CN108962883A - Upside-down mounting Micro-LED intelligent automotive light chip, preparation method and application - Google Patents
Upside-down mounting Micro-LED intelligent automotive light chip, preparation method and application Download PDFInfo
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- CN108962883A CN108962883A CN201810930801.6A CN201810930801A CN108962883A CN 108962883 A CN108962883 A CN 108962883A CN 201810930801 A CN201810930801 A CN 201810930801A CN 108962883 A CN108962883 A CN 108962883A
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- Prior art keywords
- upside
- down mounting
- led
- micro
- mounting micro
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/60—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by a variable light distribution
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
- F21W2102/10—Arrangement or contour of the emitted light
- F21W2102/13—Arrangement or contour of the emitted light for high-beam region or low-beam region
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The present invention relates to a kind of upside-down mounting Micro-LED intelligent automotive light chips, it include: Micro-LED layers of substrate, upside-down mounting, the upside-down mounting Micro-LED luminescent layer is bonded on the substrate, and the upside-down mounting Micro-LED luminescent layer includes multiple upside-down mounting Micro-LED luminescent grains.The chip realizes the industrialization of intelligent, information-based car light chip with better simply structure type by the way that multiple upside-down mounting Micro-LED luminescent grains are bonded on substrate.The present invention also provides a kind of upside-down mounting Micro-LED intelligent automotive light chip manufacture methods.The present invention provides a kind of application of upside-down mounting Micro-LED intelligent automotive light chip again.
Description
Technical field
The invention belongs to technical field of semiconductor luminescence, and in particular to a kind of LED upside-down mounting Micro-LED intelligent automotive light
Chip, preparation method and application.
Background technique
Car light mainly has illumination and signal identification function, and automotive lighting is initially using incandescent lamp as light source, but due to it
It is unstable, brightness is low, and tungsten steam condensation will lead to lamp wall blackening brightness decline, be not suitable for for a long time use.It comes into being
Halogen lamp and xenon lamp are due to the two-stage conversion of electric energy to luminous energy, and there are biggish energy losses.As energy-saving and emission-reduction, science are shone
Bright, green illumination policy requirements, LED illumination gradually move towards scientific and intelligent in the mighty torrent of history.
LED (Lighting Emitting Diode) is a kind of solid-state semiconductor device, it can directly be converted electrical energy into
Luminous energy.Micro-LED is miniatureization and matrixing of LED, i.e., high density microsize LED array is integrated on chip.With
The continuous development and maturation of micro-nano technology and semiconductor process technique, so that the development of Micro-LED and research have new dash forward
It is broken.Micro-LED array device has that Pixel Dimensions are small, flexible structure is compact, high resolution, period are controllable, fast response time
Many advantages, such as, such that it is applied to vehicle signal and illuminator lamp.Currently the most important ones project is how to optimize
The chip structure of Micro-LED and its production technique of application layer, to realize that it is widely applied in car light field.
Summary of the invention
Aiming at the problems existing in the prior art, the present invention provides a kind of upside-down mounting Micro-LED intelligent automotive light chip, will be by
The upside-down mounting Micro-LED luminescent layer that multiple upside-down mounting Micro-LED luminescent grains are formed is bonded on substrate, with better simply structure
Form realizes the industrialization of intelligent, information-based car light chip.
A kind of the technical solution adopted by the present invention: upside-down mounting Micro-LED intelligent automotive light chip, comprising: substrate, upside-down mounting
Micro-LED luminescent layer, the upside-down mounting Micro-LED luminescent layer are bonded on the substrate, and the upside-down mounting Micro-LED shines
Layer includes multiple upside-down mounting Micro-LED luminescent grains.
The present invention also provides a kind of production methods of upside-down mounting Micro-LED intelligent automotive light chip: by multiple upside-down mounting Micro-
LED luminescent grain batch is transferred on the substrate, so that the upside-down mounting that multiple upside-down mounting Micro-LED luminescent grains are formed
Micro-LED luminescent layer is bonded on the substrate.
