CN108907615A - Processing method, center component and the electronic device of center component - Google Patents
Processing method, center component and the electronic device of center component Download PDFInfo
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- CN108907615A CN108907615A CN201810696849.5A CN201810696849A CN108907615A CN 108907615 A CN108907615 A CN 108907615A CN 201810696849 A CN201810696849 A CN 201810696849A CN 108907615 A CN108907615 A CN 108907615A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The application provides processing method, center component and the electronic device of a kind of center component.The processing method of the center component includes：First blank is provided；Extrusion forming is carried out to first blank, with plate and the framework blank to extend out from the periphery of the middle plate in formation；Milling Process is carried out to the framework blank, to form the frame with slit；Non-signal is filled in the slit and shields medium, to obtain center component.The technical solution of the application helps to shorten process time, reduces cost.
Description
Technical field
This application involves electronic technology field more particularly to a kind of processing methods of center component, center component and electronics
Device.
Background technique
Electronic device generally includes front cover, rear cover and center component.Front cover is oppositely arranged with rear cover, and front cover, rear cover
And center component cooperates to accommodate function element in electronic device, such as circuit board, battery etc..Center component generally wraps
Include middle plate and frame.In traditional technology, frame is fixedly connected by welding again after individually processing with center, however, right
During frame and center are processed, in order to obtain preferable appearance, computer digital control machine tool is generallyd use
(Computer numerical control, CNC) processing, higher cost.
Summary of the invention
The application provides a kind of processing method of center component, and the processing method of the center component includes：
First blank is provided；
Extrusion forming is carried out to first blank, with plate and the framework to extend out from the periphery of the middle plate in formation
Blank；
Milling Process is carried out to the framework blank, to form the frame with slit；
Non-signal is filled in the slit and shields medium, to obtain center component.
The processing method of center component provided by the present application forms integration by carrying out extrusion forming to the first blank
Then molding middle plate and framework blank carry out Milling Process to framework blank, the frame with slit is obtained, then to slit
In filling non-signal shield medium, obtain center component.Compared in traditional technology frame and center individually process after again into
Row is welded and fixed connection, and the application is since middle plate and framework blank are using extruding integrated molding, thus in simplifying and preparing
The process of plate and frame, and during extrusion forming, can be formed together in structural member on plate, therefore, the application
The time for facilitating shortening Milling Process, reduce cost.
The application also provides a kind of center component, the processing method that the center component uses center component as described above
It is process.
The application also provides a kind of electronic device, and the electronic device includes center component as described above.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the application embodiment
Attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is some embodiments of the application, for this field
For those of ordinary skill, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of flow chart of the processing method for center component that the embodiment of the present application one provides.
Fig. 2 is the corresponding structural schematic diagram of step S100 in the embodiment of the present application one.
Fig. 3 is the structural schematic diagram of the corresponding AA cross-sectional view of step S200 in the embodiment of the present application one.
Fig. 4 is the structural schematic diagram that the middle plate of the embodiment of the present application one forms the AA cross-sectional view of structural member.
Fig. 5 is a kind of flow chart of the processing method for center component that the embodiment of the present application two provides.
Fig. 6 is the corresponding structural schematic diagram of step S210 in the embodiment of the present application two.
Fig. 7 is the corresponding structural schematic diagram of step S300 in the embodiment of the present application two.
Fig. 8 is the structural schematic diagram that connector is formed in the embodiment of the present application two.
Fig. 9 is the corresponding local flow chart of the processing method of the center component of one preferred embodiment of the application.
Figure 10 is the corresponding local flow chart of the step S300 of the embodiment of the present application one.
Figure 11 is the corresponding structural schematic diagram of step S330 of the embodiment of the present application one.
Figure 12 is the corresponding local flow chart of step S400 in the embodiment of the present application one.
Figure 13 is a kind of flow chart of the processing method for center component that the embodiment of the present application three provides.
Figure 14 is the corresponding structural schematic diagram of step S150 of the embodiment of the present application three.
Figure 15 is a kind of flow chart of the processing method for center component that the embodiment of the present application four provides.
Figure 16 is the structural schematic diagram for the center component that one preferred embodiment of the application provides.
Figure 17 is the structural schematic diagram for the electronic device that one preferred embodiment of the application provides.
Figure 18 is the structural schematic diagram of the BB cross-sectional view for the electronic device that Figure 17 is provided.
Specific embodiment
Below in conjunction with the attached drawing in the application embodiment, the technical solution in the application embodiment is carried out clear
Chu is fully described by, it is clear that described embodiment is only a part of embodiment of the application, rather than whole realities
Apply mode.Based on the embodiment in the application, those of ordinary skill in the art institute under that premise of not paying creative labor
The every other embodiment obtained, shall fall in the protection scope of this application.
Referring to Fig. 1, Fig. 1 is a kind of flow chart of the processing method for center component that the embodiment of the present application one provides.?
