CN108886848A - Organic EL display element sealant - Google Patents
Organic EL display element sealant Download PDFInfo
- Publication number
- CN108886848A CN108886848A CN201780015173.2A CN201780015173A CN108886848A CN 108886848 A CN108886848 A CN 108886848A CN 201780015173 A CN201780015173 A CN 201780015173A CN 108886848 A CN108886848 A CN 108886848A
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- CN
- China
- Prior art keywords
- organic
- mentioned
- display element
- sealant
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000565 sealant Substances 0.000 title claims abstract description 119
- 238000000034 method Methods 0.000 claims abstract description 67
- 150000001875 compounds Chemical class 0.000 claims abstract description 43
- 229920002943 EPDM rubber Polymers 0.000 claims abstract description 34
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 22
- 238000012360 testing method Methods 0.000 claims abstract description 22
- 230000008595 infiltration Effects 0.000 claims abstract description 18
- 238000001764 infiltration Methods 0.000 claims abstract description 18
- 238000000576 coating method Methods 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 21
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 6
- 238000010943 off-gassing Methods 0.000 abstract description 10
- 208000033999 Device damage Diseases 0.000 abstract description 5
- -1 ethylene, propylene, bicyclopentadiene Chemical class 0.000 description 67
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 36
- 239000000463 material Substances 0.000 description 35
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 34
- 239000000758 substrate Substances 0.000 description 34
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 32
- 239000002585 base Substances 0.000 description 23
- 239000003822 epoxy resin Substances 0.000 description 21
- 229920000647 polyepoxide Polymers 0.000 description 21
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 17
- 239000007921 spray Substances 0.000 description 17
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 13
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 238000010538 cationic polymerization reaction Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 9
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical class CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 239000006087 Silane Coupling Agent Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 229910010272 inorganic material Inorganic materials 0.000 description 8
- 239000011147 inorganic material Substances 0.000 description 8
- 150000003568 thioethers Chemical class 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 239000007870 radical polymerization initiator Substances 0.000 description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000003607 modifier Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 125000001118 alkylidene group Chemical group 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- LTYMSROWYAPPGB-UHFFFAOYSA-O diphenylsulfanium Chemical compound C=1C=CC=CC=1[SH+]C1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-O 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 150000002921 oxetanes Chemical class 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 150000003863 ammonium salts Chemical class 0.000 description 3
- 150000001450 anions Chemical group 0.000 description 3
- 150000001721 carbon Chemical group 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000012953 triphenylsulfonium Substances 0.000 description 3
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- IIISVPHVLPCACA-UHFFFAOYSA-N NCC1=CC=C(C=C1)C1=C(C=CC(=C1)C(C)C)I Chemical compound NCC1=CC=C(C=C1)C1=C(C=CC(=C1)C(C)C)I IIISVPHVLPCACA-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 150000002924 oxiranes Chemical class 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 150000004714 phosphonium salts Chemical class 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- VLTYTTRXESKBKI-UHFFFAOYSA-N (2,4-dichlorophenyl)-phenylmethanone Chemical compound ClC1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 VLTYTTRXESKBKI-UHFFFAOYSA-N 0.000 description 1
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 1
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- MWZJGRDWJVHRDV-UHFFFAOYSA-N 1,4-bis(ethenoxy)butane Chemical compound C=COCCCCOC=C MWZJGRDWJVHRDV-UHFFFAOYSA-N 0.000 description 1
- GOSBLHSXTSYOIO-UHFFFAOYSA-N 1-(naphthalen-1-ylmethyl)-2H-pyridine-2-carbonitrile Chemical compound C1(=CC=CC2=CC=CC=C12)CN1C(C=CC=C1)C#N GOSBLHSXTSYOIO-UHFFFAOYSA-N 0.000 description 1
- ZPCMJYDANICQEY-UHFFFAOYSA-N 1-benzyl-2h-pyridine-2-carbonitrile Chemical compound N#CC1C=CC=CN1CC1=CC=CC=C1 ZPCMJYDANICQEY-UHFFFAOYSA-N 0.000 description 1
- PAWXNABRTCGGRV-UHFFFAOYSA-N 1-dodecyl-2-iodobenzene Chemical compound CCCCCCCCCCCCC1=CC=CC=C1I PAWXNABRTCGGRV-UHFFFAOYSA-N 0.000 description 1
- RQJCIXUNHZZFMB-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxypropoxy)propane Chemical compound C=COCC(C)OCC(C)OC=C RQJCIXUNHZZFMB-UHFFFAOYSA-N 0.000 description 1
- FOWNZLLMQHBVQT-UHFFFAOYSA-N 1-ethenoxy-2-[2-(2-ethenoxypropoxy)propoxy]propane Chemical compound C=COCC(C)OCC(C)OCC(C)OC=C FOWNZLLMQHBVQT-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- BOSPHQRXWAPYSU-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethanol;methyl prop-2-enoate Chemical compound COC(=O)C=C.OCCOCCO BOSPHQRXWAPYSU-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical class C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 description 1
- CGRJJOYCFCCGPX-UHFFFAOYSA-N 3-ethyloxetane Chemical compound CCC1COC1 CGRJJOYCFCCGPX-UHFFFAOYSA-N 0.000 description 1
- OXQXGKNECHBVMO-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical class C1C(C(=O)O)CCC2OC21 OXQXGKNECHBVMO-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000007848 Bronsted acid Substances 0.000 description 1
- JNMQSQSQBYTXSV-UHFFFAOYSA-N C(CCCCCCCCCCC)C1=C(C=CC=C1)IC1=C(C=CC=C1)CCCCCCCCCCCC Chemical compound C(CCCCCCCCCCC)C1=C(C=CC=C1)IC1=C(C=CC=C1)CCCCCCCCCCCC JNMQSQSQBYTXSV-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- UPXQIFQSXXJDGD-UHFFFAOYSA-N N-[(3,4-dimethylphenyl)methyl]-3,5-dimethylaniline Chemical compound CC1=CC(C)=CC(NCC=2C=C(C)C(C)=CC=2)=C1 UPXQIFQSXXJDGD-UHFFFAOYSA-N 0.000 description 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N N-phenyl amine Natural products NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 1
- JBLCQXNZQUBLBR-UHFFFAOYSA-N NC[N+](CC1=CC=CC=C1)(CC1=CC=CC=C1)C1=CC=CC=C1 Chemical compound NC[N+](CC1=CC=CC=C1)(CC1=CC=CC=C1)C1=CC=CC=C1 JBLCQXNZQUBLBR-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- HUPSPBGENGJALH-UHFFFAOYSA-N [4-(4-propan-2-ylphenyl)phenyl]methanamine Chemical compound C1=CC(C(C)C)=CC=C1C1=CC=C(CN)C=C1 HUPSPBGENGJALH-UHFFFAOYSA-N 0.000 description 1
- BQODPTQLXVVEJG-UHFFFAOYSA-N [O].C=C Chemical group [O].C=C BQODPTQLXVVEJG-UHFFFAOYSA-N 0.000 description 1
- OCAUZCBELLKLQY-UHFFFAOYSA-N [O]COc1ccccc1 Chemical compound [O]COc1ccccc1 OCAUZCBELLKLQY-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000004450 alkenylene group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- HONIICLYMWZJFZ-UHFFFAOYSA-N azetidine Chemical compound C1CNC1 HONIICLYMWZJFZ-UHFFFAOYSA-N 0.000 description 1
- CIZVQWNPBGYCGK-UHFFFAOYSA-N benzenediazonium Chemical compound N#[N+]C1=CC=CC=C1 CIZVQWNPBGYCGK-UHFFFAOYSA-N 0.000 description 1
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical compound C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- DETLSQFJIKIOJL-UHFFFAOYSA-N diphenyl-(4-thiophen-2-ylphenyl)sulfanium Chemical compound C1=CSC(C=2C=CC(=CC=2)[S+](C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 DETLSQFJIKIOJL-UHFFFAOYSA-N 0.000 description 1
- PODOEQVNFJSWIK-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethoxyphenyl)methanone Chemical compound COC1=CC(OC)=CC(OC)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 PODOEQVNFJSWIK-UHFFFAOYSA-N 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- AZDCYKCDXXPQIK-UHFFFAOYSA-N ethenoxymethylbenzene Chemical compound C=COCC1=CC=CC=C1 AZDCYKCDXXPQIK-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 125000001207 fluorophenyl group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical class COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 1
- GRVDJDISBSALJP-UHFFFAOYSA-N methyloxidanyl Chemical group [O]C GRVDJDISBSALJP-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- VPXNMWFNRXLZIJ-UHFFFAOYSA-N n-[(4-methoxyphenyl)methyl]-3,5-dimethylaniline Chemical compound C1=CC(OC)=CC=C1CNC1=CC(C)=CC(C)=C1 VPXNMWFNRXLZIJ-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-methyl phenol Natural products CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- JWONEXMRGJTTMV-UHFFFAOYSA-N oxetan-2-ylmethyl 3-methylpent-2-enoate Chemical class CCC(C)=CC(=O)OCC1CCO1 JWONEXMRGJTTMV-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- ROMWNDGABOQKIW-UHFFFAOYSA-N phenyliodanuidylbenzene Chemical compound C=1C=CC=CC=1[I-]C1=CC=CC=C1 ROMWNDGABOQKIW-UHFFFAOYSA-N 0.000 description 1
- RMVRSNDYEFQCLF-UHFFFAOYSA-O phenylsulfanium Chemical compound [SH2+]C1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-O 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N pyridine Substances C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- HMKGBOLFVMRQRP-UHFFFAOYSA-N tribenzyl(phenyl)azanium Chemical compound C=1C=CC=CC=1C[N+](C=1C=CC=CC=1)(CC=1C=CC=CC=1)CC1=CC=CC=C1 HMKGBOLFVMRQRP-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 229960000834 vinyl ether Drugs 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 230000004584 weight gain Effects 0.000 description 1
- 235000019786 weight gain Nutrition 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Sealing Material Composition (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The object of the present invention is to provide can be easily coated with by ink-jet method, low out gassing is excellent and can reduce ink discharge device damage organic EL display element sealant.The present invention is a kind of organic EL display element sealant, it contains polymerizable compound and polymerization initiator, the organic EL display element is 5mPas~50mPas with viscosity of the sealant at 25 DEG C, surface tension at 25 DEG C is 15mN/m~35mN/m, and when carrying out standing the infiltration test in 1 week at 25 DEG C in the state of making Ethylene-Propylene-Diene rubber impregnated in sealant, the weight rate of the Ethylene-Propylene-Diene rubber of infiltration test front and back is 10% or less.
