CN108897553B - Chip programming tool, system, chip programming method and device - Google Patents
Chip programming tool, system, chip programming method and device Download PDFInfo
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- CN108897553B CN108897553B CN201810651163.4A CN201810651163A CN108897553B CN 108897553 B CN108897553 B CN 108897553B CN 201810651163 A CN201810651163 A CN 201810651163A CN 108897553 B CN108897553 B CN 108897553B
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Abstract
The disclosure relates to a chip programming tool, a chip programming system, a chip programming method and a chip programming device. This chip burns writes frock includes: the device comprises a first fixing plate for mounting a chip, an interface-to-serial port converter, a conduction device and a programming tool thimble which are sequentially connected; the conduction device is used for conducting a circuit between the interface-to-serial port converter and the programming tool thimble after the programming tool thimble is contacted with a programming point of a chip arranged on the first fixing plate; and when the programming tool thimble is not in contact with the programming point of the chip arranged on the first fixing plate, disconnecting the circuit between the interface-to-serial port converter and the programming tool thimble. After the burning point of the burning tool thimble and the chip is contacted, the conduction device can conduct a circuit between the interface serial port converter and the burning tool thimble, so that the chip is prevented from being broken down by voltage, the damage rate of the chip is reduced, and the reliability of the chip is effectively ensured.
Description
Technical Field
The disclosure relates to the technical field of communication, in particular to a chip programming tool, a chip programming system, a chip programming method and a chip programming device.
Background
After the chip is produced, in order to ensure that the chip realizes the functions of the chip, a program needs to be programmed to the chip, and at present, a programming tool is generally used for programming the chip.
Disclosure of Invention
In order to overcome the problems in the related art, the embodiments of the present disclosure provide a chip programming tool, a chip programming system, a chip programming method and a chip programming device. The technical scheme is as follows:
according to a first aspect of the embodiments of the present disclosure, a chip programming tool is provided, including: the device comprises a first fixing plate for mounting a chip, and an interface-to-serial converter, a conduction device and a programming tool thimble which are connected in sequence;
the conduction device is used for conducting a circuit between the interface serial-to-serial port converter and the programming tool thimble after the programming tool thimble is contacted with a programming point of a chip arranged on the first fixing plate; and when the programming tool ejector pin is not in contact with the programming point of the chip arranged on the first fixing plate, disconnecting the circuit between the interface-to-serial port converter and the programming tool ejector pin.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: the conduction device is used for conducting a circuit between the interface-to-serial port converter and the programming tool thimble after the programming tool thimble is contacted with a programming point of a chip arranged on the first fixing plate; and when the programming tool thimble is not in contact with the programming point of the chip arranged on the first fixing plate, disconnecting the circuit between the interface-to-serial port converter and the programming tool thimble. The contact device is used for connecting the interface-to-serial port converter and the circuit between the programming tool thimbles after the programming tool thimbles are contacted with the programming points of the chip, and the programming tool thimbles are fully contacted with the programming points of the chip, so that electric sparks cannot exist between the programming tool thimbles and a bonding pad of the programming points of the chip, the chip is prevented from being broken down by voltage, the damage rate of the chip is reduced, and the reliability of the chip is effectively guaranteed.
In one embodiment, the conducting means comprises: a switch unit.
In one embodiment, the chip includes: and a wireless module.
In one embodiment, the interface-to-serial converter includes: USB-to-serial converter.
In one embodiment, the conducting means comprises:
a power supply pin VCC conducting device, a ground terminal pin GND conducting device, a data sending pin TXD conducting device and a data receiving pin RXD conducting device;
the frock thimble of writing includes: the first programming tool thimble, the second programming tool thimble, the third programming tool thimble and the fourth programming tool thimble;
the power supply pin VCC conducting device is connected with the first programming tool thimble;
the ground terminal pin GND conducting device is connected with the second programming tool thimble;
the transmitting data pin TXD conducting device is connected with the third programming tool thimble;
and the received data pin RXD conduction device is connected with the fourth programming tool thimble.
In one embodiment, the programming tool further comprises: a chip program output device;
the chip program output device is connected with the interface-to-serial port converter.
In one embodiment, the programming tool further comprises: a second fixing plate;
the programming tool thimble is fixedly arranged on the second fixing plate.
