CN108908075A - A kind of wafer processing section burnishing device - Google Patents
A kind of wafer processing section burnishing device Download PDFInfo
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- CN108908075A CN108908075A CN201811060249.6A CN201811060249A CN108908075A CN 108908075 A CN108908075 A CN 108908075A CN 201811060249 A CN201811060249 A CN 201811060249A CN 108908075 A CN108908075 A CN 108908075A
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- polishing wheel
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- 238000012545 processing Methods 0.000 title claims abstract description 34
- 238000005498 polishing Methods 0.000 claims abstract description 65
- 238000009434 installation Methods 0.000 claims description 12
- 235000005121 Sorbus torminalis Nutrition 0.000 claims description 3
- 244000152100 Sorbus torminalis Species 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 17
- 235000012431 wafers Nutrition 0.000 description 82
- 239000007787 solid Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005422 blasting Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000002224 dissection Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention relates to the technical fields of wafer processing auxiliary equipment to improve the fixed effect to wafer more particularly to a kind of wafer processing section burnishing device, to improve the effect polished to wafer section, improves practicability；And the once fixed polishing that brilliant section can be completed, improves working efficiency；Security risk is reduced simultaneously；Including workbench, left supported plate, right supported plate, top plate, cylinder, mounting plate, telescopic rod, two groups of motors, two groups of shafts, the first polishing wheel and the second polishing wheel；It further include turntable, swinging strut, fixed device and the first ball bearing, fixed device includes the first supporting plate, the second supporting plate, third supporting plate, support plate, two groups of push rods, two groups of support springs, screwed pipe, threaded rod and the second ball bearing, the left and right side of first front edge of board is provided with fixing groove, two groups of fixing grooves are located at the dead astern of two groups of push rods, and two groups of fixing grooves are located at the underface of the first polishing wheel and the second polishing wheel.
Description
Technical field
The present invention relates to the technical fields of wafer processing auxiliary equipment, are polished more particularly to a kind of wafer processing with section
Device.
Background technique
It is well known that need then to polish the section of wafer columnar wafer dissection in wafer fabrication processes,
Wafer processing section burnishing device is a kind of auxiliary dress for being polished in wafer fabrication processes to the section of wafer
It sets, is widely used in a variety of applications in the field of semiconductor machining；Existing wafer processing section burnishing device includes work
Make platform and manual polishing machine, the top of workbench is provided with mounting table, and the top of mounting table is provided with semicircle fixing groove；It is existing
Some wafer processing section burnishing device is in use, wafer to be processed is placed in fixing groove and is fixed manually, so
It is polished afterwards by section of the manual polishing machine to wafer；Existing wafer processing is sent out in the burnishing device use of section
It is existing, it is poor to the fixed effect of wafer, the effect of wafer section polishing is influenced, causes practicability lower；And it needs to crystalline substance
Round section carries out repeatedly different degrees of polishing, causes working efficiency lower；Manual polishing machine is in use process with depositing simultaneously
In some potential safety problems.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of fixed effect improved to wafer, to improve to wafer
The effect of section polishing, improves practicability；And the once fixed polishing that brilliant section can be completed, improves working efficiency；Simultaneously
Reduce the wafer processing section burnishing device of security risk.