Description
Technical field
The present invention relates to can be easily coated with by ink-jet method, low out gassing is excellent and can reduce ink discharge device
Damage organic EL display element sealant.
Background technique
Organic electroluminescent (" organic EL ") display element has clamps organic hair between a pair of electrodes opposite each other
Laminate construction obtained by optical material layer, by from an electrode to the organic light emitting material inject electronics, and from another
Electrode injects hole to the organic light emitting material, so that electronics and hole combine and shine in organic light emitting material.Picture
In this way, organic EL display element carries out self-luminous, therefore, compared with liquid crystal display element for needing backlight etc., have following excellent
Point：Visibility is good, can be realized slimming, and is able to carry out DC low-voltage driving.
Constitute the organic light emitting material of organic EL display element, electrode is easy to occur because of moisture, oxygen etc. there are characteristic
The problem of deterioration.Therefore, it in order to obtain practical organic EL display element, needs organic light emitting material, electrode and atmosphere
Isolation is to realize long lifetime.Patent document 1 discloses the stacked film using the silicon nitride film and resin film formed by CVD method
The method that the organic light emitting material of organic EL display element and electrode are sealed.Herein, resin film has and prevents from nitrogenizing
The internal stress of silicon fiml causes organic layer, electrode to oppress this effect.
In the disclosed method being sealed using silicon nitride film of patent document 1, due to the surface of organic EL display element
Bumps, the attachment of foreign matter, the generation of crackle caused by internal stress etc., when forming silicon nitride film, can not cover completely sometimes
Lid organic light emitting material, electrode.If the covering based on silicon nitride film is incomplete, moisture can pass through silicon nitride film and immerse
To organic light emitting material.
As for preventing moisture from immersing the method to organic light emitting material, patent document 2, which discloses, to be alternately deposited
The method of inorganic material film and resin film, patent document 3, patent document 4 are disclosed forms resin film on inorganic material film
Method.
As the method for forming resin film, exist after being coated with sealant on substrate using ink-jet method, keeps the sealant solid
The method of change.If using the coating method based on this ink-jet method, can high speed and be formed uniformly resin film.However,
In the case where making sealant become low viscosity to make it suitable for the coating based on ink-jet method, there are following problems：Hair
Raw degassing；Or so that flow path is changed since damage is caused in the spray head part etc. to ink discharge device, it thus can not be steady for a long time
Surely it sprays.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2000-223264 bulletin
Patent document 2：Japanese Unexamined Patent Application Publication 2005-522891 bulletin
Patent document 3：Japanese Unexamined Patent Publication 2001-307873 bulletin
Patent document 4：Japanese Unexamined Patent Publication 2008-149710 bulletin
Summary of the invention
Problems to be solved by the invention
The object of the present invention is to provide can be easily coated with by ink-jet method, low out gassing is excellent and can subtract
The organic EL display element sealant of the damage of few ink discharge device.
The method used for solving the problem
The present invention 1 is a kind of organic EL display element sealant, contains polymerizable compound and polymerization initiator, institute
Stating viscosity of the organic EL display element sealant at 25 DEG C is 5~50mPas, surface tension at 25 DEG C is 15~
35mN/m, and carry out the leaching for standing for 1 week at 25 DEG C in the state of making Ethylene-Propylene-Diene rubber impregnated in sealant
When seeping test, the weight rate of the Ethylene-Propylene-Diene rubber of infiltration test front and back is 10% or less.
In addition, the present invention 2 is a kind of organic EL display element sealant, it is used for the coating based on ink-jet method, it is described
Organic EL display element sealant contains polymerizable compound and polymerization initiator, and progress makes Ethylene-Propylene-Diene rubber
When the infiltration test in 1 week is stood in the state of being impregnated in sealant at 25 DEG C, the ethylene-propylene-two of infiltration test front and back
The weight rate of alkene rubber is 10% or less.
The present invention described below.It should be noted that for the organic EL display element sealant and this hair of the present invention 1
The common item of bright 2 organic EL display element sealant is denoted as " organic EL display element sealant of the invention ".
The inventors of the present invention's organic EL display element sealant excellent for ink-jet application, further studying makes to soak
The weight rate for seeping the Ethylene-Propylene-Diene rubber (hereinafter also referred to " EPDM rubber ") of test front and back becomes specific model
It encloses.Finally, it is found that：Can get can be easily coated with by ink-jet method, low out gassing is excellent and can reduce ink-jet dress
The organic EL display element sealant for the damage set, so as to complete the present invention.
About organic EL display element sealant of the invention, as ink-jet method, can be used for spraying based on non-heated formula
The coating of the method for the use of ink and water can be used for the coating based on heated type ink-jet method.
It should be noted that above-mentioned " non-heated formula ink-jet method " is in the coating spray head temperature less than 28 DEG C in this specification
The lower method for carrying out ink-jet application of degree, above-mentioned " heated type ink-jet method " is to carry out ink-jet under 28 DEG C or more of coating nozzle temperature
The method of coating.
The coating spray head of the ink-jet equipped with heating mechanism can be used in above-mentioned heated type ink-jet method.By making ink-jet application
Spray head carries heating mechanism, so as to reduce viscosity and surface tension when spraying organic EL display element sealant.
As the above-mentioned ink-jet equipped with heating mechanism coating spray head, such as KONICA MINOLTA company can be enumerated
The KM1024 series of manufacture；The SG1024 series etc. of Fuji Film Dimatix company manufacture.
When organic EL display element of the invention is used for the above-mentioned coating based on heated type ink-jet method with sealant, coating
The heating temperature of spray head is preferably 28 DEG C~80 DEG C of range.By making the heating temperature of the above-mentioned coating spray head range, from
And the rising of viscosity by the time of organic EL display element sealant is suppressed, and it is more excellent to spray stability.
The present invention 1 organic EL display element sealant lower viscosity limit be 5mPas, upper viscosity limit 50mPa
s.By making the above-mentioned viscosity range, so as to be coated with well using ink-jet method.
It should be noted that above-mentioned viscosity refers to using E type viscosimeter in 25 DEG C, the condition of 100rpm in this specification
The value of lower measurement.
