CN108873189A - Optical module and its light emitting secondary module - Google Patents

Optical module and its light emitting secondary module Download PDF

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Publication number
CN108873189A
CN108873189A CN201810640829.6A CN201810640829A CN108873189A CN 108873189 A CN108873189 A CN 108873189A CN 201810640829 A CN201810640829 A CN 201810640829A CN 108873189 A CN108873189 A CN 108873189A
Authority
CN
China
Prior art keywords
light emitting
baffle
emitting secondary
secondary module
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810640829.6A
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Chinese (zh)
Inventor
樊凤梅
吴铁山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Priority to CN201810640829.6A priority Critical patent/CN108873189A/en
Publication of CN108873189A publication Critical patent/CN108873189A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4287Optical modules with tapping or launching means through the surface of the waveguide
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4296Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50Transmitters
    • H04B10/501Structural aspects
    • H04B10/503Laser transmitters

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The present invention provides a kind of optical module and its light emitting secondary modules.Light emitting secondary module includes coaxial packaging laser and welding resistance pipe.Coaxial packaging laser includes optical chip and lens, and lens are set to the side of optical chip, is used for convergent beam.Welding resistance pipe includes tube body and the baffle on inboard wall of tube body, and baffle offers loophole, and loophole is located on the optical axis of light beam.Above-mentioned optical module and its light emitting secondary module can be realized by baffle and stop to the reflected light generated during beam Propagation, and the adverse effect for avoiding the reflected light in light emitting secondary module from generating light source or light path system guarantees the performance of optic communication product.

