CN108864378A - UV (ultraviolet) photocuring photosensitive material for rapid prototyping industrial equipment of DIL (digital laser sintering) - Google Patents

UV (ultraviolet) photocuring photosensitive material for rapid prototyping industrial equipment of DIL (digital laser sintering) Download PDF

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Publication number
CN108864378A
CN108864378A CN201810774762.5A CN201810774762A CN108864378A CN 108864378 A CN108864378 A CN 108864378A CN 201810774762 A CN201810774762 A CN 201810774762A CN 108864378 A CN108864378 A CN 108864378A
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China
Prior art keywords
sensitive material
commercial scale
rapid shaping
scale plant
parts
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CN201810774762.5A
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Chinese (zh)
Inventor
欧龙生
钟海英
邹名超
欧晓明
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Heyuan Ransheng New Material Co ltd
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Heyuan Ransheng New Material Co ltd
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Priority to CN201810774762.5A priority Critical patent/CN108864378A/en
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
    • C08F283/065Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to unsaturated polyethers, polyoxymethylenes or polyacetals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00Materials specially adapted for additive manufacturing
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/01Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to unsaturated polyesters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C08F283/105Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule on to unsaturated polymers containing more than one epoxy radical per molecule

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

The invention discloses a UV light-cured photosensitive material for DLP rapid prototyping industrial equipment. The UV light-cured photosensitive material comprises the following components in parts by weight: 10-30 parts of acrylic resin, 60-80 parts of a reactive diluent, 5-20 parts of a toughening agent, 1-5 parts of a photoinitiator and 1-5 parts of an auxiliary agent. The UV light-cured photosensitive material disclosed by the invention is high in curing speed and high in product storage stability, a printed three-dimensional model is difficult to deform, the environment-friendly performance and chemical resistance are excellent, the UV light-cured photosensitive material is applicable to the DLP rapid prototyping industrial equipment, and the 3D printing requirements of the equipment are completely met.

