CN108974885A - A kind of quartz plate full wafer unit - Google Patents
A kind of quartz plate full wafer unit Download PDFInfo
- Publication number
- CN108974885A CN108974885A CN201810508296.6A CN201810508296A CN108974885A CN 108974885 A CN108974885 A CN 108974885A CN 201810508296 A CN201810508296 A CN 201810508296A CN 108974885 A CN108974885 A CN 108974885A
- Authority
- CN
- China
- Prior art keywords
- full wafer
- cell body
- quartz plate
- pushing part
- wafer cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
This application involves a kind of quartz plate full wafer units, the full wafer unit include full wafer cell body, be arranged in the full wafer cell body one side edge teeth portion, the pushing part of the full wafer cell body other side is set, the pushing part is mutually fixedly connected by welding with the full wafer cell body.A kind of quartz plate full wafer unit described herein is additionally provided with pushing part in full wafer cell body, and the pushing part can install promotion cylinder, can carry out full wafer to quartz plate automatically and accurately, the full wafer cellular construction is simple, easy to use.
Description
Technical field
This application involves a kind of quartz plate full wafer units.
Background technique
In the prior art, quartz plate during processing, needs to carry out multi-disc quartz plate whole Transporting to next
Workflow prevents quartz plate from irregular situation occur therefore, it is necessary to transport after multi-disc quartz plate is carried out full wafer.
Summary of the invention
The main purpose of the application is to provide a kind of quartz plate full wafer unit, the problems such as to overcome the prior art.
For realization aforementioned application purpose, the technical solution that the application uses includes:
This application involves a kind of quartz plate full wafer unit, the full wafer unit include full wafer cell body, be arranged in it is described
The teeth portion of the one side edge of full wafer cell body, the pushing part that the full wafer cell body other side is arranged in, described pushes away
Dynamic portion is mutually fixedly connected by welding with the full wafer cell body.
Preferably, the pushing part is the plate object for being welded on the full wafer cell body edge, the promotion
Plane where portion is mutually perpendicular to the plane where the full wafer cell body.
Preferably, multiple mounting holes through the pushing part ontology are provided on the pushing part.
Preferably, the teeth portion includes the tooth that multiple edges along the full wafer cell body are arranged, adjacent
Two teeth between form the clearance portion for placing quartz plate.
Preferably, the edge of the full wafer cell body has multiple clearance portions to form the teeth portion.
Preferably, the full wafer cell body is made with the pushing part of metal material.
Preferably, the clearance portion is to be formed by way of milling at the edge of the full wafer cell body.
Preferably, multiple teeth are uniformly arranged in the edge of the full wafer cell body.
By above technical solution, the beneficial effects of the present application are as follows:
A kind of quartz plate full wafer unit described herein is additionally provided with pushing part, the pushing part in full wafer cell body
Promotion cylinder can be installed, full wafer can be carried out to quartz plate automatically and accurately, the full wafer cellular construction is simple, user
Just.
Referring to following description and accompanying drawings, specific implementations of the present application are disclosed in detail, specify the original of the application
Reason can be in a manner of adopted.It should be understood that presently filed embodiment is not so limited in range.In appended power
In the range of the spirit and terms that benefit requires, presently filed embodiment includes many changes, modifications and is equal.
The feature for describing and/or showing for a kind of embodiment can be in a manner of same or similar one or more
It uses in a other embodiment, is combined with the feature in other embodiment, or the feature in substitution other embodiment.
It should be emphasized that term "comprises/comprising" refers to the presence of feature, one integral piece, step or component when using herein, but simultaneously
It is not excluded for the presence or additional of one or more other features, one integral piece, step or component.
Detailed description of the invention
Attached drawing described here is only used for task of explanation, and is not intended to limit model disclosed in the present application in any way
It encloses.In addition, shape and proportional sizes of each component in figure etc. are only schematical, it is used to help the understanding to the application, and
It is not the specific shape and proportional sizes for limiting each component of the application.Those skilled in the art, can under teachings of the present application
Implement the application to select various possible shapes and proportional sizes as the case may be.In the accompanying drawings:
Attached drawing 1 is the structural schematic diagram of herein described quartz plate full wafer unit.
Wherein: 1, full wafer cell body；11, teeth portion；2, pushing part；21, mounting hole.
Specific embodiment
Below in conjunction with the attached drawing in the application embodiment, the technical solution in the application embodiment is carried out clear
Chu is fully described by, it is clear that described embodiment is only a part of embodiment of the application, rather than whole realities
Apply mode.Based on the embodiment in the application, those of ordinary skill in the art institute without creative efforts
The every other embodiment obtained, shall fall in the protection scope of this application.
It should be noted that it can directly on the other element when element is referred to as " being set to " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and the technical field for belonging to the application
The normally understood meaning of technical staff is identical.The term used in the description of the present application is intended merely to description tool herein
The purpose of the embodiment of body, it is not intended that in limitation the application.Term as used herein "and/or" includes one or more
Any and all combinations of relevant listed item.
As shown, the full wafer unit includes full wafer cell body this application involves a kind of quartz plate full wafer unit
1, the teeth portion 11 of the one side edge of the full wafer cell body 1 is set, 1 other side of full wafer cell body is set
Pushing part 2, the pushing part 2 is mutually fixedly connected by welding with the full wafer cell body 1.Described pushes away
Dynamic portion 2 be the plate object for being welded on 1 edge of full wafer cell body, the plane where the pushing part 2 with it is described
Plane where full wafer cell body 1 is mutually perpendicular to.It is provided on the pushing part 2 multiple through the pushing part 2
The mounting hole 21 of body.The teeth portion 11 includes the tooth that multiple edges along the full wafer cell body 1 are arranged, adjacent
Two teeth between form the clearance portion for placing quartz plate.The edge of the full wafer cell body 1 has multiple institutes
The clearance portion stated forms the teeth portion 11.The full wafer cell body 1 is made with the pushing part 2 of metal material.
