CN108911501A - A kind of high rigidity Aluminiu, boron silicate glass without alkali and the preparation method and application thereof suitable for floating process production - Google Patents

A kind of high rigidity Aluminiu, boron silicate glass without alkali and the preparation method and application thereof suitable for floating process production Download PDF

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CN108911501A
CN108911501A CN201810897758.8A CN201810897758A CN108911501A CN 108911501 A CN108911501 A CN 108911501A CN 201810897758 A CN201810897758 A CN 201810897758A CN 108911501 A CN108911501 A CN 108911501A
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glass
alkali
high rigidity
floating process
aluminiu
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王静
王维年
韩建军
刘超
谢俊
阮健
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Wuhan University of Technology WUT
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/076Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00Other methods of shaping glass
    • C03B19/02Other methods of shaping glass by casting molten glass, e.g. injection moulding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Glass Compositions (AREA)

Abstract

The present invention discloses a kind of high rigidity Aluminiu, boron silicate glass without alkali and preparation method suitable for floating process production.The glass is indicated with mass percent, based on oxide content, has consisting of:SiO2:55.0~65.0%, Al2O3:11.0~29.0%, B2O3:2.0~9.0%, MgO:2.4~5.0%, SrO:4.6~10.0%, CaO:2.5~5.5%.The present invention provides Vickers hardnesses to be higher than 670kgf/mm2, strain point be more than 680 DEG C, glass melting temperature 1620~1660 DEG C, annealing temperature 700 DEG C, can be used floating process production, high elastic modulus, chemical stability it is good, it is widely portable to flat panel displaying element or the base plate glass of other photoelectric devices, is particularly suitable for TFT-LCD base plate glass.

