CN108899199A - Transcalent capacitor - Google Patents

Transcalent capacitor Download PDF

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Publication number
CN108899199A
CN108899199A CN201810639000.4A CN201810639000A CN108899199A CN 108899199 A CN108899199 A CN 108899199A CN 201810639000 A CN201810639000 A CN 201810639000A CN 108899199 A CN108899199 A CN 108899199A
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CN
China
Prior art keywords
capacitor
heat
conducting layer
weight
transcalent
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Granted
Application number
CN201810639000.4A
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Chinese (zh)
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CN108899199B (en
Inventor
陈芳
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Jiangsu raspberry Information Technology Co.,Ltd.
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Suqian Raspberry Information Technology Co Ltd
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Priority to CN201810639000.4A priority Critical patent/CN108899199B/en
Publication of CN108899199A publication Critical patent/CN108899199A/en
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Publication of CN108899199B publication Critical patent/CN108899199B/en
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular

Abstract

This case is related to a kind of transcalent capacitor comprising shell and capacitor core, capacitor core encapsulate inside the shell, heat-conducting layer are equipped between the bottom and shell of capacitor core, heat-conducting layer is contacted with the bottom of capacitor core and shell；Wherein, heat-conducting layer includes the material of following parts by weight：50~70 parts by weight of dimethyl silicone polymer；10~12 parts by weight of glutaraldehyde；5~8 parts by weight of lauric monoglyceride；20~30 parts by weight of Heat Conduction Material.The present invention makes heat-conducting effect reach the service life for most preferably improving capacitor, reduces damage of the high temperature to capacitor internal structure, extend the service life of capacitor by being equipped with heat-conducting layer between the bottom and shell of capacitor core.