Organic EL display element sealant of the invention when being coated using above-mentioned non-heated formula ink-jet method it is viscous
The preferred lower limit of degree is 5mPas, preferred upper limit 20mPa.s.It is non-so as to utilize by making the above-mentioned viscosity range
Heated type ink-jet method is coated with well.Organic EL of the invention when being coated using above-mentioned non-heated formula ink-jet method is shown
The more preferable lower limit of the viscosity of element sealant is 8mPas, the more preferable upper limit is 16mPa.s, and further preferred lower limit is
10mPas, the further preferred upper limit are 13mPa.s.
Organic EL display element of the invention when on the other hand, for the above-mentioned coating based on heated type ink-jet method is with close
Seal agent viscosity preferred lower limit be 10mPas, preferred upper limit 50mPa.s.By making the above-mentioned viscosity range, thus
It can be coated with well using heated type ink-jet method.Of the invention when for the above-mentioned coating based on heated type ink-jet method has
The more preferable lower limit of the viscosity of machine EL display element sealant is 20mPas, the more preferable upper limit is 40mPa.s.
The present invention 1 organic EL display element sealant surface tension lower limit be 15mN/m, upper limit 35mN/m.
By making the above-mentioned surface tension range, so as to be coated with well using ink-jet method.Above-mentioned surface tension it is preferred
Lower limit is 20mN/m, preferred upper limit 30mN/m, and more preferable lower limit is 22mN/m, the more preferable upper limit is 28mN/m.
In addition, the preferred lower limit of the surface tension of the organic EL display element sealant of the present invention 2 is 15mN/m, preferably
The upper limit is 35mN/m.By making the above-mentioned surface tension range, can be coated with well using ink-jet method.Above-mentioned surface
The more preferable lower limit of power is 20mN/m, the more preferable upper limit is 30mN/m, further preferred lower limit be 22mN/m, further preferably on
It is limited to 28mN/m.
It should be noted that above-mentioned surface tension, which refers to, passes through Wilhelmy method using dynamic wettability testing machine at 25 DEG C
Value obtained by being measured.
Organic EL display element of the invention is carried out in the state of being impregnated in EPDM rubber in sealant with sealant
When standing the infiltration test in 1 week at 25 DEG C, the weight rate of the EPDM rubber of infiltration test front and back is 10% or less.Pass through
Make the weight rate 10% of above-mentioned EPDM rubber hereinafter, to make the effect for the damage for reducing ink discharge device become excellent.
The preferred upper limit of the weight rate of above-mentioned EPDM rubber is 8%, the more preferable upper limit is 5%.
It should be noted that specifically, the weight rate of the EPDM rubber of above-mentioned infiltration test front and back is asked as follows
Out：Organic EL display element sealant is fitted into brown screwed pipe, weight W is impregnated1(g) EPDM rubber and capping,
After 25 DEG C of 1 weeks of standing, takes out EPDM rubber and wipe surface with gauze etc., measure weight (W2(g)), thus using following
Formula finds out weight rate.
Weight rate (%)=((W2-W1)/W1)×100
Above-mentioned EPDM rubber is the rubber of ethylene-propylene-bicyclopentadiene copolymer.Specifically, source can be used
From ethylene, propylene, bicyclopentadiene each structural unit ratio with molar ratio computing be the structural unit from ethylene：It is originated from
The structural unit of propylene：Structural unit=10~90 from bicyclopentadiene: 15~50: 1~50 and weight average molecular weight be 20
Ten thousand~2,000,000 EPDM rubber.Using be originated from ethylene, propylene, bicyclopentadiene each structural unit ratio and again divide equally
Son amount be above range EPDM rubber any one of when, as long as above-mentioned infiltration test front and back EPDM rubber weight become
Rate is 10% or less.As the commercially available product for belonging to this EPDM rubber, (the gloomy Qinghua such as AS568-009 can be enumerated
Work corporation) etc..
It should be noted that above-mentioned weight average molecular weight is surveyed using gel permeation chromatography (GPC) in this specification
Value that is fixed, and being found out based on polystyrene conversion.As measured using GPC based on polystyrene conversion weight average molecular weight
When pillar, can enumerate such as Shodex LF-804 (Showa electrician corporation).In addition, as molten used in GPC
Agent can enumerate tetrahydrofuran etc..
The weight rate of the EPDM rubber of above-mentioned viscosity, above-mentioned surface tension and above-mentioned infiltration test front and back is come
It says, it can be by carrying out their kind for aftermentioned polymerizable compound, polymerization initiator and optionally other ingredients for containing
The selection of class and the adjustment of content ratio, to be set as above range.
Organic EL display element sealant of the invention contains polymerizable compound.
Above-mentioned polymerizable compound preferably comprises compound in the molecule comprising 17% or more oxygen atom, described in molecule
The compound for inside including 17% or more oxygen atom is 10~100 parts by weight in polymerizable compound all 100 parts by weight.
The inventors of the present invention think：The damage reason of above-mentioned ink discharge device is rubber used in spray head part of device etc.
The compatibility of material and sealant is high.Therefore, it as the polymerizable compound cooperated into sealant, has studied using based on molten
The value of solution degree parameter and think the compound that the compatibility of itself and the rubber material can be lower.However, even if being joined based on solubility
Several values carrys out selective polymerization compound, it is also difficult to be set as the weight rate of the EPDM rubber of above-mentioned infiltration test front and back
10% hereinafter, be unable to fully reduce the damage of ink discharge device sometimes.Thus, the inventors of the present invention through furtheing investigate as a result, it has been found that：
It in the molecule include 17% or more oxygen atom being used in a manner of reaching certain content above-mentioned as polymerizable compound
Compound, so as to which the weight rate of the EPDM rubber of above-mentioned infiltration test front and back is easily set as 10% or less.
The above-mentioned compound comprising 17% or more oxygen atom in the molecule preferably includes 20% or more oxygen atom in the molecule,
It more preferably include 25% or more.
In addition, above-mentioned in the molecule comprising 17% or more oxygen atom in whole 100 parts by weight of above-mentioned polymerizable compound
Compound content more preferable lower limit be 20 parts by weight.
In addition, above-mentioned polymerizable compound does not preferably contain carbon atom continuous 8 or more carbon chain backbones.It is above-mentioned by making
Polymerizable compound does not contain carbon atom continuous 8 or more carbon chain backbones, so that the compatibility of itself and rubber material will not become
Height, the effect for reducing ink discharge device damage become more excellent.As above-mentioned carbon atom continuous 8 or more carbon chain backbones, can arrange
Enumerate the alkylidene or Asia that alkenylene, cyclohexane ring and carbon number that alkylidene, carbon number that carbon number is 8 or more are 8 or more are 2 or more
The combination etc. of alkenyl.
As above-mentioned polymerizable compound, free-radical polymerised compound, cationically polymerizable compound can be used.
As above-mentioned free-radical polymerised compound, preferably (methyl) acrylic compounds.
Above-mentioned (methyl) acrylic compounds can be simple function (methyl) acrylic compounds, or more officials
Energy (methyl) acrylic compounds, can also be by above-mentioned simple function (methyl) acrylic compounds and above-mentioned multifunctional (first
Base) acrylic compounds are applied in combination.
It should be noted that above-mentioned " (methyl) acrylic compounds " refer to acrylic compounds or methacrylic acid in this specification
Class, above-mentioned " (methyl) acrylic compounds " refer to the compound with (methyl) acryloyl group, above-mentioned " (methyl) acryloyl
Base " refers to acryloyl group or methylacryloyl.
From viewpoints such as low out gassing, above-mentioned simple function (methyl) acrylic compounds preferably have cationic polymerization
Property group.
As above-mentioned cationic polymerizable group, such as vinyl ether group, epoxy group, oxetanylmethoxy, alkene can be enumerated
Propyl ether, vinyl, hydroxyl etc..
