CN108960371B - Abnormality analysis method and abnormality analysis device for mounted component - Google Patents
Abnormality analysis method and abnormality analysis device for mounted component Download PDFInfo
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- CN108960371B CN108960371B CN201810738634.5A CN201810738634A CN108960371B CN 108960371 B CN108960371 B CN 108960371B CN 201810738634 A CN201810738634 A CN 201810738634A CN 108960371 B CN108960371 B CN 108960371B
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Abstract
The application provides an abnormity analysis method and an abnormity analysis device of a mounted component, wherein the method comprises the following steps: when the identification patch and the base material are mounted to form a mounted component, acquiring first material information of the identification patch and second material information of the base material, establishing an incidence relation between the first material information and the second material information, and storing the incidence relation in a material mapping table; acquiring second material information in a surface-mounted component with a surface-mounted state being an abnormal surface-mounted state as first target material information; and acquiring first material information corresponding to the first target material information from the material mapping table to serve as second target material information, and displaying the association relationship between the first target material information and the second target material information. The second material information of the abnormal surface-mounted component is obtained, and the first material information can be obtained according to the material mapping table, so that the efficiency of the surface-mounted abnormal analysis of the identification patch is improved.
Description
Technical Field
The application relates to the field of electronic device assembly detection, in particular to an abnormity analysis method and an abnormity analysis device for a surface-mounted component.
Background
The conventional identification (e.g. logo) of the electronic device is usually manufactured by using an identification patch to be flatly pressed and hot-melted on a housing of the electronic device, so as to increase the identification degree of the electronic device. However, in the production process, the identification patch is likely to have mounting abnormalities such as warping, falling, deformation and the like. When the material information analysis of the identification patch is carried out on the surface mounted component which is abnormally mounted, the material information of the surface mounted identification patch can be printed unclear or can be seen only by disassembling the electronic equipment, so that the material information of the identification patch is difficult to obtain, and the reason analysis of the surface mounted abnormal identification patch is blocked. Therefore, how to provide an efficient method for analyzing the abnormality of the mounted component becomes a problem to be solved.
Disclosure of Invention
The application provides an abnormity analysis method and an abnormity analysis device for a mounting assembly, which can improve the mounting abnormity detection efficiency.
In one aspect, the present application provides a method for analyzing an abnormality of a mounted component, the method including:
when a label patch and a base material are pasted to form a pasted assembly, acquiring first material information of the label patch and second material information of the base material, establishing an incidence relation between the first material information and the second material information, and storing the incidence relation in a material mapping table;
acquiring second material information in a surface-mounted component with a surface-mounted state being an abnormal surface-mounted state as first target material information;
and acquiring first material information corresponding to the first target material information from the material mapping table, using the first material information as second target material information, and displaying an association relation between the first target material information and the second target material information.
On the other hand, the application also provides an abnormity analysis device of the mounting assembly, and the device comprises a substrate, a mark patch, a processor and a memory;
the memory for storing program code;
the processor is used for acquiring first material information of the identification patch and second material information of the base material when the identification patch and the base material are mounted to form a mounted component, establishing an incidence relation between the first material information and the second material information, and storing the incidence relation in a material mapping table; acquiring second material information in a surface-mounted component with a surface-mounted state being an abnormal surface-mounted state as first target material information; and acquiring first material information corresponding to the first target material information from the material mapping table, using the first material information as second target material information, and displaying an association relation between the first target material information and the second target material information.
Through obtaining the first material information of the identification patch and the second material information of the base material and establishing an incidence relation, the identification patch and the base material are mounted according to the incidence relation, when the reason that the mounting component is abnormally mounted is traced, the first material information can be obtained by collecting the second material information of the abnormally mounted component and storing a material mapping table of the incidence relation, so that the efficiency of abnormal analysis of mounting of the identification patch is improved, and the production efficiency of electronic equipment is further improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart of an abnormality analysis method for a mounted component according to an embodiment of the present application.
Fig. 2 is a schematic flow chart of another mounted component abnormality analysis method according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of an abnormality analysis device for mounted components according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.
The abnormity analysis method of the mounting component is applied to mounting identification on the shell of the electronic equipment, so that the identification degree of the electronic equipment is improved. The electronic device may be a tablet computer, a television, a mobile phone, a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, etc.