Description

A kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant
Technical field
The invention belongs to light-sensitive material technical fields, and in particular to a kind of UV for DLP rapid shaping commercial scale plant Photocuring light-sensitive material.
Background technique
The maximum feature of DLP rapid shaping desktop grade equipment be it is small-sized and easy to operate, be chiefly used in business, office, scientific research and The environment such as personal work room.The volume of DLP rapid shaping commercial scale plant is big, can print bigger threedimensional model, and DLP is quick After the completion of one layer of commercial scale plant solidification of molding, workbench moves down the distance of a thickness, then in the resin being originally cured Surface applies one layer of new liquid resin again, until obtaining three-dimensional entity model.This method shaping speed is fast, the degree of automation Height, dimensional accuracy is high, plastic arbitrarily complicated shape, is mainly used in complicated, high-precision delicate workpieces rapid shaping, can pole The earth improves the speed of 3D printing rapid shaping and production and design cost is effectively reduced.Light-sensitive material is that influence DLP is quick Form one of the key factor of commercial scale plant 3D printing, the good fast printing matter for directly determining threedimensional model of light-sensitive material Amount.And photosensitive resin used in traditional desktop grade printing device and SLA photosensitive resin curing rate are slow, product storage stability Difference is easily deformed in the printing of large-scale three dimensional model, is not able to satisfy the requirement of DLP rapid shaping commercial scale plant.
Summary of the invention
For slow, the product poor storage stability that solves existing photosensitive resin curing rate, in the printing of large-scale three dimensional model The problems such as being easily deformed, the present invention provide a kind of UV photocuring light-sensitive material that can be suitably used for DLP rapid shaping commercial scale plant.
The purpose of the present invention will be realized by following technical method:A kind of UV for DLP rapid shaping commercial scale plant Photocuring light-sensitive material, including acrylic resin, reactive diluent, toughener, photoinitiator and auxiliary agent, the weight of each component Part is as follows:
Preferably, a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant, the propylene Acid resin includes silicon-modified polyether acrylate, hyperbranched polyester acrylic ester, at least one in modified epoxy acrylic ester Kind.
Preferably, a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant, the activity Diluent include tripropylene glycol diacrylate, polyethylene glycol (600) diacrylate, triethylene glycol dimethacrylate, Ethoxylated bisphenol A diacrylate, trimethylolpropane trimethacrylate, the third oxidation trimethylolpropane trimethacrylate, uncle At least one of amine acrylate.
Preferably, a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant, the toughening Agent is organic-silicon hybridization object.
Preferably, a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant, the light draw Hair agent is free radical photo-initiation, and free radical photo-initiation includes 2,4,6- trimethylbenzoy-dipheny phosphine oxides, phenyl In bis- (2,4,6- trimethylbenzoyl) phosphine oxides, 2- methyl-1-(4- methyl mercapto phenyl)-2- morpholinyl-1- acetone extremely Few one kind.
Preferably, a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant, the auxiliary agent At least one of object, defoaming agent, polymerization inhibitor are pre-dissolved including mill base, CAB.
Preferably, a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant, the mill base It is 0.5-3 parts, the partial size of mill base is less than 5 μm, and mill base is made of titanium dioxide, polyether acrylate and fumed silica, polyethers Acrylate includes hyperbranched polyester acrylic ester and silicon-modified polyether acrylate.
Preferably, a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant, the CAB Being pre-dissolved object is 2-3 parts, and CAB is pre-dissolved object by mass ratio 1:2 acetylbutyrylcellulose and polyol ester composition, polyol ester include One of polyethylene glycol (600) diacrylate, triethylene glycol dimethacrylate and tripropylene glycol diacrylate.
Preferably, a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant, the defoaming Agent is 0.05-0.5 parts, and defoaming agent is polyoxyethylene polyoxypropylene glycerin ether or BYK1790 defoaming agent.
Preferably, a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant, the polymerization inhibitor Agent is 0.05-0.1 parts, and polymerization inhibitor is methyl hydroquinone or 2,5- di-tert-butyl hydroquinone.
Compared with prior art, the present invention has following beneficial effect:UV photocuring light-sensitive material of the invention is not only Curing rate is fast, and product storage stability is good, and the threedimensional model printed is unlikely to deform, and resistance to ring surveys performance and endurance can be excellent It is different, it is suitable for DLP rapid shaping commercial scale plant, has fully met the 3D printing requirement of the equipment.
Specific embodiment
For a better understanding of the invention, further specific elaboration is made to the present invention below by following embodiment, but not It can be regarded as limitation of the invention, it is some nonessential according to made by foregoing invention content for those skilled in the art It improves and adjusts, be also considered as and be within the scope of the present invention.
Embodiment 1
A kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant, including acrylic resin, activity Diluent, toughener, photoinitiator and auxiliary agent, parts by weight are as shown in the table:
Raw material Parts by weight
Acrylic resin 15
Reactive diluent 70
Toughener 10
Photoinitiator 5
Auxiliary agent 2.65
The acrylic resin is silicon-modified polyether acrylate, by the polyether acrylate that organic-silicon hybridization is added Improve the endurance energy of light-sensitive material.
The reactive diluent is tripropylene glycol diacrylate, the third oxidation trimethylolpropane trimethacrylate and tertiary amine The mixture of acrylate three, tripropylene glycol diacrylate in mixture, the third oxidation trimethylolpropane trimethacrylate, The mass ratio of tertiary amine acrylate is 3:3:1.
The toughener is organic-silicon hybridization object.
The photoinitiator is 2,4,6- trimethylbenzoy-dipheny phosphine oxides, by selecting different free radicals Photoinitiator meets the demand of light sources with different wavelengths.
The auxiliary agent is pre-dissolved object, 0.05 part of defoaming agent and 0.1 part of polymerization inhibitor by 0.5 part of mill base, 2 parts of CAB and forms.
The partial size of the mill base is less than 5 μm, and mill base is by titanium dioxide, silicon-modified polyether acrylate and fumed silica group At the mass ratio of titanium dioxide, silicon-modified polyether acrylate and fumed silica is 1:2:0.12, mill base is by by titanium white Powder, silicon-modified polyether acrylate and fumed silica are added separately to dispersion machine, and partial size is ground to after being uniformly dispersed less than 5 μm.
It is 1 that the CAB, which is pre-dissolved object by mass ratio,:2 acetylbutyrylcellulose (U.S. CAB Yi Shiman 551-0.01) and three Propylene glycol diacrylate composition.
The defoaming agent is polyoxyethylene polyoxypropylene glycerin ether.
The polymerization inhibitor is 2,5 di tert butyl hydroquinone.
Each raw material component is weighed according to above-mentioned parts by weight, and is joined it into dispersion machine, in 50~60 DEG C of conditions Lower stirring 30~40 minutes to being uniformly dispersed.
Embodiment 2
A kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant, including acrylic resin, activity Diluent, toughener, photoinitiator and auxiliary agent, parts by weight are as shown in the table:
Raw material Parts by weight
Acrylic resin 10
Reactive diluent 80
Toughener 5
Photoinitiator 4
Auxiliary agent 3.95
The acrylic resin is hyperbranched polyester acrylic ester.
The reactive diluent is the mixing of triethylene glycol dimethacrylate and ethoxylated bisphenol A diacrylate Object, the mass ratio of triethylene glycol dimethacrylate and ethoxylated bisphenol A diacrylate is 1 in mixture:1.
The toughener is organic-silicon hybridization object.
The photoinitiator is 3 by mass ratio:1 2,4,6- trimethylbenzoy-dipheny phosphine oxide and 2- methyl- 1- (4- methyl mercapto phenyl) -2- morpholinyl -1- acetone composition.
The auxiliary agent is pre-dissolved object, 0.1 part of defoaming agent and 0.05 part of polymerization inhibitor including 0.8 part of mill base, 3 parts of CAB.
The partial size of the mill base is less than 5 μm, and mill base is by titanium dioxide, hyperbranched polyester acrylic ester and fumed silica group At the mass ratio of titanium dioxide, hyperbranched polyester acrylic ester and fumed silica is 1:2:0.12, mill base is by by titanium white Powder, hyperbranched polyester acrylic ester and fumed silica are added separately to dispersion machine, and partial size is ground to after being uniformly dispersed less than 5 μm.
It is 1 that the CAB, which is pre-dissolved object by mass ratio,:2 acetylbutyrylcellulose (U.S. CAB Yi Shiman 381-0.1) and three Ethylene glycol dimethacrylate composition.
The defoaming agent is polyoxyethylene polyoxypropylene glycerin ether.
The polymerization inhibitor is methyl hydroquinone.
Each raw material component is weighed according to above-mentioned parts by weight, and is joined it into dispersion machine, in 50~60 DEG C of conditions Lower stirring 30~40 minutes to being uniformly dispersed.
Embodiment 3
A kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant, including acrylic resin, activity Diluent, toughener, photoinitiator and auxiliary agent, parts by weight are as shown in the table:
Raw material Parts by weight
Acrylic resin 20
Reactive diluent 60
Toughener 15
Photoinitiator 3.5
Auxiliary agent 4.15
The acrylic resin is modified epoxy acrylic ester.
The reactive diluent is the mixing of polyethylene glycol (600) diacrylate and trimethylolpropane trimethacrylate Object, the mass ratio of polyethylene glycol (600) diacrylate and trimethylolpropane trimethacrylate is 2 in mixture:1.
The toughener is organic-silicon hybridization object.
The photoinitiator is bis- (2,4,6- trimethylbenzoyl) phosphine oxides of phenyl.
The auxiliary agent is pre-dissolved object, 0.1 part of defoaming agent and 0.05 part of polymerization inhibitor including 1 part of mill base, 3 parts of CAB.
The partial size of the mill base is less than 5 μm, and mill base is by titanium dioxide, hyperbranched polyester acrylic ester and fumed silica group At the mass ratio of titanium dioxide, hyperbranched polyester acrylic ester and fumed silica is 1:2:0.12, mill base is by by titanium white Powder, hyperbranched polyester acrylic ester and fumed silica are added separately to dispersion machine, and partial size is ground to after being uniformly dispersed less than 5 μm.
It is 1 that the CAB, which is pre-dissolved object by mass ratio,:2 acetylbutyrylcellulose (U.S. CAB Yi Shiman 381-0.1) and poly- Ethylene glycol (600) diacrylate composition.
The defoaming agent is BYK1790 defoaming agent.
The polymerization inhibitor is methyl hydroquinone.
Each raw material component is weighed according to above-mentioned parts by weight, and is joined it into dispersion machine, in 50~60 DEG C of conditions Lower stirring 30~40 minutes to being uniformly dispersed.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.

