CN108973057A - A kind of injection mold - Google Patents
A kind of injection mold Download PDFInfo
- Publication number
- CN108973057A CN108973057A CN201811108013.5A CN201811108013A CN108973057A CN 108973057 A CN108973057 A CN 108973057A CN 201811108013 A CN201811108013 A CN 201811108013A CN 108973057 A CN108973057 A CN 108973057A
- Authority
- CN
- China
- Prior art keywords
- dynamic model
- liquid
- cover half
- injection mold
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 title claims abstract description 42
- 239000007924 injection Substances 0.000 title claims abstract description 42
- 239000007788 liquid Substances 0.000 claims abstract description 125
- 238000010438 heat treatment Methods 0.000 claims abstract description 72
- 239000002826 coolant Substances 0.000 claims abstract description 56
- 238000001816 cooling Methods 0.000 claims abstract description 35
- 238000005086 pumping Methods 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000005338 heat storage Methods 0.000 claims description 16
- 238000009413 insulation Methods 0.000 claims description 16
- 238000002663 nebulization Methods 0.000 claims description 16
- 239000007787 solid Substances 0.000 claims description 6
- 239000000498 cooling water Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000000889 atomisation Methods 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The present invention relates to injection molding technology field more particularly to a kind of injection molds.Injection mold includes: dynamic model component, cover half component, liquid reserve tank, transfer tube and atomizer.Dynamic model component includes dynamic model, and dynamic model has movable model chamber.Cover half component and dynamic model component cooperate.Liquid reserve tank provides coolant liquid or heating liquid for storage coolant liquid respectively and heating liquid and to dynamic model, with cooling or heating dynamic model.Transfer tube connects liquid reserve tank, and transfer tube is used to coolant liquid and heating liquid selecting a pumping outward.One end of atomizer connects transfer tube, and the other end of atomizer connects dynamic model, the coolant liquid or heating liquid that atomizer is used to receive simultaneously atomized liquid coolant or heating liquid from transfer tube and has been atomized to dynamic model conveying.Dynamic model can individually be rapidly cooled or quickly heat by the present invention, avoid and carry out whole cooling or whole heating to injection mold, improve the heating speed and cooling velocity of injection mold, saved energy, finally shorten injection molding working hour.
Description
Technical field
The present invention relates to injection molding technology field more particularly to a kind of injection molds.
Background technique
In injection molding, the temperature of mold be determine injecting products quality an important factor for one of.Mold heterogeneous
Temperature will lead to the defects of fusion line, current mark, burr.In the case where the product of injection molding thin plate form or product with holes
Problem is particularly acute.
Usually mold is preheated, this problem is solved with this.I.e. first heating mould, reinjects molten state
Injected plastics material, it is then again that mold is cooling.There are many ways to for heating mould, for example, the electric heater of heat transfer, infrared
Line heating or radio frequency heating etc..
However, the method for these heating moulds, since mold integrally as heating target, is not only consumed a large amount of energy
Amount, and after the temperature of mold reaches required temperature, mold can not be rapidly cooled.
Summary of the invention
The present invention provides a kind of injection molds, it is intended to solve how quickly to heat or be quickly cooled down asking for injection mold
Topic.
The invention is realized in this way a kind of injection mold, comprising:
Dynamic model component, the dynamic model component includes dynamic model, and the dynamic model has movable model chamber；
Cover half component, the cover half component and the dynamic model component cooperate；
Liquid reserve tank, the liquid reserve tank for storage coolant liquid respectively and heating liquid and provide the coolant liquid to the dynamic model
Or the heating liquid, with cooling or heat the dynamic model；
Transfer tube, the transfer tube connect the liquid reserve tank, and the transfer tube is used for the coolant liquid and the heating
Liquid selects a pumping outward；
Atomizer, one end of the atomizer connect the transfer tube, and the other end of the atomizer connects the dynamic model,
The atomizer from the transfer tube for receiving and being atomized the coolant liquid or the heating liquid and convey to the dynamic model
The coolant liquid of atomization or the heating liquid.