The clearance portion is to be formed by way of milling at the edge of the full wafer cell body 1.Multiple teeth are uniform
The edge for being arranged in the full wafer cell body 1.
A kind of quartz plate full wafer unit described herein is additionally provided with pushing part 2 in full wafer cell body 1, described
Pushing part 2 can install promotion cylinder, can carry out full wafer to quartz plate automatically and accurately, and the full wafer cellular construction is simple,
It is easy to use.
It should be noted that in the description of the present application, in the description of the present application, unless otherwise indicated, " multiples' "
It is meant that two or more.
All articles and reference disclosed, including patent application and publication, for various purposes by quoting knot
Together in this.Describing combined term " substantially by ... constitute " should include identified element, ingredient, component or step and reality
Other elements, ingredient, component or the step of the basic novel feature of the combination are not influenced in matter.Using term "comprising" or
" comprising " describes the combination of element here, ingredient, component or step it is also contemplated that substantially by these elements, ingredient, component
Or the embodiment that step is constituted.Here by using term " can with ", it is intended to illustrate that " can with " includes described any
Attribute is all optional.
Multiple element, ingredient, component or step can be provided by single integrated component, ingredient, component or step.Optionally
Ground, single integrated component, ingredient, component or step can be divided into multiple element, ingredient, component or the step of separation.It is used to
The open "a" or "an" for describing element, ingredient, component or step is not said to exclude other elements, ingredient, component
Or step.
It should be understood that above description is to illustrate rather than to be limited.By reading above-mentioned retouch
It states, many embodiments and many applications except provided example all will be aobvious and easy for a person skilled in the art
See.Therefore, the range of this introduction should not be determined referring to foregoing description, but should referring to preceding claims and this
The full scope of the equivalent that a little claims are possessed determines.For comprehensive purpose, all articles and with reference to including special
The disclosure of benefit application and bulletin is all by reference to being incorporated herein.Theme disclosed herein is omitted in preceding claims
Any aspect is not intended to abandon the body matter, also should not be considered as applicant the theme is not thought of as it is disclosed
Apply for a part of theme.
Claims (8)
1. a kind of quartz plate full wafer unit, it is characterised in that: the full wafer unit includes full wafer cell body, is arranged described
Full wafer cell body one side edge teeth portion, the pushing part of the full wafer cell body other side is set, it is described
Pushing part is mutually fixedly connected by welding with the full wafer cell body.
2. quartz plate full wafer unit according to claim 1, it is characterised in that: the pushing part be welded on it is described
The plate object at full wafer cell body edge, the plane where plane and the full wafer cell body where the pushing part
It is mutually perpendicular to.
3. quartz plate full wafer unit according to claim 2, it is characterised in that: be provided with multiple pass through on the pushing part
Wear the mounting hole of the pushing part ontology.
4. quartz plate full wafer unit according to claim 3, it is characterised in that: the teeth portion includes multiple along described
The tooth that the edge of full wafer cell body is arranged forms the clearance portion for placing quartz plate between two adjacent teeth.
5. quartz plate full wafer unit according to claim 4, it is characterised in that: open at the edge of the full wafer cell body
The teeth portion is formed equipped with multiple clearance portions.
6. quartz plate full wafer unit according to claim 5, it is characterised in that: the full wafer cell body and described
Pushing part is made of metal material.
7. quartz plate full wafer unit according to claim 6, it is characterised in that: the clearance portion is the side by milling
Formula is formed at the edge of the full wafer cell body.
8. quartz plate full wafer unit according to claim 7, it is characterised in that: multiple teeth are uniformly arranged in institute
The edge for the full wafer cell body stated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810508296.6A CN108974885A (en) | 2018-05-24 | 2018-05-24 | A kind of quartz plate full wafer unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810508296.6A CN108974885A (en) | 2018-05-24 | 2018-05-24 | A kind of quartz plate full wafer unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108974885A true CN108974885A (en) | 2018-12-11 |
Family
ID=64542661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810508296.6A Pending CN108974885A (en) | 2018-05-24 | 2018-05-24 | A kind of quartz plate full wafer unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108974885A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207157823U (en) * | 2017-09-06 | 2018-03-30 | 无锡市江松科技有限公司 | Silicon chip burst component |
| CN207158272U (en) * | 2017-09-06 | 2018-03-30 | 无锡市江松科技有限公司 | Silicon chip burst component |
| CN207353222U (en) * | 2017-09-06 | 2018-05-11 | 无锡市江松科技有限公司 | Silicon chip burst Suction cup assembly |
-
2018
- 2018-05-24 CN CN201810508296.6A patent/CN108974885A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207157823U (en) * | 2017-09-06 | 2018-03-30 | 无锡市江松科技有限公司 | Silicon chip burst component |
| CN207158272U (en) * | 2017-09-06 | 2018-03-30 | 无锡市江松科技有限公司 | Silicon chip burst component |
| CN207353222U (en) * | 2017-09-06 | 2018-05-11 | 无锡市江松科技有限公司 | Silicon chip burst Suction cup assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181211 |
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| WD01 | Invention patent application deemed withdrawn after publication |