CN108886084A - The manufacturing method of thermo-electric conversion module and thermo-electric conversion module - Google Patents

The manufacturing method of thermo-electric conversion module and thermo-electric conversion module Download PDF

Info

Publication number
CN108886084A
CN108886084A CN201780021662.9A CN201780021662A CN108886084A CN 108886084 A CN108886084 A CN 108886084A CN 201780021662 A CN201780021662 A CN 201780021662A CN 108886084 A CN108886084 A CN 108886084A
Authority
CN
China
Prior art keywords
thermo
heat
conversion module
electric conversion
containment member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780021662.9A
Other languages
Chinese (zh)
Inventor
近川修
林幸子
山下是如
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN108886084A publication Critical patent/CN108886084A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/81Structural details of the junction
    • H10N10/817Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions
    • H10N10/855Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00

Abstract

Thermo-electric conversion module (1) includes:Multiple thermoelectric conversion elements (10):And containment member (22), seal multiple thermoelectric conversion elements (10).Thermoelectric conversion element (10) has the multiple 1st heat to electricity conversion portions and multiple 2nd heat to electricity conversion portions being alternately arranged along the y axis.At least one of end and the end of +Z direction side of the -Z direction side in the 1st heat to electricity conversion portion are electrically connected with the end in adjacent another 2nd heat to electricity conversion portion.The upside of containment member (22) is contact surface (22a).