Referring to fig. 1, fig. 1 is a schematic flow chart illustrating a method 10 for analyzing an abnormality of a mounted component according to an embodiment of the present disclosure. The method 10 comprises:
101: when a label patch and a base material are pasted to form a pasted component, acquiring first material information of the label patch and second material information of the base material, establishing an incidence relation between the first material information and the second material information, and storing the incidence relation in a material mapping table.
In one embodiment, first material information on an identification patch roll is collected and stored; the identification patch is wound in a material cavity of the mounting device; collecting second material information of a base material, and storing the second material information; wherein the substrate is positioned on a transport mechanism of the placement device; establishing an incidence relation between the first material information and the second material information, and storing the incidence relation in a material mapping table; and controlling the mounting device to mount one identification patch on the identification patch roll on one base material.
Specifically, first material information on the label pasting roll can be scanned through the scanning gun and stored in the computer. Wherein, the first material information can be pasted on the outer surface of the identification patch roll. The scanning gun can be an infrared light scanning gun or a laser scanning gun, a handheld scanning gun or a platform type scanning gun, a wired scanning gun or a wireless scanning gun. The scanning gun can be electrically connected with or wirelessly communicated with the computer to transmit the scanned first material information to the computer. Wherein, sign paster roll can include the flexible coiled material and laminate in a plurality of sign pasters on the flexible coiled material surface, and a plurality of sign pasters are roll-like along with the flexible coiled material. A label patch is adapted to be correspondingly attached to an outer surface of one of the substrates. The identification patch roll is pasted with first material information, in other words, a plurality of identification patches with the same first material information can be packaged in the same identification patch roll, and the first material information of the identification patches in the identification patch rolls of different rolls is different.
The first material information may include at least one of a material code, manufacturer information, a material batch, a production time, a processing team, and the like. The first material information can be stored in the form of two-dimensional codes, bar codes and the like, so that the first material information can be attached to each identification patch roll. In other embodiments, the first material information may also be stored in one or more combinations of one or more numbers, one or more letters, one or more words, etc. so that the first material information of the identification patches of different volumes is different.
Specifically, the second material information of the substrate can be scanned by the scanning gun and the first material information can be stored in the computer. The scanning gun and the scanning gun are independent from each other, namely, the scanning gun and the scanning gun can work simultaneously. The scanning gun and the scanning gun can be multiplexed, and the same scanning gun can be controlled to scan the identification patch firstly and then scan the base material. Wherein, the substrate can be a battery cover of the electronic device. The identification patch is processed on the substrate through a mounting device by adopting a flat pressing hot melting process so as to form an identification on the electronic equipment. The material of the substrate can be at least one of steel sheet, plastic, ceramic, glass and the like. The material of the identification patch can be at least one of steel sheet, plastic, ceramic, glass and the like. Wherein, the material of sign paster can be the same with the material of substrate. Wherein, the second material information can be pasted on the outer surface of the base material. When the base material is a battery cover of the electronic equipment, the second material information is attached to the outer surface of the battery cover assembled on the electronic equipment, so that the second material information on the base material can be acquired without disassembling the electronic equipment.
The second material information may include at least one of a material code, manufacturer information, a material batch, a production time, a processing team, and the like. The second material information can be stored in the form of two-dimensional codes, bar codes and the like, so that the second material information can be attached to the base material. In other embodiments, the second material information may also be stored in one or more combinations of one or more numbers, one or more letters, one or more words, etc. so that the second material information is different for different substrates. That is, each second material information corresponds to one substrate. The second material information is attached to the outer surface of the base material.
Specifically, the association relationship between the first material information and the second material information is established, so that the user can obtain the corresponding first material information through the second material information, in other words, the first material information of the identification patch arranged on the base material can be obtained through the second material information of the base material, or the user can obtain the corresponding second material information through the first material information. The material mapping table may be stored in a computer.
Specifically, the identification patch is coiled in a material cavity of the mounting device, the identification patch coil aligns the identification patches to the base material under the action of the mounting device, and the mounting device is controlled to mount one identification patch on the identification patch coil on one base material so as to form a mounting assembly. Wherein, a plurality of said substrates can be arranged on the transmission mechanism in turn. The conveying mechanism conveys the base materials to a position opposite to the identification patch so as to carry out a mounting process. The mounting device controls the mark patch roll to rotate so that after the former mark patch is mounted on one substrate, the latter mark patch is opposite to the other substrate, and one mark patch on the mark patch roll is mounted on one substrate to form a mounting assembly.