Description

It is a kind of suitable for floating process production high rigidity Aluminiu, boron silicate glass without alkali and its Preparation method and application
Technical field
The invention belongs to field of glass production technology, and in particular to one kind can be widely applied to display industry thin film transistor (TFT) Liquid crystal display (TFT-LCD) high rigidity Aluminiu, boron silicate glass without alkali and the preparation method and application thereof.
Background technique
TFT-LCD have stable operating voltage, energy saving, lightweight high image quality, full color, fine definition, high-resolution, A variety of good characteristics such as radiationless and pollution-free, have been widely used.Key foundation material of the base plate glass as TFT-LCD Material mainly has both sides to act on:One is the thickness for making liquid crystal molecule keep certain;The other is carrying driving is had to Transparent electrode and switching element.Currently, Aluminiu, boron silicate glass without alkali is widely used to TFT- due to its excellent performance LCD substrate material, the quality of base plate glass influence TFT-LCD performance huge.
Alkali-free aluminoborosilicate base plate glass as TFT-LCD baseplate material must the following conditions:
(1) there is high rigidity, it is ensured that base plate glass is not scratched and destroys by other in end processing sequences.
(2) strict control alkali metal (Na2O、K2O etc.) introducing, in heat treatment process, if containing alkali metal from Son will lead to alkali metal film forming and spread in semiconductor substance, cause membrane property to deteriorate, but lack alkali metal oxide (R2O it) helps It is molten, lead to that glass melting is difficult, clarification is difficult, homo-effect is poor, so in general control glass alkali content in 1000~2000ppm,.
(3) has good chemical stability, this is because needing in TFT-LCD device fabrication process in base plate glass It is upper to carry out the operation such as multiple film, etching and chemical attack.
(4) strain point is higher than 650 DEG C, to guarantee the stability of the high temperature process of glass in panel manufacturing process.
(5) there is suitable thermal expansion coefficient, in 25~300 DEG C of thermal expansion coefficients between 3.0~3.8 × 10-6/ DEG C, Suitable matching degree can be kept with peripheral parts, since device in the fabrication process can be by multiple, quick liter repeatedly Cooling avoids deformation caused by glass bending and peripheral devices in following process glass heat treatment process from deviation occur.
(6) density will be lower than 2.55g/cm3, large scale display panel is prepared to lighting, slimming development.
(7) there is high elasticity modulus, generally higher than 65Gpa preferably reaches 70Gpa or more, avoids working as in industrial production It is middle to prepare large-sized base plate glass and depending condition occur and make glass breaking.
(8) alkali-free aluminium borosilicic acid base plate glass will also guarantee molten in glass other than the condition for meeting above (1)~(7) The defects of process processed reaches preferable clarification, homo-effect, and bubble, crackle is not present in the base plate glass after guaranteeing forming.
Based on the requirement of the above property, TFT-LCD base plate glass is generally made of Aluminiu, boron silicate glass without alkali, ingredient For SiO2、Al2O3、B2O3, RO (MgO, SrO and CaO) composition, introduce raw material be generally quartz sand, aluminium oxide, boric acid, lightweight oxygen Change magnesium, strontium carbonate and calcium carbonate raw material.To guarantee glass smelting effect, it is ensured that when enough mixings, melted, clarification and homogenizing Between.
The addition of alkaline-earth metal intermediate oxide and suitable proportion reduce glass melting temperature and high temperature viscosity, shorten glass The material of glass is conducive to glass Quick-forming, can be improved the hardness of glass again to a certain extent, and alkaline earth oxide makees glass The network outer body of glass structure is present in glass spaces position, so that the connection of key is stronger in glass network structure, more Step up close, improves the compaction rate of glass structure.
The EAGLE XG slim Glass LCD sheet glass dimension that U.S. CORNING limited liability company completely newly releases Family name's hardness is 640kgf/mm2, the minimum weightlessness ratio 1.83mg/cm in mass fraction 5%NaOH solution2;Patent CN1328531 A A kind of glass for flat-panel monitor is disclosed, the strain temperature highest of glass only has 660 DEG C, and the fusion temperature of glass reaches To 1700 DEG C;Disclosed in patent CN101400614 A glass combination with high thermal stability and chemical stability and Preparation method is added to BaO, Sb in composition2O3、As2O3Equal heavy metallic oxides and noxious material, also added ZrO2、 SnO2With rare earth oxide La2O3Component, the composition glass are prepared suitable for press over system;It is disclosed in patent CN101801872 A A kind of glass combination and production and preparation method thereof of suitable glass tube down-drawing, contains BaO, TiO in composition2、MnO、ZnO、Nb2O5、 MoO3、Ta2O5And the substances such as rare earth oxide, and be illustrated for down draw process performance;In 102531386 A of patent CN A kind of alkali-free glass compositions with high thermal stability and chemical stability are disclosed, are selected in the preparation process of glass SnO2、Fe2O3、CeO2、Sb2O3、As2O3Or mixtures thereof be used as clarifying agent;A kind of liquid is disclosed in patent CN101544467A Brilliant substrate glass material and preparation method thereof, but contain ZnO in composition, and be added to BaO, Ba (NO3)2It is disagreeableness to environment Component.