In present embodiment, the processing method of the center component includes but is not limited to step S100, S200, S300 and S400, about
Step S100, S200, S300 and S400 are described in detail as follows.
S100：First blank 100 is provided.Referring to Fig. 2, Fig. 2 is the corresponding knot of step S100 in the embodiment of the present application one
Structure schematic diagram.
Wherein, blank refers to the raw material to be processed for not reaching final size and shape.The material of first blank 100 can
Think the materials such as aluminium alloy, titanium alloy either stainless steel.First blank 100 can directly be provided by supplier, can also be by
What other profiles obtained after processing.
S200：Extrusion forming is carried out to first blank 100, with plate 200 in being formed and from the periphery of the middle plate 200
The framework blank 300 to extend out.Referring to Fig. 3, Fig. 3 is the corresponding AA cross-sectional view of step S200 in the embodiment of the present application one
Structural schematic diagram.
Wherein, framework blank 300 is metal material, and the material of framework blank 300 can be for aluminium alloy, titanium alloy either
The materials such as stainless steel.
Wherein, " extrusion forming " is a kind of processing method of blank, and process is blank in the uneven compression of three-dimensional
Under effect, is squeezed out from the aperture of extrusion die or gap and be allowed to cross-sectional area reduction length increase, become required product.
Optionally, in one embodiment, before squeezing the first blank 100, first to the first blank 100 into
Row the pre-heat treatment.The warm-up movement for promoting metallic molecule in first blank 100, after preheating, molecular structure carries out weight
New arrangement, the metallization structure of adjustable first blank 100 help to eliminate stress, so that first blank
100 have more excellent mechanical property.
Optionally, in another embodiment, when squeezing the first blank 100, to first blank 100
Repeatedly squeeze with plate 200 and the framework blank 300 to extend out from the periphery of the middle plate 200 in being formed, and to described
When first blank 100 is repeatedly squeezed, to the extruding dynamics of first blank 100 when being gradually increased each extruding.
For example, n times extruding is carried out to first blank 100, the extruding force that every n times squeeze is denoted as Fn, then meets
Fn>Fn-1>…>F1, wherein n is the integer more than or equal to 2.When squeezing in this way first blank 100, (n-1)th
It is secondary squeeze corresponding extruding force Fn-1 and be less than n-th squeeze corresponding extruding force Fn, can be improved first blank 100 can
Plasticity, i.e., the extruding dynamics squeezed next time are greater than the last extruding dynamics squeezed, help to improve first blank 100
Plasticity, and then increase the toughness of first blank 100, improve the metal cutting performance of first blank 100, thus
Plate 200 and the framework blank 300 to extend out from the periphery of the middle plate 200 in acquisition that can be more convenient.
Optionally, the middle plate 200 and framework blank 300 may be constructed integral structure, the shape in same manufacturing procedure
At middle plate 200 and framework blank 300, to help to save manufacturing procedure, shorten the process-cycle of product.By to the first base
Part carries out extrusion forming, forms the middle plate and framework blank of integrated molding.Compared to the frame and center list in traditional technology
It solely carries out that connection is welded and fixed again after processing, the application is since middle plate and framework blank use and squeeze integrated molding, thus simple
Changed the process for preparing middle plate and frame, and during extrusion forming, can be formed together in structural member on plate,
Therefore, the application helps to shorten the time of Milling Process, reduces cost.
Referring to Figure 2 together and Fig. 4, Fig. 4 be the embodiment of the present application one middle plate formed structural member AA cross-sectional view knot
Structure schematic diagram.Extrusion forming is being carried out to first blank 100, is being prolonged with plate 200 in formation and from the periphery of the middle plate 200
When the framework blank 300 stretched, the structural member 210 on the middle plate 200 is also formed.
Wherein, structural member 210 can be for the locating piece on middle plate 200, the baffle arrangement being also possible on middle plate 200, also
It can be the screw pole etc. on plate 200.Since multiple structural members 210 can carry out extrusion forming to the first blank 100
During, it is disposable to be formed, mass production is helped to realize, while greatly shortening the process-cycle, reduces processing
Cost.
Specifically, the mold that extrusion forming uses includes cavity plate and punch-pin, the first blank 100 be located at cavity plate and punch-pin it
Between, punch-pin is mounted on the cover half of extrusion molding dies, and cavity plate is mounted on the dynamic model of extrusion molding dies, cavity plate and punch-pin phase
Mutually cooperation is to realize the extruding to the first blank 100, so that the first blank 100 generates deformation, to be formed on the middle plate 200
Structural member 210.
Referring to Fig. 5, Fig. 5 is a kind of flow chart of the processing method for center component that the embodiment of the present application two provides.?
In this implementation embodiment, in " the S200：Extrusion forming is carried out to first blank 100, with plate 200 in formation and certainly
After the framework blank 300 " that the periphery of the middle plate 200 extends out, in " the S300：The framework blank 300 is carried out
Milling Process, before forming the frame 310 " with slit 310a, the processing method of the center component further includes but unlimited
In S210 and S220, about being described in detail as follows for step S210 and S220.