As above-mentioned simple function (methyl) acrylic compounds, specifically, such as (methyl) acrylic acid can be enumerated
3,4- epoxycyclohexanecarboxylates, (methyl) glycidyl acrylate, (methyl) acrylic acid 4- hydroxybutyl glycidol ether,
(methyl) acrylic acid 2- (2- vinyloxyethoxy) ethyl ester, 3- ethyl -3- (methyl) acryloyloxymethyl oxetanes,
(methyl) allyl acrylate, methoxyl group diethylene glycol (methyl) acrylate, methoxy triethylene (methyl) acrylate,
Ethoxydiglycol (methyl) acrylate, ethoxytriglycol (methyl) acrylate, (methyl) acrylic acid -2- (2-
Vinyloxyethoxy) ethyl ester, (methyl) dicyclopentanyl acrylate etc..Wherein, preferably (methyl) acrylic acid 3,4- epoxy
Cyclohexylmethyl, (methyl) acrylic acid 4- hydroxybutyl glycidol ether, (methyl) acrylic acid 2- (2- vinyloxyethoxy)
Ethyl ester.
It should be noted that above-mentioned " (methyl) acrylate " refers to acrylate or methacrylic acid in this specification
Ester.
When above-mentioned polymerizable compound contains above-mentioned simple function (methyl) acrylic compounds, above-mentioned polymerizable compound
The preferred lower limit of the content of above-mentioned simple function (methyl) acrylic compounds in 100 parts by weight be 20 parts by weight, preferably on
It is limited to 80 parts by weight.By making the content of above-mentioned simple function (methyl) acrylic compounds range, resulting organic EL
The low out gassing etc. of display element sealant becomes more excellent.The content of above-mentioned simple function (methyl) acrylic compounds
More preferable lower limit is 30 parts by weight, the more preferable upper limit is 60 parts by weight.
From viewpoints such as ink-jet applications, above-mentioned multifunctional (methyl) acrylic compounds preferably have in main chain poly-
Oxyalkylene skeleton.
Skeleton made of continuous 2~6 of the above-mentioned preferred oxygen alkylidene unit of polyoxy alkylidene skeleton.
As the oxygen alkylidene unit for constituting above-mentioned polyoxy alkylidene skeleton, more oxygen ethylene unit, oxygen Asia third can be enumerated
Base unit etc..
From viewpoints such as ink-jet applications, above-mentioned multifunctional (methyl) acrylic compounds are preferably the branch of carbochain
Few structure, more preferably straight-chain.
As above-mentioned multifunctional (methyl) acrylic compounds, specifically, such as two (first of diethylene glycol can be enumerated
Base) acrylate, triethylene glycol two (methyl) acrylate, tetraethylene glycol two (methyl) acrylate, two (first of dipropylene glycol
Base) acrylate, tripropylene glycol two (methyl) acrylate, four propylene glycol two (methyl) acrylate, polytetramethylene glycol
Two (methyl) acrylate etc..Wherein, preferably tetraethylene glycol two (methyl) acrylate.
When above-mentioned polymerizable compound contains above-mentioned multifunctional (methyl) acrylic compounds, above-mentioned polymerizable compound
The preferred lower limit of the content of above-mentioned multifunctional (methyl) acrylic compounds in 100 parts by weight be 20 parts by weight, preferably on
It is limited to 80 parts by weight.By making the content of above-mentioned multifunctional (methyl) the acrylic compounds range, so that resulting have
The ink-jet application etc. of machine EL display element sealant becomes more excellent.Above-mentioned multifunctional (methyl) acrylic compounds
The more preferable lower limit of content is 30 parts by weight, the more preferable upper limit is 60 parts by weight.
It combines above-mentioned simple function (methyl) acrylic compounds with above-mentioned multifunctional (methyl) acrylic compounds
In use, above-mentioned simple function (methyl) acrylic compounds and above-mentioned multifunctional (methyl) acrylic compounds containing than
Example is preferably simple function (methyl) acrylic compounds with weight ratio meter：Multifunctional (methyl) acrylic compounds=7: 3
~3: 7.By by above-mentioned simple function (methyl) acrylic compounds and above-mentioned multifunctional (methyl) acrylic compounds
Content ratio is set as the range, more excellent so as to the ink-jet application that makes resulting organic EL display element sealant etc.
It is different.The content ratio of above-mentioned simple function (methyl) acrylic compounds and above-mentioned multifunctional (methyl) acrylic compounds with
Weight ratio meter is more preferably simple function (methyl) acrylic compounds：Multifunctional (methyl) acrylic compounds=6: 4~4
∶6。
As above-mentioned cationically polymerizable compound, such as epoxide, oxetane compound, second can be enumerated
Alkenyl ether compound etc..
As above-mentioned epoxide, such as bisphenol A type epoxy resin, bisphenol E-type epoxy resin, Bisphenol F can be enumerated
The O-shaped epoxy resin of type epoxy resin, bisphenol-s epoxy resin, bis-phenol, 2,2 '-diallyl bisphenol type epoxy resin, alicyclic ring
Formula epoxy resin, A Hydrogenated Bisphenol A type epoxy resin, propylene oxide addition bisphenol A type epoxy resin, resorcinol type epoxy resin,
Biphenyl type epoxy resin, thioether-type epoxy resin, diphenyl ether type epoxy, dicyclopentadiene-type epoxy resin, naphthalene type ring
Oxygen resin, phenol novolak type epoxy resin, o-cresol phenolic epoxy varnish, dicyclopentadiene novolac type ring
Oxygen resin, biphenyl phenolic resin varnish type epoxy resin, naphthol novolac type epoxy resin, glycidyl amine type epoxy resin, alkane
Polylol type epoxy resin, modified rubber type epoxy resin, epihydric alcohol ester compound, 1,6- hexanediol diglycidyl ether
Deng.Wherein, preferably alicyclic epoxy resin.
As the commercially available product among above-mentioned alicyclic epoxy resin, can enumerate such as CELLOXIDE 2000,
CELLOXIDE 2021P, 2081 CELLOXIDE, CELLOXIDE 3000, CELLOXIDE 8000 (are Daicel company
System)；Sansocizer EPS (new Japan Chemical industrial group system) etc..
As above-mentioned oxetane compound, such as allyloxy oxetanes, phenoxymethyl oxygen can be enumerated
Azetidine, 3- ethyl -3- hydroxymethyl oxetane, 3- ethyl -3- (phenoxymethyl) oxetanes, 3- ethyl -
3- ((2- ethylhexyl oxygroup) methyl) oxetanes, 3- ethyl -3- ((3- (triethoxysilyl) propoxyl group) first
Base) oxetanes, 3- ethyl -3- (((3- Ethyloxetane -3- base) methoxyl group) methyl) oxetanes, oxa- ring
Bis- (((3- ethyl -3- oxetanylmethoxy) methoxyl group) first of butyl silsesquioxane, phenol novolacs oxetanes, Isosorbide-5-Nitrae -
Base) benzene etc..
As above-mentioned vinyl ether compound, such as benzyl vinyl ether, cyclohexanedimethanol mono-vinyl can be enumerated
Ether, bicyclopentadiene vinyl ethers, 1,4-butanediol divinyl ether, cyclohexanedimethanol divinyl base ether, diethylene glycol two
Vinyl ethers, triethyleneglycol divinylether, dipropylene glycol divinyl ether, tripropylene glycol divinyl ether etc..
Organic EL display element sealant of the invention contains polymerization initiator.
It, can be compatibly free using light according to type of polymerizable compound used etc. as above-mentioned polymerization initiator
Base polymerization initiator, hot radical polymerization initiator, light cationic polymerization initiator, hot cationic polymerization.
As above-mentioned optical free radical polymerization initiator, such as benzophenone based compound, acetophenone system chemical combination can be enumerated
Object, acylphosphine oxide compound, titanocenes based compound, oxime ester based compound, benzoin ether based compound, benzil, thiophene
Ton ketone based compound etc..
As the commercially available product among above-mentioned optical free radical polymerization initiator, can enumerate such as IRGACURE184,
IRGACURE369、IRGACURE379、IRGACURE651、IRGACURE819、IRGACURE907、IRGACURE2959、
IRGACURE OXE01, Lucirin TPO (being BASF AG's system)；Benzoin methylether, benzoin ethyl ether, benzoin iso-propylether
(being Tokyo chemical conversion industry corporation) etc..
As above-mentioned hot radical polymerization initiator, can enumerate such as the shape as azo-compound, organic peroxide
At hot radical polymerization initiator.
As above-mentioned azo-compound, such as 2 can be enumerated, 2 '-azos bis- (2,4- methyl pentane nitriles), azobisisobutylonitrile
Nitrile etc..