As can be appreciated, also include: detecting whether the number of the identification patches on the identification patch roll is smaller than a preset number value or not; and if the detection result is yes, prompting to replace the identification patch.
Specifically, whether the number of the identification patches on the identification patch roll is less than 1 or not is detected, and if the result is less than 1, replacement of the identification patch roll is prompted. If the result is more than or equal to 1, the mounting process is continued. In the process of replacing the identification patch roll, the identification patch roll which runs out of the identification patches is taken down to obtain another identification patch roll, the scanning gun scans the first material information of the other identification patch roll, and the identification patches of the other identification patch roll are pasted with the base material on the conveying mechanism.
After the mounting device is controlled to mount one identification patch on the identification patch roll on one substrate, the number of the identification patches on the identification patch roll is monitored in real time, so that the situation that mounting components cannot be formed due to the fact that no identification patch is mounted on the substrate is avoided, and the mounting stability of the identification patches is improved.
102: and obtaining second material information in the surface-mounted component with the surface-mounted state being the surface-mounted abnormal state as first target material information.
Specifically, the mounting abnormality of the mounted component includes that the identification patch is likely to warp, fall off, deform, and the like. Whether the surface-mounted component is abnormally mounted can be directly checked through human eyes, and whether the surface-mounted component is abnormally mounted can be checked through an automatic machine.
When the electronic device is a mobile phone, the first material information is usually disposed on the surface of the battery cover covering the battery. When the base material is a battery cover, the first material information may have the problems of poor printing and unclear display, and when the base material is a mobile phone, the first material information can be seen only by disassembling the mobile phone, so that the first material information is difficult to obtain.
When the reason for the abnormal mounting of the mounting component is traced, the second material information of the abnormal mounting component is input into the memory, the memory can output the first material information of the abnormal mounting component according to the second material information, the problem that the first material information of the identification patch is difficult to acquire can be effectively avoided, the efficiency of the abnormal analysis of the mounting of the identification patch is improved, and the production efficiency of the electronic equipment is improved.
103: and acquiring first material information corresponding to the first target material information from the material mapping table, using the first material information as second target material information, and displaying an association relation between the first target material information and the second target material information.
Specifically, in the surface mounting component with the abnormal surface mounting function, the second target material information (namely the first material information of the surface mounting component with the abnormal surface mounting function) cannot be directly acquired, or the electronic equipment needs to be dismounted to be acquired, the first target material information is arranged on the outer surface of the base material and can be directly acquired, the second target material information of the identification patch when the surface mounting function is carried out is traced back through the first target material information of the base material in the surface mounting component with the abnormal surface mounting function, the difficulty that the electronic equipment needs to be dismounted to acquire the second target material information is avoided, and the convenience of the abnormal surface mounting analysis is improved.
Through obtaining the first material information of the identification patch and the second material information of the base material and establishing an incidence relation, the identification patch and the base material are mounted according to the incidence relation, when the reason that the mounting component is abnormally mounted is traced, the first material information can be obtained by collecting the second material information of the abnormally mounted component and storing a material mapping table of the incidence relation, so that the efficiency of abnormal analysis of mounting of the identification patch is improved, and the production efficiency of electronic equipment is further improved.
Fig. 2 is a schematic flow chart of another method for analyzing an abnormality of a mounted component provided in the present application, where as shown in fig. 2, the method includes:
201: when a label patch and a base material are pasted to form a pasted component, acquiring first material information of the label patch and second material information of the base material, establishing an incidence relation between the first material information and the second material information, and storing the incidence relation in a material mapping table.
202: and obtaining second material information in the surface-mounted component with the surface-mounted state being the surface-mounted abnormal state as first target material information.
203: and acquiring first material information corresponding to the first target material information from the material mapping table, using the first material information as second target material information, and displaying an association relation between the first target material information and the second target material information.
204: and comparing whether the ratio of the number of the same second target material information to the number of all the second target material information is greater than a preset value.
205: if the comparison result is yes, the second target material information, in which the ratio of the number of the same second target material information to the number of all the second target material information is larger than the preset value, is used as third target material information, second material information corresponding to the third target material information is obtained from the material mapping table and is used as fourth target material information, and the incidence relation between the third target material information and the fourth target material information is displayed.