S210：Detect the location parameter of the several points on the structural member 210.Referring to Fig. 6, Fig. 6 is the application reality
Apply the corresponding structural schematic diagram of step S210 in example two.
Optionally, the mode for detecting the location parameter of the several points on the structural member 210 can use ultrasound
Away from method.Peripheral part M1, M2 from ultrasonic distance-measuring sensor to the structural member 210 ..., Mn emit several ultrasonic waves
Signal can determine the structural member 210 using the time difference between the ultrasonic signal and received ultrasonic signal of transmitting
On several points structural parameters.
It should be understood that in other embodiments, detecting the location parameter of the several points on the structural member 210
Mode can also be using infrared distance measurement, binocular distance measurement or three-dimensionalreconstruction etc. mode.
Optionally, in one embodiment, the location parameter of the multiple points detected on the structural member 210 is carried out
Screening, will weed out with other positions parameter difference away from biggish location parameter in multiple location parameters, to exclude a few locations ginseng
The situation of whole statistical result inaccuracy caused by number inaccuracy, it is ensured that the location parameter counted is accurate and reliable.Specifically,
A preset range can be determined, for example, if the difference between two location parameters can achieve between-δ to δ
It is expected that calculated result, then [- δ, δ] is exactly the preset difference value range for the condition that meets.The position of the point detected on the structural member
Setting parameter can be the position coordinates of the point detected on the structural member.By taking three points P1, P2, P3 on structural member as an example into
Row explanation, if the difference DELTA δ between P1 and the position coordinates of P21∈ [- δ, δ], and the difference between P2 and the position coordinates of P3
Δδ2∈ [- δ, δ], and the difference DELTA δ between P1 and the position coordinates of P33∈ [- δ, δ], then it is assumed that described P1, P2 and P3's
Position coordinates difference within a preset range, otherwise it is assumed that the difference of position coordinates not within a preset range, is needed location parameter
Weed out, then according in database point a1, a2 ..., an determine the structural parameters of the structural member 210, according to a1,
A2 ..., an can simulate the threedimensional model of structural member 210, and the technical program helps to ensure that the accuracy of result,
Obtain the threedimensional model of more accurate structural member 210.
S220：On the basis of the location parameter, the processing road that Milling Process is carried out to the framework blank 300 is determined
Diameter.
Wherein, the process of Milling Process can be by computer digital control machine tool (Computerized Numerical
Control Machine, CNC) it completes.
Specifically, the structure can be simulated due to the location parameter for detecting the several points on the structural member 210
The more accurate threedimensional model of part 210, accordingly, it is possible to be determined using the location parameter of the structural member 210 as benchmark to institute
State the machining path that framework blank 300 carries out Milling Process.
Further, since the more accurate threedimensional model of the structural member 210 can be obtained, then, so that it may obtain
The coordinate of the geometric center of the structural member 210, when carrying out Milling Process to the framework blank 300, with the structural member
210 geometric center is the starting point to knife, then formulates the feed path of CNC, completes the processing to framework blank 300.This skill
Art scheme is formulated the machining path for carrying out Milling Process to the framework blank 300, is realized using structural member 210 as reference
To the multiplexing functions of structural member 210.The time for reducing the machining path of determining framework blank 300 helps to reduce and be processed into
This.
S300：Milling Process is carried out to the framework blank 300, to form the frame 310 with slit 310a.It please refers to
Fig. 7, Fig. 7 are the corresponding structural schematic diagrams of step S300 in the embodiment of the present application two.
Specifically, carrying out Milling Process to the framework blank 300, when forming the frame 310 with slit 310a,
The processing of the first precision is first carried out to framework blank 300, then the processing of the second precision is carried out to the framework blank 300, second
Precision is higher than the first precision, i.e. the first precision is processed as roughing, and the second precision is processed as finishing.On the one hand, it helps
In the time that the framework blank 300 is processed in shortening, to be quickly obtained framework blank 300；On the other hand, Ke Yibao
The appearance that card obtains frame 310 is relatively smooth, and helps avoid processing the framework blank 300 and scrap, and improves wave
The problem of taking material.
Referring to Fig. 8, Fig. 8 is the structural schematic diagram for forming connector in the embodiment of the present application two.Specifically, described
"S300：Milling Process is carried out to the framework blank 300, to be formed in the process of the frame 310 " with slit 310a, is also wrapped
Include the connector 220 to be formed between the frame 310 and the middle plate 200, wherein when forming connector 220 with
The slit 310a and the structural member 210 are that reference is processed.
And it is further, Milling Process is carried out to the framework blank 300, to form the frame 310 with slit 310a
And when forming the connector 220 between the frame 310 and the middle plate 200, with the slit 310a and the structure
Part 210 is positioning reference, carries out clamping position to the frame 310 and the middle plate 200 using fixture.
