CN108865013A - A kind of preparation method of wiring board ESD function adhesive - Google Patents
A kind of preparation method of wiring board ESD function adhesive Download PDFInfo
- Publication number
- CN108865013A CN108865013A CN201810749574.7A CN201810749574A CN108865013A CN 108865013 A CN108865013 A CN 108865013A CN 201810749574 A CN201810749574 A CN 201810749574A CN 108865013 A CN108865013 A CN 108865013A
- Authority
- CN
- China
- Prior art keywords
- parts
- wiring board
- component
- function adhesive
- esd function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/02—Copolymers with acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J155/00—Adhesives based on homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C09J123/00 - C09J153/00
- C09J155/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The present invention provides a kind of preparation method of wiring board ESD function adhesive; the wiring board of preparation is bonded with ESD function adhesive for the insulation of electronic component in the circuit board; it is contacted with the input and output pin of electronic component; it is in parallel with electronic component internal circuit on circuit; ESD function adhesive is in high resistant state of insulation; when electronic component overvoltage condition, electronic component is protected in the conducting of ESD function adhesive seepage flow.Present invention process is simple, low in cost, can effectively save wiring board area, reduces manufacturing cost and process cycle, can promote device circuit reliability.
Description
Technical field
The invention belongs to electronic materials and adhesive area, are related to a kind of preparation side of wiring board ESD function adhesive
Method.
Background technique
Static discharge (ESD) problem is the important harm that each electronic product faces, ESD protection element with protected first device
Part is in parallel, itself is in high resistant state of value, works normally component without influence, when generating transient high voltages, ESD protection member
Part rapidly goes to low-resistance conducting, realizes protective effect.Electronic component just develops towards multi-functional, miniaturization, flexibility direction, specially
Need to tie up the valuable area on wiring board with anti-static elements, in addition the factors such as the welding of discrete component, route design also can
Increase the manufacturing cost of integral device.It insulate in the circuit board convered structure using the medium of ESD defencive function as electronic component, it can
Effectively to save wiring board area, manufacturing cost is reduced, device circuit reliability can be promoted.The adhesive solidification time is often direct
Influence time and the reliability of SMT process flow, the present invention, which develops, a kind of can quickly consolidate for being conductively connected with overcurrent protection
Change PESD adhesive.
Summary of the invention
For prior art defect, the purpose of the present invention is to provide a kind of preparations of ESD function adhesive of wiring board
Method, which is characterized in that include the following steps：
(1) antimonic salt and pink salt are dissolved in n,N-Dimethylformamide, alkali is added, stirs evenly, solution is moved into band
Have in the hydrothermal reaction kettle of polytetrafluoroethylliner liner, tighten sealing, is put into 150~200 DEG C of constant temperature ovens and stands reaction 8~12
Hour；Filtering precipitating after reaction is cleaned with deionized water repeatedly until pH value 7~8；It is precipitated or is filtered using centrifuge and set
Standby be filtered isolates sediment, is put into calcining in 500~700 DEG C of Muffle furnace and obtains ATO powder, powder is distributed to third
In olefin(e) acid butyl ester, powder and butyl acetate mass ratio 1: 3~1: 5；
(2) step (1) butyl acrylate dispersion liquid is divided into two parts, is separately added into functional component for preparing adhesive
Component A and B component,
Each weight ratio of constituents of component A is：
100 parts of butyl acrylate dispersion liquid
10-20 parts of methacrylic acid
20-30 parts of ABS
3-8 parts of isopropyl benzene hydroperoxide
0.1-0.5 parts of hydroquinone
Each weight ratio of constituents of B component is：
100 parts of butyl acrylate dispersion liquid
10-20 parts of methacrylic acid
10-15 parts of nitrile rubber
1-5 parts of thiocarbamide
0.1-0.5 parts of hydroquinone
(3) two kinds of components of A, B are mixed in equal volume, at room temperature solidification bonding.
The antimonic salt includes one of antimony trichloride, potassium antimony tartrate or combinations thereof, in n,N-Dimethylformamide
Concentration be 0.01~0.03mol/L；Pink salt includes stannous chloride, stannous sulfate, one of tin tetrachloride or combinations thereof,
Concentration in n,N-Dimethylformamide is 0.1~0.2mol/L.