Specifically, when the ratio of the number of the same second target material information to the number of all the second target material information is greater than a preset value, the preset value may be 30% to 100%. Mounted components that account for mounting anomalies are most likely the result of identifying the problem with the mounted material. That is, the mounting of the mounted component may be abnormal due to the poor molding quality of the identification patch material. However, the material composition, the processing time, the processing technology, and the like of each identification patch roll are the same, and all the identification patches in the identification patch roll are likely to cause mounting abnormality of the mounted components. Then, by screening out all the mounted components mounted by the volume identification patch, a large number of mounted components with abnormal mounting can be screened out.
For example, the first material information and the second material information of the mounted component with the mounting abnormality are: (1, a), (1, b), (2, c), (3, d), (1, e), (1, f), (1, g), (1, h). Then the first target material information is a, b, c, d, e, f, g, h. And inquiring whether the second target material information is 1, 1, 2, 3, 1, 1, 1, 1, 1 according to the first target material information and the material mapping table, wherein the proportion of the quantity of the same second target material information to all the second target material information is more than 30-100% of the preset value. That is, the number of the second target material information 1 is 6, the number of all the second target material information is greater than the preset value, and the second target material information of 1 is used as the third target material information. It can be judged that the material of the identification patch roll of which the first material information is 1 has a problem. And inquiring all second material information corresponding to the first material information of 1 according to the third target material information and the material mapping table, and taking all second material information corresponding to the first material information of 1 as fourth target material information.
In an embodiment, the method further comprises: acquiring the second material information on the surface-mounted component as second material information to be compared; judging whether the information of the second material to be compared is the same as that of the fourth target material; and if the judgment results are the same, determining that the surface-mounted component corresponding to the fourth target material information is a target surface-mounted component.
Specifically, the first target material information is a, b, c, d, e, f, g, h. And inquiring whether the second target material information is 1, 1, 2, 3, 1, 1, 1, 1, 1 according to the first target material information and the material mapping table, wherein the proportion of the quantity of the same second target material information to all the second target material information is more than 30-100% of the preset value. That is, the number of the second target material information 1 is 6, the number of all the second target material information is greater than the preset value, and the second target material information of 1 is used as the third target material information. It can be judged that the material of the identification patch roll of which the first material information is 1 has a problem. And inquiring all second material information corresponding to the first material information of 1 according to the third target material information and the material mapping table, taking all second material information corresponding to the first material information of 1 as fourth target material information, and finding all surface-mounted components with the first material information of 1 according to the fourth target material information so as to quickly find surface-mounted abnormal surface-mounted components.
In an embodiment, the method further comprises: acquiring the second material information on the surface-mounted component as second material information to be compared; judging whether the information of the second material to be compared is the same as that of the fourth target material; and if the judgment results are the same, determining that the surface-mounted component corresponding to the fourth target material information is a target surface-mounted component.
The method specifically comprises the following steps: and scanning the second material information on the surface mounting component one by one through a scanning gun, comparing the scanned second material information with second target material information, if the scanned second material information is the same as the second target material information, indicating that the surface mounting component is the surface mounting component which is searched for and is abnormally mounted, and if the scanned second material information is different from the second target material information, indicating that the surface mounting component is not the surface mounting component which is searched for and is abnormally mounted. So as to quickly select the mounting component with abnormal mounting.
In other embodiments, manual input and storage of the first material information and the second material information in the memory may also be employed to avoid setting the scanning gun to scan the first material information and the second material information.
Through obtaining the first material information of the identification patch and the second material information of the base material and establishing an incidence relation, the identification patch and the base material are mounted according to the incidence relation, when the reason that the mounting component is abnormally mounted is traced, the first material information can be obtained by collecting the second material information of the abnormally mounted component and storing a material mapping table of the incidence relation, so that the efficiency of abnormal analysis of mounting of the identification patch is improved, and the production efficiency of electronic equipment is further improved.
In addition, according to the abnormality analysis method for the mounted component provided in the embodiment of the application, third target material information may be obtained according to the second target material information and the material mapping table, in other words, the first material information corresponding to the abnormally mounted component may be obtained through the second material information corresponding to the abnormally mounted component, whether the first material information occupies a larger proportion in all the first material information corresponding to the abnormally mounted components is compared, whether the problem of the material of the identification patch causes the mounting abnormality of the mounted component is determined according to the comparison result, all the abnormally mounted components caused by the material problem of the identification patch are obtained according to the third target material information of the identification patch having the material problem and the material mapping table, and therefore, the analysis efficiency of the mounting abnormality of the identification patch is improved.