Description

Transcalent capacitor
Technical field
The present invention relates to a kind of capacitor technology field, in particular to a kind of transcalent capacitor.
Background technique
Capacitor, usually referred to as its accommodate charge ability be capacitor, simplest capacitor be by both ends pole plate and What intermediate insulation dielectric was constituted, after energization, pole plate electrification forms voltage, but due to intermediate megohmite insulant, so whole A capacitor is nonconducting.But, such situation be under the precondition for the critical voltage for being not above capacitor, It is known that any substance is all opposing insulation, after the voltage when substance both ends increases to a certain extent, substance can all Conductive, it is not just insulator after capacitor is breakdown that we, which claim this voltage breakdown voltage, and capacitor is no exception, but In middle school period, such voltage be can not see in circuit, so being worked below breakdown voltage, can be worked as Insulator is made to see.
Original capacitor heat dissipation effect is poor, capacitor cannot good heat-sinking capability, in long-time using can be internal Portion's structure damages, the serious service life for reducing capacitor.
Summary of the invention
For the shortcomings of the prior art, the purpose of the present invention is to provide a kind of transcalent capacitor, To solve to propose that original capacitor heat dissipation effect is poor in above-mentioned background technique, capacitor cannot good heat-sinking capability, For a long time using that can be damaged to internal structure, seriously reduce the service life of capacitor the problem of.
The technical solution adopted by the present invention is as follows：
A kind of transcalent capacitor comprising shell and capacitor core, the capacitor core are encapsulated in the shell, It is characterized in that, being equipped with heat-conducting layer, the heat-conducting layer and the capacitor between the bottom of the capacitor core and the shell The bottom of core and shell contact；
Wherein, the heat-conducting layer includes the material of following parts by weight：
Preferably, the transcalent capacitor, wherein the Heat Conduction Material includes 25~30wt%Ti3SiC2、 35~40wt%VxCr2-xGeC and 30~40wt% aluminium oxide.
Preferably, the transcalent capacitor, wherein in the VxCr2-xIn GeC, 0.8≤x≤1.2.
Preferably, the transcalent capacitor, wherein the heat-conducting layer further includes 3~5 parts by weight titanium carbides.
Preferably, the transcalent capacitor, wherein the heat-conducting layer further includes 1~3 parts by weight zirconium oxide.
Preferably, the transcalent capacitor, wherein the heat-conducting layer further includes 1~3 parts by weight tungsten carbide.
Preferably, the transcalent capacitor, wherein the heat-conducting layer further includes 1~3 parts by weight strontium zirconate.
Preferably, the transcalent capacitor, wherein the heat-conducting layer further includes 1~3 parts by weight samarium oxide.
Preferably, the transcalent capacitor, wherein the heat-conducting layer further includes 1~3 parts by weight of graphite alkene.
The beneficial effects of the invention are as follows：The present invention is made by being equipped with heat-conducting layer between the bottom and shell of capacitor core Heat-conducting effect reaches the service life for most preferably improving capacitor, reduces damage of the high temperature to capacitor internal structure, extends The service life of capacitor.
Specific embodiment
The present invention will be further described in detail below with reference to the embodiments, to enable those skilled in the art referring to specification Text can be implemented accordingly.
This case proposes the transcalent capacitor of an embodiment comprising shell and capacitor core, capacitor core are encapsulated in In shell, heat-conducting layer is equipped between the bottom and shell of capacitor core, heat-conducting layer is contacted with the bottom of capacitor core and shell；
Wherein, heat-conducting layer includes the material of following parts by weight：
Dimethyl silicone polymer is simultaneously aided with a small amount of glutaraldehyde to keep the low oily from degree of silicone grease, but the study found that when penta After dialdehyde is increased relative to the accounting of dimethyl silicone polymer, the thermal coefficient of silicone grease can be reduced, and will affect Heat Conduction Material Dispersibility；The effect of lauric monoglyceride is to improve the compatibility of Heat Conduction Material and polysiloxanes, while can make poly- silicon oxygen again Alkane keeps stable mastic state for a long time, not thinning using not softening at high temperature for a long time, not retrogradation at low temperature, not solid Change.
As another embodiment of this case, Heat Conduction Material includes 25~30wt%Ti3SiC2, 35~40wt%VxCr2-xGeC and 30~40wt% aluminium oxide.Ti3SiC2、VxCr2-xGeC and aluminium oxide make heating conduction reach best by synergistic effect.
As the another embodiment of this case, VxCr2-xIn GeC, 0.8≤x≤1.2.
As the another embodiment of this case, heat-conducting layer further includes 3~5 parts by weight titanium carbides.Titanium carbide is found to coordinate The thermal coefficient of dimethyl silicone polymer is improved, certainly on condition that based on the formula of above-described embodiment, and departing from above-mentioned The formula of embodiment, simple replaces Heat Conduction Material with titanium carbide, although improvement effect that also can be faint, is obviously not achieved Improvement degree of the Heat Conduction Material to thermal coefficient.
As the another embodiment of this case, heat-conducting layer further includes 1~3 parts by weight zirconium oxide.Zirconium oxide can cooperate with titanium carbide into One step improves its heating conduction.
As the another embodiment of this case, heat-conducting layer further includes 1~3 parts by weight tungsten carbide.Tungsten carbide can synergistic oxidation zirconium, carbon Change titanium and improves its heating conduction.
As the another embodiment of this case, heat-conducting layer further includes 1~3 parts by weight strontium zirconate.The effect of strontium zirconate is to increase to lead The heat accumulation time of thermosphere is returned to preventing heat not have enough time also being conducted to capacitor.
As the another embodiment of this case, heat-conducting layer further includes 1~3 parts by weight samarium oxide.The effect of samarium oxide is and zirconic acid Strontium generates synergistic effect, the common heat accumulation time for improving heat-conducting layer.
As the another embodiment of this case, heat-conducting layer further includes 1~3 parts by weight of graphite alkene.Graphene can synergistic oxidation zirconium, carbon Change titanium and tungsten carbide improves its heating conduction.
Table one lists the concrete composition and its performance ginseng of the heat-conducting layer containing different formulations of embodiment 1-3 and comparative example 1-6 Number：
Table one
Although the embodiments of the present invention have been disclosed as above, but its is not only in the description and the implementation listed With it can be fully applied to various fields suitable for the present invention, for those skilled in the art, can be easily Realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, the present invention is simultaneously unlimited In specific details.

