CN108950614A - A kind of efficient copper brightener of VCP - Google Patents
A kind of efficient copper brightener of VCP Download PDFInfo
- Publication number
- CN108950614A CN108950614A CN201810619706.4A CN201810619706A CN108950614A CN 108950614 A CN108950614 A CN 108950614A CN 201810619706 A CN201810619706 A CN 201810619706A CN 108950614 A CN108950614 A CN 108950614A
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- Prior art keywords
- brightener
- vcp
- efficient copper
- added
- copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The present invention discloses a kind of efficient copper brightener of VCP, its component for containing following mass parts: polyethers 10~15, flatten auxiliary agent 3~8, sulfuric acid 0.4~0.6, sodium polydithio-dipropyl sulfonate 0.1~0.2, quaternary ammonium salt 0.4~0.8, formaldehyde 0.1~0.3, cupric sulfate pentahydrate 0.1~0.3, deionized water 75~88.When in VCP to the copper coating of printed wiring board substrate through-hole, covering power and covering power are excellent, and the ductility of copper coatings is splendid, form the curved surface of smooth light, keep coating unstressed.
Description
Technical field
The invention belongs to brightener technical fields, and in particular to a kind of efficient copper brightener of VCP.
Background technique
Over returning year, with the rapid development of consumer electronics product, function is also constantly upgrading, to carrying electronic component
Printed circuit board more stringent requirements are proposed, printed wiring board designed lines line width line-spacing is more and more thinner, to plate face copper plate
Higher requirements are also raised for uniformity, and originally 4 microns of deviation is no longer satisfied the requirement of 3/3mil route manufacture, and makees
For traditional coppered wire: gantry line can no longer meet more accurate PCB manufacture and require, therefore in recent years, part PCB manufacturer
Traditional gantry wire type plating copper and tin production line has been eliminated completely, then uses more advanced vertical continuous plating lines
(VCP) formula electrolytic copper production line.
And be also required to use electro-coppering brightener in vertical continuous plating lines, VCP electro-coppering brightener is as a kind of novel
Electro-coppering brightener, have in terms of performance and resistance to high current with traditional gantry line electro-coppering brightener in all respects very big
Variation, so needing to make improvements existing electro-coppering brightener.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of efficient copper brightener of VCP.
Technical solution used by this invention in order to achieve the above objectives is:
A kind of efficient copper brightener of VCP, the component containing following mass parts:
It further illustrates, the polyethers is polyethylene oxide polypropylene oxide monobutyl ether.
It further illustrates, the leveling auxiliary agent is butynediols diethoxy ether.
It further illustrates, the quaternary ammonium salt is to be copolymerized made of alkyl dimethyl ammonium chloride and sulfur dioxide copolymerization
Object.
It further illustrates, a kind of preparation method of the efficient copper brightener of VCP, implements according to the following steps:
A. deionized water is added in a kettle, opens stirring, is slowly added to sulfuric acid, stirs evenly.
B. polyethers, leveling auxiliary agent, sodium polydithio-dipropyl sulfonate, quaternary ammonium salt is sequentially added to stir into reaction kettle to complete
Dissolution.
C. formaldehyde is added to stir evenly into reaction kettle.
D. cupric sulfate pentahydrate is added to reaction kettle, stirring obtains brightener to being completely dissolved uniformly.
Compared with prior art, the beneficial effects of the present invention are:
When in VCP to the copper coating of printed wiring board substrate through-hole, covering power and covering power are excellent, copper facing
The ductility on surface is splendid, forms the curved surface of smooth light, keeps coating unstressed.
Specific embodiment
In order to further understand the content, features and effects of the present invention, hereby enumerating following embodiment explanation.
Embodiment 1
Component and proportional quantity (parts by weight) are as follows: polyethers 10 flattens auxiliary agent 5, sulfuric acid 0.5, sodium polydithio-dipropyl sulfonate
0.15, quaternary ammonium salt 0.5, formaldehyde 0.2, cupric sulfate pentahydrate 0.25, deionized water 83.4.
Preparation step:
A. deionized water is added in a kettle, opens stirring, is slowly added to sulfuric acid, stirs evenly.
B. polyethers, leveling auxiliary agent, sodium polydithio-dipropyl sulfonate, quaternary ammonium salt is sequentially added to stir into reaction kettle to complete
Dissolution.
C. formaldehyde is added to stir evenly into reaction kettle.
D. cupric sulfate pentahydrate is added to reaction kettle, stirring obtains brightener to being completely dissolved uniformly
Embodiment 2
Polyethers 12, leveling auxiliary agent 4, sulfuric acid 0.5, sodium polydithio-dipropyl sulfonate 0.16, quaternary ammonium salt 0.6, formaldehyde 0.24, five
Brochanite 0.2, deionized water 82.3.Preparation step is the same as embodiment 1.
Embodiment 3
Polyethers 14, leveling auxiliary agent 6, sulfuric acid 0.5, sodium polydithio-dipropyl sulfonate 0.15, quaternary ammonium salt 0.7, formaldehyde 0.2, five
Brochanite 0.25, deionized water 77.95.Preparation step is the same as embodiment 1
The efficient copper brightener of VCP of the present invention and U.S.'s reputable brand brightener, with code name J replacement, and it is domestic certain
Brand brightener makees comprehensive performance comparison with code name B replacement, and specific sample preparation is as follows: 25 pieces of hole-drilled PCB substrate,
Using 5 blocks of plates as experimental test plate, test result is averaged every kind of brightener, radius-thickness ratio 8:1, and substrate copper is 14 microns thick, ruler
Very little 603mm*518mm, linear velocity 0.7m/min, setting copper is 31.2 microns thick, current density 4.2ASD.
