rilanit special,
0.6 ~ 1.5 part of dicyandiamide,
0.3 ~ 0.5 part of hexahydrophthalic acid anhydride,
0.1 ~ 0.25 part of propylamine of N, N- dipropyl -1-,
10 ~ 15 parts of neopentyl glycol glycidol ether,
0.5 ~ 1 part of gamma-aminopropyl-triethoxy-silane,
0.2 ~ 0.4 part of defoaming agent,
4 ~ 7 parts of methyl second butanone,
2 ~ 3 parts of cyclohexanone；
The conductive filler is silver powder and silver nanowires according to 100:(25 ~ 40) mixture that is mixed to form of the ratios of parts by weight,
The diameter of the silver powder is 2 ~ 8 μm, and the silver nanowires length is 20 ~ 200 μm, and diameter is 20 ~ 100nm.
2. low temperature high adhesion force conductive silver paste according to claim 1, it is characterised in that: the defoaming agent is dodecyl
Sodium sulfonate or 4,4- diaminodiphenylmethane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710420253.8A CN108997952A (en) | 2017-06-06 | 2017-06-06 | Low temperature high adhesion force conductive silver paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710420253.8A CN108997952A (en) | 2017-06-06 | 2017-06-06 | Low temperature high adhesion force conductive silver paste |
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| Publication Number | Publication Date |
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| CN108997952A true CN108997952A (en) | 2018-12-14 |
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|---|---|---|---|
| CN201710420253.8A Pending CN108997952A (en) | 2017-06-06 | 2017-06-06 | Low temperature high adhesion force conductive silver paste |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102653659A (en) * | 2012-04-26 | 2012-09-05 | 苏州艾达仕电子科技有限公司 | Conductive coating material based on polyurethane dispersion body |
| CN102676102A (en) * | 2011-03-16 | 2012-09-19 | 上海富信新能源科技有限公司 | Silver nanowire doped conductive silver colloid and preparation method thereof |
| CN105810294A (en) * | 2016-06-01 | 2016-07-27 | 合肥微晶材料科技有限公司 | Waterborne conductive silver paste and preparation method thereof |
-
2017
- 2017-06-06 CN CN201710420253.8A patent/CN108997952A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102676102A (en) * | 2011-03-16 | 2012-09-19 | 上海富信新能源科技有限公司 | Silver nanowire doped conductive silver colloid and preparation method thereof |
| CN102653659A (en) * | 2012-04-26 | 2012-09-05 | 苏州艾达仕电子科技有限公司 | Conductive coating material based on polyurethane dispersion body |
| CN105810294A (en) * | 2016-06-01 | 2016-07-27 | 合肥微晶材料科技有限公司 | Waterborne conductive silver paste and preparation method thereof |
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Application publication date: 20181214 |
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