Wherein, " fixture " is used to fix processing object during referring to machine-building, is allowed to occupy correct position, to connect
By the device of construction or testing, also known as fixture.In a broad sense, any process in technical process, be used to rapidly, conveniently,
The device for safely installing workpiece, all can be described as fixture.
Specifically, due to being initially formed frame 310 with slit 310a and with the middle plate 200 of structural member 210, in
It is, so that it may with the slit 310a and the structural member 210 to position reference, process the frame 310 and the middle plate
Connector 220 between 200.Further, it is fixed clamp to the slit 310a and the structural member 210 using fixture
Position carries out Milling Process using position of the CNC to 300 connecting middle plate 200 of framework blank, to form the frame by material reducing
Connector 220 between 310 and the middle plate 200.The technical program using the slit 310a and the structural member 210 as
Positioning reference is realized with this come the connector 220 formed between the frame 310 and the middle plate 200 to the slit
The multiplexing functions of 310a and the structural member 210 reduce the time of the position of determining connector 220, save cost.
Referring to Fig. 9, Fig. 9 is the corresponding local process of processing method of the center component of one preferred embodiment of the application
Figure.Described " with the slit 310a and the structural member 210 to position reference, using fixture to the frame 310 and institute
State plate 200 carry out clamping position " before, the processing method of the center component further include but be not limited to step S310 and
S320 is described in detail as follows about step S310 and S320.
S310：Form the first flexible part 410 for being arranged in the slit 310a, first flexible part 410 for pair
The frame 310 forms protection, prevents the fixture from causing to damage to the frame 310.
Specifically, on the one hand, first flexible part 410 is used to form frame 310 and protect, on the other hand, described the
One flexible part 410 is used to increase the frictional force between fixture and frame 310.Optionally, the first flexible part 410 can be flexible cloth
Material, or flexible plastic cement.Optionally, in one embodiment, first flexible part 410 can also be fixed
On the retaining part of fixture.It should be understood that in other embodiments, directlying adopt flexible fixture to the frame 310
It is clamped, to prevent opposite side frame 310 from causing to damage.
S320：The second flexible part 420 that 210 surface of structural member is set is formed, second flexible part 420 is used for
The structural member 210 is formed and is protected, prevents the fixture from causing to damage to the structural member 210.
Specifically, second flexible part 420 can be silica gel sheath, second flexible part 420 is set in the structure
On part 210, on the one hand, second flexible part 420 is used to form structural member 210 and protect, and on the other hand, described second is flexible
Portion 420 is used to increase the frictional force between fixture and structural member 210.Optionally, the fixture can be scroll chuck, using three
The structural member 210 is carried out clamping position by dog chuck, three-point fix principle is utilized, positioning is stronger, so as to obtain
Obtain the connector 220 between the frame 310 and the middle plate 200 of degree of precision.
Referring to Fig. 10, Figure 10 is the corresponding local flow chart of step S300 of the embodiment of the present application one.It is described " to described
Framework blank 300 carries out Milling Process, includes but is not limited to step S330 to form the frame 310 " with slit 310a, about
Step S330's is described in detail as follows.
S330：Form the substrate 320 of the corresponding slit 310a setting, the substrate 320 to the slit 310a into
For forming support to non-signal shielding medium 330 during row filling non-signal shielding medium 330.Specifically, asking
1, Figure 11 is the corresponding structural schematic diagram of step S330 of the embodiment of the present application one refering to fig. 1.
Optionally, non-signal shielding medium 330 can be colloid.
Specifically, retaining described in 300 face of framework blank when carrying out material reducing processing to the framework blank 300
The part of slit 310a, to form the substrate 320.Optionally, in a better embodiment, in specifically filling non-signal screen
During covering medium 330, the direction of filling non-signal shielding medium 330 is vertical with the surface of the substrate 320, so that
The substrate 320 preferably can form support to non-signal shielding medium 330, avoid the non-signal shielding medium
330 pairs of middle plates 200 for having completed processing pollute, and cause to do over again.It should be strongly noted that having filled non-signal shielding
After medium 330, it is also necessary to remove the substrate 320.Therefore, filled non-signal shielding medium 330 after, it is also necessary to adopt
The substrate 320 is removed with CNC processing, in the process, the micro- of the frame 310 can also be removed using CNC processing together
It stitches non-signal extra in 310a and shields medium 330, to improve the appearance consistency of the frame 310, so that the frame 310
Surface it is more smooth.
S400：Non-signal is filled in the slit 310a and shields medium 330, to obtain center component 10.
Figure 12 is please referred to, Figure 12 is the corresponding local flow chart of step S400 in the embodiment of the present application one." the S400：
In to the slit 310a fill non-signal shielding medium 330 " include but is not limited to step S410, S420, S430, S440 and
S450, about being described in detail as follows for step S410, S420, S430, S440 and S450.
S410：First medium 331 is filled into the slit 310a.