As above-mentioned organic peroxide, such as benzoyl peroxide, ketone peroxide, ketal peroxide, mistake can be enumerated
Hydrogen oxide, dialkyl peroxide, peroxyester, diacyl peroxide, peroxy dicarbonate etc..
As the commercially available product among above-mentioned hot radical polymerization initiator, can enumerate such as VPE-0201, VPE-0401,
VPE-0601, VPS-0501, VPS-1001, V-501 (being and Wako Pure Chemical Industries corporation) etc..
As long as above-mentioned light cationic polymerization initiator by light irradiation generate Bronsted acid or lewis acidic light sun from
Sub- polymerization initiator, there is no particular limitation, can be ionic light and produce acid type, be also possible to nonionic light and produce acid type.
The anion part that the light cationic polymerization initiator of acid type is produced as above-mentioned ionic light, can enumerate for example
BF4 -、PF6 -、SbF6 -Or (BX4)-(wherein, X is indicated by fluorine or the phenyl that replaces of trifluoromethyl more than at least two) etc..
The light cationic polymerization initiator that acid type is produced as above-mentioned ionic light, can enumerate for example with above-mentioned anion
Partial aromatic series sulfonium salt, aromatic iodonium salts, aromatic diazonium salt, aromatic series ammonium salt, (2,4- cyclopentadiene -1- base) ((1-
Methylethyl) benzene)-Fe salt etc..
As above-mentioned aromatic series sulfonium salt, can enumerate the double hexafluorophosphate of for example bis- (4- (diphenyl sulfonium) phenyl) thioethers,
It is the double tetrafluoroborates of the double hexafluoro antimonate of bis- (4- (diphenyl sulfonium) phenyl) thioethers, bis- (4- (diphenyl sulfonium) phenyl) thioethers, double
(4- (diphenyl sulfonium) phenyl) thioether four (pentafluorophenyl group) borate, diphenyl -4- (thiophenyl) phenyl sulfonium hexafluorophosphate, two
Phenyl -4- (thiophenyl) phenyl sulfonium hexafluoro antimonate, diphenyl -4- (thiophenyl) phenyl sulfonium tetrafluoroborate, diphenyl -4-
(thiophenyl) phenyl sulfonium four (pentafluorophenyl group) borate, triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoro antimonate, triphenyl
Sulfonium tetrafluoroborate, triphenylsulfonium four (pentafluorophenyl group) borate, bis- (4- (two (4- (2- hydroxyl-oxethyl)) phenyl sulfoniums) benzene
Base) it is the double hexafluorophosphate of thioether, the double hexafluoro antimonates of bis- (4- (two (4- (2- hydroxyl-oxethyl)) phenyl sulfoniums) phenyl) thioethers, double
(4- (two (4- (2- hydroxyl-oxethyl)) phenyl sulfoniums) phenyl) thioether double tetrafluoroborates, bis- (4- (two (4- (2- '-hydroxyethoxies
Base)) phenyl sulfonium) phenyl) thioether four (pentafluorophenyl group) borate, three (4- (4- acetylphenyl) sulfenyl phenyl) (five fluorine of sulfonium four
Phenyl) borate etc..
As above-mentioned aromatic iodonium salts, such as diphenyl iodine hexafluorophosphate, diphenyl iodine hexafluoro can be enumerated
Stibate, diphenyl iodine tetrafluoroborate, diphenyl iodine four (pentafluorophenyl group) borate, bis- (dodecylphenyl) iodine
It is hexafluorophosphate, bis- (dodecylphenyl) iodine hexafluoro antimonates, bis- (dodecylphenyl) iodine tetrafluoroborates, double
(dodecylphenyl) iodine four (pentafluorophenyl group) borate, 4- aminomethyl phenyl -4- (1- Methylethyl) phenyl-iodide hexafluoro phosphorus
Hydrochlorate, 4- aminomethyl phenyl -4- (1- Methylethyl) phenyl-iodide hexafluoro antimonate, 4- aminomethyl phenyl -4- (1- Methylethyl) benzene
Base iodine tetrafluoroborate, 4- aminomethyl phenyl -4- (1- Methylethyl) phenyl-iodide four (pentafluorophenyl group) borate etc..
As above-mentioned aromatic diazonium salt, such as phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoro-antimonic acid can be enumerated
Salt, phenyldiazonium tetrafluoroborate, phenyldiazonium four (pentafluorophenyl group) borate etc..
As above-mentioned aromatic series ammonium salt, such as 1- benzyl -2- cyanopyridine hexafluorophosphate, 1- benzyl-can be enumerated
2- cyanopyridine hexafluoro antimonate, 1- benzyl -2- cyanopyridine tetrafluoroborate, 1- benzyl -2- cyanopyridine four (five
Fluorophenyl) borate, 1- (naphthyl methyl) -2- cyanopyridine hexafluorophosphate, 1- (naphthyl methyl) -2- cyanopyridine six
Fluorine antimonate, 1- (naphthyl methyl) -2- cyanopyridine tetrafluoroborate, four (five fluorine of 1- (naphthyl methyl) -2- cyanopyridine
Phenyl) borate etc..
As above-mentioned (2,4- cyclopentadiene -1- base) ((1- Methylethyl) benzene)-Fe salt, such as (2,4- rings can be enumerated
Pentadiene -1- base) ((1- Methylethyl) benzene)-Fe (II) hexafluorophosphate, (2,4- cyclopentadiene -1- base) ((1- methyl second
Base) benzene)-Fe (II) hexafluoro antimonate, (2,4- cyclopentadiene -1- base) ((1- Methylethyl) benzene)-Fe (II) tetrafluoroborate,
(2,4- cyclopentadiene -1- base) ((1- Methylethyl) benzene)-Fe (II) four (pentafluorophenyl group) borate etc..
As above-mentioned nonionic light produce acid type light cationic polymerization initiator, can enumerate such as nitrobenzyl ester,
Sulfonic acid, phosphate, sulfophenylate, diazo naphthoquinone, N- hydroxy imide sulfonate etc..
As the commercially available product among above-mentioned light cationic polymerization initiator, such as DTS-200 (green chemical company can be enumerated
System)；UVI6990, UVI6974 (being Union Carbide corporation)；SP-150, SP-170 (being ADEKA corporation)；
FC-508, FC-512 (being 3M corporation)；IRGACURE261, IRGACURE290 (being BASF AG's system)；PI2074
(Rhodia corporation) etc..
As above-mentioned hot cationic polymerization, anion part can be enumerated by BF4 -、PF6 -、SbF6 -Or (BX4)-
The sulfonium salt, phosphonium salt of (wherein, X is indicated by fluorine or the phenyl that replaces of trifluoromethyl more than at least two) composition, ammonium salt etc..Wherein,
Preferably sulfonium salt, ammonium salt.
As above-mentioned sulfonium salt, triphenylsulfonium tetrafluoroborate, triphenylsulfonium hexafluoro antimonate etc. can be enumerated.
As Shang Shu phosphonium salt, Yi base triphenyl phosphonium hexafluoro antimonate, 4-butyl-phosphonium hexafluoro antimonate etc. can be enumerated.
As above-mentioned ammonium salt, such as 3,5-dimethylphenyl (4- methoxy-benzyl) ammonium hexafluorophosphate, dimethyl can be enumerated
Phenyl (4- methoxy-benzyl) ammonium hexafluoro antimonate, 3,5-dimethylphenyl (4- methoxy-benzyl) ammonium four (pentafluorophenyl group) borate,
3,5-dimethylphenyl (4- methylbenzyl) ammonium hexafluorophosphate, 3,5-dimethylphenyl (4- methylbenzyl) ammonium hexafluoro antimonate, dimethyl
Phenyl (4- methylbenzyl) ammonium hexafluoro four (pentafluorophenyl group) borate, aminomethyl phenyl dibenzyl ammonium hexafluorophosphate, aminomethyl phenyl
Dibenzyl ammonium hexafluoro antimonate, aminomethyl phenyl dibenzyl ammonium four (pentafluorophenyl group) borate, four (phenyl-pentafluoride of phenyl tribenzyl ammonium
Base) borate, 3,5-dimethylphenyl (3,4- dimethyl benzyl) ammonium four (pentafluorophenyl group) borate, N, N- Dimethyl-NBenzyl benzene
Amine hexafluoro antimonate, N, N- diethyl-Phenhenzamine tetrafluoroborate, N, N- Dimethyl-NBenzyl pyridine hexafluoro
Stibate, N, N- diethyl-N- benzyl pyridine trifluoromethayl sulfonic acid etc..