Description

The manufacturing method of thermo-electric conversion module and thermo-electric conversion module
Technical field
The present invention relates to the manufacturing methods of thermo-electric conversion module and thermo-electric conversion module.
Background technique
It is previous to propose have a kind of thermo-electric conversion module of thermoelectric conversion element including multiple laminated types (referring for example to patent Document 1).The thermo-electric conversion module connects respectively in thermal objects and than the object of thermal objects low temperature and multiple thermoelectric conversion elements It generates electricity in the state of touching.
Existing technical literature
Patent document
Patent document 1:Japanese Unexamined Patent Publication 9-74227 bulletin
Summary of the invention
Problems to be solved by the invention
In addition, thermoelectric conversion element dimensionally generates deviation because of its manufacture deviation etc..For recorded in patent document 1 Thermo-electric conversion module for, want to make thermoelectric conversion element and be formed in thermal objects part flat face contact and make A part of heat in the case where, due to the deviation of the size of multiple thermoelectric conversion element, in these thermoelectric conversion elements Gap is generated between electric transition element and thermal objects.Under the transmission efficiency of the heat from thermal objects of the thermoelectric conversion element Drop, therefore the temperature difference in thermoelectric conversion element cannot be fully obtained, it is defeated compared to the voltage that can be exported from its specification Voltage is lower out.
The present invention be in view of the cause and be made into, and it is an object of the present invention to provide a kind of thermoelectricity that can be improved output voltage turns Change the mold the manufacturing method of block and thermo-electric conversion module.
The solution to the problem
In order to reach the purpose, thermo-electric conversion module of the invention includes:
Multiple thermoelectric conversion elements:And
Containment member seals the multiple thermoelectric conversion element,
The thermoelectric conversion element has been alternately arranged the 1st heat to electricity conversion portion and the 2nd heat to electricity conversion portion, the 1st direction side At least one of end and the end of the 2nd direction side are electrically connected with the end in adjacent another 2nd heat to electricity conversion portion, this 1 direction is orthogonal to the orientation in the 1st heat to electricity conversion portion and the 2nd heat to electricity conversion portion, and the 2nd direction is and described 1 contrary direction,
At least one of the 1st direction side of the containment member and the 2nd direction side is are heated portion.
Thermo-electric conversion module of the invention is also possible to
The portion of being heated is the shape that face contact can be carried out with thermal objects.
Thermo-electric conversion module of the invention is also possible to
The portion that is heated is formed by heat transfer part, and the heat transfer part is set to the end in the 1st direction of the containment member At least one of the end in portion and the 2nd direction transmits heat to the containment member for spontaneous hot object, or described in Containment member transmits heat to radiating component.
Thermo-electric conversion module of the invention is also possible to
The containment member is the hardenite formed by epoxy resin.
Thermo-electric conversion module of the invention is also possible to
The hardenite also contains inorganic filler.
Thermo-electric conversion module of the invention is also possible to
The regional area of the 1st heat to electricity conversion portion and the 2nd heat to electricity conversion portion on joint surface is joined directly, It is bonded together in other regions on the joint surface via insulator layer.
Thermo-electric conversion module of the invention is also possible to
The insulator layer also covers the end in the direction orthogonal with the orientation in the 2nd heat to electricity conversion portion,
The 2nd heat to electricity conversion portion is formed by metal thermoelectric transition material.
Thermo-electric conversion module of the invention is also possible to
The 1st heat to electricity conversion portion is formed by oxide thermoelectricity transition material,
The insulator layer is formed by oxide insulator material.
The manufacturing method of thermo-electric conversion module of the invention contains following process:
Prepare in the metal foil for being formed with the inadhering anti-adhesion region of conductive paste on one side;
The metal foil is pasted on bearing base from that side opposite with the anti-adhesion area side of the metal foil Plate;
The position that will form multiple conductive parts in the metal foil, the wetability for forming conductive paste are more anti-than described Good join domain (the Japanese of adhering zone:The domain ラ ン ド Collar);
The electrode of thermoelectric conversion element is electrically connected to the join domain using the conductive paste;
Form the 1st secondary sealing portion for covering the thermoelectric conversion element side of the metal foil;
The supporting substrates are removed from the metal foil;
That side opposite with the 1st secondary sealing portion side of the metal foil is processed, to be formed described more A conductive part;
Two conductive parts in the multiple conductive part form external electrode;And
The 2nd secondary sealing portion is formed in a manner of covering the downside of conductive part of the not formed external electrode.
The effect of invention
Using the present invention, at least one of the 1st direction side of containment member and the 2nd direction side is are heated portion.As a result, certainly Each thermoelectric conversion element turns via the efficiency or spontaneous hot object of the transmitting of the heat in the portion that is heated to each thermoelectricity to radiating component The efficiency for changing the transmitting of the heat via the portion that is heated of element improves.Thus, the temperature difference in each thermoelectric conversion element close to The temperature difference of thermal objects and radiating component, therefore correspondingly improve output voltage, and then it is whole to improve thermo-electric conversion module Output voltage.
Detailed description of the invention
Fig. 1 is the perspective view of the thermo-electric conversion module of embodiments of the present invention 1
Fig. 2 is the arrow direction cross-sectional view of the line A-A of Fig. 1 of the thermo-electric conversion module of embodiment 1.
Fig. 3 is the partial sectional view of the thermo-electric conversion module of embodiment 1.
Fig. 4 is the cross-sectional view of the thermo-electric conversion module of comparative example.
Fig. 5 A is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 1.
Fig. 5 B is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 1.
Fig. 5 C is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 1.
Fig. 6 A is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 1.
Fig. 6 B is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 1.
Fig. 6 C is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 1.
Fig. 6 D is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 1.
Fig. 7 is the perspective view of the thermo-electric conversion module of embodiments of the present invention 2.
Fig. 8 is the arrow direction cross-sectional view of the line B-B of Fig. 7 of the thermo-electric conversion module of embodiment 2.
Fig. 9 A is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 2.
Fig. 9 B is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 2.
Figure 10 A is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 2.
Figure 10 B is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 2.
Figure 10 C is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 2.
Figure 11 A is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 2.
Figure 11 B is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 2.
Figure 11 C is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 2.
Figure 12 A is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 2.
Figure 12 B is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 2.
Figure 12 C is the cross-sectional view in each process of the manufacturing method of the thermo-electric conversion module of embodiment 2.
Figure 13 is the perspective view of the thermo-electric conversion module of variation.
Figure 14 is the arrow direction cross-sectional view of the line C-C of Figure 13 of the thermo-electric conversion module of variation.
Figure 15 is the partial sectional view of the thermo-electric conversion module of variation.
Figure 16 is the perspective view of the thermo-electric conversion module of variation.
Figure 17 is the perspective view of the thermo-electric conversion module of variation.
Figure 18 A is the perspective view of the thermo-electric conversion module of variation.
Figure 18 B is the perspective view of the thermo-electric conversion module of variation observed from the direction different from Figure 18 A.
Figure 19 is the perspective view of the thermo-electric conversion module of variation.
Figure 20 is the perspective view of the thermo-electric conversion module of variation.
Figure 21 is the partial sectional view of the thermo-electric conversion module of variation.
Specific embodiment
(embodiment 1)
Hereinafter, the thermo-electric conversion module of embodiments of the present invention is described in detail with reference to accompanying drawings.
The thermo-electric conversion module of present embodiment have using containment member will be mounted on multiple thermoelectricity on substrate turn Change the construction that element integrally covers.As the thermo-electric conversion module, such as there is thermo-electric conversion module 1 as shown in Figure 1.Such as figure Shown in 1, thermo-electric conversion module 1 includes substrate 30, containment member 22 and multiple (being 4 in Fig. 1) thermoelectric conversion elements 10. As shown in Fig. 2, using thermo-electric conversion module in the state of the mounting surface HF face contact of containment member 22 and thermal objects HS 1.Thermal objects HS with the metal plate for the heat exhausting pipe thermal coupling for being set to factory etc. for example by forming.In addition, in this embodiment party In the explanation of formula, using the +Z direction in Fig. 1 as top, -Z direction is illustrated as below.
Substrate 30 is formed by SiN etc., as shown in Fig. 2, 4 heat to electricity conversion members can be connected in series by being formed in upper surface Conductive part 33 as part 10.Substrate 30 configures on metal radiator (radiating component) 1030.Multiple conductive parts The part of the conductive part 33 at the both ends being located in Y direction in 33 is via lead (not shown) and external equipment (not shown) The external electrode 34 of connection.Conductive part 33 is formed by metals such as Cu, Al, Ni.