According to a second aspect of the embodiments of the present disclosure, a chip programming tool system is provided, which includes a chip fixed on the first fixing plate according to any one of the embodiments and a chip programming tool according to any one of the embodiments.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: detecting whether a thimble of the programming tool is in contact with a programming point of a chip arranged on a first fixing plate; when detecting that the programming tool thimble is contacted with a programming point of a chip arranged on the first fixing plate, controlling the conduction device to conduct a circuit between the interface-to-serial port converter and the programming tool thimble; and when detecting that the programming tool thimble is not in contact with a programming point of a chip arranged on the first fixing plate, controlling the conduction device to disconnect a circuit between the interface-to-serial port converter and the programming tool thimble. The contact device is used for connecting the interface-serial port converter and the circuit between the programming tool thimbles after the programming tool thimbles are contacted with the programming points of the chip, and the programming tool thimbles are fully contacted with the programming points of the chip, so that electric sparks cannot exist between the programming tool thimbles and a bonding pad of the programming points of the chip, the chip is prevented from being broken down by voltage, and the reliability of the chip is effectively guaranteed.
According to a third aspect of the embodiments of the present disclosure, there is provided a chip programming method, which is applied to the chip programming tool according to any one of the embodiments, and the method includes:
detecting whether a thimble of the programming tool is in contact with a programming point of a chip arranged on the first fixing plate;
when the contact between the programming tool thimble and a programming point of a chip arranged on the first fixing plate is detected, controlling the conduction device to conduct a circuit between the interface-to-serial port converter and the programming tool thimble;
and when detecting that the programming tool ejector pin is not in contact with a programming point of a chip arranged on the first fixing plate, controlling the conduction device to disconnect a circuit between the interface-to-serial port converter and the programming tool ejector pin.
According to a fourth aspect of the embodiments of the present disclosure, there is provided a chip programming device, where the chip programming device is applied to the chip programming tool according to any one of the embodiments, and the device includes:
a processor;
a memory for storing processor-executable instructions;
wherein the processor is configured to:
detecting whether a thimble of the programming tool is in contact with a programming point of a chip arranged on the first fixing plate;
when the contact between the programming tool thimble and a programming point of a chip arranged on the first fixing plate is detected, controlling the conduction device to conduct a circuit between the interface-to-serial port converter and the programming tool thimble;
and when detecting that the programming tool ejector pin is not in contact with a programming point of a chip arranged on the first fixing plate, controlling the conduction device to disconnect a circuit between the interface-to-serial port converter and the programming tool ejector pin.
According to a fifth aspect of embodiments of the present disclosure, there is provided a computer-readable storage medium having stored thereon computer instructions which, when executed by a processor, implement the steps of the method of any one of the first aspects.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a schematic diagram illustrating a related art programming tool according to an exemplary embodiment.
FIG. 2 is a schematic diagram of a programming tool shown in accordance with an exemplary embodiment.
FIG. 3 is a schematic diagram of a programming tool shown in accordance with an exemplary embodiment.
FIG. 4 is a schematic diagram of a programming tool shown in accordance with an exemplary embodiment.
FIG. 5 is a schematic diagram of a programming tool shown in accordance with an exemplary embodiment.
FIG. 6 is a flow chart illustrating a method of chip programming in accordance with an exemplary embodiment.
FIG. 7 is a block diagram illustrating an apparatus 80 for chip programming in accordance with an exemplary embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the disclosure, as detailed in the appended claims.
After the chip is produced, in order to ensure that the chip realizes its own functions, a program for programming the chip is also required, and at present, a programming tool shown in fig. 1 is generally used for programming the chip.
As shown in fig. 1, the programming tool includes a chip program output device 11, an interface-to-serial converter 12, a programming tool thimble 13, and a first fixing plate 14 for mounting a chip; when programming a chip, the chip is fixedly arranged on the first fixing plate 14, the programming tool thimble 13 is pressed down, and after the programming tool thimble 13 is contacted with a chip programming point fixedly arranged on the chip fixing plate, the chip program output device 11 can sequentially program the chip to the chip programming program fixedly arranged on the first fixing plate 14 through the interface serial-to-serial converter 12 and the programming tool thimble 13.
However, insufficient contact occurs in the process of contacting the programming tool thimble 13 with the chip programming point, at this time, an electric spark may occur between the programming tool thimble 13 and the pad corresponding to the chip programming point, and the generated electric spark may easily cause voltage breakdown on the chip, thereby causing the chip to be damaged.
In order to reduce the damage rate of the chip and improve the reliability of the chip, the chip programming tool is provided in the present disclosure, as shown in fig. 2, the chip programming tool in the present disclosure includes: the device comprises a first fixing plate 14 for mounting a chip, an interface-to-serial converter 12, a conduction device 15 and a programming tool thimble 13 which are connected in sequence.
