CN108961388A - Microstructure three-dimensional modeling method, device, equipment and computer storage medium - Google Patents
Microstructure three-dimensional modeling method, device, equipment and computer storage medium Download PDFInfo
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Abstract
The invention discloses a kind of microstructure three-dimensional modeling method, device, equipment and computer storage mediums, a kind of microstructure three-dimensional modeling includes: to scan the number of plies according to the microstructure to material to be observed, determines material microstructure threedimensional model cell node information to be observed；The scanning error of every layer of microstructure scan data is determined according to the sweep parameter of every layer of microstructure of scanning；According to the scanning error of cell node information and every layer of microstructure scan data, the revised cell node information of material to be observed is generated；According to the marked region of material to be observed, multilayer microstructure scan data corresponding with marked region is selected；According to marked region, the boundary condition information of marked region is generated；The corresponding multilayer microstructure scan data of marked region is handled according to revised cell node information, the boundary condition information of marked region, obtains the threedimensional model of material microstructure to be observed.The present invention can establish the threedimensional model of microstructure scanning.
Description
Technical field
The present embodiments relate to computer technology more particularly to a kind of microstructure three-dimensional modeling methods, device, equipment
And computer storage medium.
Background technique
Make rapid progress today of development in science and technology, to the performance of material, more stringent requirements are proposed, it is therefore desirable to right
Material internal heterogeneous microstructure is more apparent from.The actual effect of current most of engineerings or mechanical structure is all due to it
Caused by the understanding of material property is insufficient.But most of materials are all nontransparent, it is desirable to directly observe its interior microscopic tissue
Structure is less likely, although the form of the microstructure of some materials can be observed directly, Observational depth is extremely limited, differentiates
Rate is also very low.
The observation method to microstructure is currently existed, but current observation method is only capable of to material
Heterogeneous microstructure carries out two-dimensional observation, but the two dimensional image limitation that two-dimensional observation obtains is too big, cannot sufficiently reflect in it
Institutional framework is surrounded and watched in portion's organizational information, the inside that still can not have a clear understanding of material.
Summary of the invention
The present invention provides a kind of microstructure three-dimensional modeling method, device, equipment and computer storage medium, for establishing
The threedimensional model of microstructure scanning.
In a first aspect, the embodiment of the present invention provides a kind of microstructure three-dimensional modeling method, comprising:
The number of plies is scanned according to the microstructure to material to be observed, determines the material microstructure threedimensional model to be observed
Cell node information；
The scanning error of every layer of microstructure scan data is determined according to the sweep parameter of every layer of microstructure of scanning；
According to the scanning error of the cell node information and every layer of microstructure scan data, the material to be observed is generated
Expect revised cell node information；
According to the marked region of the material to be observed, multilayer microstructure scanning corresponding with the marked region is selected
Data；
According to the marked region, the boundary condition information of the marked region is generated；
According to the revised cell node information, the boundary condition information of the marked region to the marked region
Corresponding multilayer microstructure scan data is handled, and the threedimensional model of the material microstructure to be observed is obtained.
In a kind of possible implementation of first aspect, the sweep parameter according to every layer of microstructure of scanning is determined
The scanning error of every layer of microstructure scan data, comprising:
Euler's angle information of every layer of microstructure scan data is determined according to the sweep parameter of every layer of microstructure of scanning；
The scanning error according to the cell node information and every layer of microstructure scan data generates described wait see
It measures and monitor the growth of standing timber and expects revised cell node information, comprising:
Layer unit every in the cell node information is carried out according to Euler's angle information of every layer of microstructure scan data
Coordinate transform generates the revised cell node information of material to be observed.
In a kind of possible implementation of first aspect, the marked region according to the material to be observed, selection
Multilayer microstructure scan data corresponding with the marked region, comprising:
Obtain the marked region in the material any layer to be observed；
Select in the material multilayer microstructure scan data to be observed, in every layer of microstructure scan data with it is described
The corresponding scan data of marked region.