As the commercially available product among above-mentioned hot cationic polymerization, such as San-Aid SI-60, San- can be enumerated
Aid SI-80, San-Aid SI-B3, San-Aid SI-B3A, San-Aid SI-B4 (being three new chemical industrial company's systems)；
CXC1612, CXC1821 (being King Industries corporation) etc..
The content of above-mentioned polymerization initiator is 0.01 weight relative to the preferred lower limit of above-mentioned 100 parts by weight of polymerizable compound
Measure part, preferred upper limit is 10 parts by weight.More than 0.01 parts by weight of content by making above-mentioned polymerization initiator, thus resulting
The curability of organic EL display element sealant becomes more excellent.By 10 parts by weight of content for making above-mentioned polymerization initiator
Hereinafter, the curing reaction to resulting organic EL display element sealant will not be too fast, workability becomes more excellent, can
Make solidfied material more evenly.The more preferable lower limit of the content of above-mentioned polymerization initiator is 0.05 parts by weight, the more preferable upper limit is 5 weight
Part.
Organic EL display element sealant of the invention can contain sensitizer.Above-mentioned sensitizer, which has, to be further increased
The polymerization initiation efficiency of above-mentioned polymerization initiator further promotes the solidification of organic EL display element sealant of the invention anti-
The effect answered.
As above-mentioned sensitizer, the thioxanthones based compounds such as such as 2,4- diethyl thioxanthone can be enumerated；2,2- diformazans
Oxy-1,2- diphenylethane -1- ketone, benzophenone, 2,4- dichloro benzophenone, o-benzoyl yl benzoic acid methyl esters, 4,4 ' -
Bis- (dimethylamino) benzophenone, 4- benzoyl -4 '-dimethyl diphenyl sulfide etc..
The content of above-mentioned sensitizer is 0.01 weight relative to the preferred lower limit of above-mentioned 100 parts by weight of polymerizable compound
Part, preferred upper limit are 3 parts by weight.More than 0.01 parts by weight of content by making above-mentioned sensitizer, so as to further play
It is sensitized effect.By making 3 parts by weight of content of above-mentioned sensitizer hereinafter, absorb and so as to which light is conveyed to deep will not
Become excessive.The more preferable lower limit of the content of above-mentioned sensitizer is 0.1 parts by weight, the more preferable upper limit is 1 parts by weight.
Organic EL display element sealant of the invention can contain silane coupling agent.Above-mentioned silane coupling agent have make
The effect that the cementability of organic EL display element sealant and substrate etc. of the invention improves.
As above-mentioned silane coupling agent, such as 3- TSL 8330,3- mercaptopropyi front three can be enumerated
Oxysilane, 3- glycidoxypropyltrime,hoxysilane, 3- isocyanate propyl trimethoxysilane etc..These silane are even
Connection agent may be used alone, can also be used in combination two or more.
The content of above-mentioned silane coupling agent is 0.1 weight relative to the preferred lower limit of above-mentioned 100 parts by weight of polymerizable compound
Measure part, preferred upper limit is 10 parts by weight.By making the content of the above-mentioned silane coupling agent range, so as to inhibit extra
Silane coupling agent exudation, and the effect for improving cementability becomes more excellent.The content of above-mentioned silane coupling agent it is more preferable under
It is limited to 0.5 parts by weight, the more preferable upper limit is 5 parts by weight.
Organic EL display element sealant of the invention can further contain within the scope without prejudice to the object of the present invention
There is surface modifier.By containing above-mentioned surface modifier, so as to organic EL display element sealant of the invention
Assign the flatness of film.
As above-mentioned surface modifier, can enumerate such as surfactant, levelling agent.
As above-mentioned surface modifier, the surface modifier such as silicone-based, fluorine system can be enumerated.
As the commercially available product among above-mentioned surface modifier, can enumerate such as BYK-340, BYK-345 (is BYK-
Chemie JAPAN corporation), Surflon S-611 (AGC Seimi Chemical corporation) etc..
Organic EL display element sealant of the invention can contain solvent for the purpose for adjusting viscosity etc., but deposit
Worry the problems such as generating organic light emitting material deterioration because of remaining solvent or deaerating, it is therefore preferable that being free of
The content of solvent or solvent is 0.05 weight % or less.
In addition, organic EL display element sealant of the invention can contain reinforcing agent, softening agent, plasticising as needed
Various additives well known to agent, viscosity modifier, ultraviolet absorbing agent, antioxidant etc..
As the method for manufacturing organic EL display element sealant of the invention, can enumerate for example using homogenous disperse
The mixing machines such as machine, homogeneous mixer, universal mixer, planetary mixer, kneader, three-roller, by polymerizable compound, polymerization
The method etc. that the additives such as initiator and the silane coupling agent being added as needed are mixed.
Total light of light of the solidfied material of organic EL display element sealant of the invention at 380~800nm of wavelength
The preferred lower limit of transmissivity is 80%.By making above-mentioned 80% or more total light transmittance, so that resulting organic EL is shown
The optical characteristics of element becomes more excellent.The more preferable lower limit of above-mentioned total light transmittance is 85%.
(the east such as AUTOMATIC HAZE MATER MODEL TC=III DPK can be used in above-mentioned total light transmittance
Capital electricity color corporation) etc. spectrometers be measured.
In addition, if solidfied material used in the measurement of above-mentioned total light transmittance is the sealant of photo-curable, then may be used
To irradiate 3000mJ/cm to sealant by, for example, LED light2The ultraviolet light of wavelength 365nm obtain, if it is thermosetting
The sealant for the property changed can then be obtained for example, by heating 1 hour at 80 DEG C.
400nm about organic EL display element sealant of the invention, after 100 hours ultraviolet lights are irradiated to solidfied material
The transmissivity at place is preferably 85% or more in terms of 20 μm of optical path length.It is saturating after 100 hours ultraviolet lights of above-mentioned irradiation by making
Penetrating rate is 85% or more, so that the transparency is got higher, luminous loss becomes smaller, and colorrendering quality becomes more excellent.It is above-mentioned
The more preferable lower limit of transmissivity after irradiating 100 hours ultraviolet lights is 90%, further preferred lower limit is 95%.
As the light source for irradiating above-mentioned ultraviolet light, the conventionally known light source such as xenon lamp, carbon arc lamp can be used.
In addition, if solidfied material used in the measurement of the transmissivity after 100 hours ultraviolet lights of above-mentioned irradiation is photocuring
Property sealant, then can by, for example, LED light to sealant irradiate 3000mJ/cm2Wavelength 365nm ultraviolet light come
It obtains, if it is the sealant of Thermocurable, then can be obtained for example, by heating 1 hour at 80 DEG C.
About organic EL display element sealant of the invention, according to JIS Z 0208, by solidfied material in 85 DEG C, 85%
Exposure 24 hours in the environment of RH and the moisture permeability under the conditions of 100 μ m thicks that measure is preferably 100g/m2Below.On making
Stating moisture permeability is 100g/m2Hereinafter, to which the effect for preventing moisture from reaching organic light emitting material and generating dim spot becomes more excellent
Different, the reliability of resulting organic EL display element becomes more excellent.
In addition, if solidfied material used in the measurement of above-mentioned moisture permeability is the sealant of photo-curable, then can pass through
Such as 3000mJ/cm is irradiated to sealant using LED light2The ultraviolet light of wavelength 365nm obtain, if it is Thermocurable
Sealant can then be obtained for example, by heating 1 hour at 80 DEG C.
In turn, about organic EL display element sealant of the invention, by solidfied material in the environment of 85 DEG C, 85%RH
At exposure 24 hours, the moisture content of solidfied material is preferably smaller than 0.5%.By making the moisture content of above-mentioned solidfied material less than 0.5%, from
And the effect for preventing organic light emitting material from deteriorating by the moisture in solidfied material becomes more excellent, resulting organic EL is aobvious
Show that the reliability of element becomes more excellent.The more preferable upper limit of the moisture content of above-mentioned solidfied material is 0.3%.
As the measuring method of above-mentioned moisture content, can enumerate for example based on JIS K 7251 and by Karl_Fischer method come
The method that finds out the methods of finds out weight gain after water suction based on JIS K 7209-2.