Specifically, the first medium 331 is liquid glue.Because liquid glue has preferable mobility, to
In the slit 310a when filling first medium 331, the slit 310a can be preferably filled, can prevent to leak
The problems such as glue, few glue etc., to ensure that the frame 310 has better water proof and dust proof performance, and then promote electronic device
Overall sealing performance.
S420：Solidify the first medium 331, forms the first sealant 332.
Optionally, the mode for solidifying the first medium 331 can be ultraviolet curing, and it is solid to be also possible to baking
Change, the application to solidify the mode of the first medium 331 without limitation, it is any can reach the first medium 331 is formed
Cured mode be all it is feasible, all this application claims in the range of.The first medium 331 after solidification have compared with
Big density may be constructed the first sealant of the frame 310, play the role of water proof and dust proof, to the frame 310 formation
A degree of seal protection.
S430：Second medium 333 is filled into the slit 310a, it is close that the second medium 333 is covered on described first
The surface of sealing 332.
S440：It blows to the second medium 333, so that the second medium 333 fills up the slit 310a.
S450：Solidify the second medium 333, forms the second sealant 334.
Optionally, in one embodiment, the viscosity of the second medium 333 is greater than the viscous of the first medium 331
Degree.
Optionally, the viscosity of the first medium 331 is less than the viscosity of the second medium 333.The first medium 331
It is all made of liquid glue with the second medium 333, since the viscosity of the first medium 331 is less than the second medium 333
Viscosity, therefore compared to the second medium 333 for, the first medium 331 has better mobility.To described
The first medium 331 is first filled when filling non-signal shielding medium 330 in slit 310a, because of the first medium
331 mobility is more preferable, can preferably be filled in the slit 310a, after then solidifying the first medium 331, shape
At the first sealant 332.The second medium 333 is refilled, at this moment first sealant 332 can be to the second medium
333 form a degree of support, and the second medium 333 can have sufficient time solidification, shape in the slit 310a
At the second leakproofness 334 of better quality, guarantee the airtight quality of the frame 310, and then guarantees the whole of the electronic device
Body sealing performance.
Optionally, realize that the mode to slit 310a filling non-signal shielding medium 330 can be dispenser filler,
It is also possible to other filler modes, the mode of the opposite slit 310a filling non-signal shielding medium 330 of the application is not done
It limits.
Furthermore, it is necessary to illustrate, the application for point glue equipment number without limitation, can have a dispensing
Device can also have multiple point glue equipments, specifically, can be in conjunction with filler when effect determine the number of point glue equipment.
For example, it if the item number of the slit 310a is more, needs larger to the slit 310a amount for dispensing glue, is then arranged multiple
Point glue equipment, using multiple dispenser dispensings.On the contrary, if the item number of the slit 310a only has one, only with a point
Adhesive dispenser.
Furthermore, it is necessary to illustrate, the application shields medium 330 for filling non-signal into the slit 310a
Number also without limitation, the number that colloid is filled into the slit 310a can be once, be also possible to it is multiple, specifically
Ground, effect when can be in conjunction with filler determine point glue equipment number for dispensing glue.To be carried out twice into the slit 310a
It is illustrated for filling colloid.The non-signal shielding medium 330 includes first medium 331 and second medium 333.Specifically
First medium 331 is first filled on ground, is solidified to form the first sealant 332, is then refilled second medium 333, is formed by curing the
Two sealants 334, first sealant 332 have supporting role to second sealant 334.To the slit 310a
When interior filling colloid, it can pressurize to the colloid filled in the slit 310a, be filled out with being discharged in the slit 310a
The bubble of the colloid filled.Specifically, in one embodiment, when to first medium 331 is filled in the slit 310a, to institute
The pressurization of first medium 331 is stated, to exclude the bubble in the slit 310a.The mode pressurizeed to the first medium 331
It can be but be not limited only to for supercharging device is unified, for example：Booster pump.Pressurizeing to the first medium 331 can
To help the first medium 331 filled in the slit 310a preferably to flow, fill in the slit 310a first is situated between
The generation of the problems such as bubble discharge in matter 331, preventing from cementing leakage, few glue, enhances the overall tightness of finally formed frame 310
Energy.
Furthermore, it is necessary to illustrate, the direction that first medium 331 is filled into the slit 310a is to can change
, the direction that first medium 331 is filled into the slit 310a can be the direction perpendicular to the substrate 320, can also be with
It is parallel to the direction of the substrate 320, can also be and tilt filler, this Shen with the direction of the substrate 320 at an angle
Please in the opposite slit 310a filling first medium 331 direction without limitation, without departing from technical scheme
Original idea, all this application claims in the range of, be regarded as meeting condition.
Optionally, realize that the device of air blowing can be air feeder etc. instrument.The application does not do the mode for realizing air blowing
Limit, without departing from the original idea of technical scheme, all this application claims in the range of, be regarded as meeting item
The blowing method of part.
