CN108879329A - Edge-emitting laser coupled structure and preparation method thereof - Google Patents
Edge-emitting laser coupled structure and preparation method thereof Download PDFInfo
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- CN108879329A CN108879329A CN201810864256.5A CN201810864256A CN108879329A CN 108879329 A CN108879329 A CN 108879329A CN 201810864256 A CN201810864256 A CN 201810864256A CN 108879329 A CN108879329 A CN 108879329A
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- 238000002360 preparation method Methods 0.000 title abstract description 5
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 229910000679 solder Inorganic materials 0.000 claims description 32
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 17
- 238000010586 diagram Methods 0.000 description 22
- 230000008569 process Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000002372 labelling Methods 0.000 description 2
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- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2202—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure by making a groove in the upper laser structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2218—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers having special optical properties
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- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses a kind of edge-emitting laser coupled structures and preparation method thereof, wherein the method includes：At least one groove is opened up on first substrate surface；Correspondingly, groove two sides form protrusion；In the first surface setting wire structures and edge-emitting laser of at least one protrusion；Wherein, raised first surface is the side surface where notch；At least one protrusion is cut down from first substrate, obtains block；Block is mounted to the first surface of the second substrate, and makes first surface of the second surface of block towards the second substrate；On the first surface of first substrate or second surface side is provided with the incidence surface of device to be coupled, and second surface is oppositely arranged with first surface.By means of the invention it is possible to produce a kind of edge-emitting laser coupled structure out in enormous quantities, so that the emergent light of edge-emitting laser is emitted directly toward the incidence surface of device to be coupled without reflection.
Description
Technical field
The present invention relates to silicon light and optoelectronic integrated technology field, and in particular to edge-emitting laser coupled structure and its production
Method.
Background technique
The luminous zone of edge-emitting laser is limited in the part of very little, can improve the coupling effect of optical fiber, integrated optical circuit
Rate.Edge-emitting laser goes out light towards side, and pad is set to top surface or bottom surface, is often electrically connected with the route of substrate surface
It connects.
In order to produce edge-emitting laser coupled structure in enormous quantities, existing production method is all utilized on substrate
Mount the mode of the conventional devices such as edge-emitting laser, reflective surface (or reflective mirror), lens.For example, first in first substrate table
Face paste rim emitting laser and lens, then the slot that side wall is inclined-plane is opened up on the second substrate surface, it is formed on inclined-plane reflective
Then the overhead guard that reflective surface is equipped in surface groove is buckled to and is mounted and obtain side as shown in Figure 1 on the first substrate again by face
Emitting laser.In Fig. 1, edge-emitting laser 110 is fixed at the surface of substrate 120, the pad of edge-emitting laser 110
115 are connect by bonding line with the pad 122 on 120 surface of substrate；Edge-emitting laser goes out light from right side, recessed through overhead guard surface
It after reflective surface 150 in slot reflects, then focuses through lens 160,120 surface of laser directive substrate or the other side after being then focused into
Device to be coupled incidence surface (such as grating, waveguide device).
However, existing edge-emitting laser coupled structure needs accurate placement light reflection device, edge-emitting laser could be made
Emergent light through reflecting the incidence surface of directive device to be coupled, it is more demanding to technique, and the prior art is difficult to produce in enormous quantities
A kind of edge-emitting laser coupled structure out, so that the emergent light of edge-emitting laser is emitted directly toward device to be coupled without reflection
Incidence surface the problem of.
Summary of the invention
In view of this, the embodiment of the invention provides a kind of edge-emitting laser coupled structure and preparation method thereof, with solution
Certainly existing way can not produce a kind of edge-emitting laser coupled structure out in enormous quantities, so that the emergent light of edge-emitting laser is not
The problem of being emitted directly toward the incidence surface of device to be coupled through reflection.
First aspect present invention provides a kind of production method of edge-emitting laser coupled structure, including：In the first base
Plate surface opens up at least one groove；Correspondingly, groove two sides form protrusion；In the first surface of at least one protrusion, cloth is set
Cable architecture and edge-emitting laser；Wherein, the first surface of the protrusion is the side surface where notch；By described at least one
A protrusion is cut down from the first substrate, obtains block；Correspondingly, the first surface of the protrusion corresponds to described piece
The first surface of body, the upper second surface adjacent with the first surface of the protrusion of protrusion correspond to the second of the block
Surface；The block is mounted to the first surface of the second substrate, and makes the second surface of the block towards described second
The first surface of substrate；What on the first surface of the first substrate or second surface side was provided with device to be coupled enters light
Face, the second surface are oppositely arranged with the first surface.