As depicted in figs. 1 and 2, multiple thermoelectric conversion elements 10 are arranged in the upper surface of substrate 30 in straight line shape.With Under, suitably the orientation of multiple thermoelectric conversion element 10 is illustrated as Y direction.As shown in figure 3, each thermoelectricity Conversion element 10 includes electrode 16, multiple 1st heat to electricity conversion portions 113, multiple 2nd heat to electricity conversion portions 111 and multiple insulators Layer 115.Multiple 1st heat to electricity conversion portions 113 and multiple 2nd heat to electricity conversion portions 111 are alternately arranged along the y axis and are bonded on one It rises.1st heat to electricity conversion portion 113 is directly engaged with the 2nd heat to electricity conversion portion 111 in the region of a part on joint surface, on joint surface Other regions be bonded together via insulator layer 115.Specifically, the lower end 113a in the 1st heat to electricity conversion portion 113 and The lower end 111a in the 2nd heat to electricity conversion portion 111 i.e. adjacent thereto on a direction of orientation is electrically connected in the-y direction It connects.The upper end 113b in the 1st heat to electricity conversion portion 113 and in +Y direction be it is adjacent thereto on the other direction of orientation The upper end 111b in the 2nd heat to electricity conversion portion 111 is electrically connected.
1st heat to electricity conversion portion 113 is N-type semiconductor.1st heat to electricity conversion portion 113 is formed by oxide thermoelectricity transition material. Oxide thermoelectricity transition material, which contains, uses composition formula with perovskite construction:ATiO3The composite oxides of expression.The composition Formula:ATiO3A contain Sr.A is also possible in La1-xSrxIn in the range of 0≤x < 0.2 Sr is replaced into La after obtain, Such as or (Sr0.965La0.035)TiO3
2nd heat to electricity conversion portion 111 is formed by metal thermoelectric transition material.Metal thermoelectric transition material contains NiMo and has Perovskite construction uses composition formula:ATiO3The composite oxides of expression.It is P-type semiconductor by the Material Definitions of this composition.It should Composition formula:ABO3A contain Sr.A is also possible in La1-xSrxIn Sr is replaced into La in the range of 0≤x < 0.2 after obtain , such as or (Sr0.965La0.035)TiO3
Insulator layer 115 is between the 1st adjacent heat to electricity conversion portion 113 and the 2nd heat to electricity conversion portion 111.Multiple 1st heat It is stacked together that electric converter section 113 and multiple 2nd heat to electricity conversion portions 111 direction arranged along clip 115 ground of insulator layer.Insulation Body layer 115 is formed by the oxide insulator material with electrical insulating property.As the oxide insulator material, using for example adding Y is added2O3ZrO as stabilizer2(yttria-stabilized zirconia).
As shown in figure 3, a pair of electrodes 16 is electrically connected to the end positioned at +Y direction in multiple 2nd heat to electricity conversion portions 111 The 2nd heat to electricity conversion portion 111 and the 2nd heat to electricity conversion portion 111 positioned at the end of -Y direction.It is located at+Y in a pair of electrodes 16 The electrode 16 of direction side has will be positioned at a part in the face of the +Y direction side in the 2nd heat to electricity conversion portion 111 of the end of +Y direction Section with a part covering in lower end surface (face of -Z direction side) is the shape of L-shaped.In addition, the position in a pair of electrodes 16 Electrode 16 in -Y direction side has will be positioned at the face of the -Y direction side in the 2nd heat to electricity conversion portion 111 of the end of -Y direction The section of a part covering of a part and lower end surface is the shape of L-shaped.Electrode 16 includes basal layer and contact layer, above-mentioned base Bottom is formed by Ni, and above-mentioned contact layer coats the basal layer.Contact layer has Ni layers and Sn layers of lit-par-lit structure.Ni layers of thickness It is set as 3 μm~5 μm, Sn layers of thickness is set as 4 μm~6 μm.The conductive part 33 of electrode 16 and substrate 30 using between this two Conductive member 21 between person is joined to each other.Conductive member 21 is formed by metals such as solders.
The shape of containment member 22 is cuboid, is configured in a manner of covering the upper surface of substrate 30, multiple for sealing Thermoelectric conversion element 10.Contact surface (being heated portion) 22a with thermal objects HS thermal coupling is equipped in the upside of containment member 22. Contact surface 22a is can be with the shape of the mounting surface HF face contact of thermal objects HS.10 mean roughness of contact surface 22a It is set as about 1 μm or less.Containment member 22 containing epoxy resin and the hardenite of inorganic filler by forming.As epoxy resin, It is preferred that the material excellent as far as possible using heat resistance.As the typical example of this epoxy resin, more aromatic system asphalt mixtures modified by epoxy resin can be enumerated Rouge, specifically, phenol novolak type epoxy resin and o-cresol phenolic epoxy varnish etc. can be enumerated.These epoxies As long as resin would not be plastically deformed in the range of 250 DEG C of degree of ceiling temperature.As inorganic filler, SiO can be enumerated2、 Al2O3, MgO etc. fine grained.
Next, the result that explanation obtains after evaluating the power generation performance of thermo-electric conversion module 1.About above-mentioned sheet The thermoelectric conversion element 10 of embodiment and the thermoelectric conversion element of aftermentioned comparative example, inventor implement commenting for generated energy Valence.
The thermo-electric conversion module 1 of evaluation as present embodiment, use the rated value including 4 output voltages for The structure of the thermoelectric conversion element 10 of 63mV.The upper surface of the containment member 22 of the thermo-electric conversion module 1 and thermoelectric conversion element The average value of the distance between 10 upper surface is set as 0.2mm.
As shown in figure 4, same as thermo-electric conversion module 1, the thermo-electric conversion module 9001 of comparative example includes 4 output voltages For the thermoelectric conversion element 10 of 63mV.The thermo-electric conversion module 9001 in addition to do not have containment member this point other than, have with The same structure of thermo-electric conversion module 1.
In order to evaluate generating capacity, each thermo-electric conversion module 1,9001 for having prepared 10 evaluations, warm to these respectively Electric conversion module 1,9001 implements the measurement of output voltage.By the fever of the upper contact with thermo-electric conversion module 1,9001 In the state that the temperature of object is maintained 30 DEG C, the temperature of substrate 30 is maintained 20 DEG C, the measurement of the output voltage is carried out.
About the measurement result of output voltage, in the case where thermo-electric conversion module 9001, the average value of output voltage is 102mV, in contrast, the average value of output voltage is 178mV in the case where thermo-electric conversion module 1.In this way it is found that thermoelectricity The output voltage of conversion module 1 76mV degree higher than the output voltage of thermo-electric conversion module 9001.
The result can be studied as follows.In the case where thermo-electric conversion module 9001, due to foozle etc., often The height of a thermoelectric conversion element 10 is different.Therefore, in the mounting surface HF for making thermo-electric conversion module 9001 Yu thermal objects HS In the case where contact, gap (air is generated between the upper surface and mounting surface HF of the relatively low thermoelectric conversion element 10 of height Layer).In this case, the thermal resistance between thermal objects HS and thermoelectric conversion element 10 is larger, and spontaneous hot object HS thermoelectric turns The transmission efficiency for changing the heat of element 10 is lower.The temperature difference of the lower end and upper end of thermoelectric conversion element 10 is less than hair as a result, The temperature difference of hot object HS and substrate 30, therefore the output voltage of thermo-electric conversion module 9001 is lower.
On the other hand, in the case where thermo-electric conversion module 1, as shown in Fig. 2, the contact surface 22a of containment member 22 and hair The mounting surface HF face contact of hot object HS, does not generate gap between contact surface 22a and mounting surface HF.In addition, containment member 22 Thermal conductivity ratio air layer thermal coefficient it is high.The heat of the upper end of spontaneous hot object HS thermoelectric conversion element 10 as a result, Transmission efficiency it is higher than comparative example.The temperature difference of the lower end and upper end of thermoelectric conversion element 10 is close to heat object as a result, The temperature difference of body HS and substrate 30, therefore correspondingly make the output voltage of thermo-electric conversion module 1 higher.
As discussed above, it using the thermo-electric conversion module of present embodiment 1, is equipped on containment member 22 With the contact surface 22a of thermal objects HS thermal coupling.The spontaneous hot object HS of each thermoelectric conversion element 10 is via contact surface as a result, 22a is improved to the transmission efficiency of the upper end of each thermoelectric conversion element 10 transmitting heat.Thus, the lower end of each thermoelectric conversion element 10 The temperature difference of portion and upper end therefore correspondingly mentions output voltage close to the temperature difference of thermal objects HS and radiator 1030 Height, and then improve the whole output voltage of thermo-electric conversion module 1.
In addition, using the thermo-electric conversion module 1 of present embodiment, by covering thermoelectric conversion element using containment member 22 10, the external force applied to thermoelectric conversion element 10 can be reduced when thermo-electric conversion module 1 is installed on thermal objects HS.Thus, It is able to suppress heat caused by the external force applied when thermo-electric conversion module 1 is installed on thermal objects HS to thermoelectric conversion element 10 The local damage of electric transition element 10.