In a kind of possible implementation of first aspect, it is described according to the revised cell node information, it is described
The boundary condition information of marked region handles the corresponding multilayer microstructure scan data of the marked region, obtains institute
State the threedimensional model of material microstructure to be observed, comprising:
According to the revised cell node information to the corresponding multilayer microstructure scan data of the marked region
It is modified, obtains the corresponding revised multilayer microstructure scan data of the marked region；
According to the boundary condition information of the marked region revised microcosmic knot of multilayer corresponding to the marked region
Borderline region data in structure scan data are modified, and obtain the corresponding final multilayer microstructure scanning of the marked region
Data；
Using the corresponding final multilayer microstructure scan data of the marked region as the microcosmic knot of material to be observed
The threedimensional model of structure.
Second aspect, the embodiment of the present invention provide a kind of microstructure three-dimensional modeling apparatus, comprising:
Cell node generation module determines described wait see for scanning the number of plies according to the microstructure to material to be observed
Survey material microstructure threedimensional model cell node information；
Error determination module is scanned, for determining that every layer of microstructure is swept according to the sweep parameter of every layer of microstructure of scanning
Retouch the scanning error of data；
Cell node correction module, for the scanning according to the cell node information and every layer of microstructure scan data
Error generates the revised cell node information of material to be observed；
Marked region selecting module, for the marked region according to the material to be observed, selection and the marked region
Corresponding multilayer microstructure scan data；
Boundary condition generation module, for generating the boundary condition information of the marked region according to the marked region；
Threedimensional model generation module, for the boundary according to the revised cell node information, the marked region
Conditional information handles the corresponding multilayer microstructure scan data of the marked region, and it is micro- to obtain the material to be observed
See the threedimensional model of structure.
In a kind of possible implementation of second aspect, the scanning error determination module is specifically used for according to scanning
The sweep parameter of every layer of microstructure determines Euler's angle information of every layer of microstructure scan data；
The cell node correction module, specifically for according to Euler's angle information of every layer of microstructure scan data to institute
It states every layer unit in cell node information to be coordinately transformed, generates the revised cell node information of material to be observed.
In a kind of possible implementation of second aspect, the marked region selecting module is specifically used for obtaining in institute
State the marked region in material any layer to be observed；It selects in the material multilayer microstructure scan data to be observed, every layer
Scan data corresponding with the marked region in microstructure scan data.
In a kind of possible implementation of second aspect, the threedimensional model generation module is specifically used for according to
Revised cell node information is modified the corresponding multilayer microstructure scan data of the marked region, obtains described
The corresponding revised multilayer microstructure scan data of marked region；According to the boundary condition information of the marked region to institute
The borderline region data stated in the corresponding revised multilayer microstructure scan data of marked region are modified, and are obtained described
The corresponding final multilayer microstructure scan data of marked region；The corresponding final multilayer microstructure of the marked region is swept
Retouch threedimensional model of the data as the material microstructure to be observed.
The third aspect, the embodiment of the present invention provide a kind of microstructure three-dimensional modeling equipment, comprising:
One or more processors；
Storage device, for storing one or more programs,
When one or more programs are executed by one or more processors, so that one or more processors realize such as first
The microstructure three-dimensional modeling method of any implementation of aspect.
Fourth aspect, the embodiment of the present invention provide a kind of computer readable storage medium, are stored thereon with computer program,
The microstructure three-dimensional modeling method such as any implementation of first aspect is realized when the program is executed by processor.
Microstructure three-dimensional modeling method, device, equipment and computer storage medium provided in an embodiment of the present invention, pass through
The number of plies is scanned according to the microstructure to material to be observed, determines the material microstructure threedimensional model cell node to be observed
Information determines the scanning error of every layer of microstructure scan data according to the sweep parameter of every layer of microstructure of scanning, according to institute
The scanning error of cell node information and every layer of microstructure scan data is stated, the revised unit of material to be observed is generated
Nodal information selects multilayer microstructure corresponding with the marked region to sweep according to the marked region of the material to be observed
Data are retouched, according to the marked region, generate the boundary condition information of the marked region, according to the revised unit section
Point information, the boundary condition information of the marked region carry out the corresponding multilayer microstructure scan data of the marked region
Processing, finally obtains the threedimensional model of the material microstructure to be observed, to realize to material microstructure to be observed
Three-dimensional modeling.