Test result is as follows table:
Test item Industry code requirements are as follows: shiny appearance is smooth, no copper particle；COV≤5%: the thick very poor value of copper is smaller
Better；TP value is the bigger the better；Thermal shock reaches 3 non-porous copper fractures；Yan Zhan≤12%, ductility is bigger, brightener performance
It is more excellent.
The above is only the preferred embodiments of the present invention, and is not intended to limit the present invention in any form,
Any simple modification made to the above embodiment according to the technical essence of the invention, equivalent variations and modification, belong to
The range of technical solution of the present invention.
Claims (5)
1. a kind of efficient copper brightener of VCP, which is characterized in that its component for containing following mass parts:
2. the efficient copper brightener of a kind of VCP according to claim 1, it is characterised in that: the polyethers is polycyclic oxygen second
Alkane polypropylene oxide monobutyl ether.
3. the efficient copper brightener of a kind of VCP according to claim 1, it is characterised in that: the leveling auxiliary agent is butine
Glycol diethyl oxygen ether.
4. the efficient copper brightener of a kind of VCP according to claim 1, it is characterised in that: the quaternary ammonium salt is alkyl two
Copolymer made of ammonio methacrylate and sulfur dioxide copolymerization.
5. the efficient copper brightener of a kind of VCP according to claim 1, it is characterised in that: a kind of efficient copper facing of VCP
The preparation method of brightener is implemented according to the following steps:
A. deionized water is added in a kettle, opens stirring, is slowly added to sulfuric acid, stirs evenly.
B. polyethers, leveling auxiliary agent, sodium polydithio-dipropyl sulfonate, quaternary ammonium salt is sequentially added to be stirred into reaction kettle to completely molten
Solution.
C. formaldehyde is added to stir evenly into reaction kettle.
D. cupric sulfate pentahydrate is added to reaction kettle, stirring obtains brightener to being completely dissolved uniformly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810619706.4A CN108950614B (en) | 2018-06-15 | 2018-06-15 | VCP high-efficiency copper plating brightener |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810619706.4A CN108950614B (en) | 2018-06-15 | 2018-06-15 | VCP high-efficiency copper plating brightener |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108950614A true CN108950614A (en) | 2018-12-07 |
| CN108950614B CN108950614B (en) | 2021-11-26 |
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ID=64489787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810619706.4A Active CN108950614B (en) | 2018-06-15 | 2018-06-15 | VCP high-efficiency copper plating brightener |
Country Status (1)
| Country | Link |
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| CN (1) | CN108950614B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110453255A (en) * | 2019-08-30 | 2019-11-15 | 广州皓悦新材料科技有限公司 | A kind of VCP copper brightener and preparation method thereof with high covering power |
| CN113445086A (en) * | 2021-04-17 | 2021-09-28 | 珠海松柏科技有限公司 | Copper plating additive and copper electroplating solution suitable for printed circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102071443A (en) * | 2009-10-15 | 2011-05-25 | 上村工业株式会社 | Copper electrolytic plating bath and copper electrolytic plating method |
| CN105543908A (en) * | 2016-02-29 | 2016-05-04 | 广州鸿葳科技股份有限公司 | Solution and method for cyanide-free alkaline bright barrel copper plating |
| CN105734623A (en) * | 2016-05-06 | 2016-07-06 | 广东利尔化学有限公司 | High-dispersity acidic copper plating additive as well as preparation method and application thereof |
| CN108130564A (en) * | 2017-12-28 | 2018-06-08 | 韶关硕成化工有限公司 | Vertical continuous is electroplated（VCP）High TP values acid copper-plating gloss agent and preparation method and application |
-
2018
- 2018-06-15 CN CN201810619706.4A patent/CN108950614B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102071443A (en) * | 2009-10-15 | 2011-05-25 | 上村工业株式会社 | Copper electrolytic plating bath and copper electrolytic plating method |
| CN105543908A (en) * | 2016-02-29 | 2016-05-04 | 广州鸿葳科技股份有限公司 | Solution and method for cyanide-free alkaline bright barrel copper plating |
| CN105734623A (en) * | 2016-05-06 | 2016-07-06 | 广东利尔化学有限公司 | High-dispersity acidic copper plating additive as well as preparation method and application thereof |
| CN108130564A (en) * | 2017-12-28 | 2018-06-08 | 韶关硕成化工有限公司 | Vertical continuous is electroplated（VCP）High TP values acid copper-plating gloss agent and preparation method and application |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110453255A (en) * | 2019-08-30 | 2019-11-15 | 广州皓悦新材料科技有限公司 | A kind of VCP copper brightener and preparation method thereof with high covering power |
| CN113445086A (en) * | 2021-04-17 | 2021-09-28 | 珠海松柏科技有限公司 | Copper plating additive and copper electroplating solution suitable for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108950614B (en) | 2021-11-26 |
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