Invention further provides a kind of applications of upside-down mounting Micro-LED intelligent automotive light chip, by above-mentioned upside-down mounting Micro-
LED intelligent automotive light chip applies in auxiliary driving, specifically: by the luminous point in the upside-down mounting Micro-LED luminescent layer point
It is not connected with IC driving circuit, the IC driving circuit is individually realized each upside-down mounting Micro-LED luminous point and driven, so that institute
Upside-down mounting Micro-LED intelligent automotive light chip is stated according to different road conditions rows into compartmentalization illumination and/or road instruction image.It drives
In the process, it when two vehicle of night is met, controls upside-down mounting Micro-LED intelligent automotive light chip and carries out compartmentalization illumination, i.e., only illuminate
Its vehicle front visual field prevents from leading to blurred vision on big brightness light-illuminating to the vehicle drivers of adjacent lane；When being filled on vehicle
When having navigation system, upside-down mounting Micro-LED intelligent automotive light chip is associated with navigation system realization, is constantly shown in navigation system
The indication road sign image of prompt；The traffic information that can also be prompted according to sensor in navigation system or vehicle, constantly display is current
Road conditions image.Since each upside-down mounting Micro-LED luminous point can be opened and closed individually, make automobile-used light source information,
Intelligence gives bidirectional information to prompt driver and other traffic participants, generates the effect of " as being given birth to by core ", allows car light
More personalized, humanistic care and safety.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of upside-down mounting Micro-LED intelligent automotive light chip provided by the invention；
Fig. 2 is the structural schematic diagram for the single upside-down mounting Micro-LED luminous point that Pixel Dimensions are a μm of * a μm；
Fig. 3 is production method one using single upside-down mounting Micro-LED luminous point as a upside-down mounting Micro-LED luminescent grain
The upside-down mounting Micro-LED luminescent layer formed with N*N array is bonded to the process schematic representation of correspondingly-sized substrate；
Fig. 4 is the process schematic representation of production method two, wherein the upside-down mounting Micro- that it is a μm of * a μm by Pixel Dimensions that (a), which is,
LED luminous point is bonded to the technique signal of correspondingly-sized substrate with the upside-down mounting Micro-LED luminescent grain that m*m array is formed
Figure (b) is that will scheme the upside-down mounting Micro-LED luminescent layer key that the upside-down mounting Micro-LED luminescent grain in (a) is formed with n*n array
Close the process schematic representation of correspondingly-sized substrate；
Fig. 5 is that a kind of upside-down mounting Micro-LED intelligent automotive light chip provided by the invention forms instruction road in auxiliary drives
Target schematic diagram.
Specific embodiment
The principles and features of the present invention are described below, and the given examples are served only to explain the present invention, is not intended to limit
Determine the scope of the present invention.
As shown in Figure 1, the present invention provides a kind of upside-down mounting Micro-LED intelligent automotive light chip, comprising: substrate 4, upside-down mounting
Micro-LED luminescent layer 1, the substrate 1 are equipped with multiple upside-down mounting Micro-LED luminescent grains, the upside-down mounting Micro-LED hair
Photosphere 1 is bonded on the substrate 4.
The upside-down mounting Micro-LED luminescent grain can there are many form, one form of them are as follows: the upside-down mounting Micro-
LED luminescent grain is single upside-down mounting Micro-LED luminous point 5, is needed when the luminescent grain of this form is transferred on substrate logical
Cross flood tide shifting process；Another form are as follows: the upside-down mounting Micro-LED luminescent grain is to be sent out by multiple upside-down mounting Micro-LED
The dot matrix group that array of light spots formula is constituted, can substantially reduce transfer number when the luminescent grain of this form is transferred on substrate, solve
The problem of flood tide of having determined shifts, greatlies simplify the tedious steps of bonding and encapsulation.