Further, the dynamic model offers multiple mists interval setting and flowed through for the heating liquid or the coolant liquid
Change channel, one end of each nebulization channel is all connected with the atomizer.
Further, the injection mold further includes for providing the compressor of compressed air, and the compressor connects institute
Atomizer is stated, so that the compressed air mixes with the coolant liquid or the heating liquid being atomized and forms high-pressure coolant
Or hyperbaric heating liquid.
Further, the injection mold further includes air accumulator, one end of the air accumulator and each nebulization channel
Other end connection, to recycle the compressed air, the other end of the air accumulator connects the atomizer, and compressed air is defeated
It send to the atomizer.
Further, the liquid reserve tank includes for storing the cool-storing box of the coolant liquid, the connection cool-storing box and use
In the refrigerator of the cooling coolant liquid, the heat storage box for storing the heating liquid and the connection heat storage box and for adding
The heater of the heat heating liquid.
Further, the injection mold further includes the first valve and the second valve, one end difference of first valve
The water outlet of the cool-storing box and the heat storage box is connected, the other end of first valve connects the transfer tube；Described
One end of two valves is separately connected the water inlet of the cool-storing box and the heat storage box, and the other end connection of second valve is each
The other end of the nebulization channel.
Further, the dynamic model component further includes the moving template for installing the dynamic model, is opened up on the moving template
There is dynamic model chamber, one end of the dynamic model is located at the dynamic model chamber, and the dynamic model component further includes being arranged in the dynamic model chamber and position
First thermal insulation layer between the inner wall and the dynamic model of the dynamic model chamber.
Further, the cover half component include the cover half being oppositely arranged with the dynamic model, it is described for being heated or cooled
The semiconductor chilling plate of cover half and solid plate for installing the cover half；The cover half has to be adapted to the movable model chamber
Determine model cavity, the solid plate offers cover half chamber, and one end of the cover half is located at the cover half chamber；The semiconductor refrigerating
Piece is arranged between the cover half bottom of chamber and the cover half intracavitary and positioned at the cover half chamber.
Further, the cover half component further includes that setting is intracavitary in the cover half so that the moving template and the dynamic model
Spaced heat second thermal insulation layer, the second thermal insulation layer is located between the inner wall and the cover half of the cover half chamber, described half
Conductor cooling piece is between the second thermal insulation layer and the dynamic model.
Further, the cover half component further includes the coldplate for cooling down the semiconductor chilling plate, the cooling
Between the second thermal insulation layer and the semiconductor chilling plate, the coldplate offers multiple interval settings and for institute plate
State the cooling water channel that coolant liquid flows through.
The solution have the advantages that: the coolant liquid in liquid reserve tank is selected one with heating liquid and is pumped to atomizer by transfer tube,
The coolant liquid received or heating liquid are atomized by atomizer, then the coolant liquid being atomized or heating liquid are delivered to dynamic model,
So as to individually be rapidly cooled dynamic model or quickly heat, avoids whole to injection mold progress cooling or entirety and add
Heat improves the heating speed and cooling velocity of injection mold, has saved energy, finally shortens injection molding working hour.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of injection mold provided by the embodiment of the present invention.
Fig. 2 is the cross-sectional view of injection mold provided by the embodiment of the present invention.
Numbering in the drawing relationship corresponding with title is as follows:
100, injection mold；10, cover half component；70, semiconductor chilling plate；20, dynamic model component；58, nebulization channel；30,
Heat storage box；31, heater；40, cool-storing box；41, refrigerator；32, go out Water Heat Pipes；42, go out water cooling tube；63, water inlet heat pipe；65,
Into water cooling tube；51, the first valve；61, the second valve；52, transfer tube；53, first pipe；56, second pipe；57, communicating valve；
54, atomizer；81, vacuum pump；82, vacuum pipe；55, compressor；83, air accumulator；23, dynamic model；21, moving template；11, cover half
Plate；13, cover half；24, movable model chamber；14, determine model cavity；90, coldplate；91, cooling water channel；28, first thermal insulation layer 18；18,
Second thermal insulation layer；
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
Fig. 1 to Fig. 2 is please referred to, injection mold 100 provided by the embodiment of the present invention can be used to molten states such as plastic cement
Material carry out injection molding, injection mold 100 provided by the present invention have the characteristics that quickly heat and rapid cooling.