Optionally, described to be wrapped in the step of first surface setting wire structures and edge-emitting laser of at least one protrusion
It includes：There is the flexible base board of wiring layer in the first surface setting of at least one protrusion；Attachment edge emitting swashs in the flexibility
Light device.
Optionally, described the step of at least one described protrusion is cut down from the first substrate, obtains block
Before, further include：The light-emitting surface side of the edge-emitting laser mounts lens on the wire structures.
Optionally, it is described on the wire structures edge-emitting laser light-emitting surface side mount lens the step of it
Before, further include：At least one hole is opened up on the raised first surface and along the length direction of the groove, for being clamped
The lens.
Second aspect of the present invention provides a kind of edge-emitting laser coupled structure, including：The second substrate；Device to be coupled
Part, incidence surface is set on the first surface of the second substrate or the second surface side of the second substrate, described
Second surface is oppositely arranged with the first surface；Block is arranged on the first surface of the second substrate, the block
Second surface is arranged towards the second substrate；Wire structures are arranged on the first surface of the block, and the of the block
One surface is adjacent with the second surface of the block；Edge-emitting laser is set on the wire structures, and light-emitting surface is towards institute
State the second substrate.
Optionally, the wire structures extend to the second surface of the block.
Optionally, the first solder joint, the second substrate are provided on the wire structures of the block second surface
Position corresponding with first solder joint is provided with the second solder joint on one surface, and first solder joint and second solder joint are logical
It crosses soldered ball and realizes electrical connection.
Optionally, the wire structures extend to the third surface of the block, the third surface of the block with it is described
The second surface of block is oppositely arranged.
Optionally, the wire structures positioned at block third surface are provided with third solder joint, the third solder joint and institute
The 4th solder joint stated on the second substrate first surface realizes electrical connection by bonding line.
Optionally, the wire structures include flexible base board, are provided with wiring layer on the flexible base board.
Optionally, the edge-emitting laser coupled structure further includes：Lens are set to the first surface of the block,
And it is located on the laser emitting direction of the edge-emitting laser.
Optionally, it is offered in the first surface of the block and in the light-emitting surface side of the edge-emitting laser
Hole, the lens are connected to the opening in the hole.
Optionally, the material of the block is highly heat-conductive material.
Optionally, the included angle in the second substrate between the normal direction of first surface and the first surface of the block
It is 5 ° to 15 °.
The production method of edge-emitting laser coupled structure provided by the embodiment of the present invention first opens up on the first substrate
Groove forms protrusion, in the first surface setting wire structures and edge-emitting laser of protrusion, then by protrusion from first substrate
It cuts off to obtain block, finally mounts block to the first surface of the second substrate, and be adjacent with first surface on block
Second surface towards the second substrate first surface so that the exit direction face the second substrate of edge-emitting laser
Surface allows the emergent light of edge-emitting laser to be emitted directly toward device to be coupled on the second substrate surface without reflection
Incidence surface；And above-mentioned each step is adapted to high-volume and operates, and can produce edge-emitting laser in enormous quantities by this method
Emergent light be emitted directly toward the coupled apparatus of incidence surface.
The of the second substrate is arranged in edge-emitting laser coupled structure provided by the embodiment of the present invention, device to be coupled
Second surface the second base of direction of the first surface of the second substrate and block is arranged in one surface or second surface side, block
The block first surface adjacent with block second surface is arranged in the first surface of plate, wire structures, then is arranged in the wire bond
The lateral light-emitting surface of edge-emitting laser on structure can be emitted directly toward the incidence surface of device to be coupled without reflection, be not necessarily to
Accurate placement light reflection device, reduces process complexity.