In addition, not having the feelings for sealing the thermo-electric conversion module 9001 of the containment member 22 of thermoelectric conversion element 10 Under condition, all upper surfaces for making multiple thermoelectric conversion elements 10 is needed to contact with the mounting surface HF of thermal objects HS.Therefore, it examines For example the pressing machine pressed to the mounting surface HF of thermal objects HS is arranged in multiple thermoelectric conversion elements 10 in worry one by one respectively Structure will not be in thermoelectric conversion element 10 and mounting surface HF even if the respective size of multiple thermoelectric conversion elements 10 has differences Between there is gap.But in the case of such a construction, it needs that quantity identical as the quantity of multiple thermoelectric conversion elements 10 is arranged Pressing mechanism lead to thermo-electric conversion module if the quantity of thermoelectric conversion element 10 possessed by thermo-electric conversion module increases Construction correspondingly complicate.
In this regard, in the thermo-electric conversion module 1 of present embodiment, it is not necessary to above-mentioned such pressing mechanism, therefore energy be arranged Enough realize the simplification of the construction of thermo-electric conversion module 1.
In addition, being equipped with the heat supply with thermal objects HS in containment member 22 in the thermo-electric conversion module 1 of present embodiment The contact surface 22a for the mounting surface HF face contact that electric conversion module 1 is installed.Thereby, it is possible to increase containment member 22 and thermal objects The contact area of HS, therefore the thermal coupling of thermal objects HS and containment member 22 enhances.
In addition, the containment member 22 of present embodiment containing epoxy resin and the hardenite of inorganic filler by forming.As a result, It can ensure hot transmission efficiency of the spontaneous hot object HS to containment member 22, therefore the heat of thermal objects HS and containment member 22 Coupling enhancing.
Next, illustrating the thermoelectricity of present embodiment referring to Fig. 5 A, Fig. 5 B, Fig. 5 C, Fig. 6 A, Fig. 6 B, Fig. 6 C and Fig. 6 D The manufacturing method of conversion module 1.In this manufacturing method, first as shown in Figure 5A, when pasted on substrate 30 become conduction After the metal foil 133 on the basis in portion 33, pattern is carried out to the resist being formed on the metal foil 133 and is formed, to be formed Mask.Metal foil is formed by metals such as Cu, Al, Ni.Then, it by being etched to metal foil 133, is formed shown in Fig. 5 B like that Conductive part 33.
Then, as shown in Figure 5 C, metal layer 512 is formed on conductive part 33 using plating method.As plating method, use Electrolytic plating method or electroless plating method, above-mentioned electrolytic plating method by the state that metal foil is soaked in electrolyte to gold Belong to foil to be powered to form metal layer, above-mentioned electroless plating method is utilized when making metal foil be soaked in the plating liquid containing reducing agent The reduction of generation forms metal layer.Metal layer 512 is Ni/Au.
Then, 512 solder-coating of metal layer on conductive part 33, so that thermoelectric conversion element 10 electrode 16 with should After the mode that part clips solder contact configures thermoelectric conversion element 10, reflow soldering process is carried out.Then, solder and metal layer 512 form alloy, and solder climbs up the side of the electrode 16 of thermoelectric conversion element 10, form such conductive structure shown in Fig. 6 A Part 21.In addition, though illustration omitted, but a part for the metal layer 512 for not forming alloy with solder be present in conductive part 33 it On.
Then, the tectosome formed by substrate 30, conductive part 33, conductive member 21 and thermoelectric conversion element 10 is loaded In the mold of molding, is encapsulated in normal direction mold using transfer moudling, encapsulating and fill sealing material.Sealing material is such as It is upper described, contain epoxy resin and inorganic filler.At this point, sealing material also enters lower surface and the base of thermoelectric conversion element 10 Gap between the upper surface of plate 30.Then, sealing material is heated, to form hardenite.In this way, as shown in Figure 6B, 33 side of conductive part of substrate 30 forms containment member 522.
Then, as shown in Figure 6 C, slot 522a is formed at the position corresponding with external electrode 34 of containment member 522, thus Make the exposure of external electrode 34.
Then, using well known cutting technique, substrate 30 and containment member 522 are divided into monolithic, to complete Fig. 6 D Shown such thermo-electric conversion module 1.
In addition, not having the case where thermo-electric conversion module of containment member 22 for sealing thermoelectric conversion element 10 Under, in order to make all upper surfaces of multiple thermoelectric conversion elements 10 and the peace for thermo-electric conversion module installation of thermal objects HS Dress face HF contact, needs to make the equal sized of the Z-direction of multiple thermoelectric conversion elements 10.Thus, in this heat to electricity conversion mould In the case where block, after multiple thermoelectric conversion elements 10 are fixed on substrate 30, in order to make the Z axis of multiple thermoelectric conversion elements 10 Direction it is equal sized, need to carry out the process ground to the upper surface of multiple thermoelectric conversion elements 10.Thus, it is grinding When thermoelectric conversion element 10, stress is applied to thermoelectric conversion element 10 and may cause the local damage of thermoelectric conversion element 10.
In contrast, in the manufacturing method of the thermoelectric conversion element 10 of present embodiment, as described above, without to thermoelectricity The process that conversion element 10 is ground.Thereby, it is possible to prevent from causing heat to electricity conversion first because of the grinding of thermoelectric conversion element 10 The local damage of part 10.
(embodiment 2)
The thermo-electric conversion module of present embodiment is in the thermo-electric conversion module 1 for not having substrate this point and embodiment 1 It is different.As shown in Figure 7 and Figure 8, the thermo-electric conversion module 2001 of present embodiment include containment member 2022, it is conductive part 33, outer Portion's electrode 2034, heat transfer part (being heated portion) 2027,2029 and multiple (being 4 in Fig. 7) thermoelectric conversion elements 10.Such as figure Shown in 8, is contacted in heat transfer part 2029 with the mounting surface HF of thermal objects HS and heat transfer part 2027 is contacted with radiator 2030 In the state of, use thermo-electric conversion module 2001.In addition, in figures 7 and 8, to structure same as embodiment 1 mark with The identical appended drawing reference of Fig. 1 and Fig. 2.In addition, in description of the present embodiment, using the +Z direction in Fig. 8 as above, will- Z-direction is used as lower section to be illustrated.
Multiple conductive parts 33 are embedded in containment member 2022.External electrode 2034 is set to being located in multiple conductive parts 33 The lower surface of the conductive part 33 at the both ends in Y direction.
The shape of containment member 2022 is cuboid.Containment member 2022 seals multiple thermoelectric conversion elements 10.With implementation The containment member 22 of mode 1 is same, and containment member 2022 containing epoxy resin and the hardenite of inorganic filler by forming.
Heat transfer part 2027 is set to the lower end of containment member 2022, and self-sealing component 2022 is to the outside of containment member 2022 Radiator 2030 transmit heat.Heat transfer part 2029 is set to the upper end of containment member 2022, and spontaneous hot object HS is to containment member 2022 transmitting heat.Heat transfer part 2027 is set to the projecting thermoelectric conversion element 10 towards -Z direction of the lower surface of containment member 2022 The inside of obtained view field.Heat transfer part 2029 is arranged in a manner of the entire upper surface for covering containment member 2022.Heat transfer Portion 2027,2029 is formed by metals such as Cu, Ni, Al.
As discussed above, using the thermo-electric conversion module of present embodiment 2001, heat transfer part 2029 is set to close It seals on component 2022, spontaneous hot object HS transmits heat to containment member 2022.In addition, heat transfer part 2027 is set to containment member Under 2022, self-sealing component 2022 transmits heat to radiator 2030.Spontaneous hot object HS is via heat transfer part 2029 to each as a result, The transmission efficiency of the upper end transmitting heat of thermoelectric conversion element 10 improves, from the lower end of each thermoelectric conversion element 10 via heat transfer It is improved to the transmission efficiency that radiator 2030 transmits heat in portion 2027.Thus, the lower end and upper end of each thermoelectric conversion element 10 Temperature difference close to the temperature difference of thermal objects HS and radiator 1030, therefore correspondingly improve output voltage, Jin Erti The whole output voltage of high thermo-electric conversion module 2001.
In addition, not having substrate, using by flexible resin using the thermo-electric conversion module 2001 of present embodiment The containment member 2022 that material is formed supports multiple thermoelectric conversion elements 10.Even if being applied to thermoelectricity in bending stress as a result, to turn In the case where the entirety for changing the mold block 2001, it is also able to suppress the breakage of thermo-electric conversion module 2001.
Next, referring to Fig. 9 A, Fig. 9 B, Figure 10 A, Figure 10 B, Figure 10 C, Figure 11 A, Figure 11 B, Figure 11 C, Figure 12 A, Figure 12 B And Figure 12 C, illustrate the manufacturing method of the thermo-electric conversion module 2001 of present embodiment.In this manufacturing method, prepare first The metal foil 2133 of such foil-like shown in Fig. 9 A.Be formed on one side as electroconductive paste in the thickness direction thereof of metal foil 2133 The rough surface 2133a in the inadhering anti-adhesion region of agent.The metal foil 2133 becomes the basis of conductive part 33.Metal foil 2133 by The metals such as Cu, Ni, Al are formed.If but in view of processing sticking operation from operation to aftermentioned supporting substrates 5030, etching etc. Workability, cost, then preferably using Cu as the material of metal foil 2133.Form the rough surface 2133a's of metal foil 2133 Method is not particularly limited, either the method that etching etc. is carried out by chemical treatment, is also possible to milled processed, at shot-peening The method that reason etc. is carried out by mechanical treatment.The thickness of metal foil 2133 is preferably 5 μm~100 μm.Supporting substrates 5030 are by glass The formation such as glass.