Injection mold 100 includes: dynamic model component 20, cover half component 10, liquid reserve tank, transfer tube 52 and atomizer 54.
Dynamic model component 20 includes dynamic model 23, and dynamic model 23 has movable model chamber 24, and dynamic model component 20 further includes for that will be molded
The thimble of product ejection movable model chamber 24.
Cover half component 10 and dynamic model component 20 cooperate.
Liquid reserve tank provides coolant liquid or heating liquid for storage coolant liquid respectively and heating liquid and to dynamic model 23, with cooling or
Heat dynamic model 23.Optionally, coolant liquid and heating liquid are liquid water in the present embodiment, in other embodiments or oily
Etc. other fluid media (medium)s.Coolant liquid and heating liquid flow separately through dynamic model 23, when coolant liquid flows through dynamic model 23 will to dynamic model 23 into
Row is quickly cooled down；When heating liquid stream through dynamic model 23, dynamic model 23 will quickly be heated.
Please refer to Fig. 1 to Fig. 2, transfer tube 52 connects liquid reserve tank, transfer tube 52 be used to select coolant liquid and heating liquid one to
Outer pumping.Coolant liquid or heating liquid can be selected one and pumped to dynamic model 23 by transfer tube 52, to enable coolant liquid or heating liquid
Dynamic model 23 is flowed through with predetermined flow rate, cooling or heating efficiency is provided.
One end of atomizer 54 connects transfer tube 52, and the other end of atomizer 54 connects dynamic model 23, atomizer 54 be used for from
Transfer tube 52 receives simultaneously atomized liquid coolant or heating liquid and conveys the coolant liquid being atomized or heating liquid to dynamic model 23.Atomizer 54
It is attached between transfer tube 52 by first pipe 53.By first pipe 53, transfer tube 52 can be pumped to atomizer 54
Coolant liquid or heating liquid are sent, the received coolant liquid of 54 pairs of institutes of atomizer or heating liquid are atomized, then are delivered to dynamic model 23, favorably
In offer heat exchanger effectiveness.
Coolant liquid in liquid reserve tank is selected one with heating liquid and is pumped to atomizer 54 by transfer tube 52, and atomizer 54 will receive
Coolant liquid or heating liquid be atomized, then by the coolant liquid being atomized or heating liquid be delivered to dynamic model 23, so as to move
Mould 23 is rapidly cooled or quickly heats, and avoids and carries out whole cooling or whole heating to injection mold 100, improves note
The heating speed and cooling velocity of mould 100, have saved energy, finally shorten injection molding working hour.
Dynamic model 23 offers multiple nebulization channels 58 interval setting and flowed through for heating liquid or coolant liquid, each nebulization channel
58 one end is all connected with atomizer 54.Each nebulization channel 58 is equidistantly opened in the bottom of chamber of movable model chamber 24, in heating liquid or cold
But when liquid is by each nebulization channel 58, dynamic model 23 can be heated or cooled respectively.
Fig. 1 to Fig. 2 is please referred to, injection mold 100 further includes for providing the compressor 55 of compressed air, and compressor 55 connects
Atomizer 54 is connect, so that compressed air mixes and formed high-pressure coolant or hyperbaric heating with the coolant liquid or heating liquid being atomized
Liquid.After compressed air is mixed with the coolant liquid of atomization or heating liquid, the high-pressure coolant or hyperbaric heating liquid of formation can be quick
Each nebulization channel 58 is flowed through, to improve coolant liquid or heat the heat exchange between liquid and dynamic model 23, into once improving cooling
Speed or heating speed.