A kind of wafer processing section burnishing device, including workbench of the invention；It further include left supported plate, right supported plate, top
The top of plate, cylinder and mounting plate, the left supported plate and right supported plate is connect with the left and right side of top plate bottom end respectively, left supported plate
It being connect respectively with the left and right side on workbench top with the bottom end of right supported plate, the cylinder is mounted on the top of top plate, and
The bottom output end of cylinder is provided with telescopic rod, the bottom end of the telescopic rod from the top of top plate pass through top plate and with mounting plate
Top connection, the top of the mounting plate is equipped with two groups of motors, and is provided with shaft in the bottom output end of two groups of motors,
The top of the bottom end self installation plate of two groups of shafts is each passed through mounting plate to the lower section of mounting plate, and at the bottom of two groups of shafts
End is respectively arranged with the first polishing wheel and the second polishing wheel；It further include turntable, swinging strut and fixed device, the workbench
Top is provided with mounting groove, and the first ball bearing is fixedly installed in the mounting groove, and the bottom end of the swinging strut works certainly
The top of platform is inserted into inside the first ball bearing, and the top of swinging strut is fixedly connected with the center bottom of turntable, described solid
Determining device includes the first supporting plate, the second supporting plate, third supporting plate, support plate, two groups of push rods, two groups of support springs, screwed pipe and spiral shell
Rasp bar, first supporting plate, the second supporting plate and third supporting plate are installed in the top of turntable, and the first supporting plate, the second supporting plate
It is set gradually from back to front with third supporting plate, and is provided with installation through-hole in the middle part of third supporting plate, it is solid in the installation through-hole
Dingan County is equipped with the second ball bearing, and the rear end of the screwed pipe passes through the second ball bearing to third branch from the front end of third supporting plate
The rear of plate, the rear end of the threaded rod and the front center of support plate are hinged, and simultaneously spiral shell is filled to screw thread for the front end insertion of threaded rod
Inside the rear end of pipe, the left half and right half of second supporting plate are provided with the perforation that front and back penetrates through, two groups of push rods
Front end be each passed through two groups of support springs and hinged with the left end of support plate and right end respectively, the rear ends of two groups of push rods is from second
The front end of supporting plate is each passed through two groups of perforation to the rear of the second supporting plate, the front end of two groups of support springs respectively with support plate
The left and right side of rear end connects, and the rear end of two groups of support springs is connect with the left and right side of second front edge of board respectively, institute
The left and right side for stating first front edge of board is provided with fixing groove, two groups of fixing grooves be located at two groups of push rods just after
Side, and two groups of fixing grooves are located at the underface of the first polishing wheel and the second polishing wheel.
A kind of wafer of the invention, which is processed, uses section burnishing device, is provided with arc on the rear end face of two groups of push rods
Groove, two groups of arc grooves are opposite with before and after two groups of fixing grooves respectively.
A kind of wafer processing section burnishing device of the invention, further includes locating piece and locating rod, the locating piece is solid
Top of the Dingan County mounted in workbench and the left side positioned at turntable, and it is solid in the cavity that is internally provided with of locating piece, the cavity
Dingan County is equipped with limit plate and limit spring, the left end of the limit spring and right end respectively with the left side wall of cavity and limit plate
Left end connection, the right end of locating piece are provided with the through-hole communicated with cavity, and the right end that self-positioning piece of the left end of the locating rod is worn
It crosses limit hole to stretch in cavity and connect with the right end of limit plate middle part, the left end of the turntable and right end are respectively arranged with a left side
Locating slot and right locating slot, the right end of the locating rod are inserted into left locating slot.
A kind of wafer processing section burnishing device of the invention, further includes pull rod, the top of the locating piece is provided with
Lateral strip-shaped hole, the strip-shaped hole are communicated with cavity, and the top of the self-positioning plate in the bottom end of the pull rod is protruded into across strip-shaped hole
It is connect in cavity and with the top middle portion of limit plate.
A kind of wafer processing section burnishing device of the invention, further includes PLC controller, the telescopic rod and mounting plate
Junction be provided with pressure sensor, the pressure sensor, cylinder and two groups of motors are electrically connected with PLC controller.
A kind of wafer processing section burnishing device of the invention, further includes two groups of gag lever posts, the mounting plate it is left back
End and right rear end are provided with limit hole up and down, the top of the two groups of gag lever posts left rear side with top plate bottom end respectively
Connected with right lateral side, the top of the bottom end self installation plate of two groups of gag lever posts be each passed through two groups of limit holes and respectively with bench top
The left rear side at end is connected with right lateral side.
A kind of wafer processing section burnishing device of the invention, two groups of fixing grooves are triangular structure, described
Rubber slab is provided on the groove face of two groups of arc grooves, the rubber slab is arcuate structure, and is arranged in the rear end of rubber slab
There is anti-skid chequer.