Detailed description of the invention
The features and advantages of the present invention will be more clearly understood by referring to the accompanying drawings, and attached drawing is schematically without that should manage
Solution is carries out any restrictions to the present invention, in the accompanying drawings：
Fig. 1 shows the schematic diagram of existing edge-emitting laser coupled structure；
Fig. 2A shows the production method for providing a kind of edge-emitting laser coupled structure according to embodiments of the present invention
Flow chart；
Fig. 2 B is shown provides the production method of another edge-emitting laser coupled structure according to embodiments of the present invention
Flow chart；
Fig. 3 A shows the structural schematic diagram after first substrate surface opens up groove；
Fig. 3 B is the longitudinal cross-section schematic diagram of structure shown in Fig. 3 A；
Fig. 3 C shows the schematic diagram for the flexible base board made；
Fig. 3 D shows the structural schematic diagram after the first surface setting wire structures of protrusion；
Fig. 3 E is the longitudinal cross-section schematic diagram of structure shown in Fig. 3 D；
Fig. 3 F shows the structural schematic diagram mounted after edge-emitting laser on wire structures；
Fig. 3 G is the longitudinal cross-section schematic diagram of structure shown in Fig. 3 F；
Fig. 4 A, which is shown, to be provided the longitudinal profile of edge-emitting laser coupled structure a kind of according to embodiments of the present invention and shows
It is intended to；
Fig. 4 B is shown provides the longitudinal profile of another edge-emitting laser coupled structure according to embodiments of the present invention
Schematic diagram；
Fig. 4 C is shown provides the longitudinal profile of another edge-emitting laser coupled structure according to embodiments of the present invention
Schematic diagram.
Specific embodiment
In order to keep the purpose of the present invention, advantage, preparation method clearer, below in conjunction with attached drawing to implementation of the invention
Example is described in detail, and examples of the embodiments are shown in the accompanying drawings, wherein in attached drawing part-structure directly given it is excellent
The structural material of choosing, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.It needs
Illustrate, the embodiment being described with reference to the drawings is exemplary, and the structural material shown in embodiment is also exemplary, only
It is used to explain the present invention, and is not construed as limiting the claims, the attached drawing of each embodiment of the present invention is merely to signal
Purpose, therefore be not necessarily to scale.Based on the embodiments of the present invention, those skilled in the art are not making wound
Every other embodiment obtained under the premise of the property made labour, shall fall within the protection scope of the present invention.
Embodiment one
Fig. 2A shows the production method for providing a kind of edge-emitting laser coupled structure according to embodiments of the present invention
Flow chart.As shown in Figure 2 A, which includes the following steps：
S101：At least one groove is opened up on first substrate surface, correspondingly, groove two sides form protrusion.
Fig. 3 A shows the structural schematic diagram after first substrate surface opens up groove, and Fig. 3 B is structure shown in Fig. 3 A
Longitudinal cross-section schematic diagram.Wherein, 10 be first substrate, and 11 be groove, and 12 be protrusion.
Groove 11 in the step can be the strip-shaped groove as shown in Figure 3A extended along first substrate surface, and recessed
The cross section of slot 11 is U-shaped；It is also possible to the groove that notch is rectangle or polygon, and notch is located at the first substrate
Surface side.
The specific method for opening up groove can be through techniques such as drilling, groove millings, and the application is to the specific work for opening up groove
Skill is without limitation.
S102：In the first surface setting wire structures and edge-emitting laser of at least one protrusion, wherein the protrusion
First surface is the side surface where notch.
It can be and wire structures first are set in the first surface of protrusion, then mount edge-emitting laser on wire structures；
Alternatively, wire structures can also be first fabricated separately, then wire structures are mounted to the first surface of protrusion, is mounted in wire structures
To before or after raised first surface, edge-emitting laser is mounted to wire structures.
Fig. 3 F shows the structural schematic diagram mounted after edge-emitting laser on wire structures, and Fig. 3 G is shown in Fig. 3 F
The longitudinal cross-section schematic diagram of structure.Wherein, 30 be edge-emitting laser.
Fig. 3 D shows the structural schematic diagram after the first surface setting wire structures of protrusion, and Fig. 3 E is shown in Fig. 3 D
The longitudinal cross-section schematic diagram of structure.Wherein, 40 be wire structures.Wire structures can be is arranged at least one layer of cloth on a silicon substrate
TSV structure can also be arranged in line layer；Alternatively, being also possible to that at least one layer of wiring layer is arranged on flexible substrates.
As shown in FIGURE 3 E, the surface A1 of raised A is first surface, and the surface A2 is second surface, and the surface A3 is third surface.
Can wire structures only be arranged in first surface in the step, wire structures can also be arranged in first surface and second surface, or
Wire structures are arranged in first surface and third surface in person, or are respectively provided with wiring on first surface, second surface, third surface
Structure.Optionally, the wire structures between different surfaces are electrical connections.