Furthermore, it is necessary to illustrate, the application for blowning installation number without limitation, can have an air blowing
Device can also have multiple blowning installations, specifically, can blow in conjunction with the effect of colloid is filled into the slit to determine
The number of device.Furthermore, it is necessary to illustrate, the application for air blowing number also without limitation, air blowing number can be with
It is once, to be also possible to repeatedly, specifically, can determine air blowing number in conjunction with the effect of colloid is filled into the slit.
Furthermore, it is necessary to illustrate, the direction that the colloid filled into the slit 310a is blown is to can change
, the direction that the first medium 331 filled into the slit 310a is blown can be perpendicular to the substrate 320, can also be with
It is parallel to the substrate 320, can also be with the substrate 320 at an angle, the opposite slit 310a of the application
The direction that the colloid of interior filling is blown without limitation, arbitrary blowing direction, without departing from the original idea of technical scheme,
All this application claims in the range of, be regarded as meeting the blowing method of condition.For example, if the slit
310a extends in certain orientation, then can blow along the extending direction of the slit 310a to the colloid, thus
The colloid can be made to flow along the extending direction of the slit 310a, and then reach slit 310a described in Fast Filling
Purpose.
Figure 13 is please referred to, Figure 13 is a kind of flow chart of the processing method for center component that the embodiment of the present application three provides.
The processing method of the center component of the processing method and embodiment one of the center component of embodiment three is essentially identical, and difference exists
In in the present embodiment, in " the S100：After providing the first blank 100 ", in " the S200：To first blank
100 carry out extrusion forming, with plate 200 in formation and from before the framework blank 300 " that the periphery of the middle plate 200 extends out,
The processing method of the center component further includes but is not limited to step S150, about being described in detail as follows for step S150.
S150：Reduction processing is carried out to the intermediate position 100a of first blank 100, during reducing extrusion forming
Flash.Specifically, please referring to Figure 14, Figure 14 is the corresponding structural schematic diagram of step S150 of the embodiment of the present application three.
Specifically, can add to the intermediate position 100a of first blank 100 mode for carrying out reduction processing for CNC
Work can also use milling machine Milling Process, be processed using grinding machine, can also use planer planing operation.Due to being herein
It is a kind of roughing, it is preferred that using planer to the centre of first blank 100 to the pretreatment that the first blank 100 carries out
Position 100a carries out reduction processing, and since the cutting output of planer processing is bigger, precision is not high, can shorten adding for reduction processing
Between working hour, the period that reduction processing is carried out to the intermediate position 100a to first blank 100 is improved, to help to reduce
Cost.
Further, it when carrying out extrusion forming to the first blank 100 due to the mold using extrusion forming, can generate more
Flash, and flash amount will block greatly very much the mold of extrusion forming, be unfavorable for the extrusion forming to the first blank 100, and have
It may be damaged the mold of extrusion forming, therefore, the technical program first carries out the intermediate position 100a of the first blank 100 thinned
Processing, to reduce the flash in subsequent extrusion forming process, on the one hand facilitates the extrusion forming to the first blank 100, another
Aspect can preferably protect the mold of extrusion forming.And the process time of reduction processing can be shortened, it improves to described the
The intermediate position 100a of one blank 100 carries out the period of reduction processing, to help to reduce cost.
Figure 15 is please referred to, Figure 15 is a kind of flow chart of the processing method for center component that the embodiment of the present application four provides.
The processing method of the center component of the processing method and embodiment one of the center component of example IV is essentially identical, and difference exists
In in the present embodiment, in " the S400：It is described after filling non-signal shielding medium 330 " in the slit 310a
The processing method of center component further includes but is not limited to step S500 and S600, about step S500 and S600 be discussed in detail as
Under.
S500：The first coating 510 for covering the center component 10 is formed, first coating 510 is described for improving
The surface smoothness of center component 10.
Wherein, when " flatness " refers to processing or production certain things, surface can't be absolutely smooth, and institute is uneven and exhausted
To between level, institute's difference value.Wherein, numerical value is smaller, and flatness is better.
Optionally, first coating 510 is formed using water plating surface treatment, and first coating 510 shows metal
Gloss, enhances the metal-like of the center component 10, and makes the center component 10 that highlight effect be presented, and more dazzles cruel.
Wherein, " water plating surface treatment " refers to the needs for various center components and coating, with different dedicated " water plating " liquid, will in
Frame component is placed in water plating solution under room temperature (15-40 DEG C), makees weak vibrations, and in a relatively short period of time (it is such as silver-plated, usually need
30 seconds) it can be completed.
S600：The second coating 520 for covering first coating 510 is formed, second coating 520 is described for increasing
The surface hardness of center component 10.