In addition, if solidfied material used in the measurement of above-mentioned moisture content is the sealant of photo-curable, example can be passed through
3000mJ/cm such as is irradiated to sealant using LED light2The ultraviolet light of wavelength 365nm obtain, if it is the close of Thermocurable
Agent is sealed, can be obtained for example, by heating 1 hour at 80 DEG C.
The organic EL display element sealant of the present invention 1 can be suitable for the coating based on ink-jet method, and the present invention's 2 has
Machine EL display element sealant can be used for the coating based on ink-jet method.
As the method for using organic EL display element of the invention with sealant and manufacturing organic EL display element, can arrange
It enumerates such as the method with following process：By ink-jet method, organic EL display element of the invention is coated with sealant
In the process of substrate；And it is cured be coated with organic EL display element with sealant by light irradiation and/or heating
Process.
Organic EL display element of the invention is coated in the process of substrate with sealant, organic EL of the invention is shown
Element sealant can be coated on the whole face of substrate, can also be coated on a part of substrate.It is formed as by coating
Organic EL display element sealant of the invention sealing shape, as long as can protect with luminous organic material
The shape that the laminated body of layer is not influenced by extraneous gas, there is no particular limitation, it can be the shape that the laminated body is completely covered,
It can also be formed in the pattern of the peripheral portion closure of the laminated body, the peripheral portion for being additionally formed in the laminated body is provided with one
Separate the pattern of the shape of oral area.
When making above-mentioned organic EL display element sealant cures by light irradiation, organic EL display element of the invention is used
Sealant can be 300nm~400nm by illumination wavelength and accumulated light is 300~3000mJ/cm2Light come it is solid well
Change.
As for the light source to organic EL display element of the invention with sealant irradiation light, such as low pressure can be enumerated
Mercury lamp, medium pressure mercury lamp, high-pressure sodium lamp, ultrahigh pressure mercury lamp, excimer laser, chemical lamp, black light lamp, microwave-excited mercury lamp, metal
Halide lamp, sodium vapor lamp, halogen lamp, xenon lamp, LED light, fluorescent lamp, sunlight, electron beam illuminating device etc..These light sources can be single
It solely uses, also can be used together two or more.
These light sources can be fitted according to the absorbing wavelength of above-mentioned optical free radical polymerization initiator, light cationic polymerization initiator
Work as selection.
As the means to organic EL display element of the invention with sealant irradiation light, for example various light sources can be enumerated
While irradiation, separate the successively irradiation of time difference and irradiate simultaneously and the combination irradiation that successively irradiates etc., any photograph can be used
Shooter's section.
The process of above-mentioned organic EL display element sealant cures is obtained using irradiating and/or heating by light
Solidfied material can further be covered by inorganic material film.
As the inorganic material for constituting above-mentioned inorganic material film, conventionally known inorganic material can be used, can enumerate
Such as silicon nitride (SiNx), silica (SiOx) etc..Above-mentioned inorganic material film can be constituted by 1 layer, can also be laminated there are many
Layer.Further, it is also possible to which above-mentioned inorganic material film and the resin film comprising organic EL display element sealant of the invention are handed over
For repeatedly covering above-mentioned laminated body.
The method for manufacturing above-mentioned organic EL display element can have following process：It is aobvious to be coated with organic EL of the invention
Show the process that the substrate (hereinafter also referred to " substrate of a side ") of element sealant is bonded with the substrate of another party.
The substrate (hereinafter also referred to " substrate of a side ") for being coated with organic EL display element sealant of the invention can be with
It is the substrate for being formed with the laminated body with organic light emitting material, is also possible to the substrate of the not formed laminated body.
In the case where the substrate of one side is the substrate of not formed above-mentioned laminated body, in the base for being bonded above-mentioned another party
When material, as long as being coated on the substrate of one side in the way of above-mentioned laminated body can be protected not influenced by extraneous gas
Organic EL display element sealant of the invention.That is, when being bonded the substrate of another party above-mentioned stacking can be being become
The position of the position of body is coated by entire surface, alternatively, can form closure when being bonded the substrate of another party as above-mentioned
The sealant portion of the pattern for the shape that the position of the position of laminated body is stored completely.
Being irradiated and/or being heated by light allows the process of above-mentioned organic EL display element sealant cures will be above-mentioned
Carry out before the process that the substrate of one side is bonded with the substrate of above-mentioned another party, can also by the substrate of one side with
It is carried out after the process that the substrate of above-mentioned another party is bonded.
Being irradiated and/or being heated by light makes the process of above-mentioned organic EL display element sealant cures by one side
The process that is bonded with the substrate of above-mentioned another party of substrate before carry out in the case where, organic EL display element of the invention
With sealant, from carrying out light irradiation and/or heating to curing reaction promote and the up time until can not being bonded it is excellent
It is selected as 1 minute or more.By making 1 minute above-mentioned up time or more, thus by the substrate of one side and above-mentioned another
Before the substrate of one side is bonded, solidification will not be promoted excessively and can obtain higher adhesive strength.
In the process for being bonded the substrate of one side with the substrate of above-mentioned another party, by the substrate of one side
The method being bonded with the substrate of above-mentioned another party is not particularly limited, and is preferably bonded under reduced atmosphere.
The preferred lower limit of vacuum degree under above-mentioned reduced atmosphere is 0.01kPa, preferred upper limit 10kPa.It is above-mentioned by making
Vacuum degree under reduced atmosphere is the range, to reach vacuum shape from the air-tightness of vacuum plant, the ability of vacuum pump
State can be removed more effectively when being bonded the substrate of one side with the substrate of above-mentioned another party without expending for a long time
Organic EL display element sealant of the invention in bubble.
The effect of invention
According to the present invention, it is possible to provide can be easily coated with by ink-jet method, low out gassing is excellent and can reduce spray
The organic EL display element sealant of the damage of black device.
Specific embodiment
It is exemplified below out embodiment, the present invention is described in more detail, but the present invention is not merely defined in these embodiments.
(Examples 1 to 9, comparative example 1~3)
According to match ratio recorded in table 1, using homogenous disperse type stirring mixer (Primix corporation,
" HOMODISPER L-type "), each material is equably stirred with the mixing speed of 3000rpm, thus make embodiment 1~
9, each organic EL display element sealant of comparative example 1~3.
For each organic EL display element sealant obtained in embodiment and comparative example, E type viscosimeter (east will be used
Machine industry companies system, " VISCOMETER TV-22 ") viscosity that is measured under conditions of 25 DEG C, 100rpm and in 25 DEG C of benefits
The surface tension measured with dynamic wettability testing machine (RHESCA corporation, " WET-6100 type ") is shown in table 1.
In addition, each organic EL display element sealant as obtained from embodiment and comparative example is packed into brown screw thread
Guan Zhong impregnates EPDM rubber 10g (W1) and cover, after 25 DEG C of 1 weeks of standing, takes out EPDM rubber and wipe table with gauze
Then face measures weight (W2), and the weight rate that the EPDM rubber of front and back is tested in infiltration is calculated by above-mentioned formula.As
EPDM rubber uses AS568-009 (gloomy Qinghua work corporation).Show the result in table 1.
<Evaluation>
For each organic EL display element sealant obtained in embodiment and comparative example, following evaluations are carried out.It will knot
Fruit is shown in table 1.
It should be noted that being applied in ink-jet ejection, wetting diffusivity and each evaluation of device damage as ink-jet
Cloth spray head and use IJH-30 (IJT corporation), and in the case where not heated carry out ink-jet application (nozzle temperature be
25℃)。
(1) ink-jet application
(1-1) ink-jet ejection
Using inkjet discharge device (MICROJET corporation, " NanoPrinter500 "), with 30 picoliters of drop amount,
Each organic EL display element obtained in embodiment and comparative example is coated on to the alkali-free glass (rising sun nitre cleaned through alkali with sealant
Subsidiary system, " AN100 ") on.Drop is normally sprayed from inkjet nozzle and drip "○" is denoted as in the case where substrate, will not
Normal the case where spraying, is denoted as "×", evaluates ink-jet ejection.