Referring to fig. 3, the present application further provides an abnormality analysis device a for a mounted component. The abnormality analysis device a is applied to the abnormality analysis method 10 for a mounted component according to any one of the above-described embodiments. The abnormality analysis device a includes a substrate 3, a label sheet 22, a processor 11, and a memory 12. Wherein the memory 12 is used for storing program codes. The processor 11 is configured to, when the identification patch 22 and the substrate 3 are mounted to form a mounted component 23, obtain first material information of the identification patch 22 and second material information of the substrate 3, establish an association relationship between the first material information and the second material information, and store the association relationship in a material mapping table.
Specifically, referring to fig. 3, the processor 11 is configured to collect first material information on the identification sticker roll 2, and store the first material information; the identification patch roll 2 is arranged in a material cavity 7 of the mounting device 1; the processor 11 is used for acquiring second material information of the substrate 3 and storing the second material information; wherein, the base material 3 is positioned on the transmission mechanism of the mounting device 1; the processor 11 is configured to establish an association relationship between the first material information and the second material information, and store the association relationship in a material mapping table; the processor 11 is configured to control the mounting device 1 to mount one of the identification patches 22 on the identification patch roll 2 on one of the substrates 3.
In an embodiment, referring to fig. 3, the abnormality analysis device a further includes a mounting device 1, a first scanning gun 4, a second scanning gun 5 and a computer 6. The processor 11 and the memory 12 are provided in the computer 6. Specifically, the first material information on the identification patch roll 2 may be scanned by the scanning gun and stored in the computer 6. Wherein, the first material information can be pasted on the outer surface of the identification film roll 2. Wherein, the first scanning gun 4 transmits the scanned first material information to the computer 6. The identification patch roll 2 may include a flexible roll 21 and a plurality of identification patches 22 attached to the surface of the flexible roll 21, and the plurality of identification patches 22 are rolled up with the flexible roll. One identification patch 22 is adapted to be correspondingly attached to an outer surface of one of the substrates 3. The identification patch roll 2 is attached with the first material information, in other words, a plurality of identification patches 22 with the same first material information can be packaged in the same identification patch roll 2, and the first material information of the identification patches 22 in the identification patch roll 2 of different rolls is different.
Specifically, referring to fig. 3, the second material information of the substrate 3 may be scanned by the second scanning gun 5 and stored in the computer 6. The scanning gun 4 and the scanning gun 5 are independent of each other, that is, they can work simultaneously. The scanning gun 4 and the scanning gun 5 may be multiplexed, and the same scanning gun may be controlled to scan the marking patch 22 and then the substrate 3. The substrate 3 may be a battery cover of an electronic device. The identification patch 22 is processed on the substrate 3 through the mounting device 1 by using a flat pressing hot melting process to form an identification on the electronic device. The material of the substrate 3 may be at least one of steel sheet, plastic, ceramic, glass, and the like. The identification patch 22 may be made of at least one of steel, plastic, ceramic, glass, etc. The material of the label sheet 22 may be the same as that of the base material 3. Wherein, the second material information can be attached to the outer surface of the substrate 3. When the substrate 3 is a battery cover of the electronic device, the second material information is attached to the outer surface of the battery cover assembled on the electronic device, so that the second material information on the substrate 3 can be acquired without disassembling the electronic device.
Wherein, each kind of second material information corresponds to a substrate 3. The second material information is attached to the outer surface of the base material 3.
Specifically, the association relationship between the first material information and the second material information is established, so that the user can obtain the corresponding first material information through the second material information, in other words, the first material information of the identification patch 22 disposed on the base material 3 can be obtained through the second material information of the base material 3, or the user can obtain the corresponding second material information through the first material information. The material mapping table may be stored in the computer 6.
In an embodiment, referring to fig. 3, the mounting device 1 further includes a material chamber 7, a conveying mechanism 8, and a flat-pressing heat-melting machine 9. The material cavity 7 is used for storing the label film roll 2. First scanning gun 4 can be close to material chamber 7 sets up to after the first material information that identification film rolled up 2 was scanned by first scanning gun 4, identification film rolled up 2 can put into material chamber 7 conveniently.