The conduction device 15 is used for conducting a circuit between the interface-to-serial port converter 12 and the programming tool thimble 13 after the programming tool thimble 13 is contacted with a programming point of a chip arranged on the first fixing plate 14; and when the programming tool thimble 13 is not in contact with the programming point of the chip arranged on the first fixing plate 14, the circuit between the interface-to-serial port converter 12 and the programming tool thimble 13 is disconnected.
In order to avoid the phenomenon of voltage breakdown of a chip caused by insufficient contact between a programming tool thimble 13 and a programming point of the chip in the process of programming the chip, in the disclosure, a conduction device 15 is arranged between the interface serial-to-serial converter 12 and the programming tool thimble 13, in the process of contacting the programming tool thimble 13 and the programming point of the chip, namely when the programming tool thimble 13 is not contacted with the programming point of the chip, the conduction device 15 can disconnect a circuit between the interface serial-to-serial converter 12 and the programming tool thimble 13, and after the programming tool thimble 13 is contacted with the programming point of the chip, the conduction device 15 can conduct the circuit between the interface serial-to-serial converter 12 and the programming tool thimble 13, and because the programming tool thimble 13 is fully contacted with the programming point of the chip at the moment, no electric spark exists between the programming tool thimble 13 and a pad of the programming point of the chip, therefore, the chip is prevented from being broken down by voltage, and the reliability of the chip is effectively ensured.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: the conduction device is used for conducting a circuit between the interface-to-serial port converter and the programming tool thimble after the programming tool thimble is contacted with a programming point of a chip arranged on the first fixing plate; and when the programming tool thimble is not in contact with the programming point of the chip arranged on the first fixing plate, disconnecting the circuit between the interface-to-serial port converter and the programming tool thimble. The contact device is used for connecting the interface-to-serial port converter and the circuit between the programming tool thimbles after the programming tool thimbles are contacted with the programming points of the chip, and the programming tool thimbles are fully contacted with the programming points of the chip, so that electric sparks cannot exist between the programming tool thimbles and a bonding pad of the programming points of the chip, the chip is prevented from being broken down by voltage, the damage rate of the chip is reduced, and the reliability of the chip is effectively guaranteed.
In one embodiment, the above-mentioned conducting device 15 includes: a switch unit.
In the process of contacting the programming point of the programming tool thimble 13 and the chip, the switch unit is opened, the circuit between the interface serial-to-serial converter 12 and the programming tool thimble 13 is disconnected at the moment, after the programming tool thimble 13 is contacted with the programming point of the chip, the switch unit is closed, the circuit between the interface serial-to-serial converter 12 and the programming tool thimble 13 is conducted at the moment, and because the programming tool thimble 13 is fully contacted with the programming point of the chip at the moment, no electric spark exists between the programming tool thimble 13 and a bonding pad of the programming point of the chip, so that the chip is prevented from being broken down by voltage, and the reliability of the chip is effectively ensured.
In one embodiment, the chip includes: and a wireless module.
Illustratively, the wireless module includes: a Wireless-Fidelity (WIFI) module or a Bluetooth Low Energy (BLE) module.
In one embodiment, the interface-to-serial converter 12 includes: universal Serial Bus (USB) to Serial converter.
Fig. 3 is a schematic diagram of a programming tool according to an exemplary embodiment, and as shown in fig. 3, based on fig. 2, the interface-to-serial converter 12 is a USB-to-serial converter.
The USB-to-serial port converter comprises four pins, namely a power supply pin VCC, a ground terminal pin GND, a data sending pin TXD and a data receiving pin RXD; correspondingly, the conducting means 15 comprise: a power supply pin VCC turn-on device 151, a ground terminal pin GND turn-on device 152, a transmission data pin TXD turn-on device 153, and a reception data pin RXD turn-on device 154; the programming frock thimble 13 includes: the first programming tool thimble 131, the second programming tool thimble 132, the third programming tool thimble 133 and the fourth programming tool thimble 134.
The power pin VCC conducting device 151 is connected to the first programming tool thimble 131. The ground terminal pin GND conducting device 152 is connected with the second programming tool thimble 132; the transmitting data pin TXD conducting device 153 is connected with the third programming tool thimble 133; the receive data pin RXD switch-on device 154 is connected to the fourth programming fixture thimble 134.