A kind of wafer processing section burnishing device of the invention, the front end of two groups of screwed pipes is provided with rotation handle
Hand.
Beneficial effects of the present invention are compared with prior art：By the way that two groups of contour column wafers are placed in the first supporting plate
And second between supporting plate, and is located at the rear end of two groups of wafers in two groups of fixing grooves, by rotating screwed pipe manually, passes through
The cooperation of screwed pipe and threaded rod drives support plate to move backward, and pushes two groups of push rods to move backward until two groups by support plate
Front end of the rear end of push rod respectively with two groups of wafers is adjacent to, so that two groups of wafers be fixed, passes through two groups of push rods and support plate
Both ends it is hinged, the rear end of threaded rod and the front center of support plate are hinged, can make support plate during moving backward
Inclination, is fixed so as to the wafer to two groups of different-diameters, improves the fixed effect to wafer, to improve to wafer
The effect of section polishing, improves practicability；Telescopic rod is driven to move down by cylinder, telescopic rod drives mounting plate and two groups
Motor moves down, until the bottom end of the first polishing wheel and the second polishing wheel tip contact with two groups of wafers respectively, passes through two
Group motor drives the first polishing wheel and the second polishing wheel high speed rotation respectively, polishes to the section of wafer, during which passes through rotation
Turn pillar and turntable is rotated 180 °, makes to be located at the lower section that the wafer below the first polishing wheel turns to the second polishing wheel originally, lead to
The section for crossing the second polishing wheel again and be wafer is processed by shot blasting, with the first polishing wheel and the second buffing head of different rough surfaces
It changes and the section of wafer is polished, the primary fixed polishing that brilliant section can be completed improves working efficiency；Safety is reduced simultaneously
Hidden danger.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is the overlooking structure diagram of turntable of the present invention and fixed device；
Fig. 3 is partial enlargement structural representation at the A of Fig. 1 of the present invention；
Fig. 4 is the structural schematic diagram of circuit connection of the present invention；
It is marked in attached drawing：1, workbench；2, left supported plate；3, right supported plate；4, top plate；5, cylinder；6, mounting plate；7, telescopic rod；8,
Motor；9, shaft；10, the first polishing wheel；11, turntable；12, swinging strut；13, the first ball bearing；14, the first supporting plate；15,
Second supporting plate；16, third supporting plate；17, support plate；18, push rod；19, support spring；20, screwed pipe；21, threaded rod；22,
Two ball bearings；23, fixing groove；24, arc groove；25, locating piece；26, locating rod；27, limit plate；28, limit spring；
29, right locating slot；30, pull rod；31, strip-shaped hole；32, PLC controller；33, pressure sensor；34, gag lever post；35, rubber slab；
36, rotating handles.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiments of the present invention will be described in further detail.Implement below
Example is not intended to limit the scope of the invention for illustrating the present invention.