Claims (10)

1. a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant, it is characterised in that:Including acrylic compounds The parts by weight of resin, reactive diluent, toughener, photoinitiator and auxiliary agent, each component are as follows:
2. a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant according to claim 1, special Sign is:The acrylic resin includes silicon-modified polyether acrylate, hyperbranched polyester acrylic ester, modified epoxy propylene At least one of acid esters.
3. a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant according to claim 1, special Sign is:The reactive diluent includes tripropylene glycol diacrylate, polyethylene glycol (600) diacrylate, triethylene glycol Dimethylacrylate, ethoxylated bisphenol A diacrylate, trimethylolpropane trimethacrylate, the third oxidation trihydroxy methyl third At least one of alkane triacrylate, tertiary amine acrylate.
4. a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant according to claim 1, special Sign is:The toughener is organic-silicon hybridization object.
5. a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant according to claim 1, special Sign is:The photoinitiator is free radical photo-initiation, and free radical photo-initiation includes 2,4,6- trimethylbenzoyls-two Bis- (2,4,6- trimethylbenzoyl) phosphine oxides of phenyl phosphine oxide, phenyl, 2- methyl-1-(4- methyl mercapto phenyl)-2- morpholine At least one of base -1- acetone.
6. a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant according to claim 1, special Sign is:The auxiliary agent includes that mill base, CAB are pre-dissolved at least one of object, defoaming agent, polymerization inhibitor.
7. a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant according to claim 6, special Sign is:The mill base is 0.5-3 parts, and the partial size of mill base is less than 5 μm, and mill base is by titanium dioxide, polyether acrylate and gas phase two Silica composition, polyether acrylate includes hyperbranched polyester acrylic ester and silicon-modified polyether acrylate.
8. a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant according to claim 6, special Sign is:It is 2-3 parts that the CAB, which is pre-dissolved object, and CAB is pre-dissolved object by mass ratio 1:2 acetylbutyrylcellulose and polyol ester group At polyol ester includes polyethylene glycol (600) diacrylate, two propylene of triethylene glycol dimethacrylate and tripropylene glycol One of acid esters.
9. a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant according to claim 6, special Sign is:The defoaming agent is 0.05-0.5 parts, and defoaming agent is that polyoxyethylene polyoxypropylene glycerin ether or BYK1790 are defoamed Agent.
10. a kind of UV photocuring light-sensitive material for DLP rapid shaping commercial scale plant according to claim 6, It is characterized in that:The polymerization inhibitor is 0.05-0.1 parts, and polymerization inhibitor is methyl hydroquinone or 2,5- di-tert-butyl hydroquinone.
CN201810774762.5A 2018-07-16 2018-07-16 UV (ultraviolet) photocuring photosensitive material for rapid prototyping industrial equipment of DIL (digital laser sintering) Pending CN108864378A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109941026A (en) * 2019-04-04 2019-06-28 谭宏伟 A kind of floor surface digital printing archaizing processing technology
CN110204661A (en) * 2019-05-13 2019-09-06 无锡市腰果新材料有限公司 A kind of 3D printing photo-curing material and its underwater curing post-treatment process technique
CN110527030A (en) * 2019-07-31 2019-12-03 映维(苏州)数字科技有限公司 A kind of 3D printing lower shrinkage photosensitive resin and preparation method thereof
CN110903437A (en) * 2019-11-04 2020-03-24 杭州乐一新材料科技有限公司 High-efficiency DLP photosensitive resin with flame retardant property
EP3680263A1 (en) * 2019-01-14 2020-07-15 Basf Se Limonene-based (meth)acrylates for use in 3d printing
CN111471139A (en) * 2020-04-27 2020-07-31 孝感市易生新材料有限公司 Soft photocuring 3D printing resin material and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105622859A (en) * 2016-03-31 2016-06-01 江苏萨恩斯网络科技有限公司 UV-curing resin for visible-light SLA 3D printer and preparation method of UV-curing resin
WO2017029657A1 (en) * 2015-08-14 2017-02-23 Stratasys Ltd. Support material formulation and additive manufacturing processes employing same
CN107868443A (en) * 2017-12-01 2018-04-03 惠州市优恒科三维材料有限公司 A kind of photosensitive resin material of 3D printing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017029657A1 (en) * 2015-08-14 2017-02-23 Stratasys Ltd. Support material formulation and additive manufacturing processes employing same
CN105622859A (en) * 2016-03-31 2016-06-01 江苏萨恩斯网络科技有限公司 UV-curing resin for visible-light SLA 3D printer and preparation method of UV-curing resin
CN107868443A (en) * 2017-12-01 2018-04-03 惠州市优恒科三维材料有限公司 A kind of photosensitive resin material of 3D printing

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3680263A1 (en) * 2019-01-14 2020-07-15 Basf Se Limonene-based (meth)acrylates for use in 3d printing
WO2020148189A1 (en) 2019-01-14 2020-07-23 Basf Se Limonene-based (meth)acrylates for use in 3d printing
CN109941026A (en) * 2019-04-04 2019-06-28 谭宏伟 A kind of floor surface digital printing archaizing processing technology
CN110204661A (en) * 2019-05-13 2019-09-06 无锡市腰果新材料有限公司 A kind of 3D printing photo-curing material and its underwater curing post-treatment process technique
CN110527030A (en) * 2019-07-31 2019-12-03 映维(苏州)数字科技有限公司 A kind of 3D printing lower shrinkage photosensitive resin and preparation method thereof
CN110903437A (en) * 2019-11-04 2020-03-24 杭州乐一新材料科技有限公司 High-efficiency DLP photosensitive resin with flame retardant property
CN111471139A (en) * 2020-04-27 2020-07-31 孝感市易生新材料有限公司 Soft photocuring 3D printing resin material and preparation method thereof

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Application publication date: 20181123