(1-2) soaks diffusivity
Using inkjet discharge device (MICROJET corporation, " NanoPrinter500 "), with 30 picoliters of drop amount,
By each organic EL display element sealant obtained in Examples 1 to 9 and comparative example 3 with 5m/ seconds speed and with 500 μm
Spacing is coated with 1000 drops on the alkali-free glass (Asahi Glass corporation, " AN100 ") cleaned through alkali.Measurement is 10 minutes from coating
The diameter of drop is that 150 μm or more of situation is denoted as "○", by the diameter of drop by the diameter of the drop on alkali-free glass afterwards
The case where for 50 μm more than and less than 150 μm is denoted as " △ ", by the diameter of drop less than 50 μm the case where be denoted as "×", evaluation profit
Wet diffusivity.
(2) low out gassing
Using the gas chromatograph (JEOL corporation, " JMS-Q1050GC ") based on Head space, measure Examples 1 to 9 and
The degassing that the solidfied material of each organic EL display element sealant generates when heated obtained in comparative example 3.Utilize applicator
Each organic EL display element is coated into sealant 100mg to 300 μm of thickness.Then, 3000mJ/cm is irradiated using LED light2
Wavelength 365nm ultraviolet light and by after sealant cures, to head space with being packed into cured sealant cures object in bottle, and
Sealed vial is heated 30 minutes at 100 DEG C, generated gas is measured using Head space.
The case where generated gas is less than 300ppm is denoted as "○", by the feelings for 300ppm more than and less than 500ppm
Condition is denoted as " △ ", will be denoted as "×" for the situation of 500ppm or more, evaluates low out gassing.
(3) device damages
Using inkjet discharge device (MICROJET corporation, " NanoPrinter500 "), by Examples 1 to 9 and compare
It is every in 1 month that each organic EL display element obtained in example 3 rises after just being manufactured with sealant with the voltage self-sealing substance of 55V
It sprays 1,000,000 and is sent on the alkali-free glass (Asahi Glass corporation, " AN100 ") through alkali cleaning.The sealing that will be sprayed after 1 month
The weight of agent be 95% or more situation of the weight of the sealant sprayed after just manufacturing be denoted as "○", will be 80% or more and
The case where less than 95% is denoted as " △ ", will be less than 80% the case where is denoted as "×", so that evaluating apparatus damages.
[table 1]
In order to confirm the viscosity of in non-heated formula ink-jet method and heated type ink-jet method, organic EL display element sealant
To effect brought by ink-jet application, experiment below has been carried out.Show the result in table 2.
(experimental example 1)
According to the match ratio recorded in table 2, using homogenous disperse type stirring mixer (Primix corporation,
" HOMODISPER L-type "), after each material is equably stirred with the mixing speed of 3000rpm, carry out 50 DEG C,
The dehydration procedure of exposure 30 minutes, thus produces organic EL display element sealant in the environment of 0.1MPa.
For resulting organic EL display element sealant, using E type viscosimeter (Dong Ji industry companies system,
" VISCOMETER TV-22 "), viscosity is measured under conditions of 25 DEG C, 100rpm, and try using dynamic wettability at 25 DEG C
Test machine (RHESCA corporation, " WET-6100 type ") measurement surface tension.
In addition, resulting organic EL display element sealant is fitted into brown screwed pipe, EPDM rubber 10g is impregnated
(W1) and cover, after 25 DEG C of 1 weeks of standing, takes out EPDM rubber and wipe surface with gauze, then measure weight (W2), and
The weight rate of the EPDM rubber of infiltration test front and back is calculated using above-mentioned formula.As EPDM rubber, AS568- has been used
009 (gloomy Qinghua work corporation).
Using inkjet discharge device (MICROJET corporation, " NanoPrinter500 "), with 30 picoliters of drop amount,
Resulting organic EL display element is coated on to the alkali-free glass (Asahi Glass corporation, " AN100 ") cleaned through alkali with sealant
On.Drop is normally sprayed from inkjet nozzle and drips the case where being denoted as "○" in the case where substrate, not spraying normally note
Make "×", evaluates ink-jet ejection.It should be noted that IJH-30 (IJT corporation) is used with coating spray head as ink-jet,
Ink-jet application is carried out in the case where not heated (nozzle temperature is 25 DEG C).
(experimental example 2)
Prepare organic EL display element sealant identical with the sealant made in experimental example 1.
IJH-30 (IJT corporation) is used with coating spray head as ink-jet, ink-jet application (spray is carried out while heating
Head temperature is 60 DEG C), in addition to this, ink-jet ejection is evaluated in the same manner as experimental example 1.
[table 2]
Industrial availability
According to the present invention, it is possible to provide can be easily coated with by ink-jet method, low out gassing is excellent and can reduce spray
The organic EL display element sealant of the damage of black device.
Claims (4)
1. a kind of organic EL display element sealant, which is characterized in that it contains polymerizable compound and polymerization initiator,
The organic EL display element is 5mPas~50mPas with viscosity of the sealant at 25 DEG C, the table at 25 DEG C
Face tension is 15mN/m~35mN/m, and
Carry out the infiltration test for standing for 1 week at 25 DEG C in the state of making Ethylene-Propylene-Diene rubber impregnated in sealant
When, the weight rate of the Ethylene-Propylene-Diene rubber of infiltration test front and back is 10% or less.
2. a kind of organic EL display element sealant, which is characterized in that it is used for the coating based on ink-jet method,
The organic EL display element sealant contains polymerizable compound and polymerization initiator,
Carry out the infiltration test for standing for 1 week at 25 DEG C in the state of making Ethylene-Propylene-Diene rubber impregnated in sealant
When, the weight rate of the Ethylene-Propylene-Diene rubber of infiltration test front and back is 10% or less.
3. organic EL display element sealant according to claim 1 or 2, which is characterized in that polymerizable compound contains
There is compound in the molecule comprising 17% or more oxygen atom, the compound comprising 17% or more oxygen atom in the molecule exists
It is 10 parts by weight~100 parts by weight in whole 100 parts by weight of polymerizable compound.
4. organic EL display element sealant according to claim 1,2 or 3, which is characterized in that solvent is not contained, or
The content of person's solvent is 0.05 weight % or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310734056.9A CN116782448A (en) | 2016-10-19 | 2017-10-18 | Sealing agent for organic EL display element |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016205484 | 2016-10-19 | ||
| JP2016-205484 | 2016-10-19 | ||
| PCT/JP2017/037662 WO2018074510A1 (en) | 2016-10-19 | 2017-10-18 | Organic el display element sealing agent |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310734056.9A Division CN116782448A (en) | 2016-10-19 | 2017-10-18 | Sealing agent for organic EL display element |
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| Publication Number | Publication Date |
|---|---|
| CN108886848A true CN108886848A (en) | 2018-11-23 |
Family
ID=62019172
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780015173.2A Pending CN108886848A (en) | 2016-10-19 | 2017-10-18 | Organic EL display element sealant |
| CN202310734056.9A Pending CN116782448A (en) | 2016-10-19 | 2017-10-18 | Sealing agent for organic EL display element |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310734056.9A Pending CN116782448A (en) | 2016-10-19 | 2017-10-18 | Sealing agent for organic EL display element |
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| Country | Link |
|---|---|
| JP (3) | JP6404496B2 (en) |
| KR (2) | KR102416056B1 (en) |
| CN (2) | CN108886848A (en) |
| TW (1) | TWI797092B (en) |
| WO (1) | WO2018074510A1 (en) |
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| JP7474053B2 (en) * | 2018-03-30 | 2024-04-24 | 積水化学工業株式会社 | Sealant for organic EL display devices |
| KR20200136878A (en) * | 2018-03-30 | 2020-12-08 | 세키스이가가쿠 고교가부시키가이샤 | Sealant for organic EL display devices |
| JP6573089B1 (en) * | 2018-05-31 | 2019-09-11 | パナソニックＩｐマネジメント株式会社 | Ultraviolet curable resin composition, method for manufacturing light emitting device, and light emitting device |
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Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2018074510A1 (en) | 2018-10-18 |
| JP2022016567A (en) | 2022-01-21 |
| KR102416056B1 (en) | 2022-07-01 |
| JP6985226B2 (en) | 2021-12-22 |
| JP7457686B2 (en) | 2024-03-28 |
| TWI797092B (en) | 2023-04-01 |
| KR20220100723A (en) | 2022-07-15 |
| KR20190064528A (en) | 2019-06-10 |
| JP6404496B2 (en) | 2018-10-10 |
| JP2018200891A (en) | 2018-12-20 |
| TW201819472A (en) | 2018-06-01 |
| WO2018074510A1 (en) | 2018-04-26 |
| CN116782448A (en) | 2023-09-19 |
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