Then, as shown in Figure 9 A, the face of that side opposite with rough surface 2133a of metal foil 2133 is pasted on bearing Substrate 5030.Then, as shown in Figure 9 B, the mask 2533 of plating is formed on metal foil 2133.About the mask 2533, Such as can be after dry film photoresist is pasted on metal foil 2133, by being exposed, development treatment covers to form this Mould 2533, or also can use well known silk screen print method printing resist, to form the mask 2533.Mask 2533 exists Being formed becomes the metal layer 2133b on basis of conductive part 33 part shown in Figure 10 A has opening portion 2533a.Preferably, it covers The thickness of metal layer 2133b of the thickness of mould 2533 than being formed using plating method is thick.
Then, as shown in Figure 10 A, the opening portion 2533a positioned at mask 2533 using plating method in metal foil 2133 Inside will form multiple conductive parts 33 predetermined position formed metal layer 2133b.The upper surface of metal layer 2133b is than thick Matte 2133a is flat, constitutes the wetability of the conductive paste join domain better than rough surface 2133a.As a result, to metal layer In the case that the upper surface of 2133b is coated with conductive paste, the conductive paste is due to surface tension in the upper table of metal layer 2133b Face stops, and is not easy to spread to rough surface 2133a.Metal layer 2133b is formed by metals such as Cu and Ni.If but in view of conductivity, Cost, then preferred metal layers 2133b is formed by Cu.In addition, as plating method, using above-mentioned electrolytic plating method or electroless plating Cover method.The thickness of metal layer 2133b is set as making the thickness as top of the position of its upper surface higher than rough surface 2133a Degree.
As described above, after foring metal layer 2133b on metal foil 2133, by supporting substrates 5030, metal foil 2133 and mask 2533 be soaked in the anticorrosive additive stripping liquid controllings such as NaOH solution, to remove mask 2533.
Then, using well known printing process, conductive paste 2121 is coated on metal layer like that as shown in Figure 10 B The upper surface of 2133b.As conductive paste 2121, solder paste etc. can be enumerated.
Then, conductive paste is being coated with the upper surface of the electrode 16 of thermoelectric conversion element 10 and metal layer 2133b After the mode of 2121 part contact configures thermoelectric conversion element 10, reflow soldering process is carried out.Then, the one of conductive paste 2121 The side of the electrode 16 of thermoelectric conversion element 10 is climbed up in part, forms such conductive member 21 shown in Figure 10 C.In this way, using The electrode 16 of thermoelectric conversion element 10 is electrically connected to the upper surface (join domain) of metal layer 2133b by conductive paste 2121.Gold The upper surface for belonging to layer 2133b is located at the position higher than the top of rough surface 2133a.As a result, in reflow soldering process, conductive paste 2121 stop due to its surface tension in the upper surface of metal layer 2133b, will not spread to rough surface 2133a.In addition, by making The position of the upper surface of metal layer 2133b is located at the position higher than the top of rough surface 2133a, thus in thermoelectric conversion element 10 Lower surface and rough surface 2133a between generate gap.
Then, the tectosome formed by supporting substrates 5030, metal foil 2133 and thermoelectric conversion element 10 is positioned in In the mold of molding, is encapsulated in normal direction mold using transfer moudling, encapsulating and fill sealing material.Sealing material with The sealing material illustrated in embodiment 1 is identical.At this point, sealing material also enter the lower surface of thermoelectric conversion element 10 with Gap between the rough surface 2133a of metal foil 2133.Then, sealing material is heated, to form hardenite.It is formed in this way Upper side seals (the 1st secondary sealing portion) 2522a of the upside of such covering metal foil 2133 shown in Figure 11 A.Then, from metal Foil 2133 removes supporting substrates 5030.
Then, processing is etched to the downside of metal foil 2133, so that removing the formation of metal foil 2133 has rough surface The part of 2133a forms such multiple conductive parts 33 shown in Figure 11 B.
Then, as shown in Figure 11 C, the mask 5034 of plating, the plating are formed in the lower surface of upper side seals 2522a Mask 5034 has opening portion 5034a at position corresponding with the conductive part 33 at both ends being located in Y direction.Using with The above-mentioned same method of mask 2533 forms the mask 5034.
Then, using plating method, as illustrated in fig. 12, two for not being masked 5034 coverings in multiple conductive parts 33 The downside of conductive part 33 forms metal layer, to form external electrode 2034.As plating method, using above-mentioned electrolytic plating method Or electroless plating method.The construction formed by upper side seals 2522a, conductive part 33 and external electrode 2034 is formed as a result, Body.
Then, tectosome is soaked in the anticorrosive additive stripping liquid controllings such as NaOH solution, to remove mask as shown in figure 12b 5034。
Then, tectosome is positioned in the mold of molding, encapsulates in normal direction mold and fill out using transfer moudling, encapsulating Fill sealing material.Sealing material is identical as the sealing material illustrated in the embodiment 1.Then, sealing material is heated Material, to form hardenite.In this way, as indicated in fig. 12 c, to cover the downside of the conductive part 33 of not formed external electrode 2034 Mode forms lower side seals portion (the 2nd secondary sealing portion) 2522b.It is formed as a result, by upper side seals 2522a and lower side seals portion The containment member 2022 that 2522b is constituted.
Then, heat transfer part 2027 is formed in the lower surface of containment member 2022, is formed in the upper surface of containment member 2022 Heat transfer part 2029.About heat transfer part 2027,2029, well known printing technology both can use by coating conductive paste to be formed Heat transfer part 2027,2029, also can use sputtering method or vapour deposition method forms heat transfer part 2027,2029.Then, it is cut using well known It cuts technology and containment member 2022 is divided into monolithic, to complete thermo-electric conversion module 2001.
In this way, in the manufacturing method of the thermoelectric conversion element 10 of present embodiment, in the gold for being formed with rough surface 2133a It is using conductive paste 2121 that the electrode 16 of thermoelectric conversion element 10 is electric after the upper surface formation metal layer 2133b for belonging to foil 2133 It is connected to the upper surface of metal layer 2133b.Thereby, it is possible to using the rough surface 2133a being present in around metal layer 2133b come Limitation is applied to the diffusion of the upper surface in metal book 2133 of the conductive paste 2121 of the upper surface of metal layer 2133b.Cause And it is able to suppress the electricity that thermoelectric conversion element 10 occurs because of the diffusion of the upper surface in metal book 2133 of conductive paste 2121 The mutual short circuit in pole 16.
(variation)
It this concludes the description of embodiments of the present invention, but the present invention is not limited to the structures of above-mentioned embodiment.Example Such as, it is also possible to have the thermo-electric conversion module 3001 as shown in Figure 13 and Figure 14 with curved contact surface 3022a's The structure of containment member 3022.In addition, in figs. 13 and 14, to structure same as embodiment 1 mark and Fig. 1 and Fig. 2 Identical appended drawing reference.Using the thermo-electric conversion module 3001, as shown in figure 14, even if in thermal objects HS for heat to electricity conversion In the curved situation of mounting surface HF that module 3001 is installed, it can also make contact surface 3022a and mounting surface HF face contact.Such as it is sending out In the case that hot object HS is cylindric drainpipe, using with the consistent side of the peripheral radius of the drainpipe as thermal objects HS Formula selects the radius of curvature R of the contact surface 3022a of containment member 3022.
Using this structure, even if can also make containment member 3022 in the curved situation of mounting surface HF of thermal objects HS Contact surface 3022a and mounting surface HF face contact.The transmission efficiency of the heat of spontaneous hot object HS thermoelectric conversion element 10 as a result, It improves, therefore the generating efficiency of thermo-electric conversion module 3001 improves.
In the manufacturing method of the thermo-electric conversion module 1,2001 of each embodiment, as conductive paste, also it can be used Conductive adhesive containing heat-curing resin.In this case, with the electrode 16 and conductive part of thermoelectric conversion element 10 The mode of the part contact coated with conductive adhesive of the upper surface of 33 and metal layer 2133b is configured with thermoelectric conversion element After 10, carry out for making the cured heat treatment of conductive adhesive.
Illustrate the thermo-electric conversion module 1,2001 of each embodiment with as shown in Figure 3 in thermoelectric conversion element 10 Y direction on both ends be configured with the 2nd heat to electricity conversion portion 111, and the 2nd heat to electricity conversion portion 111 end face exposure thermoelectricity The example of conversion element 10.But thermoelectric conversion element possessed by thermo-electric conversion module 1,2001 is not limited to this structure.Such as There can also be the both ends in the Y direction of thermoelectric conversion element 4010 as thermo-electric conversion module 4001 shown in figure 15 Configured with the 1st heat to electricity conversion portion 4113, and insulator layer 4115 covers the orthogonal with Y direction of the 2nd heat to electricity conversion portion 4111 Direction end entirety thermoelectric conversion element 4010.In addition, being marked in Figure 15 to structure same as embodiment 1 Appended drawing reference identical with Fig. 3.
Multiple 1st heat to electricity conversion portions 4113 and multiple 2nd heat to electricity conversion portions 4111 are alternately arranged and engage along the y axis Together.In the region of a part in the face of the Y direction in the 1st heat to electricity conversion portion 4113 and the 2nd heat to electricity conversion portion 4111, the 1 heat to electricity conversion portion 4113 and the 2nd heat to electricity conversion portion 4111 are bonded together, in other regions in the face of Y direction, insulator Layer 4115 is between the 1st heat to electricity conversion portion 4113 and the 2nd heat to electricity conversion portion 4111.Specifically, the 2nd heat to electricity conversion portion 4111 Lower end 4111a and the lower end 4113a in the 1st heat to electricity conversion portion 4113 adjacent thereto in the-y direction be bonded together. In addition, the upper end 4111b in the 2nd heat to electricity conversion portion 4111 and the 1st heat to electricity conversion portion 4113 adjacent thereto in +Y direction Upper end 4113b is bonded together.1st heat to electricity conversion portion 4113 and the 1st heat to electricity conversion portion 113 that illustrates in the embodiment 1 Equally, it is formed by the oxide thermoelectricity transition material of N-type.In addition, the 2nd heat to electricity conversion portion 4111 with illustrate in the embodiment 1 The 2nd heat to electricity conversion portion 111 it is same, formed by the metal thermoelectric transition material of p-type.