Optionally, second coating 520 is formed using nano-plating, and second coating 520 is for increasing in described
The surface hardness of frame component 10.Wherein, " nano-plating " refers to the basal liquid or electricity that electronickelling is deactivated with nanometer concentrate
The basal liquid of chromium plating makes nickel ion contained in basal liquid either chromium ion tinyization, to make metal deposit nucleus granularity
Technique between 18~25nm.Wherein：Basal liquid refers to the electroplate liquid for being mixed with certain metal ion species, for example, at this
In embodiment, the basal liquid of nickel refers to the electroplate liquid for being mixed with nickel ion.Nano-plating technique is by will be in center component 10
Interionic distance be adjusted to the spacing less than 10nm from common 20-25nm or so, so that the surface for enhancing center component 10 is hard
Degree, intensity, corrosion resistance.Hardness can achieve 8H, and yield strength is up to 500-1000Mpa.The first step of basic processing flow
Be to provide center component matrix, second step is pre-processed to center component matrix, third step be to center component matrix into
Row chemical nickel process, the 4th step are to carry out copper plating process processing to center component matrix, and the 5th step is to center component
Matrix carries out electroplated nanometer Ni process, and the 6th step is to carry out the processing of surface layer coating to center component matrix.
Specifically, being described in detail as follows for above-mentioned each process." providing center component matrix " refers to production center group
The blank of part；" pre-processing to center component matrix ", which refers to, is fabricated to center component matrix for blank, can using polishing,
The form processings such as polishing either wire cutting；" carrying out chemical nickel process to center component matrix " refers to center component base
Body is placed in the mixed liquor of nickel ion, and the mixed liquor is used to carry out surface cleaning processing to center component matrix, to improve
The adsorption ability of the center component；" carrying out copper plating process processing to center component matrix " refers to center component base
Body immersion, which is mixed in the electroplate liquid of copper powders, to be electroplated, and to improve the Metal Mechanic Property of the center component, will pass through institute
Case ring after stating copper powders plating immerses in the liquid medium in acidity, to carry out protection against oxidation to the center component；
" carrying out electroplated nanometer Ni process to center component matrix " refers to the plating immersed center component matrix and be mixed with nickel by powder
It is electroplated in liquid, so that center component shows brightness effect；" carrying out the processing of surface layer coating to center component matrix " is
Refer to after above-mentioned operation, treatment is carried out to center component matrix, with the good center component of obtained comprehensive performance.
Figure 16 is please referred to, Figure 16 is the structural schematic diagram for the center component that one preferred embodiment of the application provides.In described
The processing method for the center component that frame component 10 is provided using any embodiment as above is process.The center component 10 wraps
Include middle plate 200, frame 310, structural member 210 and connector 220.About middle plate 200, frame 310, structural member 210 and connector
220 detailed description is referring to the introduction of front, and details are not described herein.
Figure 17 is please referred to, Figure 17 is the structural schematic diagram for the electronic device that one preferred embodiment of the application provides.The electricity
Sub-device 1 can be any equipment for having communication and store function.Such as：Tablet computer, mobile phone, electronic reader, remote control
Device, personal computer (Personal Computer, PC), laptop, mobile unit, Web TV, wearable device etc.
Smart machine with network function.The electronic device 1 includes the center component 10 that any embodiment as above provides.
It is the structural schematic diagram of the BB cross-sectional view for the electronic device that Figure 17 is provided also referring to Figure 17 and Figure 18, Figure 18.
The electronic device 1 includes center component 10, and the center component 10 includes frame 310 and center 200, and center 200 is also known as
For front housing, it is fixedly connected between the frame 310 and middle plate 200 by connector 220.
The electronic device 1 further includes screen 1010, and the screen 1010 can be but be not limited to LCD screen
(Liquid Crystal Display, LCD) or Organic Light Emitting Diode (Original Light Emitting Diode,
OLED) screen.The screen 1010 can be only display panel 1800 having a display function, can also only have touch-control
The touch panel 1700 of function can also have the display panel 1800 and touch panel 1700 of display and touch function simultaneously
Combining form.
In the present embodiment, the antenna radiator 1001 can be at least one of the frame 310 in electronic device 1
Point, it is said by taking a part in the frame 310 that the antenna radiator 1001 is electronic device 1 as an example in the present embodiment
It is bright.The electronic device 1 further includes rear cover 1002, sealant 1400.The frame 310 may make up the portion of the electronic device 1
Divide appearance, at least part of the frame 310 is as the antenna radiator 1001, the frame 310 and the rear cover
1002 interval settings and formation gap.The sealant 1400 is located at the gap between the frame 310 and the rear cover 1002
Interior, the sealant 1400 is for the frame 310 and the rear cover 1002 to be combined together, 1400 pairs of electricity of the sealant
Magnetostatic wave signal does not have shielding action, and the electromagnetic wave signal can be radiate via the sealant 1400.
In addition, the electronic device 1 further includes cover board 1100.The rear cover 1002, the frame 310 and the cover board
1100 cooperations are to form accommodating space, and the accommodating space will be for that will accommodate the screen 1010, support plate 1600 and circuit board
1500.The circuit board 1500 is for the fixed radio-frequency signal source 400 for generating radiofrequency signal and corresponding match circuit 700.