S103：By this, at least one protrusion is cut down from first substrate, obtains block.Correspondingly, raised first
Surface corresponds to the first surface of block, and the second surface adjacent with the first surface of protrusion corresponds to the second of block in protrusion
Surface.
As shown in Figure 3 G, first substrate can be cut along direction shown in the dotted line B1 and B2 in Fig. 3 G.
S104：Block is mounted to the first surface of the second substrate, and makes the second surface of block towards the second substrate
First surface.On the first surface of first substrate or second surface side is provided with the incidence surface of device to be coupled, the second table
Face is oppositely arranged with first surface.
The longitudinal profile schematic diagram of coupled structure after attachment is as shown in figs. 4 a-4 c.Wherein, 70 be the second substrate, and 80 are
The incidence surface of device (such as can be grating, waveguide device etc.) to be coupled.
It should be added that can all preset corresponding alignment before attachment step in the embodiment of the present application
Label, the application to specific labeling method without limitation.
The production method of above-mentioned edge-emitting laser coupled structure first opens up groove on the first substrate and forms protrusion,
The first surface setting wire structures and edge-emitting laser of protrusion, then protrusion is cut off to obtain block from first substrate,
Finally block is mounted to the first surface of the second substrate, and be on block the second surface adjacent with first surface towards the
The first surface of two substrates, so that the surface of the exit direction face the second substrate of edge-emitting laser, so that edge emitting
The emergent light of laser can be emitted directly toward the incidence surface of device to be coupled on the second substrate surface without reflection；And it is above-mentioned
Each step is adapted to high-volume and operates, and is emitted directly toward by the emergent light that this method can produce edge-emitting laser in enormous quantities
The coupled apparatus of incidence surface.
Embodiment two
Fig. 2 B is shown provides the production method of another edge-emitting laser coupled structure according to embodiments of the present invention
Flow chart.As shown in Figure 2 B, which includes the following steps：
S201：At least one groove is opened up on first substrate surface.Correspondingly, groove two sides form protrusion.
The step please refers to step S101, and details are not described herein.
S202：At least one hole is opened up on raised first surface and along the length direction of groove, for being clamped lens.
As shown in figs.3 a and 3b, 60 be the hole for being clamped lens.
Alternatively it is also possible to without carrying out the step.
S203：There is the flexible base board of wiring layer in the first surface setting of at least one protrusion.
Fig. 3 C shows the schematic diagram for the flexible base board made.Step S203 can first produce as shown in Figure 3 C soft
Property substrate 40, be provided with wiring layer on substrate 40, also with 41 in solder joint, such as Fig. 3 C swashed for mounting edge emitting certainly
The solder joint of light device, 43 be to mount for raised second surface to the solder joint on the second substrate first surface.When needing lens card
It connects and is arranged when on hole, also need that through-hole 42 is arranged on flexible base board.
Finally, by the flexible base board 40 made attachment to the surface of first substrate, and for mounting edge emitting laser
Solder joint 41, the through-hole 42 of device are arranged on the first surface of protrusion, as shown in figures 3 d and 3e.
S204：Edge-emitting laser is mounted on flexible substrates.
Fig. 3 F shows the structural schematic diagram mounted after edge-emitting laser on flexible substrates, wherein 30 be edge emitting
Laser.
S205：The light-emitting surface side of edge-emitting laser mounts lens on flexible substrates.
Fig. 3 F shows the structural schematic diagram mounted after lens on flexible substrates, wherein 50 be lens.
The lens can be fixed on the first surface of protrusion；Alternatively, a kind of optional embodiment as the present embodiment,
At least one hole (such as Fig. 3 A to 3G can also be opened up before the step on raised first surface and along the length direction of groove
In 60 shown in), for being clamped lens, lens are connected to the opening in hole.This aperture set-up mode that is connected to can be used for
Ball-type lens can be used for the lens of other shapes.Lens can be clamped by the way of laser welding to be arranged in opening.
S206：At least one protrusion is cut down from first substrate, obtains block.Correspondingly, the first raised table
First surface in face of should be block corresponds to the second surface of block with the second surface of protrusion.
The step please refers to step S103, and details are not described herein.