The alkali includes one of sodium hydroxide, potassium hydroxide or combinations thereof, and alkali concentration is 0.1mol/L~0.5mol/
L。
The wiring board of preparation is bonded with ESD function adhesive for the insulation of electronic component in the circuit board, with electronics member
The input and output pin of part has a contact, in parallel with electronic component internal circuit on circuit, and ESD function adhesive insulate in high resistant
State, when electronic component overvoltage condition, electronic component is protected in the conducting of ESD function adhesive seepage flow.
Present invention process is simple, low in cost, can effectively save wiring board area, reduces manufacturing cost and technique week
Phase can promote device circuit reliability.
The contents of the present invention and feature have revealed that as above, however the present invention that describes of front only briefly or pertains only to this
The specific part of invention, feature of the invention may be more than what content disclosed herein was related to.Therefore, protection model of the invention
The revealed content of embodiment should be not limited to by enclosing, and should include the combination of all the elements embodied in different piece, with
And it is various without departing substantially from replacement and modification of the invention, and covered by claims of the present invention.
Specific embodiment
Embodiment 1：
(1) 0.01mol/L antimony trichloride and 0.1mol/L stannous chloride are dissolved in n,N-Dimethylformamide, are added
0.1mol/L mol/L sodium hydroxide, stirs evenly, and solution is moved into the hydrothermal reaction kettle with polytetrafluoroethylliner liner, is twisted
Close envelope, is put into 150 DEG C of constant temperature ovens and stands reaction 12 hours；Filtering precipitating after reaction, it is repeatedly clear with deionized water
It washes until pH value 7~8；It is filtered using centrifuge precipitating or pumping and filtering device and isolates sediment, be put into 500 DEG C of Muffle furnace
Middle calcining obtains ATO powder, powder is distributed in butyl acrylate, powder and butyl acetate mass ratio 1: 3；
(2) step (1) butyl acrylate dispersion liquid is divided into two parts, is separately added into functional component for preparing adhesive
Component A and B component,
Each weight ratio of constituents of component A is：
100 parts of butyl acrylate dispersion liquid
20 parts of methacrylic acid
30 parts of ABS
8 parts of isopropyl benzene hydroperoxide
0.5 part of hydroquinone
Each weight ratio of constituents of B component is：
100 parts of butyl acrylate dispersion liquid
20 parts of methacrylic acid
15 parts of nitrile rubber
5 parts of thiocarbamide
0.5 part of hydroquinone
(3) two kinds of components of A, B are mixed in equal volume, at room temperature solidification bonding, adhesive tensile strength：45Mpa, ESD
IEC6100-4-2 can be reached.
Embodiment 2：
(1) 0.03mol/L antimony trichloride and 0.2mol/L stannous sulfate are dissolved in n,N-Dimethylformamide, are added
0.5mol/L sodium hydroxide, stirs evenly, and solution is moved into the hydrothermal reaction kettle with polytetrafluoroethylliner liner, is tightened close
Envelope is put into 200 DEG C of constant temperature ovens and stands reaction 8 hours；After reaction filtering precipitating, clean repeatedly with deionized water up to
PH value 7~8；It is filtered using centrifuge precipitating or pumping and filtering device and isolates sediment, be put into 700 DEG C of Muffle furnace and calcine
ATO powder is obtained, powder is distributed in butyl acrylate, powder and butyl acetate mass ratio 1: 5；
(2) step (1) butyl acrylate dispersion liquid is divided into two parts, is separately added into functional component for preparing adhesive
Component A and B component,
Each weight ratio of constituents of component A is：
100 parts of butyl acrylate dispersion liquid
10 parts of methacrylic acid
20 parts of ABS
3 parts of isopropyl benzene hydroperoxide
0.1 part of hydroquinone
Each weight ratio of constituents of B component is：
100 parts of butyl acrylate dispersion liquid
10 parts of methacrylic acid
10 parts of nitrile rubber
1 part of thiocarbamide
0.1 part of hydroquinone
(3) two kinds of components of A, B are mixed in equal volume, at room temperature solidification bonding, adhesive tensile strength：42Mpa, ESD
IEC6100-4-2 can be reached.