An important performance indexes of the hardness as base plate glass, due to Thin Film Transistor-LCD (TFT-LCD) Base plate glass will pass through multiple cold treatment and heat treatment in post-production and installation process, to avoid base plate glass subsequent It is not scratched in processing and treatment process and is destroyed by other, high rigidity is applied to pass in TFT-LCD to base plate glass It is important.Currently, the glass Vickers hardness for TFT-LCD substrate is generally in 630kgf/mm2Left and right.
Summary of the invention
The present invention provides a kind of high rigidity alkali-free aluminium borosilicate suitable for floating process production to solve above-mentioned technical problem Silicate glass and the preparation method and application thereof.
The present invention is achieved through the following technical solutions:
A kind of high rigidity Aluminiu, boron silicate glass without alkali suitable for floating process production, is indicated with mass percent, is pressed Oxide content meter has consisting of:
In above scheme, the SiO2And Al2O3The sum of mass percentage be not more than 83%.
In above scheme, by mass, 0.24≤(MgO+SrO+CaO)/SiO2≤0.32。
In above scheme, by mass, 0.59≤(MgO+SrO+CaO)/Al2O3≤1.19。
In above scheme, by mass, 0.08≤B2O3/Al2O3≤0.41。
In above scheme, by mass, 0.26≤Al2O3/SiO2≤0.45。
In above scheme, the liquidus temperature of glass raw material is at 1050~1170 DEG C, and operating temperature range is 920~1250 DEG C, strain point is higher than 680 DEG C.
In above scheme, Vickers hardness is higher than 670kgf/mm2, elasticity modulus is in 80.0~90.0GPa, in volume fraction It is weightless than being 5.19~6.70mg/cm in 10%HF solution2, weightless than being 1.12 in mass fraction 5%NaOH solution ~1.74mg/cm2, and the linear expansion coefficient at 25~300 DEG C is less than or equal to 38 × 10-7/℃。
The method of the high rigidity Aluminiu, boron silicate glass without alkali, using floating process, processing step is:Match above-mentioned After mixing than weighed oxide, it melts, in 1620~1660 DEG C of 2~3h of heat preservation, then falls the glass metal melted Enter rapid shaping in the stainless steel cast iron vessel for be preheated to 200~300 DEG C, controls in 650-720 DEG C of annealing 2~3h, Zhi Housui Aluminiu, boron silicate glass without alkali sample is made in furnace natural cooling.
The high rigidity Aluminiu, boron silicate glass without alkali for being suitable for floating process production is aobvious in tft liquid crystal Show the application in the base plate glass of device (TFT-LCD) panel.
The present invention this Aluminiu, boron silicate glass without alkali in order to obtain, first is that passing through control SiO2And Al2O3Amount, addition Variety classes alkaline earth oxide reduces high temperature viscosity of glass and glass melting temperature, shortens frit, accelerates forming of glass.Two It is by adjusting mol ratio (the preferably MgO of alkaline earth oxide (MgO, CaO, SrO) type:CaO:The molar ratio of SrO= 4:3:And SiO 3)2、Al2O3、B2O3Mass content optimize the hardness of glass.Third is that strict control processing parameter, including The process parameter optimizings glass properties such as glass melting temperature, melting time, annealing temperature and sufficient annealing time.
The invention has the advantages that:The alkaline earth oxide of suitable proportion is added in glass composition of the invention Selection with excellent floating process parameter can effectively reduce high temperature viscosity of glass and glass melting temperature, shortening strip, raising glass are hard Degree.The present invention provides Vickers hardnesses to be higher than 670kgf/mm2, strain point be more than 680 DEG C, glass melting temperature 1620~1660 DEG C, Annealing temperature 700 DEG C, can be used floating process production, high elastic modulus, chemical stability it is good, be widely portable to plate The base plate glass of display element or other photoelectric devices is particularly suitable for TFT-LCD base plate glass.
Specific embodiment
The present invention is furtherd elucidate below with reference to embodiment, but the contents of the present invention are not limited solely to following reality Example is applied, embodiment is not construed as limitation of the invention.
A kind of preparation method of high rigidity Aluminiu, boron silicate glass without alkali provided by the present invention, steps are as follows:
1) selection of raw material:According to SiO255.0~65.0%, Al2O311.0~29.0%, B2O32.0~9.0%, MgO 2.4~5.0%, SrO 4.6~10.0%, 2.5~5.5% ingredient of CaO, by percentage to the quality, the sum of each oxide Meet 100%, wherein SiO2、Al2O3、B2O3, MgO, CaO, SrO be respectively by quartz sand, aluminium oxide, boric acid, light magnesium oxide, carbon Sour calcium, strontium carbonate introduce;
2) mass fraction of batch is calculated according to above-mentioned each oxide mass score and weigh about 200g batch, mix After uniformly, it is added in platinum-rhodium alloy crucible and melts, in 1620~1660 DEG C of 2~3h of heat preservation, then fall the glass metal melted Enter rapid shaping in the stainless steel cast iron die for be preheated to 200~300 DEG C, controls in 700 DEG C of 2~3h of annealing, certainly with furnace later It is so cooling, to eliminate stress present in glass, a kind of high rigidity Aluminiu, boron silicate glass without alkali sample is made.
The compositing range of each ingredient is illustrated below.
In glass system, SiO2It is that glass network generates oxide body, is the basic skeleton structure of glass.Glass of the present invention SiO in glass component2Content suitably increases SiO between 55~65% (mass percents, not specified then identical below)2 The hardness of glass can be made to increase, promote strain point, improve chemical stability, reduce thermal expansion coefficient.But its content is super Crossing 65% or more causes melting temperature to increase, and increases tendency towards devitrification;If content is lower than 55%, the strain point of glass is lower, And the coefficient of expansion increases, therefore preferred SiO2The component of content 57.0~60.0%, more preferable 57.4% or more 60.0% or less.