Referring to fig. 3, the transfer mechanism 8 is used for sequentially transferring the substrates 3 onto the platen 9. The mounting device 1 aligns one identification patch 22 of the identification patch roll 2 in the material cavity 7 with the substrate 3 on the flat pressing hot melting machine table 9, and the identification patch 22 is attached to the substrate 3. After the mounting device 1 mounts the identification patch 22 on the substrate 3, the transport mechanism 8 transports the mounted component 23 to the next process platform. The second scanning gun 5 can scan the second material information on the outer surface of the substrate 3 before the substrate 3 is transported to the platen fuser 9. Then, the second scanning gun 5 sequentially scans the second material information as the base material 3 moves along with the transfer mechanism 8.
Specifically, referring to fig. 3, the identification patch roll 2 is installed in the material cavity 7 of the mounting device 1, the identification patch 22 of the identification patch roll 2 is aligned with the substrate 3 under the action of the mounting device 1, and the mounting device 1 is controlled to mount one identification patch 22 on the identification patch roll 2 on one substrate 3, so as to form a mounting assembly. Wherein, a plurality of said base materials 3 can be arranged on the transmission mechanism 8 in sequence. The transport mechanism 8 transports the plurality of substrates 3 to a position opposite the identification patch 22 for a placement process. The mounting device 1 controls the identification patch roll 2 to rotate, so that after the previous identification patch 22 is mounted on one substrate 3, the next identification patch 22 is opposite to the other substrate 3, and one identification patch 22 on the identification patch roll 2 is mounted on one substrate 3 to form a mounting assembly 23.
The processor 11 is further configured to obtain second material information in the mounted component 23 in which the mounting state is the mounting abnormal state as the first target material information.
Specifically, the mounting abnormality of the mounting component 23 includes that the identification patch 22 is likely to be warped, fallen, deformed, and the like. Whether the mounted component 23 is abnormally mounted may be directly checked by a human eye, and whether the mounted component 23 is abnormally mounted may be checked by an automated machine.
When the electronic device is a mobile phone, the first material information is usually disposed on the surface of the battery cover covering the battery. When the substrate 3 is a battery cover, the first material information may have the problems of poor printing and unclear display, and when the substrate 3 is a mobile phone, the first material information can be seen only by disassembling the mobile phone, so that the first material information is difficult to obtain.
When tracing the reason of the abnormal mounting of the mounted component 23, the memory 12 can output the first material information of the abnormal mounted component 23 according to the second material information by inputting the second material information of the abnormal mounted component 23 into the memory 12, so that the problem that the first material information of the identification patch 22 is difficult to obtain can be effectively avoided, the efficiency of the abnormal mounting analysis of the identification patch 22 can be improved, and the production efficiency of the electronic equipment can be further improved.
The processor 11 is further configured to obtain first material information corresponding to the first target material information from the material mapping table, use the first material information as second target material information, and display an association relationship between the first target material information and the second target material information.
Specifically, in the surface mounting component with the abnormal surface mounting function, the second target material information (namely the first material information of the surface mounting component with the abnormal surface mounting function) cannot be directly acquired, or the electronic equipment needs to be dismounted to be acquired, the first target material information is arranged on the outer surface of the substrate 3 and can be directly acquired, the first target material information of the substrate 3 in the surface mounting component 23 with the abnormal surface mounting function is used for backtracking the second target material information of the identification patch 22 during surface mounting, so that the difficulty that the electronic equipment needs to be dismounted to acquire the second target material information is avoided, and the convenience of the abnormal surface mounting analysis is improved.
Through obtaining the first material information of the identification patch 22 and the second material information of the substrate 3 and establishing an incidence relation, the identification patch 22 and the substrate 3 are mounted according to the incidence relation, when the reason that the mounting component 23 is abnormally mounted is traced, the first material information can be obtained by collecting the second material information of the abnormally mounted component 23 and storing a material mapping table of the incidence relation, so that the efficiency of mounting abnormal analysis of the identification patch 22 is improved, and the production efficiency of electronic equipment is further improved.
In summary, although the present application has been described with reference to the preferred embodiments, the present application is not limited to the preferred embodiments, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application is defined by the appended claims.
The foregoing is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.