Description

Optical module and its light emitting secondary module
Technical field
The present invention relates to optic communication device field, especially a kind of optical module and its light emitting secondary module.
Background technique
With the rapid development of Internet, demand of the people to Internet resources rapidly increases, the requirement to speed and flow, So that optical communication technique obtains the development of high speed.
Light emitting secondary module (Transmitter Optical Subassembly, hereinafter referred to as TOSA) mainly includes:Together Axis encapsulated laser TO-CAN, welding resistance pipe, adjusting sleeve, isolator, adapter etc..Light emitting secondary module (Transmitter Optical Subassembly, hereinafter referred to as TOSA) possess and converts electrical signals to optical signal, it is used for fiber optic communication.According to biography Defeated distance is different, is especially typically free of isolator in the transmitting optical assembly of short-range signal transmission.But in traditional technology In light emitting secondary module in, since reflex is serious, for being not provided with the light emitting secondary module of isolator, reflected light is to light The adverse effect that source or light path system generate, influences the performance of optic communication product.
Summary of the invention
The purpose of the present invention is to provide a kind of light emitting secondary modules of better performances.
A kind of light emitting secondary module, including:
Coaxial packaging laser, including optical chip and lens, the lens are set to the side of the optical chip, for assembling Light beam;And
The tube body of welding resistance pipe, the welding resistance pipe is socketed the coaxial packaging laser,
The inner wall of the tube body is equipped with baffle, and the baffle offers loophole, and the loophole is located at the light beam Optical axis on.Above-mentioned light emitting secondary module can be realized by baffle and hinder the reflected light generated during beam Propagation Gear, the adverse effect for avoiding the reflected light in light emitting secondary module from generating light source or light path system, guarantees optic communication product Performance.
Meanwhile reflected light is obstructed by baffle, it avoids additionally increasing isolator, reduces being fabricated to for light emitting secondary module This.Therefore, above-mentioned light emitting secondary module realizes the purpose of simple, economical and effective enhancing optic communication quality by baffle.
Also, no setting is required isolator avoids the additional occupied space of isolator, and the volume for reducing light emitting secondary module is big It is small, be conducive to the Miniaturization Design of light emitting secondary module.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the light emitting secondary module of present embodiment.
10, light emitting secondary module;11, coaxial packaging laser;111, tube socket;112, pipe cap;113, optical chip;114, thoroughly Mirror;12, welding resistance pipe;121, tube body;122, baffle;123, loophole;13, sleeve is adjusted;14, adapter;141, ceramic insertion core; 142, inclined-plane.
Specific embodiment
The exemplary embodiment for embodying feature of present invention and advantage will describe in detail in the following description.It should be understood that The present invention can have various variations in different embodiments, neither depart from the scope of the present invention, and theory therein Bright and diagram inherently is illustrated as being used, rather than to limit the present invention.
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people The model that the present invention protects all should belong in member's every other embodiment obtained without making creative work It encloses.
Term " includes " in description and claims of this specification and above-mentioned attached drawing and " having " and they Any deformation, it is intended that cover it is non-exclusive include, for example, containing the process, method of a series of steps or units, being System, product or equipment those of are not necessarily limited to be clearly listed step or unit, but may include be not clearly listed or For the intrinsic other step or units of these process, method, system, product or equipment.
Referring to Fig. 1, the present invention provides a kind of optical module and its light emitting secondary module.
Optical module includes light emitting secondary module.Light beam is transmitted in the optical fiber of one end by light emitting secondary module, to realize The transmission of signal.
The light emitting secondary module 10 of present embodiment includes coaxial packaging laser 11 and welding resistance pipe 12.
Coaxial packaging laser 11 includes tube socket 111, pipe cap 112, optical chip 113 and lens 114.Pipe cap 112 is welded on On tube socket 111, optical chip 113 and lens 114 are encapsulated in it.
Optical chip 113 is connect with the driving chip signal that optical chip 113 matches, and driving chip drives optical chip 113 to send out Light beam out.Specifically, optical chip 113 issues laser beam.Optical chip 113 is laser, and driving chip is to provide hair Penetrate the device of signal processing.
Optical transmission window is offered on pipe cap 112, lens 114 are embedded on the optical transmission window.And the optical transmission window is in plane Shape can shorten the distance between lens 114 and optical chip 113 in this way, and then shorten the length of coaxial packaging laser 11, have Conducive to the miniaturization of coaxial packaging laser 11.
Lens 114 are set to the side of optical chip 113, are used for convergent laser light beam.Lens 114 can for convex lens 114 or 114 groups of person's lens, light beam is assembled as long as can be realized.
Welding resistance pipe 12 is connect with coaxial packaging laser 11.Welding resistance pipe 12 includes tube body 121 and baffle 122.121 sets of tube body Connect coaxial packaging laser 11.Baffle 122 is set on the inner wall of tube body 121.
Specifically, above-mentioned coaxial packaging laser 11 connects the one end for being contained in tube body 121.Baffle 122 is set to tube body 121 The other end.Baffle 122 offers loophole 123, and loophole 123 is located on the optical axis of laser beam.