Al2O3It can inhibit the split-phase of glass, reduce thermal expansion coefficient, improve strain point, improve elasticity modulus.Al2O3Contain Amount is in 11~29%, suitably increase Al2O3The durability of glass can be improved, reduce thermal expansion coefficient.If Al2O3Content is lower than 11%, then it can not show by adding Al2O3Obtained from effect, content is more than 29% glass infusibility to be caused to melt or devitrification, because This preferably 15.0~28.5% component, more preferable content is 15.0% or more below 25.5%.
B2O32.0~9.0%, the strain point of glass is can be improved in it for content control, reduces linear expansion coefficient and high temperature is viscous Degree, is a kind of good fluxing agent.Due to B under the high temperature conditions2O3With [BO3] form exist be difficult to form [BO4], to drop Low high temperature viscosity, [BO when low temperature3] capture free oxygen to [BO4] conversion, so that the compaction rate of glass increases, promotion glass is hard Degree.Its fluxing effect is deteriorated when boron oxide content is lower than 2.0%, and clarifying effect is deteriorated when also can be glass smelting, but content is high In the reduction of 9% or more strain point, elasticity modulus is greatly lowered, and in addition boron volatilization increase leads to component design and reality when high temperature There is certain deviation, reduces component deviation by supplementing suitable boron oxide, thus preferred B2O3The group of content 2.0~6.5% Point.
The high temperature viscosity and glass melting temperature of glass can be effectively reduced in alkaline earth oxide RO (MgO, CaO and SrO), contracting The material of short glass, is conducive to Quick-forming, belongs to network outer body.MgO have do not reduce reduce in the case where strain point it is high Warm viscosity makes glass be easy to melt, also can reduce tendency towards devitrification, since its radius is small, Mg2+It is all octahedra under normal circumstances Form is present in glass structure, can be filled in network interstitial site, be conducive to close structure.Introduction volume is more than 5% meeting Lead to short texture, hardness reduces, and preferably content of MgO is 2.4~5.0%, more preferable 3.0% or more 5% or less.CaO is helped In reduce glass fusing point and liquidus temperature, but content be more than 5% will lead to strain point reduce and the coefficient of expansion increase, therefore Control CaO content is advisable 2.5~5.5%, and more preferable 3.0% or more 5.5% or less.Mg2+And Ca2+The radius of ion is smaller, Charge is higher, polarizability is stronger, thus influences on the elasticity modulus of base plate glass very big.SrO too high levels are not in comparison Conducive to elasticity modulus is increased, its relative molecular mass score of Sr member procatarxis is larger, has a great impact to density, the content of SrO Control is 4.6~10.0%, more preferable 9% or less 4.6% or more.
For a better understanding of the invention, the content that the present invention is further explained combined with specific embodiments below, but the present invention The following examples are not limited solely to, a kind of high rigidity Aluminiu, boron silicate glass without alkali suitable for floating process production is excellent Glass is selected to form:SiO257.0~60.0%, Al2O315.0~28.5%, B2O32.0~6.5%, MgO 3.0~5.0%, SrO 6.5~9.0%, CaO 3.0~5.0%, and the sum of each oxide meets 100%.The oxide mass of specific each example See Table 1 for details for percentage.
Table 1
Wherein, in table 1 each example performance test value, the density of glass measured using Archimedes's drainage;Springform Amount measures elasticity modulus using MTS ceramics experimental system line-of-sight course;Vickers hardness is tested using full-automatic microhardness instrument;Glass The water-bath at 20 DEG C of volume fraction 10%HF solution corrodes 20min and in mass fraction 5% respectively for chemical resistance test, i.e. glass 6h is corroded in water-bath at 95 DEG C of NaOH solution;Impedance analyzer Measuring Dielectric Constant;The average linear expansion coefficient of glass, strain point and Softening point is expanded to measure using horizontal expander instrument;Fusion temperature, operating point are obtained using high-temperature viscosimeter measuring and calculation;Liquidus curve Temperature is tested using thermal gradient furnace.
By 1 example of table it is found that Aluminiu, boron silicate glass without alkali provided by the invention Vickers hardness with higher, reaches 670kgf/mm2More than, elasticity modulus is higher than 80GPa, and strain point temperature is at 680 DEG C or more, in volume fraction 10%HF solution Weightlessness is than being 5.19~6.70mg/cm2, weightless than being 1.12~1.74mg/cm in mass fraction 5%NaOH solution2, and Linear expansion coefficient at 25~300 DEG C is less than or equal to 38 × 10-7/ DEG C, meet Thin Film Transistor-LCD (TFT-LCD) base The performance requirement of glass sheet, glass melting temperature is at 1620~1660 DEG C, and liquidus temperature is at 1050~1170 DEG C, operating temperature model 920~1250 DEG C are trapped among, annealing temperature is suitable for floating process and produces at 700 DEG C.
Above embodiments are only exemplary embodiment of the present invention, are not used in the limitation present invention, protection scope of the present invention It is defined by the claims.Those skilled in the art can within the spirit and scope of the present invention make respectively the present invention Kind modification or equivalent replacement, this modification or equivalent replacement also should be regarded as being within the scope of the present invention.