Injection mold 100 further includes air accumulator 83, and one end of air accumulator 83 is connect with the other end of each nebulization channel 58, with
Compressed air is recycled, the other end of air accumulator 83 connects atomizer 54, compressed air is delivered to atomizer 54.Specifically,
Air accumulator 83 can make to keep air pressure steady to compressed air provided by atomizer 54, thus make compressed air and coolant liquid or
Liquid is heated to be uniformly mixed.Optionally, injection mold 100 further includes the of communicating valve 57 and connect compressor 55 and communicating valve 57
Two pipelines 56, communicating valve 57 are used to from compressor 55 conduct compressed air to atomizer 54.
Liquid reserve tank includes for storing the cool-storing box 40 of coolant liquid, connection cool-storing box 40 and the refrigeration for being used to cool down coolant liquid
Device 41, the heat storage box 30 for storing heating liquid and connection heat storage box 30 and the heater 31 for heating heating liquid.It is optional
Ground, refrigerator 41 can according to refrigerator 41 made by Peltier effect.Heater 31 can be electric heater 31.
Please referring to Fig. 1 to Fig. 2, injection mold 100 further includes the first valve 51 and the second valve 61, and the one of the first valve 51
End is separately connected the water outlet of cool-storing box 40 and heat storage box 30, and the other end of the first valve 51 connects transfer tube 52；Second valve
61 one end is separately connected the water inlet of cool-storing box 40 and heat storage box 30, and the other end of the second valve 61 connects each nebulization channel 58
The other end.
Specifically, the water outlet of cool-storing box 40 is connected to the first valve 51, the water inlet of cool-storing box 40 by going out water cooling tube 42
Mouth is by being connected to the second valve 61 into water cooling tube 65.The water outlet of heat storage box 30 is connected to the first valve by going out Water Heat Pipes 32
51, the water inlet of heat storage box 30 is connected to the second valve 61 by heat pipe 63 of intaking.First valve 51 can be Two In and One Out
Solenoid valve, the second valve 61 can be the solenoid valve of One In and Two Out.Flow through the coolant liquid or heating liquid difference of each nebulization channel 58
By then flowing back to cool-storing box 40 and heat storage box 30 respectively into water cooling tube 65 and water inlet heat pipe 63.
Dynamic model component 20 further includes the moving template 21 for installing dynamic model 23, offers dynamic model chamber, dynamic model on moving template 21
23 one end is located at dynamic model chamber, and dynamic model component 20 further includes that dynamic model chamber is arranged in and is located between the inner wall and dynamic model 23 of dynamic model chamber
First thermal insulation layer 28.First thermal insulation layer 28 makes the spaced heat of dynamic model 23 Yu moving template 21, to be conducive to the quick of dynamic model 23
Heating and rapid cooling, further improve the heating speed and cooling velocity of injection mold 100.
Cover half component 10 includes the cover half 13 being oppositely arranged with dynamic model 23, the semiconductor for heating or cooling down cover half 13
Cooling piece 70 and solid plate 11 for installing cover half 13；Cover half 13 has what is be adapted to movable model chamber 24 to determine model cavity 14,
Solid plate 11 offers cover half chamber, and one end of cover half 13 is located at cover half chamber；And position intracavitary in cover half is arranged in semiconductor chilling plate 70
Between the bottom of chamber and cover half 13 of cover half chamber.Cover half component 10 further includes for pouring to determining to inject plastic cement fluid in model cavity 14
Head.
Fig. 1 to Fig. 2 is please referred to, specifically, semiconductor chilling plate 70 is also referred to as thermoelectric module, can be according to Peltier
Semiconductor chilling plate 70 made by effect.Semiconductor chilling plate 70 have noiseless, it is without friction, be not required to refrigerant, be small in size,
The features such as light-weight.