Illustrated so that the screen 1010 includes touch panel 1700 and display panel 1800 as an example in embodiments, that is, described
Screen 1010 includes the touch panel 1700 and display panel 1800 being stacked.The support plate 1600 is adjacent to the display surface
Plate 1800 is arranged, and the support plate 1600 is used to support touch panel 1700 and display panel 1800.The circuit board 1500 is set
It sets in side of the support plate 1600 far from the screen 1010.The setting of rear cover 1002 is separate in the circuit board 1500
The side of the support plate 1600, the rear cover 1002 are the battery cover of the electronic device 1.The cover board 1100 is arranged in institute
Side of the screen 1010 far from the support plate 1600 is stated, for protecting the screen 1010.The cover board 1100 is usually saturating
Bright material, the material of the cover board 1100 can be but be not limited only to for glass.
The embodiment of the present application is described in detail above, specific case used herein to the principle of the application and
Embodiment is expounded, the description of the example is only used to help understand the method for the present application and its core ideas；
At the same time, for those skilled in the art can in specific embodiments and applications according to the thought of the application
There is change place, in conclusion the contents of this specification should not be construed as limiting the present application.
Claims (11)
1. a kind of processing method of center component, which is characterized in that the processing method of the center component includes：
First blank is provided；
Extrusion forming is carried out to first blank, with plate and the framework base to extend out from the periphery of the middle plate in formation
Part；
Milling Process is carried out to the framework blank, to form the frame with slit；
Non-signal is filled in the slit and shields medium, to obtain center component.
2. the processing method of center component as described in claim 1, which is characterized in that " provide the first blank " it
Afterwards, " extrusion forming is carried out to first blank, with plate and the frame to extend out from the periphery of the middle plate in formation described
Before body blank ", the processing method of the center component further includes：
Reduction processing is carried out to the intermediate position of first blank, to reduce the flash during extrusion forming.
3. the processing method of center component as described in claim 1, which is characterized in that squeezed to first blank
Molding also forms the structure on the middle plate when with plate in being formed and from the framework blank that the periphery of the middle plate extends out
Part " carries out extrusion forming to first blank, with plate and the frame to extend out from the periphery of the middle plate in formation described
It is described before described " Milling Process being carried out to the framework blank, to form the frame with slit " after body blank "
The processing method of center component further includes：
Detect the location parameter of the several points on the structural member；
On the basis of the location parameter, the machining path that Milling Process is carried out to the framework blank is determined.
4. the processing method of center component as claimed in claim 3, which is characterized in that it is described " to the framework blank into
It further include the company to be formed between the frame and the middle plate in the process of row Milling Process, to form the frame with slit "
Fitting, wherein processed when forming the connector with the slit and the structural member for reference.
5. the processing method of center component as claimed in claim 4, which is characterized in that carry out milling to the framework blank and add
Work, when forming the frame with slit and form the connector between the frame and the middle plate, with the slit with
And the structural member is positioning reference, carries out clamping position to the frame and the middle plate using fixture.
6. the processing method of center component as claimed in claim 5, which is characterized in that described " with the slit and institute
Structural member is stated as positioning reference, clamping position is carried out to the frame and the middle plate using fixture " before, the center component
Processing method further include：
The first flexible part being arranged in the slit is formed, first flexible part is used to form the frame and protect, prevents
Only the fixture causes to damage to the frame；
The second flexible part that the structural member surface is set is formed, second flexible part is used to form the structural member and protect
Shield, prevents the fixture from causing to damage to the structural member.
7. the processing method of center component as described in claim 1, which is characterized in that described " to be carried out to the framework blank
Milling Process has the frame of slit with formation " include：
The substrate of the corresponding slit setting is formed, the substrate is in the mistake for being filled non-signal shielding medium to the slit
For forming support to non-signal shielding medium in journey.
8. the processing method of center component as described in claim 1, which is characterized in that described " to be filled in the slit non-
Signal shielding medium " includes：
First medium is filled into the slit；
Solidify the first medium, forms the first sealant；
Second medium is filled into the slit, the second medium is covered on the surface of first sealant；
It blows to the second medium, so that the second medium fills up the slit；
Solidify the second medium, forms the second sealant.
9. the processing method of center component as described in claim 1, which is characterized in that " filled in the slit described
Non-signal shields medium " after, the processing method of the center component further includes：
The first coating for covering the center component is formed, first coating is used to improve the surfacing of the center component
Degree；
The second coating for covering first coating is formed, the surface that second coating is used to increase the center component is hard
Degree.
10. a kind of center component, which is characterized in that the center component uses center as described in any one of claims 1 to 9
The processing method of component is process.
11. a kind of electronic device, which is characterized in that the electronic device includes center component as claimed in claim 10.
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| CN110434376A (en) * | 2019-08-06 | 2019-11-12 | 东莞长盈精密技术有限公司 | Center processing method |
| CN111618537A (en) * | 2020-06-11 | 2020-09-04 | 东莞益谦机械设备科技有限公司 | Processing method of ultrathin middle frame |
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| CN108907615B (en) | 2020-01-14 |
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