Further, the single upside-down mounting Micro-LED luminescent grain successively includes sapphire or transparent lining from top to down
Bottom, III-V group-III nitride (such as AlN, GaN, InN and its alloy AlGaSe, AlGaInP, AlInGaN etc.), current extending,
Reflecting layer and metal connecting layer.The upside-down mounting Micro-LED luminescent grain (hereinafter referred to as luminescent grain) is set to the substrate (such as
Ceramic substrate, metal substrate, silicon substrate etc.) above, the metal connecting layer of luminescent grain passes through on P, N metal electrode 2 and substrate
Pad point 3 be bonded by gold-tin alloy or the modes such as tin cream Reflow Soldering or elargol.,
Further, insulating layer 6 is added between upside-down mounting Micro-LED luminescent layer 1 and substrate 4, which can
Think adhesive, epoxy resin, silica gel etc., the setting of the insulating layer can be improved the reliability of chip, prevent short circuit or electric leakage.
5 in Fig. 1 be the schematic diagram of single upside-down mounting Micro-LED luminous point, and each luminous point includes the pole P, a N
Pole, each luminescent grain can also may include multiple upside-down mounting Micro-LED hairs with only one upside-down mounting Micro-LED luminous point
Luminous point.The sectional view of single upside-down mounting Micro-LED luminous point is shown in Fig. 2, wherein 1 is upside-down mounting Micro-LED luminous point
Isolation boundary, 2a indicate the pole N of the luminous point, and 2b indicates the pole P of the luminous point, 3a indicate on luminous point with substrate its
In the region that matches of a Pad point, 3b indicates the region to match on luminous point with another Pad point of substrate.
The present invention also provides a kind of production method of upside-down mounting Micro-LED intelligent automotive light chip, specifically: by multiple upside-down mountings
Micro-LED luminescent grain is successively bonded on substrate.
Above-mentioned production method is divided into two schemes.Scheme one: as shown in figure 3, directly by Pixel Dimensions be a μm of * a μm can
Independently luminous upside-down mounting Micro-LED luminous point is singly shifted as a upside-down mounting Micro-LED luminescent grain with shape
At the array of N*N.The program needs that flood tide luminescent grain is transferred to base by the modes such as mechanical arm or electrostatic force absorption
On plate, the upside-down mounting Micro-LED crystal grain and the substrate bondings side such as are bonded by gold-tin alloy, tin cream Reflow Soldering or elargol
Formula interconnection when transfer, needs to correspond the pole P, N in Fig. 2 on upside-down mounting Micro-LED luminous point and the Pad point on substrate,
Wherein 1 be upside-down mounting Micro-LED luminous point isolation boundary, 2a indicates the pole N of the luminous point, and 2b indicates the luminous point
The pole P, 3a indicate the region to match on luminous point with one of Pad point of substrate, and 3b indicates another with substrate on luminous point
The region that one Pad point matches；Scheme two: as shown in figure 4, by the upside-down mounting Micro-LED luminous point grown on wafer with
It is that unit is cut by the m*m array dot matrix group that the upside-down mounting Micro-LED luminous point that multiple Pixel Dimensions are a μm of * a μm is formed
To form single upside-down mounting Micro-LED luminescent grain, a m*m array dot matrix group is then once shifted, it is final to obtain n*n's
Array.Due to the upside-down mounting Micro- for being a μm of * a μm including Pixel Dimensions in upside-down mounting Micro-LED luminescent grain each in the program
The m*m array dot matrix group that LED luminous point is formed considerably reduces the number of crystal grain transfer, solves the luminous crystalline substance of Micro-LED
The problem of the flood tide transfer of grain, greatlies simplify the tedious steps of bonding and encapsulation.