Movable model chamber 24 cooperatively forms forming cavity for injection molding product with model cavity 14 is determined.Injection mold 100 is also
It forms the vacuum pump 81 of intracavitary air including connection forming cavity and for extracting and connects the true of vacuum pump 81 and forming cavity
Vacant duct 82.
Cover half component 10 further include be arranged in cover half it is intracavitary so that moving template 21 and the spaced heat of dynamic model 23 it is second heat-insulated
Layer 18, second thermal insulation layer 18 is located between the inner wall and cover half 13 of cover half chamber, and semiconductor chilling plate 70 is located at second thermal insulation layer 18
Between dynamic model 23.Second thermal insulation layer 18 makes the spaced heat of cover half 13 Yu solid plate 11, adds to be conducive to the quick of cover half 13
Heat and rapid cooling, further improve the heating speed and cooling velocity of injection mold 100.
Cover half component 10 further includes the coldplate 90 for cooling down semiconductor chilling plate 70, and it is heat-insulated that coldplate 90 is located at second
Between layer 18 and semiconductor chilling plate 70, coldplate 90 offers multiple interval settings and for the cooling water channel of cooling liquid stream warp
91.Coldplate 90 is for cooling down semiconductor chilling plate 70, to improve the refrigeration degree of semiconductor chilling plate 70.Flow through cooling water channel
91 coolant liquid can be provided by cool-storing box 40, can also be provided separately by other cooling device.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all in spirit of the invention and
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within principle.
Claims (10)
1. a kind of injection mold characterized by comprising
Dynamic model component, the dynamic model component includes dynamic model, and the dynamic model has movable model chamber；
Cover half component, the cover half component and the dynamic model component cooperate；
Liquid reserve tank, the liquid reserve tank for storage coolant liquid respectively and heating liquid and provide the coolant liquid or institute to the dynamic model
Heating liquid is stated, with cooling or heats the dynamic model；
Transfer tube, the transfer tube connect the liquid reserve tank, and the transfer tube is for selecting the coolant liquid and the heating liquid
One pumping outward；
Atomizer, one end of the atomizer connect the transfer tube, and the other end of the atomizer connects the dynamic model, described
Atomizer from the transfer tube for receiving and being atomized the coolant liquid or the heating liquid and be atomized to dynamic model conveying
The coolant liquid or the heating liquid.
2. injection mold as described in claim 1, it is characterised in that: the dynamic model offers described in multiple interval settings and confession
The nebulization channel that heating liquid or the coolant liquid flow through, one end of each nebulization channel is all connected with the atomizer.
3. injection mold as claimed in claim 2, it is characterised in that: the injection mold further includes for providing compressed air
Compressor, the compressor connects the atomizer, so that the compressed air and the coolant liquid that has been atomized or described
Heating liquid mixes and is formed high-pressure coolant or hyperbaric heating liquid.
4. injection mold as claimed in claim 3, it is characterised in that: the injection mold further includes air accumulator, the gas storage
One end of tank is connect with the other end of each nebulization channel, and to recycle the compressed air, the other end of the air accumulator connects
The atomizer is connect, compressed air is delivered to the atomizer.
5. injection mold as claimed in claim 2, it is characterised in that: the liquid reserve tank includes for storing the coolant liquid
Cool-storing box, the connection cool-storing box and the refrigerator for cooling down the coolant liquid, the heat storage box for storing the heating liquid
And connect the heat storage box and the heater for heating the heating liquid.
6. injection mold as claimed in claim 5, it is characterised in that: the injection mold further includes the first valve and the second valve
Door, one end of first valve are separately connected the water outlet of the cool-storing box and the heat storage box, first valve it is another
One end connects the transfer tube；One end of second valve is separately connected the water inlet of the cool-storing box and the heat storage box,
The other end of second valve connects the other end of each nebulization channel.
7. injection mold as claimed in any one of claims 1 to 6, it is characterised in that: the dynamic model component further includes for pacifying
The moving template of the dynamic model is filled, dynamic model chamber is offered on the moving template, one end of the dynamic model is located at the dynamic model chamber, described
Dynamic model component further includes that the dynamic model chamber is arranged in and is located at first heat-insulated between the inner wall and the dynamic model of the dynamic model chamber
Layer.