As shown in Figures 1 to 4, a kind of wafer of the invention processing section burnishing device, including workbench 1；Further include
The top of left supported plate 2, right supported plate 3, top plate 4, cylinder 5 and mounting plate 6, the left supported plate and right supported plate left side with top plate bottom end respectively
It is connected with right side, the bottom end of left supported plate and right supported plate is connect with the left and right side on workbench top respectively, and cylinder is mounted on top
The top of plate, and the bottom output end of cylinder is provided with telescopic rod 7, the bottom end of telescopic rod passes through top plate simultaneously from the top of top plate
It is connect with the top of mounting plate, the top of mounting plate is equipped with two groups of motors 8, and is respectively provided in the bottom output end of two groups of motors
There is a shaft 9, the top of the bottom end self installation plate of two groups of shafts is each passed through mounting plate to the lower section of mounting plate, and in two groups of shafts
Bottom end be respectively arranged with the first polishing wheel 10 and the second polishing wheel；It further include turntable 11, swinging strut 12 and fixed device, work
The top for making platform is provided with mounting groove, and the first ball bearing 13 is fixedly installed in mounting groove, and the bottom end of swinging strut works certainly
The top of platform is inserted into inside the first ball bearing, and the top of swinging strut is fixedly connected with the center bottom of turntable, fixed dress
It sets including the first supporting plate 14, the second supporting plate 15, third supporting plate 16,17, two groups of support plate 18, two groups of push rod support spring 19, spiral shell
Line pipe 20 and threaded rod 21, the first supporting plate, the second supporting plate and third supporting plate are installed in the top of turntable, and the first supporting plate,
Second supporting plate and third supporting plate are set gradually from back to front, and installation through-hole, installation through-hole are provided in the middle part of third supporting plate
It is inside fixedly installed with the second ball bearing 22, the rear end of screwed pipe passes through the second ball bearing to third from the front end of third supporting plate
The rear of supporting plate, the rear end of threaded rod and the front center of support plate are hinged, and simultaneously spiral shell is filled to screwed pipe for the front end insertion of threaded rod
Rear end inside, the left half and right half of the second supporting plate are provided with the perforation that front and back penetrates through, the front end difference of two groups of push rods
Across two groups of support springs and hinged with the left end of support plate and right end respectively, the rear ends of two groups of push rods is from the front end of the second supporting plate
Two groups of perforation are each passed through to the rear of the second supporting plate, the front end of the two groups of support springs left side and the right side with support plate rear end respectively
Side connection, the rear end of two groups of support springs are connect with the left and right side of second front edge of board respectively, a left side for first front edge of board
Side and right side are provided with fixing groove 23, and two groups of fixing grooves are located at the dead astern of two groups of push rods, and two groups of fixing grooves point
Not Wei Yu the first polishing wheel and the second polishing wheel underface；By the way that two groups of contour column wafers are placed in the first supporting plate and
It between two supporting plates, and is located at the rear end of two groups of wafers in two groups of fixing grooves, by rotating screwed pipe manually, passes through screw thread
Managing the cooperation with threaded rod drives support plate to move backward, and pushes two groups of push rods to move backward until two groups of push rods by support plate
Front end of the rear end respectively with two groups of wafers be adjacent to, so that two groups of wafers be fixed, pass through the two of two groups of push rods and support plate
End is hinged, and the rear end of threaded rod and the front center of support plate are hinged, support plate can be made to tilt during moving backward,
It is fixed so as to the wafer to two groups of different-diameters, improves the fixed effect to wafer, to improve to wafer section
The effect of polishing improves practicability；Telescopic rod is driven to move down by cylinder, telescopic rod drives mounting plate and two groups of motors
It moves down, until the bottom end of the first polishing wheel and the second polishing wheel tip contact with two groups of wafers respectively, passes through two groups of electricity
Machine drives the first polishing wheel and the second polishing wheel high speed rotation respectively, polishes to the section of wafer, during which passes through rotation branch
Turntable is rotated 180 ° by column, and the wafer being located at below the first polishing wheel originally is made to turn to the lower section of the second polishing wheel, by the
Two polishing wheels are that the section of wafer is processed by shot blasting again, the first polishing wheel and the second polishing wheel rotation pair with different rough surfaces
The section of wafer is polished, and the primary fixed polishing that brilliant section can be completed improves working efficiency；It is hidden that safety is reduced simultaneously
Suffer from.
A kind of wafer of the invention, which is processed, uses section burnishing device, is provided with arc groove on the rear end face of two groups of push rods
24, two groups of arc grooves are opposite with before and after two groups of fixing grooves respectively；It is matched, is improved to wafer by arc groove and fixing groove
Fixed effect.