A kind of upside-down mounting Micro-LED intelligent automotive light chip provided by the invention, wherein including large number of Micro-LED
The power and light emission luminance of chip can be enhanced after realizing series connection between each independent luminous point in luminous point, passes through IC driving electricity
The informationization and intelligence of car light may be implemented in individually control is realized on road to each luminous point.By the upside-down mounting Micro-LED
Intelligent automotive light chip apply to auxiliary drive in, specifically: by the luminous point in the upside-down mounting Micro-LED luminescent layer respectively with
IC driving circuit be connected, the IC driving circuit individually to each upside-down mounting Micro-LED luminous point realize drive so that it is described fall
Micro-LED intelligent automotive light chip is filled according to different road conditions rows into compartmentalization illumination and/or road instruction image.Such as Fig. 5 institute
Show, upside-down mounting Micro-LED intelligent automotive light chip can realization navigation icon associated with navigation system show, as ADAS navigate
System can constantly show the indication road sign image prompted in navigation system on road surface, and this indication road sign image is than existing
Navigation system in icon seem to be more convenient, be more intuitive, more intelligent.
The upside-down mounting Micro-LED intelligent automotive light chip can be also used for compartmentalization illumination, specifically: in driving procedure,
When two vehicle of night is met, controls upside-down mounting Micro-LED intelligent automotive light chip and carry out compartmentalization illumination, i.e., before only illuminating its vehicle
The square visual field prevents from leading to blurred vision on big brightness light-illuminating to the vehicle drivers of adjacent lane.
The upside-down mounting Micro-LED intelligent automotive light chip can be with the current road conditions of intelligent display, can be according to navigation system
Or the traffic information that sensor prompts on vehicle, the current road conditions image of real-time display, such as front are a hole just display holes
Image is that clivia just shows clivia image, has barrier just to show the image of barrier.
In addition to this, upside-down mounting Micro-LED intelligent automotive light chip be also used in communication, display, medical treatment, biology, military affairs,
The numerous areas such as detection.
The foregoing is merely a prefered embodiment of the invention, is not intended to limit the invention, all in the spirit and principles in the present invention
Within, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of upside-down mounting Micro-LED intelligent automotive light chip characterized by comprising substrate, upside-down mounting Micro-LED luminescent layer,
The upside-down mounting Micro-LED luminescent layer is bonded on the substrate, and the upside-down mounting Micro-LED luminescent layer includes multiple upside-down mountings
Micro-LED luminescent grain.
2. upside-down mounting Micro-LED intelligent automotive light chip as described in claim 1, it is characterised in that: the upside-down mounting Micro-LED
Luminescent grain is single upside-down mounting Micro-LED luminous point.
3. upside-down mounting Micro-LED intelligent automotive light chip as described in claim 1, it is characterised in that: the upside-down mounting Micro-LED
Luminescent grain is the dot matrix group being made of multiple upside-down mounting Micro-LED luminous points.
4. upside-down mounting Micro-LED intelligent automotive light chip as claimed in claim 2 or claim 3, it is characterised in that: the upside-down mounting Micro-
LED luminescent grain successively include from top to down sapphire or transparent substrates, III-V group-III nitride, current extending, reflecting layer and
Metal connecting layer, the P of the metal connecting layer, N electrode are corresponded with the Pad point on the substrate.
5. upside-down mounting Micro-LED intelligent automotive light chip as claimed in claim 4, it is characterised in that: the upside-down mounting Micro-LED
Insulating layer is equipped between luminescent layer and substrate.
6. a kind of production method of upside-down mounting Micro-LED intelligent automotive light chip, it is characterised in that: by multiple upside-down mounting Micro-LED
Luminescent grain batch is transferred on the substrate, so that the upside-down mounting that multiple upside-down mounting Micro-LED luminescent grains are formed
Micro-LED luminescent layer is bonded on the substrate.
7. the production method of upside-down mounting Micro-LED intelligent automotive light chip as claimed in claim 6, it is characterised in that: it is described fall
The production method for filling Micro-LED luminescent grain are as follows: cut down the upside-down mounting Micro-LED point grown on wafer one by one
Form single upside-down mounting Micro-LED luminescent grain.