Detailed description of the invention
Fig. 1 is the flow chart of microstructure three-dimensional modeling method embodiment one provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of session information managing device embodiment one provided in an embodiment of the present invention；
Fig. 3 is a kind of structural schematic diagram of microstructure three-dimensional modeling equipment provided in an embodiment of the present invention.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
Fig. 1 is the flow chart of microstructure three-dimensional modeling method embodiment one provided in an embodiment of the present invention, such as Fig. 1 institute
Show, method provided in this embodiment includes:
Step S101 scans the number of plies according to the microstructure to material to be observed, determines the microcosmic knot of material to be observed
Structure threedimensional model cell node information.
Microstructure three-dimensional modeling method provided in an embodiment of the present invention is applied to carry out the microstructure of any materials
Modeling.At present for the modeling of material microstructure, it is all based on to the progress of the scan data of material microstructure, and due to
The internal microstructure of material is sightless, therefore can only be in the two dimension of material for the scanning of the internal microstructure of material
It is carried out in plane.Currently used material internal microstructure scanning is using full name electron backscatter diffraction (Electron
Backscattered Diffraction, EBSD) method, EBSD's is mainly characterized by the normal of reservation scanning electron microscope
The diffraction of spatial resolution submicron order is carried out while rule feature.By the scanning of EBSD, available material internal two dimension
Microstructure data in plane.
But since scanned material is three-dimensional, even if obtaining the microstructure number of the multiple two-dimensional surfaces of material internal
According to still can not intuitively knowing the microstructure of material internal.Therefore a kind of three-dimensional of microstructure is present embodiments provided
Modeling method obtains the threedimensional model of material internal microstructure by a series of processing, so as to intuitively know material
Microstructure inside material.Firstly, it is necessary to by method that any pair of material internal microstructure is scanned to be observed
The internal microstructure of material is scanned, and this method can be and any can be scanned to material internal microstructure
Method, such as EBSD.The threedimensional model of material internal microstructure to be observed in order to obtain, needs the inside to material to be observed
Microstructure carries out the scanning of multilayer, and the number of plies of scanning is more, and the granularity of scanning is about thin, then the threedimensional model obtained is about accurate.
After obtaining the microstructure scan data of material to be observed, it is first determined the microstructure of material to be observed scans
The number of plies, and material microstructure threedimensional model cell node information to be observed is determined according to the number of plies.The microcosmic knot of material to be observed
Structure threedimensional model cell node information is for characterizing the every layer data feature for forming material microstructure threedimensional model to be observed
Information, wherein include the correlated characteristic of every layer data in cell node information.
Step S102 determines the scanning of every layer of microstructure scan data according to the sweep parameter of every layer of microstructure of scanning
Error.
When the microstructure to material to be observed is scanned, since the position of material to be observed is usually fixed
, scan used microscope or other image-forming components and scanned each layer of the relative positional relationship of material to be observed all
Be different, therefore, to the data that every layer of microstructure of material to be observed is scanned be not under the same conditions into
Capable.It that is is the presence of scanning error between every layer of microstructure scan data of material to be observed.And it if desired will be to
Each layer microstructure scan data of observation material synthesizes the internal microstructure threedimensional model of material to be observed, it is necessary to disappear
Except the error.When being scanned to every layer of microstructure of material to be observed, between each layer and image-forming component of material to be observed
Relative positional relationship can be recorded, can use the relative positional relationship, determine every layer of microstructure scan data
Scanning error.The scanning error of every layer of microstructure scan data is an opposite error, when determining scanning error, is needed
To determine that other each microcosmic scan datas of layer are swept with as the microcosmic of reference data using one layer of microcosmic scan data as reference data
Retouch the error between data, for example, by using material first layer to be observed microstructure scan data as reference data.In addition to
Other than above-mentioned relative positional relationship, other sweep parameters when being scanned to material to be observed can also be utilized to determine every
The scanning error of layer microstructure scan data.