When programming a chip placed on the first fixing plate 14, the power pin VCC conducting device 151, the ground pin GND conducting device 152, the data sending pin TXD conducting device 153 and the data receiving pin RXD conducting device 154 are firstly turned on to disconnect a circuit between the USB serial-to-serial converter and the programming tool thimble 13, then the chip is placed on the first fixing plate 14, and the first programming tool thimble 131, the second programming tool thimble 132, the third programming tool thimble 133 and the fourth programming tool thimble 134 are controlled to respectively contact with corresponding programming points in the chip, and when the first programming tool thimble 131, the second programming tool thimble 132, the third programming tool thimble 133 and the fourth programming tool thimble 134 are respectively contacted with the programming points of the chip, the power pin VCC conducting device 151, the ground pin GND conducting device 152, the data sending pin TXD conducting device 153 and the data receiving pin RXD conducting device 154 are controlled to be turned on, and the circuit between the USB-to-serial converter and the programming tool thimble 13 is conducted, and then programming is carried out on the chip.
In order to guarantee the stability of the frock thimble 13 of writing, above-mentioned frock of writing still includes: a second fixing plate; the programming tool thimble 13 is fixedly arranged on the second fixing plate.
In one embodiment, as shown in fig. 4, the programming tool further includes: a chip program output device 11;
the chip program output device 11 is connected with the interface-to-serial converter 12.
Fig. 5 is a schematic diagram of a programming tool according to an exemplary embodiment, and as shown in fig. 5, on the basis of the above embodiments, the programming tool further includes a second fixing plate 16 for fixing the programming tool thimble 13, the chip program output device 11 is a computer host, the interface-to-serial converter 12 is a USB-to-serial converter, and the conducting device 15 is a switch unit.
The USB-to-serial converter comprises four pins, namely VCC, GND, TXD and RXD, and each output end is connected with a programming tool thimble 13.
When programming a chip placed on the first fixing plate 14, the power pin VCC conducting device 151, the ground pin GND conducting device 152, the data sending pin TXD conducting device 153 and the data receiving pin RXD conducting device 154 are firstly turned on to disconnect a circuit between the USB serial-to-serial converter and the programming tool thimble 13, then the chip is placed on the first fixing plate 14, and the first programming tool thimble 131, the second programming tool thimble 132, the third programming tool thimble 133 and the fourth programming tool thimble 134 are controlled to respectively contact with corresponding programming points in the chip, and when the first programming tool thimble 131, the second programming tool thimble 132, the third programming tool thimble 133 and the fourth programming tool thimble 134 are respectively contacted with the programming points of the chip, the power pin VCC conducting device 151, the ground pin GND conducting device 152, the data sending pin TXD conducting device 153 and the data receiving pin RXD conducting device 154 are controlled to be turned on, and a circuit between the USB-to-serial converter and the programming tool thimble 13 is conducted, so that the computer host programs to the chip sequentially through the USB-to-serial converter and the programming tool thimble 13.
The embodiment of the disclosure further provides a chip programming tool system, which includes a chip fixed on the first fixing plate 14 and the chip programming tool according to any of the embodiments.
Fig. 6 is a flowchart illustrating a chip programming method according to an exemplary embodiment, where the chip programming method is applied to the chip programming tool according to any of the above embodiments, and as shown in fig. 6, the method includes the following steps S101 to S103:
in S101, detecting whether a programming tool thimble is in contact with a programming point of a chip arranged on a first fixing plate, and executing S102 when detecting that the programming tool thimble is in contact with the programming point of the chip arranged on the first fixing plate; when it is detected that the programming tool thimble is not in contact with the programming point of the chip arranged on the first fixing plate, step S103 is executed.
In S102, the control and conduction device conducts a circuit between the interface-to-serial converter and the writing tool thimble.
In S103, the on-off control device disconnects the circuit between the interface-to-serial converter and the writing tool thimble.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: detecting whether a thimble of the programming tool is in contact with a programming point of a chip arranged on a first fixing plate; when detecting that the programming tool thimble is contacted with a programming point of a chip arranged on the first fixing plate, controlling the conduction device to conduct a circuit between the interface-to-serial port converter and the programming tool thimble; and when detecting that the programming tool thimble is not in contact with a programming point of a chip arranged on the first fixing plate, controlling the conduction device to disconnect a circuit between the interface-to-serial port converter and the programming tool thimble. The contact device is used for connecting the interface-serial port converter and the circuit between the programming tool thimbles after the programming tool thimbles are contacted with the programming points of the chip, and the programming tool thimbles are fully contacted with the programming points of the chip, so that electric sparks cannot exist between the programming tool thimbles and a bonding pad of the programming points of the chip, the chip is prevented from being broken down by voltage, and the reliability of the chip is effectively guaranteed.