Embodiment 3：
(1) 0.02mol/L potassium antimony tartrate and 0.1mol/L tin tetrachloride are dissolved in n,N-Dimethylformamide, are added
Enter 0.4mol/L potassium hydroxide, stir evenly, solution is moved into the hydrothermal reaction kettle with polytetrafluoroethylliner liner, is tightened close
Envelope is put into 180 DEG C of constant temperature ovens and stands reaction 10 hours；Filtering precipitating after reaction is cleaned straight repeatedly with deionized water
To pH value 7~8；It is filtered using centrifuge precipitating or pumping and filtering device and isolates sediment, be put into 600 DEG C of Muffle furnace and forge
Burning obtains ATO powder, and powder is distributed in butyl acrylate, powder and butyl acetate mass ratio 1: 4；
(2) step (1) butyl acrylate dispersion liquid is divided into two parts, is separately added into functional component for preparing adhesive
Component A and B component,
Each weight ratio of constituents of component A is：
100 parts of butyl acrylate dispersion liquid
15 parts of methacrylic acid
24 parts of ABS
5 parts of isopropyl benzene hydroperoxide
0.2 part of hydroquinone
Each weight ratio of constituents of B component is：
100 parts of butyl acrylate dispersion liquid
15 parts of methacrylic acid
12 parts of nitrile rubber
2 parts of thiocarbamide
0.4 part of hydroquinone
(3) two kinds of components of A, B are mixed in equal volume, at room temperature solidification bonding, adhesive tensile strength：44Mpa, ESD
IEC6100-4-2 can be reached.
Embodiment 4：
(1) 0.02mol/L potassium antimony tartrate and 0.2mol/L stannous sulfate are dissolved in n,N-Dimethylformamide, are added
Enter 0.3mol/L potassium hydroxide, stir evenly, solution is moved into the hydrothermal reaction kettle with polytetrafluoroethylliner liner, is tightened close
Envelope is put into 16 DEG C of constant temperature ovens and stands reaction 12 hours；After reaction filtering precipitating, clean repeatedly with deionized water up to
PH value 7~8；It is filtered using centrifuge precipitating or pumping and filtering device and isolates sediment, be put into 700 DEG C of Muffle furnace and calcine
ATO powder is obtained, powder is distributed in butyl acrylate, powder and butyl acetate mass ratio 1: 4；
(2) step (1) butyl acrylate dispersion liquid is divided into two parts, is separately added into functional component for preparing adhesive
Component A and B component,
Each weight ratio of constituents of component A is：
100 parts of butyl acrylate dispersion liquid
12 parts of methacrylic acid
25 parts of ABS
6 parts of isopropyl benzene hydroperoxide
0.2 part of hydroquinone
Each weight ratio of constituents of B component is：
100 parts of butyl acrylate dispersion liquid
12 parts of methacrylic acid
12 parts of nitrile rubber
3 parts of thiocarbamide
0.4 part of hydroquinone
(3) two kinds of components of A, B are mixed in equal volume, at room temperature solidification bonding, adhesive tensile strength：45Mpa, ESD
IEC6100-4-2 can be reached.
Claims (4)
1. a kind of wiring board preparation method of ESD function adhesive, which is characterized in that include the following steps：
(1) antimonic salt and pink salt are dissolved in n,N-Dimethylformamide, alkali is added, stirs evenly, solution is moved into poly-
In the hydrothermal reaction kettle of tetrafluoroethene liner, sealing is tightened, it is small to be put into standing reaction 8~12 in 150~200 DEG C of constant temperature ovens
When；Filtering precipitating after reaction is cleaned with deionized water repeatedly until pH value 7~8；Using centrifuge precipitating or pumping and filtering device
It is filtered and isolates sediment, be put into calcining in 500~700 DEG C of Muffle furnace and obtain ATO powder, powder is distributed to propylene
In acid butyl ester, powder and butyl acetate mass ratio 1: 3~1: 5；
(2) step (1) butyl acrylate dispersion liquid is divided into two parts, be separately added into functional component for match preparing adhesive A
Component and B component,
Each weight ratio of constituents of component A is：
100 parts of butyl acrylate dispersion liquid
10-20 parts of methacrylic acid
20-30 parts of ABS
3-8 parts of isopropyl benzene hydroperoxide
0.1-0.5 parts of hydroquinone
Each weight ratio of constituents of B component is：
100 parts of butyl acrylate dispersion liquid
10-20 parts of methacrylic acid
10-15 parts of nitrile rubber
1-5 parts of thiocarbamide
0.1-0.5 parts of hydroquinone
(3) two kinds of components of A, B are mixed in equal volume, at room temperature solidification bonding.
2. the preparation method of a kind of wiring board ESD function adhesive according to claim 1, which is characterized in that the antimony
Salt includes one of antimony trichloride, potassium antimony tartrate or combinations thereof, and the concentration in n,N-Dimethylformamide is 0.01~
0.03mol/L；Pink salt includes stannous chloride, stannous sulfate, one of tin tetrachloride or combinations thereof, in N, N- dimethyl formyl
Concentration in amine is 0.1~0.2mol/L.