Step S103 generates institute according to the scanning error of the cell node information and every layer of microstructure scan data
State the revised cell node information of material to be observed.
After the scanning error that every layer of microstructure scan data has been determined, need to unit obtained in step S101
Nodal information is modified.Due to being scanned with the microstructure as reference data for every layer of microstructure scan data
The error of data is all identical, therefore can be directly modified to cell node information after scanning error has been determined.It is single
First nodal information is the information for every layer data feature that characterization forms material microstructure threedimensional model to be observed, then being equivalent to
The every layer data feature for forming material microstructure threedimensional model to be observed is corrected.
It should be noted that the scanning error of every layer of microstructure scan data can carry out table using arbitrary data
Show, such as Euler's angle information of every layer of microstructure scan data.Eulerian angles are 3 for determining Fixed-point Motion of A rigid body position
One group of independence angle parameter is made of nutational angle θ, angle of precession (i.e. angle of precession) ψ and angle of rotation j.It is scanned by each layer microstructure
Euler's angle information of data can determine the error between each layer microstructure scan data.It is swept obtaining every layer of microstructure
After the Euler's angle information for retouching data, according to Euler's angle information of every layer of microstructure scan data to every layer in cell node information
Unit is coordinately transformed, that is, produces the revised cell node information of material to be observed.
Step S104 selects multilayer corresponding with the marked region micro- according to the marked region of the material to be observed
See structural scan data.
When carrying out three-dimensional modeling to material to be observed, generally certain region will be selected to be modeled, which can
To be the random areas on material to be observed, it is also possible to the specific region of user's selection, which is according to material to be observed
What the different observation requirements of material determined.Such as need to detect certain a batch of material property, then can be to be observed
A random areas is chosen on material, then for example the material property of a certain fault element is detected, so that it may in material to be observed
Specific stress area is chosen on material or by temperature area.The observation area that user is selected on material to be observed is as mark zone
Domain.When the microstructure to material to be observed is scanned, what is obtained is all areas that image-forming component can scan
Data, therefore after the marked region that material to be observed has been determined, the corresponding multilayer microstructure in choosing marker region is swept
Retouch data.Wherein, marked region be a three-dimensional region, the corresponding multilayer microstructure scan data in selected marker region,
The actually corresponding each layer microstructure scan data in selected marker region.
Specifically, corresponding with the marked region multilayer microstructure scan data of selection can be obtain it is described to
The marked region in material any layer is observed, is then selected in the material multilayer microstructure scan data to be observed, every layer
Scan data corresponding with the marked region in microstructure scan data.
Step S105 generates the boundary condition information of the marked region according to the marked region.
After the marked region on material to be observed has been determined, it is also necessary to determine the boundary condition information of marked region.Side
Boundary's conditional information is in order to avoid the data on marked region boundary generate mutation, it is ensured that the threedimensional model sharpness of border of generation.
Step S106, according to the revised cell node information, the boundary condition information of the marked region to institute
It states the corresponding multilayer microstructure scan data of marked region to be handled, obtains the three-dimensional of the material microstructure to be observed
Model.
It, can be to mark zone after having obtained the boundary condition information of revised cell node information and marked region
The corresponding multilayer microstructure scan data in domain is handled, to obtain the threedimensional model of material microstructure to be observed.It repairs
In cell node information after just, each unit node characterizes the revised feature of each layer microstructure scan data, to repair
The feature of each node in cell node information after just each layer microstructure scan data corresponding to marked region is repaired
Positive processing, and the data boundary of each layer marked region is handled using the boundary condition information of marked region, it can be obtained
The corresponding final multilayer microstructure scan data of marked region, the data are the three-dimensional mould of material microstructure to be observed
Type.The corresponding final multilayer microstructure scan data of the marked region is inputted into specific PaintShop or program,
The three-dimensional graphical model of material microstructure to be observed can be obtained, so as to make user be visually observed that material to be observed
Three-dimensional microstructures.