8. the production method of upside-down mounting Micro-LED intelligent automotive light chip as claimed in claim 6, it is characterised in that: it is described fall
Fill Micro-LED luminescent grain production method are as follows: by the upside-down mounting Micro-LED luminous point grown on wafer with by it is multiple
The dot matrix group that dress Micro-LED luminous point is formed is that unit carries out being cut to single upside-down mounting Micro-LED luminescent grain.
9. such as the described in any item LED chips of claim 6-8, it is characterised in that: the bonding method particularly includes: will be described
The P of metal connecting layer on upside-down mounting Micro-LED luminescent grain, N electrode and the Pad of substrate point in a manner of being bonded one by one
It is corresponding.
10. a kind of application of upside-down mounting Micro-LED intelligent automotive light chip, it is characterised in that: will be any in the claim 2-5
Upside-down mounting Micro-LED intelligent automotive light chip described in applies in auxiliary driving, specifically: by the upside-down mounting Micro-LED
Luminous point in luminescent layer is connected with IC driving circuit respectively, and the IC driving circuit individually sends out each upside-down mounting Micro-LED
Luminous point realize driving so that the upside-down mounting Micro-LED intelligent automotive light chip according to different road conditions rows at compartmentalization illumination and/
Or road instruction image.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810930801.6A CN108962883A (en) | 2018-08-15 | 2018-08-15 | Upside-down mounting Micro-LED intelligent automotive light chip, preparation method and application |
| CN201921270962.3U CN210778583U (en) | 2018-08-15 | 2019-08-07 | Flip-chip Micro-LED intelligence car light chip and intelligent car light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810930801.6A CN108962883A (en) | 2018-08-15 | 2018-08-15 | Upside-down mounting Micro-LED intelligent automotive light chip, preparation method and application |
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| Publication Number | Publication Date |
|---|---|
| CN108962883A true CN108962883A (en) | 2018-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810930801.6A Pending CN108962883A (en) | 2018-08-15 | 2018-08-15 | Upside-down mounting Micro-LED intelligent automotive light chip, preparation method and application |
| CN201921270962.3U Active CN210778583U (en) | 2018-08-15 | 2019-08-07 | Flip-chip Micro-LED intelligence car light chip and intelligent car light |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921270962.3U Active CN210778583U (en) | 2018-08-15 | 2019-08-07 | Flip-chip Micro-LED intelligence car light chip and intelligent car light |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109448574A (en) * | 2018-12-28 | 2019-03-08 | 苏州椒图电子有限公司 | A kind of display device and its manufacturing method |
| CN111438444A (en) * | 2018-12-28 | 2020-07-24 | 北京北科天绘科技有限公司 | Laser cutting method and system based on device array mass transfer |
| WO2022157644A1 (en) * | 2021-01-22 | 2022-07-28 | Jade Bird Display (shanghai) Limited | Slicing micro-led wafer and slicing micro-led chip |
-
2018
- 2018-08-15 CN CN201810930801.6A patent/CN108962883A/en active Pending
-
2019
- 2019-08-07 CN CN201921270962.3U patent/CN210778583U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109448574A (en) * | 2018-12-28 | 2019-03-08 | 苏州椒图电子有限公司 | A kind of display device and its manufacturing method |
| CN111438444A (en) * | 2018-12-28 | 2020-07-24 | 北京北科天绘科技有限公司 | Laser cutting method and system based on device array mass transfer |
| WO2022157644A1 (en) * | 2021-01-22 | 2022-07-28 | Jade Bird Display (shanghai) Limited | Slicing micro-led wafer and slicing micro-led chip |
| US11735573B2 (en) | 2021-01-22 | 2023-08-22 | Jade Bird Display (shanghai) Limited | Slicing micro-LED wafer and slicing micro-LED chip |
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| Publication number | Publication date |
|---|---|
| CN210778583U (en) | 2020-06-16 |
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Application publication date: 20181207 |