S207：Block is mounted to the first surface of the second substrate, and makes the second surface of block towards the second substrate
First surface.On the first surface of first substrate or second surface side is provided with the incidence surface of device to be coupled, the second table
Face is oppositely arranged with first surface.
The step please refers to step S104, and details are not described herein.
It should be added that can all preset corresponding alignment before attachment step in the embodiment of the present application
Label, the application to specific labeling method without limitation.
The production method of above-mentioned edge-emitting laser coupled structure can produce a kind of edge-emitting laser coupling out in enormous quantities
Structure is closed, so that the emergent light of edge-emitting laser is emitted directly toward the incidence surface of device to be coupled without reflection.Specifically please refer to
Embodiment one.
Embodiment three
Fig. 4 A, which is shown, to be provided the longitudinal profile of edge-emitting laser coupled structure a kind of according to embodiments of the present invention and shows
It is intended to.The edge-emitting laser coupled structure can be made of production method described in embodiment one or embodiment two.Such as figure
Shown in 4A, which includes the second substrate 70, device to be coupled, block 90, wire structures 20 and side
Emitting laser 30.
The incidence surface 80 of device to be coupled be set on the first surface of the second substrate 70 or the second substrate 70 second
Surface side, second surface are oppositely arranged with first surface.
Block 90 is arranged on the first surface of the second substrate 70, and the second surface of block 90 is set towards the second substrate 70
It sets.Wire structures 20 are arranged on the first surface of block 90, and the first surface of block 90 is adjacent with the second surface of block 90,
It can be connected by bonding line (such as gold thread) 100 between the solder joint on solder joint and the second substrate 70 on the wire structures 20.
Edge-emitting laser 30 is set on wire structures 20, and light-emitting surface is towards the second substrate 70.
The first surface or second surface of the second substrate is arranged in above-mentioned edge-emitting laser coupled structure, device to be coupled
First surface of the second surface of the first surface of the second substrate and block towards the second substrate, cloth is arranged in side, block
The block first surface adjacent with block second surface is arranged in cable architecture, then the edge emitting laser on the wire structures is arranged in
The lateral light-emitting surface of device can be emitted directly toward the incidence surface of device to be coupled without reflection, be not necessarily to accurate placement reflector
Part reduces process complexity.
Example IV
Fig. 4 B is shown provides the longitudinal profile of another edge-emitting laser coupled structure according to embodiments of the present invention
Schematic diagram.The edge-emitting laser coupled structure can be made of production method described in embodiment one or embodiment two.
As shown in Figure 4 B, the difference with edge-emitting laser coupled structure shown in Fig. 4 A is, wire structures 20 extend to
The second surface of block 90 is provided with the first solder joint, the second substrate 70 on the wire structures 20 of 90 second surface of block
Position corresponding with the first solder joint is provided with the second solder joint, the first solder joint and the second solder joint and realizes electricity by soldered ball on one surface
Connection.The set-up mode shortens the solder joint on block 90 at a distance from 70 surface of the second substrate, makes to be suitable for passing through between solder joint
Soldered ball connection, can greatly improve electric signal transmission speed, promote the high frequency characteristics of edge-emitting laser coupled structure entirety.
Optionally, wire structures 20 are flexible base board, are provided with wiring layer on flexible base board.
As a kind of optional embodiment of the present embodiment, which further includes lens 50, if
It is placed in the first surface of block 90, and is located on the laser emitting direction of edge-emitting laser 30.Further, in block 90
First surface and offer hole 60 in the light-emitting surface side of edge-emitting laser 30, lens 50 are connected to the opening in hole 60.
Optionally, the material of block 90 is highly heat-conductive material, to realize the rapid cooling of edge-emitting laser.
Optionally, in the second substrate 70 first surface normal direction (i.e. the direction vertical with the first surface of the second substrate 70)
Included angle between the first surface of block 90 is 5 ° to 15 ° (such as 5 °, 10 °, 15 °) namely edge-emitting laser 30
Emergent light and planar waveguide circuit (full name in English：Planar Lightwave Circuit, abbreviation PLC) plane of incidence normal direction
Angle between (based on the vertical direction of the plane of incidence) is respectively 5 ° to 15 °, can reduce the plane of incidence in this way for the anti-of laser
It penetrates, improves coupling efficiency.
The lateral light-emitting surface of above-mentioned edge-emitting laser coupled structure, edge-emitting laser can be direct without reflection
The incidence surface of directive device to be coupled is not necessarily to accurate placement light reflection device, reduces process complexity.Specifically please refer to embodiment
Three.