Microstructure three-dimensional modeling method provided in an embodiment of the present invention, by according to the microstructure to material to be observed
The number of plies is scanned, determines the material microstructure threedimensional model cell node information to be observed, according to every layer of microstructure of scanning
Sweep parameter determine the scanning error of every layer of microstructure scan data, according to the cell node information and every layer of microcosmic knot
The scanning error of structure scan data generates the revised cell node information of material to be observed, according to the material to be observed
The marked region of material selects multilayer microstructure scan data corresponding with the marked region, raw according to the marked region
At the boundary condition information of the marked region, according to the revised cell node information, the boundary of the marked region
Conditional information handles the corresponding multilayer microstructure scan data of the marked region, finally obtains the material to be observed
The threedimensional model for expecting microstructure, to realize the three-dimensional modeling to material microstructure to be observed.
Fig. 2 is the structural schematic diagram of session information managing device embodiment one provided in an embodiment of the present invention, such as Fig. 2 institute
Show, session management device provided in this embodiment includes:
Cell node generation module 21, for scanning the number of plies according to the microstructure of material to be observed, determine it is described to
Observe material microstructure threedimensional model cell node information.
Error determination module 22 is scanned, for determining every layer of microstructure according to the sweep parameter of every layer of microstructure of scanning
The scanning error of scan data.
Cell node correction module 23, for sweeping according to the cell node information and every layer of microstructure scan data
Error is retouched, the revised cell node information of material to be observed is generated.
Marked region selecting module 24, for the marked region according to the material to be observed, selection and the mark zone
The corresponding multilayer microstructure scan data in domain.
Boundary condition generation module 25, for generating the boundary condition letter of the marked region according to the marked region
Breath.
Threedimensional model generation module 26, for the side according to the revised cell node information, the marked region
Boundary's conditional information handles the corresponding multilayer microstructure scan data of the marked region, obtains the material to be observed
The threedimensional model of microstructure.
Microstructure three-dimensional modeling apparatus provided in this embodiment is for realizing microstructure three-dimensional modeling side shown in FIG. 1
Method, it is similar that the realization principle and technical effect are similar, and details are not described herein again.
Further, on the basis of embodiment shown in Fig. 2, error determination module 22 is scanned, is specifically used for according to scanning
The sweep parameter of every layer of microstructure determines Euler's angle information of every layer of microstructure scan data；Cell node correction module
23, specifically for according to Euler's angle information of every layer of microstructure scan data to every layer unit in the cell node information into
Row coordinate transform generates the revised cell node information of material to be observed.
Further, on the basis of embodiment shown in Fig. 2, marked region selecting module 24 is specifically used for obtaining in institute
State the marked region in material any layer to be observed；It selects in the material multilayer microstructure scan data to be observed, every layer
Scan data corresponding with the marked region in microstructure scan data.
Further, on the basis of embodiment shown in Fig. 2, threedimensional model generation module 26 is specifically used for according to
Revised cell node information is modified the corresponding multilayer microstructure scan data of the marked region, obtains described
The corresponding revised multilayer microstructure scan data of marked region；According to the boundary condition information of the marked region to institute
The borderline region data stated in the corresponding revised multilayer microstructure scan data of marked region are modified, and are obtained described
The corresponding final multilayer microstructure scan data of marked region；The corresponding final multilayer microstructure of the marked region is swept
Retouch threedimensional model of the data as the material microstructure to be observed.
Fig. 3 is a kind of structural schematic diagram of microstructure three-dimensional modeling equipment provided in an embodiment of the present invention, such as Fig. 3 institute
Show, which includes processor 31, memory 32；Processor 31 in microstructure three-dimensional modeling equipment
Quantity can be one or more, in Fig. 3 by taking a processor 31 as an example；Processor in microstructure three-dimensional modeling equipment
31, memory 32 can be connected by bus or other modes, in Fig. 3 for being connected by bus.