A kind of wafer processing section burnishing device of the invention, further includes locating piece 25 and locating rod 26, locating piece is solid
Top of the Dingan County mounted in workbench and the left side positioned at turntable, and the fixed peace in the cavity that is internally provided with of locating piece, cavity
Equipped with limit plate 27 and limit spring 28, the left end of limit spring and the right end left end with the left side wall of cavity and limit plate respectively
Connection, the right end of locating piece are provided with the through-hole communicated with cavity, and the right end that self-positioning piece of the left end of locating rod passes through limit hole
Stretch in cavity and with connect in the middle part of the right end of limit plate, the left end of turntable and right end is respectively arranged with left locating slot and the right side is determined
Position slot 29, the right end of locating rod are inserted into left locating slot；It is right in left locating slot or right locating slot to be inserted by locating rod
Turntable is positioned.
A kind of wafer processing section burnishing device of the invention, further includes pull rod 30, the top of locating piece is provided with cross
To strip-shaped hole 31, strip-shaped hole is communicated with cavity, and the top of the self-positioning plate in the bottom end of pull rod passes through strip-shaped hole and stretches in cavity
And it is connect with the top middle portion of limit plate；When needing to rotate turntable, by Zola's pull rod, driving limit plate to moving to left
It moves and compresses limit spring, so that the right end of locating rod is detached from left locating slot, turntable can be rotated, then in limit bullet
Locating rod is pushed into right locating slot under the action of spring force, improves use reliability.
A kind of wafer processing section burnishing device of the invention, further includes PLC controller 32, telescopic rod and mounting plate
Junction is provided with pressure sensor 33, and pressure sensor, cylinder and two groups of motors are electrically connected with PLC controller；Pass through pressure
Force snesor detects the pressure size between the first polishing wheel and the second polishing wheel and wafer section, and will test
Pressure information passes to PLC controller, controls cylinder by PLC controller, makes the first polishing wheel and the second polishing wheel and wafer
Pressure between section keeps certain, improves the polishing effect to wafer section.
A kind of wafer processing section burnishing device of the invention, further includes two groups of gag lever posts 34, the left back end of mounting plate
It is provided with limit hole up and down with right rear end, the top of two groups of gag lever posts is respectively and after the left rear side of top plate bottom end and the right side
Side connection, the top of the bottom end self installation plate of two groups of gag lever posts is each passed through two groups of limit holes and the respectively left side with workbench top
Rear side is connected with right lateral side；Stability when guaranteeing that mounting plate moves up and down by two groups of gag lever posts.
A kind of wafer processing section burnishing device of the invention, two groups of fixing grooves are triangular structure, two groups of arcs
Rubber slab 35 is provided on the groove face of groove, rubber slab is arcuate structure, and the rear end of rubber slab is provided with anti-skid chequer；Gu
Determining slot is triangular structure, increases the contact point with wafer, and compound rubber plate further increases the fixed effect to wafer.
A kind of wafer processing section burnishing device of the invention, the front end of two groups of screwed pipes is provided with rotating handles
36；Screwed pipe is rotated by the way that rotating handles are convenient, improves use reliability.
A kind of wafer processing section burnishing device of the invention, at work, before completing above-mentioned movement, first
It is moved into the position of user's needs, two groups of contour column wafers are placed between the first supporting plate and the second supporting plate, and is made
The rear end of two groups of wafers is located in two groups of fixing grooves, is driven rotated threaded tubular by rotating rotating handles manually, is passed through spiral shell
The cooperation of line pipe and threaded rod drives support plate to move backward, and pushes two groups of push rods to move backward by support plate until two groups push away
Front end of the rear end of bar respectively with two groups of wafers is adjacent to, and is respectively clamped into the front end of two groups of wafers in two groups of arc grooves, is passed through
Rubber slab further increases the fixed effect to wafer, and the both ends by two groups of push rods and support plate are hinged, the rear end of threaded rod
It is hinged with the front center of support plate, support plate can be made to tilt during moving backward, so as to two groups of differences
The wafer of diameter is fixed, and improves the fixed effect to wafer, to improve the effect polished to wafer section, passes through cylinder
Telescopic rod is driven to move down, telescopic rod drives mounting plate and two groups of motors to move down, until the first polishing wheel and second