Specifically in the present embodiment, the pore size of loophole 123 is less than or equal to 2.8 millimeters.Therefore, loophole 123 When less than or equal to 2.8 millimeters, baffle 122 can block the reflected light in other directions, equally play the role of isolator, To reach the characteristics of signals for improving emergent light, conducive to the transmission of light.
Specifically in the present embodiment, baffle 122 is an integral structure with tube body 121.Baffle 122 is shaped in tube body The position that the link position and loophole 123 of 121 side, baffle 122 and tube body 121 are located at baffle 122 is easier to meet and set Meter requires.
Baffle 122 is 304 stainless steel plates.And the thickness of baffle 122 is greater than 0.5mm, to guarantee that it is sharp that baffle 122 is able to bear The intensity requirement of photocoagulation.
Light emitting secondary module 10 further includes adjusting sleeve 13.It cannot be directly connected to tube body 121 due to adjusting sleeve 13.Cause This, adjusts sleeve 13 and is fixedly connected with baffle 122.Baffle 122 can be also used for backwards to the one side of optical chip 113 and adjusting set Cylinder 13 connects.Specifically, sleeve 13 is adjusted to connect with baffle 122 by laser welding.The thickness of baffle 122 can bear laser The intensity requirement of welding.Therefore, baffle 122 can blocking reflected light while, it can also be ensured that can with adjust sleeve 13 It is stably connected with.
Light emitting secondary module 10 further includes adapter 14.Adapter 14 is connect with sleeve 13 is adjusted.Adapter 14 includes inserting Core 141.Specifically, lock pin 141 is ceramic insertion core.The ceramic insertion core 141 of adapter 14 adjusts ceramic insert by adjusting sleeve 13 The distance between core 141 and lens 114 guarantee light beam so that the end face of ceramic insertion core 141 be made to be located at the focal length of lens 114 The plane of incidence of ceramic insertion core 141 can be converged at.The other end of ceramic insertion core 141 is connected with optical fiber interface, and wherein the optical fiber connects Mouth is connected with optical fiber, so that light beam is transmitted to optical fiber through ceramic insertion core 141.
Also, ceramic insertion core 141 is equipped with inclined-plane 142 close to the side of baffle 122, which is the plane of incidence.The plane of incidence With certain angle, then the reflection from 141 direction of ceramic insertion core can be reduced, improve the quality of optical signal.
Above-mentioned light emitting secondary module 10, by baffle 122 can be realized to the reflected light generated during beam Propagation into Row stops, the adverse effect for avoiding the reflected light in light emitting secondary module from generating light source or light path system.Also, due to In short-range signal transmission process, since greater attenuation will not occur for signal strength, baffle 122 when obstructing reflected light, Light signal strength will not be influenced, guarantees the performance of optic communication product.
Meanwhile reflected light is obstructed by baffle 122, it avoids additionally increasing isolator, reduces the system of light emitting secondary module Make cost.Therefore, above-mentioned light emitting secondary module realizes simple, economical and effective enhancing optic communication quality by baffle 122 Purpose.
Specifically in the present embodiment, the size of the loophole 123 on baffle 122 meets:
90%r≤(L*B*tan θ)/(L+M),
Wherein, θ is the maximum angle of divergence of optical chip 113, and B is optical chip 113 at a distance from lens 114;R is optical chip The corresponding beam radius of the 113 maximum angles of divergence;R is the radius of loophole 123;M is baffle 122 at a distance from lens 114;L is Baffle 122 is at a distance from ceramic insertion core 141.
Specifically in the present embodiment, when the size r value of loophole 123 meets:When r≤(L*B*tan θ)/(L+M) It waits, then the baffle 122 preferably can pass through loophole 123 by blocking reflected light.
It is appreciated that in other embodiments, even if the size of loophole 123 is slightly larger, the size of loophole 123 In the range of increasing 10% than (L*B*tan θ)/(L+M), as long as 2.8 millimeters can be less than or equal to, also it can guarantee big portion The reflected light divided is blocked, and also may be implemented to enhance the purpose of optic communication signal quality.
And the size r of loophole 123 then illustrates that lens opening 123 can not only be compared with when be (L*B*tan θ)/(L+M) Good blocking reflected light, can also guarantee the intensity of optical signal to avoid shielding light beam.
The distance between baffle 122 and lens 114 are less than one times of focal length of lens 114.Between baffle 122 and lens 114 Distance plus the distance between baffle 122 and ceramic insertion core 141 equal to lens 114 focal length size so that light beam is through lens 114 converge at the inlet of ceramic insertion core 141.
Also, the distance between the length, that is, baffle 122 and tube socket 111 of welding resistance pipe 12 are suitable with the focal length of lens 114, and It is slightly less than the focal length size of lens 114.Then guarantee that there are a certain distance between lens 114 and baffle 122, and guarantees light beam Focus point is located at the outside of welding resistance pipe 12, so that light beam is assembled and is incident in ceramic insertion core 141.
Therefore, in above-mentioned light emitting secondary module 10, since loophole 123 is located near focal point, optical power loss is smaller, together When can reflected light with the barrier of large area from other directions, guarantee optical signal quality.
Although describing the present invention with reference to several exemplary embodiments, it is to be understood that, term used be explanation and Term exemplary, and not restrictive.Due to the present invention can be embodied in a variety of forms without departing from invention spirit or Essence, it should therefore be appreciated that above embodiment is not limited to any of the foregoing details, and should be defined by the appended claims The whole change and modification widely explained, therefore fallen into claim or its equivalent scope in spirit and scope all should be with Attached claim is covered.