Memory 32 is used as a kind of computer readable storage medium, can be used for storing software program, journey can be performed in computer
Sequence and module, as in the application Fig. 1 embodiment the corresponding program instruction/module of microstructure three-dimensional modeling method (for example,
Cell node generation module 21, scanning error determination module 22, cell node in microstructure three-dimensional modeling apparatus correct mould
Block 23, marked region selecting module 24, boundary condition generation module 25, threedimensional model generation module 26).Processor 31 passes through fortune
Software program, instruction and the module of row storage in memory 32, thus the various functions of microstructure three-dimensional modeling equipment
Using and data processing, that is, realize above-mentioned session information management method.
Memory 32 can mainly include storing program area and storage data area, wherein storing program area can store operation system
Application program needed for system, at least one function；Storage data area can store the use according to microstructure three-dimensional modeling equipment
The data etc. created.In addition, memory 32 may include high-speed random access memory, it can also include non-volatile memories
Device, for example, at least a disk memory, flush memory device or other non-volatile solid state memory parts.
The embodiment of the present application also provides a kind of storage medium comprising computer executable instructions, computer executable instructions
When being executed by computer processor for executing a kind of microstructure three-dimensional modeling method, this method comprises:
The number of plies is scanned according to the microstructure to material to be observed, determines the material microstructure threedimensional model to be observed
Cell node information；
The scanning error of every layer of microstructure scan data is determined according to the sweep parameter of every layer of microstructure of scanning；
According to the scanning error of the cell node information and every layer of microstructure scan data, the material to be observed is generated
Expect revised cell node information；
According to the marked region of the material to be observed, multilayer microstructure scanning corresponding with the marked region is selected
Data；
According to the marked region, the boundary condition information of the marked region is generated；
According to the revised cell node information, the boundary condition information of the marked region to the marked region
Corresponding multilayer microstructure scan data is handled, and the threedimensional model of the material microstructure to be observed is obtained.
Certainly, a kind of storage medium comprising computer executable instructions, computer provided by the embodiment of the present application
Executable instruction is not limited to method operation as above, and the three-dimensional of microstructure provided by the application any embodiment can also be performed
Relevant operation in modeling method.
By the description above with respect to embodiment, it is apparent to those skilled in the art that, the application
It can be realized by software and required common hardware, naturally it is also possible to which by hardware realization, but in many cases, the former is more
Good embodiment.Based on this understanding, the technical solution of the application substantially in other words contributes to the prior art
Part can be embodied in the form of software products, which can store in computer readable storage medium
In, floppy disk, read-only memory (Read-Only Memory, ROM), random access memory (Random such as computer
Access Memory, RAM), flash memory (FLASH), hard disk or CD etc., including some instructions are with so that a computer is set
Standby (can be personal computer, server or the network equipment etc.) executes method described in each embodiment of the application.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (10)
1. a kind of microstructure three-dimensional modeling method characterized by comprising
The number of plies is scanned according to the microstructure to material to be observed, determines the material microstructure threedimensional model unit to be observed
Nodal information；
The scanning error of every layer of microstructure scan data is determined according to the sweep parameter of every layer of microstructure of scanning；
According to the scanning error of the cell node information and every layer of microstructure scan data, generates the material to be observed and repair
Cell node information after just；
According to the marked region of the material to be observed, multilayer microstructure corresponding with the marked region is selected to scan number
According to；
According to the marked region, the boundary condition information of the marked region is generated；
It is corresponding to the marked region according to the revised cell node information, the boundary condition information of the marked region
Multilayer microstructure scan data handled, obtain the threedimensional model of the material microstructure to be observed.