The bottom end of the polishing wheel tip contact with two groups of wafers respectively drives the first polishing wheel and second to polish respectively by two groups of motors
High speed rotation is taken turns, the section of wafer is polished, turntable is during which rotated 180 ° by swinging strut, makes to be located at first originally
Wafer below polishing wheel turns to the lower section of the second polishing wheel, is carried out at polishing by the section that the second polishing wheel is wafer again
Reason, polishes the section of wafer with the first polishing wheel of different rough surfaces and the second polishing wheel rotation, primary fixed
The polishing for completing brilliant section, improves working efficiency；Security risk is reduced simultaneously, left locating slot or the right side are inserted by locating rod
Turntable is positioned in locating slot, when needing to rotate turntable, by driving limit plate to be moved to the left to Zola's pull rod
And compress limit spring, so that the right end of locating rod is detached from left locating slot, turntable can be rotated, then in limit spring
Locating rod is pushed into right locating slot under the action of elastic force, improves use reliability, is polished by pressure sensor to first
Wheel and the pressure size between the second polishing wheel and wafer section are detected, and the pressure information that will test passes to PLC
Controller controls cylinder by PLC controller, keeps the pressure between the first polishing wheel and the second polishing wheel and wafer section
Centainly, the polishing effect to wafer section is improved.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, several improvements and modifications, these improvements and modifications can also be made
Also it should be regarded as protection scope of the present invention.
Claims (8)
1. a kind of wafer processing section burnishing device, including workbench；It is characterized in that, further including left supported plate（2）, right supported plate
（3）, top plate（4）, cylinder（5）And mounting plate（6）, the left supported plate（2）And right supported plate（3）Top respectively with top plate（4）Bottom
The left and right side at end connects, left supported plate（2）And right supported plate（3）Bottom end respectively with workbench（1）The left and right side on top
Connection, the cylinder（5）It is mounted on top plate（4）Top, and in cylinder（5）Bottom output end be provided with telescopic rod（7）, institute
State telescopic rod（7）Bottom end from top plate（4）Top pass through top plate（4）And and mounting plate（6）Top connection, the mounting plate
（6）Top two groups of motors are installed（8）, and in two groups of motors（8）Bottom output end be provided with shaft（9）, described two
Group shaft（9）Bottom end self installation plate（6）Top be each passed through mounting plate（6）To mounting plate（6）Lower section, and two groups turn
Axis（9）Bottom end be respectively arranged with the first polishing wheel（10）With the second polishing wheel；It further include turntable（11）, swinging strut（12）With
Fixed device, the workbench（1）Top be provided with mounting groove, the first ball bearing is fixedly installed in the mounting groove
（13）, the swinging strut（12）Bottom end from workbench（1）Top be inserted into the first ball bearing（13）Inside, rotation branch
Column（12）Top and turntable（11）Center bottom be fixedly connected, the fixed device include the first supporting plate（14）, second
Plate（15）, third supporting plate（16）, support plate（17）, two groups of push rods（18）, two groups of support springs（19）, screwed pipe（20）And screw thread
Bar（21）, first supporting plate（14）, the second supporting plate（15）With third supporting plate（16）It is installed in turntable（11）Top, and
First supporting plate（14）, the second supporting plate（15）With third supporting plate（16）It sets gradually from back to front, and in third supporting plate（16）In
Portion is provided with installation through-hole, and the second ball bearing is fixedly installed in the installation through-hole（22）, the screwed pipe（20）After
It holds from third supporting plate（16）Front end pass through the second ball bearing（22）To third supporting plate（16）Rear, the threaded rod（21）
Rear end and support plate（17）Front center it is hinged, threaded rod（21）Front end insertion and spiral shell be filled to screwed pipe（20）Rear end
Inside, second supporting plate（15）Left half and right half be provided with front and back penetrate through perforation, two groups of push rods（18）
Front end be each passed through two groups of support springs（19）And respectively with support plate（17）Left end and right end it is hinged, two groups of push rods（18）
Rear end from the second supporting plate（15）Front end be each passed through two groups of perforation to the second supporting plate（15）Rear, two groups of support bullets
Spring（19）Front end respectively with support plate（17）The left and right side of rear end connects, two groups of support springs（19）Rear end respectively with
Second supporting plate（15）The left and right side of front end connects, first supporting plate（14）The left and right side of front end is provided with fixation
Slot（23）, two groups of fixing grooves（23）It is located at two groups of push rods（18）Dead astern, and two groups of fixing grooves（23）Respectively
Positioned at the first polishing wheel（10）With the underface of the second polishing wheel.