3. the preparation method of a kind of wiring board ESD function adhesive according to claim 1, which is characterized in that the alkali
Including one of sodium hydroxide, potassium hydroxide or combinations thereof, alkali concentration is 0.1mol/L~0.5mol/L.
4. prepared by a kind of preparation method of wiring board as described in claims 1 to 3 any one with ESD function adhesive
Wiring board ESD function adhesive, for the insulation bonding of electronic component in the circuit board, the input and output with electronic component are drawn
Foot has a contact, in parallel with electronic component internal circuit on circuit, and ESD function adhesive is in high resistant state of insulation, when electronics member
When part overvoltage condition, electronic component is protected in the conducting of ESD function adhesive seepage flow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810749574.7A CN108865013A (en) | 2018-07-02 | 2018-07-02 | A kind of preparation method of wiring board ESD function adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810749574.7A CN108865013A (en) | 2018-07-02 | 2018-07-02 | A kind of preparation method of wiring board ESD function adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108865013A true CN108865013A (en) | 2018-11-23 |
Family
ID=64300448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810749574.7A Withdrawn CN108865013A (en) | 2018-07-02 | 2018-07-02 | A kind of preparation method of wiring board ESD function adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108865013A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100803782B1 (en) * | 2006-09-28 | 2008-02-15 | 율촌화학 주식회사 | Surface protective film |
| CN101428848A (en) * | 2008-12-09 | 2009-05-13 | 南昌航空大学 | Process for producing tin-stibium oxide ultra-fine nano-powder |
| CN105950031A (en) * | 2016-06-28 | 2016-09-21 | 哈尔滨永淇化工有限公司 | Sealant for storage battery |
-
2018
- 2018-07-02 CN CN201810749574.7A patent/CN108865013A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100803782B1 (en) * | 2006-09-28 | 2008-02-15 | 율촌화학 주식회사 | Surface protective film |
| CN101428848A (en) * | 2008-12-09 | 2009-05-13 | 南昌航空大学 | Process for producing tin-stibium oxide ultra-fine nano-powder |
| CN105950031A (en) * | 2016-06-28 | 2016-09-21 | 哈尔滨永淇化工有限公司 | Sealant for storage battery |
Non-Patent Citations (1)
| Title |
|---|
| 王文广: "《聚合物改性原理》", 31 March 2018, 中国轻工业出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6768281B2 (en) | Adhesive sheet joint separation method | |
| JPH0429607B2 (en) | ||
| CN107287456A (en) | A kind of extracting process of separating-purifying heavy rare earth | |
| CN108865013A (en) | A kind of preparation method of wiring board ESD function adhesive | |
| CN104293253A (en) | Anti-static optical adhesive | |
| CN101934440B (en) | Soldering flux | |
| CN108461459A (en) | A kind of cathode docking biphase rectification diode and its manufacturing process | |
| CN111801394A (en) | Electrically peelable pressure-sensitive adhesive sheet, joined body, and method for peeling joined body | |
| CN104125712A (en) | Circuit board interconnection structure and circuit board interconnection method | |
| CN104023904A (en) | Solder paste | |
| CN108893065A (en) | A kind of preparation method of ESD function hot melt adhesive | |
| CN207127222U (en) | A kind of Locating Type aluminium liquid output device | |
| CN111748414A (en) | Cleaning method for semiconductor device after gold-tin soldering | |
| CN104266149A (en) | LED lamp bulb and lamp holder connecting process | |
| CN104439754A (en) | Environment-friendly and pollution-free aluminum product brazing wire and manufacturing process thereof | |
| CN104467728B (en) | A kind of crystal oscillator earthing method and crystal oscillator | |
| CN108950250B (en) | Method for recovering rare earth in neodymium iron boron waste acid-soluble slag | |
| CN104393558A (en) | Thick film low power consumption counter-attack under-voltage protection module | |
| CN106607650A (en) | Rare earth cerium solder alloy soldering paste | |
| CN206711397U (en) | A kind of intelligent traffic signal LED display | |
| CN207068445U (en) | A kind of TFT liquid crystal display screen drive boards | |
| CN105357899A (en) | Double-face welding method preventing big chip from falling off | |
| CN106866358A (en) | Lightness-removing column tower top hexafluoropropene recovery method and device in hexafluoropropene process units | |
| CN109054699A (en) | A kind of synthesis technology of PESD function water-base cement | |
| CN104853531A (en) | Automatic circuit board mounting process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181123 |