8. injection mold as claimed in any one of claims 1 to 6, it is characterised in that: the cover half component includes moving with described
The cover half that mould is oppositely arranged, the semiconductor chilling plate for the cover half to be heated or cooled and for installing determining for the cover half
Template；The cover half has what is be adapted to the movable model chamber to determine model cavity, and the solid plate offers cover half chamber, the cover half
One end be located at the cover half chamber；The semiconductor chilling plate be arranged in the cover half it is intracavitary and be located at the cover half chamber bottom of chamber
Between the cover half.
9. injection mold as claimed in claim 8, it is characterised in that: the cover half component further includes being arranged in the cover half chamber
It is interior so that the spaced heat of the moving template and the dynamic model second thermal insulation layer, the second thermal insulation layer is located at the cover half chamber
Between inner wall and the cover half, the semiconductor chilling plate is between the second thermal insulation layer and the dynamic model.
10. injection mold as claimed in claim 9, it is characterised in that: the cover half component further includes for cooling down described half
The coldplate of conductor cooling piece, the coldplate are described cold between the second thermal insulation layer and the semiconductor chilling plate
But plate offers multiple cooling water channels interval setting and flowed through for the coolant liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811108013.5A CN108973057A (en) | 2018-09-21 | 2018-09-21 | A kind of injection mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811108013.5A CN108973057A (en) | 2018-09-21 | 2018-09-21 | A kind of injection mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108973057A true CN108973057A (en) | 2018-12-11 |
Family
ID=64546419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811108013.5A Pending CN108973057A (en) | 2018-09-21 | 2018-09-21 | A kind of injection mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108973057A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114074406A (en) * | 2020-08-18 | 2022-02-22 | 苏州亮福电器有限公司 | Highlight injection mold adopting electric heating mode |
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| CN101444952A (en) * | 2007-11-27 | 2009-06-03 | 北京中拓机械有限责任公司 | Device for rapid controlling the temperature variation of an injection mold and a control method thereof |
| CN101733914A (en) * | 2008-11-12 | 2010-06-16 | 汉达精密电子(昆山)有限公司 | Fast heating and cooling forming system and forming die thereof |
| CN101961905A (en) * | 2010-10-27 | 2011-02-02 | 昆山成功模具塑件有限公司 | Injection molding machine with cavity superficial instant-heating mechanism of injection mold |
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| CN206839130U (en) * | 2017-04-02 | 2018-01-05 | 盐城市德邦机械制造有限公司 | A kind of casting mould quickly cooling device |
| CN107877809A (en) * | 2017-11-23 | 2018-04-06 | 科成精密模塑科技无锡有限公司 | The injection mold system of intelligent thermoregulating |
| CN208993018U (en) * | 2018-09-21 | 2019-06-18 | 深圳市创信力合科技有限公司 | A kind of injection mold |
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2018
- 2018-09-21 CN CN201811108013.5A patent/CN108973057A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101444952A (en) * | 2007-11-27 | 2009-06-03 | 北京中拓机械有限责任公司 | Device for rapid controlling the temperature variation of an injection mold and a control method thereof |
| CN101733914A (en) * | 2008-11-12 | 2010-06-16 | 汉达精密电子(昆山)有限公司 | Fast heating and cooling forming system and forming die thereof |
| CN101961905A (en) * | 2010-10-27 | 2011-02-02 | 昆山成功模具塑件有限公司 | Injection molding machine with cavity superficial instant-heating mechanism of injection mold |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114074406A (en) * | 2020-08-18 | 2022-02-22 | 苏州亮福电器有限公司 | Highlight injection mold adopting electric heating mode |
| CN114074406B (en) * | 2020-08-18 | 2024-02-27 | 苏州亮福电器有限公司 | High-gloss injection mold adopting electric heating mode |
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