2. a kind of wafer processing section burnishing device as described in claim 1, which is characterized in that two groups of push rods（18）
Rear end face on be provided with arc groove（24）, two groups of arc grooves（24）Respectively with two groups of fixing grooves（23）Front and back phase
It is right.
3. a kind of wafer processing section burnishing device as claimed in claim 2, which is characterized in that further include locating piece（25）
And locating rod（26）, the locating piece（25）It is fixedly mounted on workbench（1）Top and be located at turntable（11）Left side, and
Locating piece（25）Be internally provided with cavity, be fixedly installed with limit plate in the cavity（27）And limit spring（28）, described
Limit spring（28）Left end and right end respectively with the left side wall of cavity and limit plate（27）Left end connection, locating piece（25）'s
Right end is provided with the through-hole communicated with cavity, the locating rod（26）Self-positioning piece of left end（25）Right end stretched across limit hole
Enter in cavity and and limit plate（27）Right end in the middle part of connection, the turntable（11）Left end and right end be respectively arranged with it is left fixed
Position slot and right locating slot（29）, the locating rod（26）Right end be inserted into left locating slot.
4. a kind of wafer processing section burnishing device as claimed in claim 3, which is characterized in that further include pull rod（30）,
The locating piece（25）Top be provided with lateral strip-shaped hole（31）, the strip-shaped hole（31）It is communicated with cavity, the pull rod
（30）The self-positioning plate in bottom end top pass through strip-shaped hole（31）It stretches in cavity and and limit plate（27）Top middle portion connect
It connects.
5. a kind of wafer processing section burnishing device as claimed in claim 4, which is characterized in that further include PLC controller
（32）, the telescopic rod（7）With mounting plate（6）Junction be provided with pressure sensor（33）, the pressure sensor（33）,
Cylinder（5）With two groups of motors（8）And PLC controller（32）Electrical connection.
6. a kind of wafer processing section burnishing device as claimed in claim 5, which is characterized in that further include two groups of gag lever posts
（34）, the mounting plate（6）Left back end and right rear end be provided with limit hole up and down, two groups of gag lever posts（34）
Top respectively with top plate（4）The left rear side of bottom end is connected with right lateral side, two groups of gag lever posts（34）Bottom end self installation plate（6）'s
Top be each passed through two groups of limit holes and respectively with workbench（1）The left rear side on top is connected with right lateral side.
7. a kind of wafer processing section burnishing device as claimed in claim 6, which is characterized in that two groups of fixing grooves
（23）It is triangular structure, two groups of arc grooves（24）Groove face on be provided with rubber slab（35）, the rubber slab
（35）For arcuate structure, and in rubber slab（35）Rear end be provided with anti-skid chequer.
8. a kind of wafer processing section burnishing device as claimed in claim 7, which is characterized in that two groups of screwed pipes
（20）Front end be provided with rotating handles（36）.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811060249.6A CN108908075A (en) | 2018-09-12 | 2018-09-12 | A kind of wafer processing section burnishing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811060249.6A CN108908075A (en) | 2018-09-12 | 2018-09-12 | A kind of wafer processing section burnishing device |
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| Publication Number | Publication Date |
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| CN108908075A true CN108908075A (en) | 2018-11-30 |
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|---|---|---|---|
| CN201811060249.6A Pending CN108908075A (en) | 2018-09-12 | 2018-09-12 | A kind of wafer processing section burnishing device |
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| CN109746522A (en) * | 2019-01-16 | 2019-05-14 | 江西立德传动设备有限公司 | Bead cutter is used in a kind of manufacture of speed reducer |
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