Claims (10)
1. An abnormality analysis method for a mounted component, characterized by comprising:
when a label patch and a base material are pasted to form a pasted assembly, acquiring first material information of the label patch and second material information of the base material, establishing an incidence relation between the first material information and the second material information, and storing the incidence relation in a material mapping table;
acquiring second material information in a surface-mounted component with a surface-mounted state being an abnormal surface-mounted state as first target material information;
and acquiring first material information corresponding to the first target material information from the material mapping table, using the first material information as second target material information, and displaying an association relation between the first target material information and the second target material information.
2. The analysis method according to claim 1, wherein the number of the identification patches is plural, the plural identification patches are divided into plural identification patch rolls, and the first material information of the identification patch in the different identification patch rolls is different.
3. The analysis method according to claim 2, further comprising, after the displaying the association between the first target material information and the second target material information:
comparing whether the ratio of the number of the same second target material information to the number of all second target material information is larger than a preset value or not;
if the comparison result is yes, the second target material information, in which the ratio of the number of the same second target material information to the number of all the second target material information is larger than the preset value, is used as third target material information, second material information corresponding to the third target material information is obtained from the material mapping table and is used as fourth target material information, and the incidence relation between the third target material information and the fourth target material information is displayed.
4. The analysis method according to claim 3, further comprising, after the displaying the association between the third target material information and the fourth target material information:
acquiring the second material information on the surface-mounted component as second material information to be compared;
judging whether the information of the second material to be compared is the same as that of the fourth target material;
and if the judgment results are the same, determining that the surface-mounted component corresponding to the fourth target material information is a target surface-mounted component.
5. The analysis method according to claim 4, wherein when the identification patch and the substrate are mounted to form a mounted component, acquiring first material information of the identification patch and second material information of the substrate, establishing an association relationship between the first material information and the second material information, and storing the association relationship in a material mapping table, includes:
collecting first material information on an identification patch roll, and storing the first material information; the identification patch is wound in a material cavity of the mounting device;
collecting second material information of a base material, and storing the second material information; wherein the substrate is positioned on a transport mechanism of the placement device;
establishing an incidence relation between the first material information and the second material information, and storing the incidence relation in a material mapping table;
and controlling the mounting device to mount one identification patch on the identification patch roll on one base material.
6. The method of claim 5, wherein after the controlling the mounting device to mount one of the plurality of identification patches on one of the plurality of substrates, further comprising:
detecting whether the number of the identification patches on the identification patch roll is smaller than a preset number value or not;
and if the detection result is yes, prompting to replace the identification patch.
7. The analysis method according to any one of claims 2 to 6, wherein the first material information and the second material information are stored in a two-dimensional code or a bar code, the first material information is attached to the identification patch roll, and the second material information is attached to the base material.
8. The analytical method of claim 7, wherein the substrate is a housing of an electronic device or an electronic device, and the second material information is provided on an outer surface of the substrate.
9. The analytical method of claim 7, wherein the first material information comprises a material code, manufacturer information, material lot, production time, processing team.
10. An abnormity analysis device of a mounted component is characterized by comprising a substrate, a mark patch, a processor and a memory;
the memory for storing program code;
the processor is used for acquiring first material information of the identification patch and second material information of the base material when the identification patch and the base material are mounted to form a mounted component, establishing an incidence relation between the first material information and the second material information, and storing the incidence relation in a material mapping table; acquiring second material information in a surface-mounted component with a surface-mounted state being an abnormal surface-mounted state as first target material information; and acquiring first material information corresponding to the first target material information from the material mapping table, using the first material information as second target material information, and displaying an association relation between the first target material information and the second target material information.
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| CN102891832A (en) * | 2011-07-20 | 2013-01-23 | 腾讯科技（深圳）有限公司 | ID (Identity) binding method and system |
| CN107679595A (en) * | 2017-10-19 | 2018-02-09 | 宁波亿拍客网络科技有限公司 | A kind of coordinate interrelation management system |
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| US9569707B2 (en) * | 2012-04-09 | 2017-02-14 | Wal-Mart Stores, Inc. | Method and apparatus pertaining to RFID tag tag-type identifiers |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102891832A (en) * | 2011-07-20 | 2013-01-23 | 腾讯科技（深圳）有限公司 | ID (Identity) binding method and system |
| CN107679595A (en) * | 2017-10-19 | 2018-02-09 | 宁波亿拍客网络科技有限公司 | A kind of coordinate interrelation management system |
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