Insulator layer 4115 is between adjacent in the Y-axis direction the 1st heat to electricity conversion portion 4113 and the 2nd heat to electricity conversion portion 4111 Between.Insulator layer 4115 and the insulator layer 115 illustrated in the embodiment 1 are same, by the oxide with electrical insulating property Insulating material is formed.
Using this structure, it is whole that insulator layer 4115 covers the end in the Z-direction in the 2nd heat to electricity conversion portion 4111.Separately Outside, the 1st heat to electricity conversion portion 4113 converts material by the oxide thermoelectricity stable relative to the corrosive gas chemical property such as hydrogen sulfide Material is formed, and insulator layer 4115 is by the oxide insulator material shape stable relative to the corrosive gas chemical property such as hydrogen sulfide At.There are thermo-electric conversion module is used in the environment of corrosive gas for example around thermo-electric conversion module 4001 as a result, In the case where 4001, the metal thermoelectric transition material and corrosive gas that are used to form the 2nd heat to electricity conversion portion 4111 can be prevented Chemical reaction occurs and forms impurity in the 2nd heat to electricity conversion portion 4111.Thus, even if being present in thermo-electric conversion module 4001 Around corrosive gas through coming after containment member 22 in the case where, be also able to suppress the 2nd heat to electricity conversion portion 4111 Deterioration.
In various embodiments, illustrate that multiple thermoelectric conversion elements 10 turn via the thermoelectricity that conductive part 33 is connected in series The example of block 1 is changed the mold, but the present invention is not limited thereto, such as can also be the thermo-electric conversion module 5001 as shown in Figure 16 The structure that multiple thermoelectric conversion elements 10 are connected in parallel.In the thermo-electric conversion module 5001, multiple thermoelectric conversion elements 10 It is connect jointly with two conductive parts 5033 being formed on substrate 5030.Multiple heat to electricity conversion are sealed using containment member 5022 Element 10.Contact surface (being heated portion) 5022a with thermal objects HS thermal coupling is equipped in the upside of containment member 5022.Two Conductive part 5033 and the external electrode 5134 at the position that the unsealed component 5022 for being exposed to substrate 5030 covers are continuous.
Alternatively, it is also possible to the thermo-electric conversion module 6001 as shown in Figure 17, being 4 column by 4 thermoelectricity being connected in series Structure made of the series circuit that conversion element 10 is formed is connected in parallel.In the thermo-electric conversion module 6001, described 4 are constituted 16 thermoelectric conversion elements 10 of column series circuit are configured in two-dimensional-matrix-like, and are sealed by containment member 6022.In addition, each Conductive part 6033 of the thermoelectric conversion element 10 on substrate 6030 is electrically connected with other thermoelectric conversion elements 10. Contact surface (being heated portion) 6022a with thermal objects HS thermal coupling is equipped in the upside of containment member 6022.Configuration is in Y-axis side Upward both ends and two conductive parts 6033 extended along the x axis respectively with the unsealed component that is exposed to substrate 6030 The external electrode 6034 at the position of 6022 coverings is continuous.
Alternatively, can also be multiple heat to electricity conversion members the thermo-electric conversion module 7001 as shown in Figure 18 A and Figure 18 B Part 10 is connected in parallel and does not have the structure of substrate.It is close using containment member 7022 in the thermo-electric conversion module 7001 Seal multiple thermoelectric conversion elements 10, and multiple thermoelectric conversion elements 10 jointly with two conductions being embedded in containment member 7022 Portion 5033 connects.The heat transfer part 7029 with thermal objects (not shown) thermal coupling, the hair are equipped in the upside of containment member 7022 The upper contact of hot object and sealing 7022.In addition, as shown in figure 18b, the downside of containment member 7022 also be provided with to The heat transfer part 7027 of the transmitting heat such as radiator (not shown) of the contacts-side-down of containment member 7022.Heat transfer part 7027 is set to sealing The inside of the view field A7 for projecting each thermoelectric conversion element 10 towards -Z direction of the lower surface of component 7022.Two are led The external electrode 7034 in electric portion 5033 and the downside for being exposed to containment member 6022 is continuous.
Alternatively, it is also possible to the thermo-electric conversion module 8001 as shown in Figure 19 and Figure 20, be 4 column by be connected in series 4 The series loop that a thermoelectric conversion element 10 is formed is connected in parallel and does not have the structure of substrate.In the thermo-electric conversion module In 8001,16 thermoelectric conversion elements 10 for constituting the 4 column series circuit are configured in two-dimensional-matrix-like, and by containment member 8022 sealings.In addition, each thermoelectric conversion element 10 is via the conductive part 6033 for being embedded in containment member 8022 and other thermoelectricity Conversion element 10 is electrically connected.The heat transfer part with thermal objects (not shown) thermal coupling is equipped in the upside of containment member 8022 8029, the upper contact of the thermal objects and sealing 8022.In addition, as shown in figure 20, in the downside of containment member 8022 The heat transfer part 8027 of heat is transmitted equipped with the radiator (not shown) etc. to the contacts-side-down with containment member 8022.Heat transfer part 8027 In the view field A8 for projecting each thermoelectric conversion element 10 towards -Z direction of the lower surface of containment member 8022 Side.Configuration both ends in the Y-axis direction and two conductive parts 6033 extended along the x axis respectively be exposed to containment member The external electrode 8034 of 8022 downside is continuous.
In the embodiment 1, illustrate thermoelectric conversion element 10 electrode 16 have covering the 2nd heat to electricity conversion portion 111+ The section of a part of a part and lower end surface in the face in the face or -Y direction side of Y-direction side is the example of the shape of L-shaped. But it's not limited to that for the shape of electrode 16.It such as can also be to have the thermo-electric conversion module 9001 as shown in Figure 21 Electrode 9016 cover the 2nd heat to electricity conversion portion 111 +Y direction side face a part or -Y direction side face a part and The structure of the thermoelectric conversion element 9010 of the lower end surface in the 2nd heat to electricity conversion portion 111 is not covered.In addition, in Figure 21, to implementation The same structure of mode 1 marks appended drawing reference identical with Fig. 3.The thermo-electric conversion module 9001 of this variation also functions to and implements The same function and effect of mode 1.
In embodiment 2, illustrate using in the metal for being formed with the rough surface 2133a as anti-adhesion region on one side The manufacturing method of the thermo-electric conversion module 2001 of foil 2133, but the anti-adhesion region of the metal foil be not limited to be formed with it is coarse The region in face.Anti-adhesion region can also be formed by the region for being formed with oxidation film.Alternatively, anti-adhesion region can also be by forming Have and is made of the region of the Sn based material layer of the formation such as Sn or Sn alloy.
In embodiment 2, illustrate the example that heat transfer part 2027,2029 is formed by metal, but formed heat transfer part 2027, 2029 material is not limited to metal.For example, heat transfer part 2027,2029 can also be by AlN, SiN, Al2O3Equal thermal coefficients compare High insulating material is formed.
In each embodiment and above-mentioned variation, illustrate that thermo-electric conversion module 1,2001,3001,4001 has institute The example of the thermoelectric conversion element 10 of the laminated type of meaning, but the construction of thermoelectric conversion element is not limited to laminated type.For example, hot Electric conversion module 1,2001 is also possible to the columnar 1st heat to electricity conversion portion formed by N-type oxide thermoelectricity transition material The heat of so-called π type made of being alternately arranged with the columnar 2nd heat to electricity conversion portion formed as p-type metal thermoelectric transition material The structure of electric transition element.
It this concludes the description of embodiments of the present invention and the variation (content recorded comprising note.It is same below.), but The present invention is not limited to this.The present invention, which contains, is appropriately combined the structure obtained after embodiment and variation and to implementation Mode and variation suitably apply the structure obtained after change.
The application is based on the Japanese invention patent application Patent 2016-071966 submitted on March 31st, 2016.At this In specification, the specification of Japanese invention patent application Patent 2016-071966, claims are referred to as reference And the whole of attached drawing.
Description of symbols
1,2001,3001,4001,5001,6001,7001,8001,9001, thermo-electric conversion module;10,4010,9010, Thermoelectric conversion element;16,9016, electrode;21, conductive member;22,522,2022,3022,5022,6022,7022,8022, close Seal component;22a, 3022a, 5022a, 6022a, contact surface;30,5030,6030, substrate;33,5033,6033, conductive part;34, 2034,5134,6034,7034,8034, external electrode;111, the 4111, the 2nd heat to electricity conversion portion;111a,113a,4111a, 4113a, lower end;111b, 113b, 4111b, 4113b, upper end;113, the 4113, the 1st heat to electricity conversion portion;115,4115, absolutely Edge body layer;133,2133, metal foil;512, metal layer;2121, conductive paste;522a, slot;2533,5034, mask;2533a, 5034a, opening portion;2027,2029,7027,7029,8027,8029, heat transfer part;1030,2030, radiator;It is 2133a, coarse Face;2133b, metal layer;2522a, upper side seals;2522b, lower side seals portion;5030, supporting substrates;A7, A8, projected area Domain;HF, mounting surface;HS, thermal objects.