Claims (10)

1. a kind of light emitting secondary module, which is characterized in that including:
Coaxial packaging laser, including optical chip and lens, the lens are set to the side of the optical chip, are used for converging light Beam;And
The tube body of welding resistance pipe, the welding resistance pipe is socketed the coaxial packaging laser,
The inner wall of the tube body is equipped with baffle, and the baffle offers loophole, and the loophole is located at the light of the light beam On axis.
2. light emitting secondary module according to claim 1, which is characterized in that the aperture of the loophole is less than or equal to 2.8 Millimeter.
3. light emitting secondary module according to claim 1, which is characterized in that it further include the lock pin for being connected with optical fiber, The lock pin is set to the baffle backwards to the side of the coaxial packaging laser, and the size of the loophole meets:
90%r≤(L*B*tan θ)/(L+M),
Wherein, θ is the maximum angle of divergence of optical chip, and B is optical chip at a distance from the lens;R is the optical chip maximum angle of divergence Corresponding beam radius;R is the radius of loophole;M is baffle at a distance from lens;L is baffle at a distance from the lock pin.
4. light emitting secondary module according to claim 1, which is characterized in that the distance between the baffle and the lens Less than the focal length of the lens.
5. light emitting secondary module according to claim 1, which is characterized in that the thickness of the baffle is greater than 0.5mm.
6. light emitting secondary module according to claim 1, which is characterized in that the baffle is integral type knot with the tube body Structure.
7. light emitting secondary module according to claim 1, which is characterized in that further include adjusting sleeve, the adjusting sleeve It is connect with the baffle.
8. light emitting secondary module according to claim 7, which is characterized in that it further include adapter, the adapter and institute State adjusting sleeve connection.
9. light emitting secondary module according to claim 3, which is characterized in that the ceramic insertion core close to the baffle one Side is equipped with inclined-plane, and the light beam is injected in the ceramic insertion core through the inclined-plane.
10. a kind of optical module, which is characterized in that including any light emitting secondary module of claim 1-9.
CN201810640829.6A 2018-06-21 2018-06-21 Optical module and its light emitting secondary module Pending CN108873189A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810640829.6A CN108873189A (en) 2018-06-21 2018-06-21 Optical module and its light emitting secondary module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810640829.6A CN108873189A (en) 2018-06-21 2018-06-21 Optical module and its light emitting secondary module

Publications (1)

Publication Number Publication Date
CN108873189A true CN108873189A (en) 2018-11-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810640829.6A Pending CN108873189A (en) 2018-06-21 2018-06-21 Optical module and its light emitting secondary module

Country Status (1)

Country Link
CN (1) CN108873189A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109884747A (en) * 2019-02-26 2019-06-14 武汉锐科光纤激光技术股份有限公司 Laser aligner and laser system
CN109917523A (en) * 2019-04-30 2019-06-21 武汉兴思为光电科技有限公司 A kind of wavelength interval is less than the 50G simplex optical module of 20nm

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2687910Y (en) * 2003-10-30 2005-03-23 武汉电信器件有限公司 Focal freely-setting device for coaxial pluggable laser
JP2007072225A (en) * 2005-09-08 2007-03-22 Nippon Electric Glass Co Ltd Optical receptacle
US20090087142A1 (en) * 2007-09-28 2009-04-02 Ricoh Printing Systems, Ltd. Semiconductor Laser Module and Light Scanning Device and Image Forming Apparatus Using the Same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2687910Y (en) * 2003-10-30 2005-03-23 武汉电信器件有限公司 Focal freely-setting device for coaxial pluggable laser
JP2007072225A (en) * 2005-09-08 2007-03-22 Nippon Electric Glass Co Ltd Optical receptacle
US20090087142A1 (en) * 2007-09-28 2009-04-02 Ricoh Printing Systems, Ltd. Semiconductor Laser Module and Light Scanning Device and Image Forming Apparatus Using the Same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109884747A (en) * 2019-02-26 2019-06-14 武汉锐科光纤激光技术股份有限公司 Laser aligner and laser system
CN109884747B (en) * 2019-02-26 2024-03-08 武汉锐科光纤激光技术股份有限公司 Laser collimator and laser system
CN109917523A (en) * 2019-04-30 2019-06-21 武汉兴思为光电科技有限公司 A kind of wavelength interval is less than the 50G simplex optical module of 20nm

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Application publication date: 20181123