Embodiment five
Fig. 4 C is shown provides the longitudinal profile of another edge-emitting laser coupled structure according to embodiments of the present invention
Schematic diagram.The edge-emitting laser coupled structure can be made of production method described in embodiment one or embodiment two.
As shown in Figure 4 C, the difference with edge emitting laser coupled structure shown in Fig. 4 A is that wire structures 20 extend to block
The third surface of body 90, wherein the third surface of block 90 and the second surface of block 90 are oppositely arranged.Positioned at 90 third of block
Third solder joint is provided on the wire structures 20 on surface, third solder joint passes through with the 4th solder joint on 70 first surface of the second substrate
Bonding line 100 realizes electrical connection.
Optionally, wire structures 20 are flexible base board, are provided with wiring layer on flexible base board.
As a kind of optional embodiment of the present embodiment, which further includes lens 50, if
It is placed in the first surface of block 90, and is located on the laser emitting direction of edge-emitting laser 30.Further, in block 90
First surface and offer hole 60 in the light-emitting surface side of edge-emitting laser 30, lens 50 are connected to the opening in hole 60.
Optionally, the material of block 90 is highly heat-conductive material, to realize the rapid cooling of edge-emitting laser.
Optionally, in the second substrate 70 first surface normal direction (i.e. the direction vertical with the first surface of the second substrate 70)
Included angle between the first surface of block 90 is 5 ° to 15 ° (such as 5 °, 10 °, 15 °) namely edge-emitting laser 30
Emergent light and planar waveguide circuit (full name in English：Planar Lightwave Circuit, abbreviation PLC) plane of incidence normal direction
Angle between (based on the vertical direction of the plane of incidence) is respectively 5 ° to 15 °, can reduce the plane of incidence in this way for the anti-of laser
It penetrates, improves coupling efficiency.
The lateral light-emitting surface of above-mentioned edge-emitting laser coupled structure, edge-emitting laser can be direct without reflection
The incidence surface of directive device to be coupled is not necessarily to accurate placement light reflection device, reduces process complexity.Specifically please refer to embodiment
Three.
Although being described in detail about example embodiment and its advantage, those skilled in the art can not departed from
Various change, replacement are carried out to these embodiments in the case where spirit of the invention and protection scope defined in the appended claims
And modification, such modifications and variations are each fallen within be defined by the appended claims within the scope of.For other examples, ability
The those of ordinary skill in domain should be readily appreciated that the order of processing step can become while keeping in the scope of the present invention
Change.
In addition, application range of the invention is not limited to the technique, mechanism, system of specific embodiment described in specification
It makes, material composition, means, method and step.From the disclosure, will be easy as those skilled in the art
Ground understands, for current technique that is existing or will developing later, mechanism, manufacture, material composition, means, method or
Step, wherein they execute the function that the corresponding embodiment described with the present invention is substantially the same or the knot that acquisition is substantially the same
Fruit can apply them according to the present invention.Therefore, appended claims of the present invention are intended to these techniques, mechanism, system
It makes, material composition, means, method or step are included in its protection scope.
Claims (10)
1. a kind of production method of edge-emitting laser coupled structure, which is characterized in that including：
At least one groove is opened up on first substrate surface；Correspondingly, groove two sides form protrusion；
In the first surface setting wire structures and edge-emitting laser of at least one protrusion；Wherein, the first table of the protrusion
Face is the side surface where notch；
At least one described protrusion is cut down from the first substrate, obtains block；Correspondingly, the first of the protrusion
Surface corresponds to the first surface of the block, and the protrusion is upper corresponding with the adjacent second surface of the first surface of the protrusion
For the second surface of the block；
The block is mounted to the first surface of the second substrate, and makes the second surface of the block towards second base
The first surface of plate；On the first surface of the first substrate or second surface side is provided with the incidence surface of device to be coupled,
The second surface is oppositely arranged with the first surface.
2. the production method of edge-emitting laser coupled structure according to claim 1, which is characterized in that described at least
The step of one raised first surface setting wire structures and edge-emitting laser includes：
There is the flexible base board of wiring layer in the first surface setting of at least one protrusion；
Edge-emitting laser is mounted in the flexibility.