Claims (9)

1. a kind of thermo-electric conversion module, wherein
The thermo-electric conversion module includes:
Multiple thermoelectric conversion elements:And
Containment member seals the multiple thermoelectric conversion element,
The thermoelectric conversion element has been alternately arranged the 1st heat to electricity conversion portion and the 2nd heat to electricity conversion portion, the end of the 1st direction side And the 2nd at least one of the end of direction side be electrically connected with the end in adjacent another 2nd heat to electricity conversion portion, the 1st side To the orientation for being orthogonal to the 1st heat to electricity conversion portion and the 2nd heat to electricity conversion portion, the 2nd direction is and the 1st side In the opposite direction,
At least one of the 1st direction side of the containment member and the 2nd direction side is are heated portion.
2. thermo-electric conversion module according to claim 1, wherein
The portion of being heated is can be with the shape of thermal objects face contact.
3. thermo-electric conversion module according to claim 1, wherein
The portion that is heated is formed by heat transfer part, the heat transfer part be set to the containment member the 1st direction end and At least one of the end in the 2nd direction transmits heat to the containment member for spontaneous hot object, or from the sealing Component transmits heat to radiating component.
4. thermo-electric conversion module described in any one of claim 1 to 3, wherein
The containment member is the hardenite formed by epoxy resin.
5. thermo-electric conversion module according to claim 4, wherein
The hardenite also contains inorganic filler.
6. thermo-electric conversion module according to any one of claims 1 to 5, wherein
The regional area of the 1st heat to electricity conversion portion and the 2nd heat to electricity conversion portion on joint surface is joined directly, in institute Other regions for stating joint surface are bonded together via insulator layer.
7. thermo-electric conversion module according to claim 6, wherein
The insulator layer also covers the end in the direction orthogonal with the orientation in the 2nd heat to electricity conversion portion,
The 2nd heat to electricity conversion portion is formed by metal thermoelectric transition material.
8. thermo-electric conversion module according to claim 7, wherein
The 1st heat to electricity conversion portion is formed by oxide thermoelectricity transition material,
The insulator layer is formed by oxide insulator material.
9. a kind of manufacturing method of thermo-electric conversion module, wherein
The manufacturing method of the thermo-electric conversion module contains following process:
Prepare in the metal foil for being formed with the inadhering anti-adhesion region of conductive paste on one side;
The metal foil is pasted on supporting substrates from that side opposite with the anti-adhesion area side of the metal foil;
The position that will form multiple conductive parts in the metal foil, the wetability for forming conductive paste are more anti-adhesion than described The good join domain in region;
The electrode of thermoelectric conversion element is electrically connected to the join domain using the conductive paste;
Form the 1st secondary sealing portion for covering the thermoelectric conversion element side of the metal foil;
The supporting substrates are removed from the metal foil;
That side opposite with the 1st secondary sealing portion side of the metal foil is processed, to form the multiple lead Electric portion;
Two conductive parts in the multiple conductive part form external electrode;And
The 2nd secondary sealing portion is formed in a manner of covering the downside of conductive part of the not formed external electrode.
CN201780021662.9A 2016-03-31 2017-01-18 The manufacturing method of thermo-electric conversion module and thermo-electric conversion module Pending CN108886084A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-071966 2016-03-31
JP2016071966 2016-03-31
PCT/JP2017/001566 WO2017168969A1 (en) 2016-03-31 2017-01-18 Thermoelectric conversion module, and method for producing thermoelectric conversion module