The embodiment of the present disclosure further provides a chip programming device, where the chip programming device is applied to the chip programming tool according to any one of the above embodiments, and the device includes:
a processor;
a memory for storing processor-executable instructions;
wherein the processor is configured to:
detecting whether a thimble of the programming tool is in contact with a programming point of a chip arranged on the first fixing plate;
when the contact between the programming tool thimble and a programming point of a chip arranged on the first fixing plate is detected, controlling the conduction device to conduct a circuit between the interface-to-serial port converter and the programming tool thimble;
and when detecting that the programming tool ejector pin is not in contact with a programming point of a chip arranged on the first fixing plate, controlling the conduction device to disconnect a circuit between the interface-to-serial port converter and the programming tool ejector pin.
With regard to the apparatus in the above-described embodiment, the specific manner in which each module performs the operation has been described in detail in the embodiment related to the method, and will not be elaborated here.
Fig. 7 is a block diagram illustrating a chip programming device 80 according to an exemplary embodiment, which is applied to a chip programming tool according to any one of the above embodiments.
The apparatus 80 may include one or more of the following components: processing component 802, memory 804, power component 806, multimedia component 808, audio component 810, input/output (I/O) interface 812, sensor component 814, and communication component 816.
The processing component 802 generally controls overall operation of the device 80, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing components 802 may include one or more processors 820 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interaction between the processing component 802 and other components. For example, the processing component 802 can include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.
The memory 804 is configured to store various types of data to support operations at the apparatus 80. Examples of such data include instructions for any application or method operating on the device 80, contact data, phonebook data, messages, pictures, videos, and so forth. The memory 804 may be implemented by any type or combination of volatile or non-volatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.
The power supply component 806 provides power to the various components of the device 80. The power components 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the device 80.
The multimedia component 808 includes a screen that provides an output interface between the device 80 and the user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front facing camera and/or a rear facing camera. The front camera and/or the rear camera may receive external multimedia data when the device 80 is in an operating mode, such as a shooting mode or a video mode. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.
The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the apparatus 80 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.
The I/O interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.
The sensor assembly 814 includes one or more sensors for providing various aspects of state assessment for the device 80. For example, the sensor assembly 814 may detect an open/closed state of the device 80, the relative positioning of components, such as a display and keypad of the device 80, the sensor assembly 814 may also detect a change in position of the device 80 or any of the components of the device 80, the presence or absence of user contact with the device 80, orientation or acceleration/deceleration of the device 80, and a change in temperature of the device 80. Sensor assembly 814 may include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.
The communication component 816 is configured to facilitate wired or wireless communication between the apparatus 80 and other devices. The device 80 may access a wireless network based on a communication standard, such as WiFi, 2G, 3G, or 4G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 further includes a Near Field Communication (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, Ultra Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.
In an exemplary embodiment, the apparatus 80 may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.
In an exemplary embodiment, a non-transitory computer-readable storage medium comprising instructions, such as the memory 804 comprising instructions, executable by the processor 820 of the apparatus 80 to perform the above-described method is also provided. For example, the non-transitory computer readable storage medium may be a ROM, a Random Access Memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.
A non-transitory computer readable storage medium, wherein instructions of the storage medium, when executed by a processor of an apparatus 80, enable the apparatus 80 to perform the above chip programming method, the method comprising:
detecting whether a thimble of the programming tool is in contact with a programming point of a chip arranged on the first fixing plate;
when the contact between the programming tool thimble and a programming point of a chip arranged on the first fixing plate is detected, controlling the conduction device to conduct a circuit between the interface-to-serial port converter and the programming tool thimble;
and when detecting that the programming tool ejector pin is not in contact with a programming point of a chip arranged on the first fixing plate, controlling the conduction device to disconnect a circuit between the interface-to-serial port converter and the programming tool ejector pin.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (10)
1. The utility model provides a frock is write to chip, its characterized in that includes: the device comprises a first fixing plate for mounting a chip, and an interface-to-serial converter, a conduction device and a programming tool thimble which are connected in sequence;
the conduction device is used for conducting a circuit between the interface serial-to-serial port converter and the programming tool thimble after the programming tool thimble is contacted with a programming point of a chip arranged on the first fixing plate; and when the programming tool thimble is not in contact with the programming point of the chip arranged on the first fixing plate, the circuit between the interface-to-serial port converter and the programming tool thimble is disconnected,
the turn-on device includes:
a power supply pin VCC conducting device, a ground terminal pin GND conducting device, a data sending pin TXD conducting device and a data receiving pin RXD conducting device;
the frock thimble of writing includes: the first programming tool thimble, the second programming tool thimble, the third programming tool thimble and the fourth programming tool thimble;
the power supply pin VCC conducting device is connected with the first programming tool thimble;
the ground terminal pin GND conducting device is connected with the second programming tool thimble;
the transmitting data pin TXD conducting device is connected with the third programming tool thimble;
and the received data pin RXD conduction device is connected with the fourth programming tool thimble.