3. the production method of edge-emitting laser coupled structure according to claim 1, which is characterized in that it is described will be described
Before the step of at least one protrusion cuts down from the first substrate, obtains block, further include：
The light-emitting surface side of the edge-emitting laser mounts lens on the wire structures.
4. the production method of edge-emitting laser coupled structure according to claim 3, which is characterized in that described described
Before the light-emitting surface side of edge-emitting laser mounts the step of lens on wire structures, further include：
At least one hole is opened up on the raised first surface and along the length direction of the groove, it is described for being clamped
Mirror.
5. a kind of edge-emitting laser coupled structure, which is characterized in that including：
The second substrate；
Device to be coupled, incidence surface is set on the first surface of the second substrate or the second table of the second substrate
Face side, the second surface are oppositely arranged with the first surface；
Block is arranged on the first surface of the second substrate, and the second surface of the block is set towards the second substrate
It sets；
Wire structures are arranged on the first surface of the block, the second table of the first surface of the block and the block
Face is adjacent；
Edge-emitting laser is set on the wire structures, and light-emitting surface is towards the second substrate.
6. edge-emitting laser coupled structure according to claim 5, which is characterized in that the wire structures extend to institute
State the second surface of block；
Be provided with the first solder joint on the wire structures of the block second surface, on the second substrate first surface with institute
State the corresponding position of the first solder joint be provided with the second solder joint, first solder joint and second solder joint pass through soldered ball realize electricity
Connection.
7. edge-emitting laser coupled structure according to claim 5, which is characterized in that the wire structures extend to institute
The third surface of block is stated, the third surface of the block and the second surface of the block are oppositely arranged；
Wire structures positioned at block third surface are provided with third solder joint, the third solder joint and the second substrate the
The 4th solder joint on one surface is realized by bonding line to be electrically connected.
8. edge-emitting laser coupled structure according to claim 5, which is characterized in that further include：
Lens are set to the first surface of the block, and are located on the laser emitting direction of the edge-emitting laser.
9. edge-emitting laser coupled structure according to claim 8, which is characterized in that in the first surface of the block
And hole is offered in the light-emitting surface side of the edge-emitting laser, the lens are connected to the opening in the hole.
10. edge-emitting laser coupled structure according to claim 5, which is characterized in that the material of the block is height
Heat Conduction Material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810864256.5A CN108879329A (en) | 2018-08-01 | 2018-08-01 | Edge-emitting laser coupled structure and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810864256.5A CN108879329A (en) | 2018-08-01 | 2018-08-01 | Edge-emitting laser coupled structure and preparation method thereof |
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Citations (5)
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| US4738501A (en) * | 1985-04-08 | 1988-04-19 | Fuji Photo Film Co., Ltd. | Light beam scanning apparatus, and read-out apparatus and recording apparatus using same |
| CN1599158A (en) * | 2003-09-19 | 2005-03-23 | 安捷伦科技有限公司 | Optoelectronic device packaging with hermetically sealed cavity and integrated optical element |
| US20060239612A1 (en) * | 2002-06-19 | 2006-10-26 | Peter De Dobbelaere | Flip-chip devices formed on photonic integrated circuit chips |
| CN106980160A (en) * | 2017-03-07 | 2017-07-25 | 中国科学院微电子研究所 | On-chip light source structure based on hybrid integration and preparation method thereof |
| CN208723312U (en) * | 2018-08-01 | 2019-04-09 | 华进半导体封装先导技术研发中心有限公司 | Edge-emitting laser coupled structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4738501A (en) * | 1985-04-08 | 1988-04-19 | Fuji Photo Film Co., Ltd. | Light beam scanning apparatus, and read-out apparatus and recording apparatus using same |
| US20060239612A1 (en) * | 2002-06-19 | 2006-10-26 | Peter De Dobbelaere | Flip-chip devices formed on photonic integrated circuit chips |
| CN1599158A (en) * | 2003-09-19 | 2005-03-23 | 安捷伦科技有限公司 | Optoelectronic device packaging with hermetically sealed cavity and integrated optical element |
| US20050062056A1 (en) * | 2003-09-19 | 2005-03-24 | Baugh Brenton A. | Optoelectronic device packaging with hermetically sealed cavity and integrated optical element |
| CN106980160A (en) * | 2017-03-07 | 2017-07-25 | 中国科学院微电子研究所 | On-chip light source structure based on hybrid integration and preparation method thereof |
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