2. the method according to claim 1, wherein the sweep parameter according to every layer of microstructure of scanning is true
The scanning error of fixed every layer of microstructure scan data, comprising:
Euler's angle information of every layer of microstructure scan data is determined according to the sweep parameter of every layer of microstructure of scanning；
The scanning error according to the cell node information and every layer of microstructure scan data generates the material to be observed
Expect revised cell node information, comprising:
Coordinate is carried out to layer unit every in the cell node information according to Euler's angle information of every layer of microstructure scan data
Transformation generates the revised cell node information of material to be observed.
3. method according to claim 1 or 2, which is characterized in that the marked region according to the material to be observed,
Select multilayer microstructure scan data corresponding with the marked region, comprising:
Obtain the marked region in the material any layer to be observed；
Select in the material multilayer microstructure scan data to be observed, in every layer of microstructure scan data with the label
The corresponding scan data in region.
4. method according to claim 1 or 2, which is characterized in that it is described according to the revised cell node information,
The boundary condition information of the marked region handles the corresponding multilayer microstructure scan data of the marked region, obtains
To the threedimensional model of the material microstructure to be observed, comprising:
The corresponding multilayer microstructure scan data of the marked region is carried out according to the revised cell node information
Amendment, obtains the corresponding revised multilayer microstructure scan data of the marked region；
It is swept according to the boundary condition information of the marked region revised multilayer microstructure corresponding to the marked region
The borderline region data retouched in data are modified, and obtain the corresponding final multilayer microstructure scanning number of the marked region
According to；
Using the corresponding final multilayer microstructure scan data of the marked region as the material microstructure to be observed
Threedimensional model.
5. a kind of microstructure three-dimensional modeling apparatus characterized by comprising
Cell node generation module determines the material to be observed for scanning the number of plies according to the microstructure to material to be observed
Expect microstructure threedimensional model cell node information；
Error determination module is scanned, for determining every layer of microstructure scanning number according to the sweep parameter of every layer of microstructure of scanning
According to scanning error；
Cell node correction module, for being missed according to the scanning of the cell node information and every layer of microstructure scan data
Difference generates the revised cell node information of material to be observed；
Marked region selecting module selects corresponding with the marked region for the marked region according to the material to be observed
Multilayer microstructure scan data；
Boundary condition generation module, for generating the boundary condition information of the marked region according to the marked region；
Threedimensional model generation module, for the boundary condition according to the revised cell node information, the marked region
Information handles the corresponding multilayer microstructure scan data of the marked region, obtains the microcosmic knot of material to be observed
The threedimensional model of structure.
6. device according to claim 5, which is characterized in that the scanning error determination module is swept specifically for basis
The sweep parameter for retouching every layer of microstructure determines Euler's angle information of every layer of microstructure scan data；
The cell node correction module, specifically for according to Euler's angle information of every layer of microstructure scan data to the list
Every layer unit is coordinately transformed in first nodal information, generates the revised cell node information of material to be observed.
7. device according to claim 5 or 6, which is characterized in that the marked region selecting module is specifically used for obtaining
Marked region in the material any layer to be observed；It selects in the material multilayer microstructure scan data to be observed,
Scan data corresponding with the marked region in every layer of microstructure scan data.
8. device according to claim 5 or 6, which is characterized in that the threedimensional model generation module is specifically used for basis
The revised cell node information is modified the corresponding multilayer microstructure scan data of the marked region, obtains
The corresponding revised multilayer microstructure scan data of the marked region；According to the boundary condition information of the marked region
Borderline region data in revised multilayer microstructure scan data corresponding to the marked region are modified, and are obtained
The corresponding final multilayer microstructure scan data of the marked region；By the corresponding final microcosmic knot of multilayer of the marked region
Threedimensional model of the structure scan data as the material microstructure to be observed.
9. a kind of microstructure three-dimensional modeling equipment characterized by comprising
One or more processors；
Storage device, for storing one or more programs,
When one or more of programs are executed by one or more of processors, so that one or more of processors are real
The now microstructure three-dimensional modeling method as described in any in claim 1-4.
10. a kind of computer readable storage medium, is stored thereon with computer program, which is characterized in that the program is by processor
The microstructure three-dimensional modeling method as described in any in claim 1-4 is realized when execution.
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