Claims (10)

1. a kind of high rigidity Aluminiu, boron silicate glass without alkali suitable for floating process production, which is characterized in that use quality percentage Than indicating, based on oxide content, there is consisting of:
2. the high rigidity Aluminiu, boron silicate glass without alkali according to claim 1 suitable for floating process production, feature It is, SiO2And Al2O3The sum of mass percentage be not more than 83%.
3. the high rigidity Aluminiu, boron silicate glass without alkali according to claim 1 suitable for floating process production, feature It is, by mass, 0.24≤(MgO+SrO+CaO)/SiO2≤0.32。
4. the high rigidity Aluminiu, boron silicate glass without alkali according to claim 1 suitable for floating process production, feature It is, by mass, 0.59≤(MgO+SrO+CaO)/Al2O3≤1.19。
5. the high rigidity Aluminiu, boron silicate glass without alkali according to claim 1 suitable for floating process production, feature It is, by mass, 0.08≤B2O3/Al2O3≤0.41。
6. the high rigidity Aluminiu, boron silicate glass without alkali according to claim 1 suitable for floating process production, feature It is, by mass, 0.26≤Al2O3/SiO2≤0.45。
7. described in any item high rigidity alkali-free aluminoborosilicate glass suitable for floating process production according to claim 1~6 Glass, which is characterized in that the liquidus temperature of glass raw material at 1050~1170 DEG C, answer at 920~1250 DEG C by operating temperature range Height is higher than 680 DEG C.
8. described in any item high rigidity alkali-free aluminoborosilicate glass suitable for floating process production according to claim 1~6 Glass, which is characterized in that Vickers hardness is higher than 670kgf/mm2, elasticity modulus is in 80.0~90.0GPa, in volume fraction 10%HF It is weightless than being 5.19~6.70mg/cm in solution2, in mass fraction 5%NaOH solution it is weightless than for 1.12~ 1.74mg/cm2, and the linear expansion coefficient at 25~300 DEG C is less than or equal to 38 × 10-7/℃。
9. the method for preparing the described in any item high rigidity Aluminiu, boron silicate glass without alkali of claim 1~6, which is characterized in that Using floating process, processing step is:Weighed oxide will be matched after mixing by any one of claim 1~6 is described, Then the glass metal melted is poured into 1620~1660 DEG C of 2~3h of heat preservation and is preheated to 200~300 DEG C of stainless steel by melting The alkali-free aluminium boron is made later with furnace natural cooling in 650-720 DEG C of 2~3h of annealing in rapid shaping in cast iron vessel, control Silicate glass.
10. described in any item high rigidity alkali-free aluminoborosilicate glass suitable for floating process production according to claim 1~6 Application of the glass in the base plate glass of LCD panel of thin-film transistor.
CN201810897758.8A 2018-07-17 2018-08-08 A kind of high rigidity Aluminiu, boron silicate glass without alkali and the preparation method and application thereof suitable for floating process production Pending CN108911501A (en)

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CN110183103A (en) * 2019-05-06 2019-08-30 中建材蚌埠玻璃工业设计研究院有限公司 Silicate glass containing boron and aluminium without alkali clarifying agent and its application method
CN111943506A (en) * 2020-07-20 2020-11-17 广东金刚玻璃科技股份有限公司 Formula of non-conductive touch control mirror display glass
CN113735450A (en) * 2021-09-09 2021-12-03 温州市康尔微晶器皿有限公司 Transparent high-hardness magnesium-aluminum-silicon microcrystalline glass and preparation method thereof
CN116102254A (en) * 2022-12-23 2023-05-12 中建材玻璃新材料研究院集团有限公司 OLED glass substrate composition and preparation method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110183103A (en) * 2019-05-06 2019-08-30 中建材蚌埠玻璃工业设计研究院有限公司 Silicate glass containing boron and aluminium without alkali clarifying agent and its application method
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CN111943506A (en) * 2020-07-20 2020-11-17 广东金刚玻璃科技股份有限公司 Formula of non-conductive touch control mirror display glass
CN113735450A (en) * 2021-09-09 2021-12-03 温州市康尔微晶器皿有限公司 Transparent high-hardness magnesium-aluminum-silicon microcrystalline glass and preparation method thereof
CN116102254A (en) * 2022-12-23 2023-05-12 中建材玻璃新材料研究院集团有限公司 OLED glass substrate composition and preparation method thereof

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