2. The chip programming tool according to claim 1, wherein the conduction device comprises: a switch unit.
3. The chip programming tool according to claim 1, wherein the chip comprises: and a wireless module.
4. The chip programming tool according to claim 1, wherein the interface-to-serial converter comprises: USB-to-serial converter.
5. The chip programming tool of claim 1, further comprising: a chip program output device;
the chip program output device is connected with the interface-to-serial port converter.
6. The chip programming tool of claim 1, further comprising: a second fixing plate;
the programming tool thimble is fixedly arranged on the second fixing plate.
7. A chip programming tool system, characterized by comprising the chip programming tool according to any one of claims 1 to 6 and a chip fixed on a first fixing plate of the chip programming tool.
8. A chip programming method, which is applied to the chip programming tool according to any one of claims 1 to 6, and comprises the following steps:
detecting whether a thimble of the programming tool is in contact with a programming point of a chip arranged on the first fixing plate;
when the contact between the programming tool thimble and a programming point of a chip arranged on the first fixing plate is detected, controlling the conduction device to conduct a circuit between the interface-to-serial port converter and the programming tool thimble;
and when detecting that the programming tool ejector pin is not in contact with a programming point of a chip arranged on the first fixing plate, controlling the conduction device to disconnect a circuit between the interface-to-serial port converter and the programming tool ejector pin.
9. A chip programming device, wherein the chip programming device is applied to the chip programming tool according to any one of claims 1 to 6, and the device comprises:
a processor;
a memory for storing processor-executable instructions;
wherein the processor is configured to:
detecting whether a thimble of the programming tool is in contact with a programming point of a chip arranged on the first fixing plate;
when the contact between the programming tool thimble and a programming point of a chip arranged on the first fixing plate is detected, controlling the conduction device to conduct a circuit between the interface-to-serial port converter and the programming tool thimble;
and when detecting that the programming tool ejector pin is not in contact with a programming point of a chip arranged on the first fixing plate, controlling the conduction device to disconnect a circuit between the interface-to-serial port converter and the programming tool ejector pin.
10. A computer-readable storage medium having stored thereon computer instructions, which when executed by a processor, perform the steps of the method of claim 8.
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| CN1991731B (en) * | 2005-12-26 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Chip burn-recording system |
| CN104679123A (en) * | 2013-11-29 | 2015-06-03 | 英业达科技有限公司 | Mainboard and data burning method thereof |
| CN203706200U (en) * | 2013-12-26 | 2014-07-09 | 武汉光谷电气有限公司 | Simple chip program burning device |
| CN104918041B (en) * | 2015-05-30 | 2017-05-17 | 歌尔股份有限公司 | PC and television set serial communication device used for production line |
| CN107526606B (en) * | 2016-06-21 | 2020-10-02 | 无锡华润矽科微电子有限公司 | System and method for realizing chip power-on time self-adaptive control in writer |
| CN106293807A (en) * | 2016-07-26 | 2017-01-04 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of Flash chip based on DSP guides loading method |
| CN107092500B (en) * | 2017-03-17 | 2023-11-10 | 科芯(天津)生态农业科技有限公司 | Program burning tool system |
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Address after: 100085 Huarun Qingcai Street 68, Haidian District, Beijing, two stage, 9 floor, 01 rooms. Patentee after: BEIJING XIAOMI MOBILE SOFTWARE Co.,Ltd. Patentee after: Qingdao Yilai Intelligent Technology Co.,Ltd. Address before: 100085 Huarun Qingcai Street 68, Haidian District, Beijing, two stage, 9 floor, 01 rooms. Patentee before: BEIJING XIAOMI MOBILE SOFTWARE Co.,Ltd. Patentee before: QINGDAO YEELINK INFORMATION TECHNOLOGY Co.,Ltd. |
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