Claims (9)

1. a kind of transcalent capacitor comprising shell and capacitor core, the capacitor core are encapsulated in the shell, It is characterized in that, heat-conducting layer, the heat-conducting layer and the capacitor core is equipped between the bottom of the capacitor core and the shell Bottom and shell contact；
Wherein, the heat-conducting layer includes the material of following parts by weight：
2. transcalent capacitor according to claim 1, which is characterized in that the Heat Conduction Material includes 25~30wt% Ti3SiC2, 35~40wt%VxCr2-xGeC and 30~40wt% aluminium oxide.
3. transcalent capacitor according to claim 2, which is characterized in that in the VxCr2-xIn GeC, 0.8≤x≤ 1.2。
4. transcalent capacitor according to claim 1, which is characterized in that the heat-conducting layer further includes 3~5 parts by weight Titanium carbide.
5. transcalent capacitor according to claim 1, which is characterized in that the heat-conducting layer further includes 1~3 parts by weight Zirconium oxide.
6. transcalent capacitor according to claim 1, which is characterized in that the heat-conducting layer further includes 1~3 parts by weight Tungsten carbide.
7. transcalent capacitor according to claim 1, which is characterized in that the heat-conducting layer further includes 1~3 parts by weight Strontium zirconate.
8. transcalent capacitor according to claim 1, which is characterized in that the heat-conducting layer further includes 1~3 parts by weight Samarium oxide.
9. transcalent capacitor according to claim 1, which is characterized in that the heat-conducting layer further includes 1~3 parts by weight Graphene.
CN201810639000.4A 2018-06-20 2018-06-20 Capacitor easy to conduct heat Active CN108899199B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810639000.4A CN108899199B (en) 2018-06-20 2018-06-20 Capacitor easy to conduct heat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810639000.4A CN108899199B (en) 2018-06-20 2018-06-20 Capacitor easy to conduct heat

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CN108899199A true CN108899199A (en) 2018-11-27
CN108899199B CN108899199B (en) 2020-07-31

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101345141A (en) * 2008-08-25 2009-01-14 倪树春 Electrical contact material with Ti3SiC2 three-layer compound structure and preparation technique
CN105977031A (en) * 2015-03-13 2016-09-28 Avx公司 Thermally conductive encapsulant material for a capacitor assembly
CN106380871A (en) * 2016-10-09 2017-02-08 安徽四新电子有限责任公司 Rapid cooling capacitor
JP2017137437A (en) * 2016-02-04 2017-08-10 Jsr株式会社 Heat storage particle, method for producing the same and heat storage material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101345141A (en) * 2008-08-25 2009-01-14 倪树春 Electrical contact material with Ti3SiC2 three-layer compound structure and preparation technique
CN105977031A (en) * 2015-03-13 2016-09-28 Avx公司 Thermally conductive encapsulant material for a capacitor assembly
JP2017137437A (en) * 2016-02-04 2017-08-10 Jsr株式会社 Heat storage particle, method for producing the same and heat storage material
CN106380871A (en) * 2016-10-09 2017-02-08 安徽四新电子有限责任公司 Rapid cooling capacitor

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Address after: 215100 room c2041, floor 2, building 1, No. 209, Zhuyuan Road, high tech Zone, Suzhou, Jiangsu

Patentee after: Jiangsu raspberry Information Technology Co.,Ltd.

Address before: 223700 No.9, Fazhan Avenue, Siyang County, Suqian City, Jiangsu Province

Patentee before: SUQIAN FUPENZI INFORMATION TECHNOLOGY Co.,Ltd.