Publications (1)

Publication Number Publication Date
CN108886084A true CN108886084A (en) 2018-11-23

Family

ID=59964194

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780021662.9A Pending CN108886084A (en) 2016-03-31 2017-01-18 The manufacturing method of thermo-electric conversion module and thermo-electric conversion module

Country Status (4)

Country Link
US (1) US20180366631A1 (en)
JP (1) JPWO2017168969A1 (en)
CN (1) CN108886084A (en)
WO (1) WO2017168969A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102474817B1 (en) * 2018-12-04 2022-12-06 현대자동차주식회사 Thermoelectric module and apparatus for modulating a temperature including thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613664A (en) * 1992-06-29 1994-01-21 Matsushita Electric Ind Co Ltd Thermoelectric device and manufacture of thermoelectric device
US6274803B1 (en) * 1999-08-10 2001-08-14 Matsushita Electric Works, Ltd. Thermoelectric module with improved heat-transfer efficiency and method of manufacturing the same
CN103003969A (en) * 2010-07-20 2013-03-27 株式会社村田制作所 Thermoelectric conversion element, method for manufacturing same, and communication device
CN104956506A (en) * 2013-01-24 2015-09-30 株式会社电装 Method for manufacturing thermoelectric converter
JP2015177050A (en) * 2014-03-14 2015-10-05 日立化成株式会社 thermoelectric conversion module
CN105027307A (en) * 2013-03-05 2015-11-04 株式会社电装 Thermoelectric converter and method for manufacturing same
CN105070820A (en) * 2015-08-02 2015-11-18 杜效中 Fabrication method for novel thin film thermoelectric semiconductor device with separated cold end and hot end
CN105098053A (en) * 2014-05-09 2015-11-25 美国亚德诺半导体公司 Wafer thermoelectric collector

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11284235A (en) * 1998-03-27 1999-10-15 Union Material Kk Thermoelectric charger and secondary cell integrated with thermoelectric charger
JP4200256B2 (en) * 1999-08-10 2008-12-24 パナソニック電工株式会社 Thermoelectric conversion module
JP4901350B2 (en) * 2005-08-02 2012-03-21 株式会社東芝 Thermoelectric conversion device and manufacturing method thereof
US7871847B2 (en) * 2007-10-05 2011-01-18 Marlow Industries, Inc. System and method for high temperature compact thermoelectric generator (TEG) device construction
JP5264307B2 (en) * 2008-06-11 2013-08-14 株式会社朝日Fr研究所 Thermoelectric converter
JP5541137B2 (en) * 2010-12-15 2014-07-09 ソニー株式会社 Imaging device, electronic device, solar battery, and manufacturing method of imaging device
JP2012248819A (en) * 2011-05-31 2012-12-13 Murata Mfg Co Ltd Thermoelectric conversion element and manufacturing method thereof
JP5704243B2 (en) * 2011-08-22 2015-04-22 株式会社村田製作所 Thermoelectric conversion module and manufacturing method thereof
JP2013131692A (en) * 2011-12-22 2013-07-04 Ngk Spark Plug Co Ltd Laminate type thermoelectric conversion module
JP5928599B2 (en) * 2012-09-19 2016-06-01 富士通株式会社 Power generation device, measuring device and measuring system
US9748466B2 (en) * 2013-01-08 2017-08-29 Analog Devices, Inc. Wafer scale thermoelectric energy harvester
JP6232703B2 (en) * 2013-01-11 2017-11-22 富士通株式会社 Thermoelectric conversion element
JP2015005596A (en) * 2013-06-20 2015-01-08 日本特殊陶業株式会社 Thermoelectric conversion module and method for manufacturing the same
JP6240514B2 (en) * 2014-01-22 2017-11-29 株式会社アツミテック Thermoelectric conversion module
US20160163949A1 (en) * 2014-12-03 2016-06-09 Perpetua Power Source Technologies Flexible thermoelectric generator
WO2016199484A1 (en) * 2015-06-09 2016-12-15 株式会社村田製作所 Thermoelectric conversion element, thermoelectric conversion module, and electrical device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613664A (en) * 1992-06-29 1994-01-21 Matsushita Electric Ind Co Ltd Thermoelectric device and manufacture of thermoelectric device
US6274803B1 (en) * 1999-08-10 2001-08-14 Matsushita Electric Works, Ltd. Thermoelectric module with improved heat-transfer efficiency and method of manufacturing the same
CN103003969A (en) * 2010-07-20 2013-03-27 株式会社村田制作所 Thermoelectric conversion element, method for manufacturing same, and communication device
CN104956506A (en) * 2013-01-24 2015-09-30 株式会社电装 Method for manufacturing thermoelectric converter
CN105027307A (en) * 2013-03-05 2015-11-04 株式会社电装 Thermoelectric converter and method for manufacturing same
JP2015177050A (en) * 2014-03-14 2015-10-05 日立化成株式会社 thermoelectric conversion module
CN105098053A (en) * 2014-05-09 2015-11-25 美国亚德诺半导体公司 Wafer thermoelectric collector
CN105070820A (en) * 2015-08-02 2015-11-18 杜效中 Fabrication method for novel thin film thermoelectric semiconductor device with separated cold end and hot end

Also Published As

Publication number Publication date
JPWO2017168969A1 (en) 2019-01-31
WO2017168969A1 (en) 2017-10-05
US20180366631A1 (en) 2018-12-20

Similar Documents

Publication Publication Date Title
US7745928B2 (en) Heat dissipation plate and semiconductor device
TWI299581B (en) Thermoelectric device and method of manufacturing the same
JP5956608B2 (en) Thermoelectric module
JP2010109132A (en) Thermoelectric module package and method of manufacturing the same
WO2009084172A1 (en) Thermoelectric device
KR20130052361A (en) Thermoelectric module and method of manufacturing the same
JP5671569B2 (en) Thermoelectric conversion module
US20220013432A1 (en) Power semiconductor device
TW202130002A (en) Thermoelectric element
CN108886084A (en) The manufacturing method of thermo-electric conversion module and thermo-electric conversion module
US10236430B2 (en) Thermoelectric module
JP2015005595A (en) Thermoelectric conversion module and method for manufacturing the same
KR20100003494A (en) Thermoelectric cooling device with flexible copper band wire
CN115428173A (en) Thermoelectric element
CN209169125U (en) Encapsulating structure
US20140091444A1 (en) Semiconductor unit and method for manufacturing the same
JP6870747B2 (en) Thermoelectric conversion element and manufacturing method of thermoelectric conversion element
JP6399251B2 (en) Thermoelectric conversion element and method for manufacturing thermoelectric conversion element
JP6595320B2 (en) Thermoelectric module assembly
CN208572541U (en) Heat-radiating substrate with ladder route
JP2019161081A (en) Electric power conversion device and manufacturing method of electric power conversion device
US20230044428A1 (en) Thermoelectric device
US11626361B2 (en) Power semiconductor module
JP2013098309A (en) Substrate for mounting thermoelectric element and thermoelectric module
JP2004014995A (en) Thermoelectric transformation module and its manufacturing method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20181123