CN108863397A - A kind of technique preparing SiN ceramic with high heat conductivity crucible - Google Patents

A kind of technique preparing SiN ceramic with high heat conductivity crucible Download PDF

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CN108863397A
CN108863397A CN201810768009.5A CN201810768009A CN108863397A CN 108863397 A CN108863397 A CN 108863397A CN 201810768009 A CN201810768009 A CN 201810768009A CN 108863397 A CN108863397 A CN 108863397A
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crucible
heat conductivity
technique
high heat
ceramic
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于利学
邹婉如
王美玲
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Weihai Ring Advanced Ceramics Ltd By Share Ltd
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Weihai Ring Advanced Ceramics Ltd By Share Ltd
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Abstract

The present invention discloses a kind of ceramic crucible technique, belongs to ceramic crucible production technical field, and in particular to a kind of technique for preparing SiN ceramic with high heat conductivity crucible;A kind of technique preparing SiN ceramic with high heat conductivity crucible, including composite powder grinding, crucible form, are surface-treated and are made four steps of ripe base;High-purity prepared by the present invention, highly thermally conductive silicon nitride crucible, it can be repeated several times use, the wasting of resources caused by avoiding silica crucible disposable, and its high temperature resistance is superior, play the role of the bilayer of silica crucible and graphite crucible simultaneously, the oxygen content of silicon single crystal rod can be reduced, conversion efficiency of solar cell is improved, positive effect is played to monocrystalline silicon performance.

Description

A kind of technique preparing SiN ceramic with high heat conductivity crucible
Technical field
The present invention relates to a kind of ceramic crucible techniques, belong to ceramic crucible production technical field, and in particular to a kind of to prepare The technique of SiN ceramic with high heat conductivity crucible.
Background technique
With the development of science and technology and social progress, highly thermally conductive ceramic crucible is as photovoltaic cell industry, ic core The Primary Component in piece silicon wafer field achieves huge research achievement, and monocrystalline silicon is always in occupation of dominant position, and about 80% too Positive energy battery is made by crystalline silicon.Pulling of silicon single crystal has unique crystal orientation and higher purity, and defect is few, the sun obtained Energy cell conversion efficiency is high, averagely can reach 18% or so, is one of the main material of current photovoltaic cell.
Traditional pulling of silicon single crystal is quartz with crucible material, is only capable of after coating treatment disposable, and silica crucible exists Softening need to cooperate graphite crucible while use at use temperature:This mode not only results in waste of resources, and increases cost recovery, together When increase the production cost of monocrystalline silicon, be unfavorable for the promotion of the reduction of monocrystalline silicon oxygen content and the transformation efficiency of battery.It finds New material develops energy-saving crucible, to reduce turning for monocrystalline silicon production cost, the quality for improving monocrystalline silicon piece and battery Change the emphasis that efficiency is research and industrialization concern in industry.
Summary of the invention
To break through existing silicon nitride crucible size and thermal conductivity, it is developed in photovoltaic industry and IC chip field Whole new set of applications, high-purity prepared by the present invention, highly thermally conductive silicon nitride crucible can be repeated several times use, avoid silica crucible one The wasting of resources caused by secondary property use, and its high temperature resistance is superior, while playing the double-deck work of silica crucible and graphite crucible With can reduce the oxygen content of silicon single crystal rod, improve conversion efficiency of solar cell, play positive effect to monocrystalline silicon performance.
The object of the present invention is achieved like this:
A kind of technique preparing SiN ceramic with high heat conductivity crucible, includes the following steps:
S1, composite powder grinding:By 65-80 parts of high-purity a phase silicon nitride powder, 14-18 parts of magnesia and 3-5 parts of adhesive mixing, add Enter 10-18 parts of alcohol and make solvent, slurry is ground by sand mill after being sufficiently mixed, by mist projection granulating, obtains pelletizing.
Further, solids in pulp amount described in S1 is 30%-45%.
Further, grinding meso-position radius described in S1 is 0.5-1.5um.
S2, crucible molding:The pelletizing that will be obtained is formed crucible with cold isostatic compaction equipment.
S3, surface treatment:Crucible biscuit carries out the surface treatment of biscuit, formin embryo after degumming tech.
Ripe base is made in S4:Biscuit in S3 is placed in the crucible of gas pressure sintering furnace, after vacuumizing with 40-50 DEG C/ 15min carries out gas pressure sintering, is filled with nitrogen after heating up for the first time and pressurizes, with 20-30 DEG C/15min after being persistently sintered 2-3 hours Heating rate continue second and heat up, sintering is begun to cool after 1-2 hour, until the completion of ripe base.
Further, first time warming temperature described in S4 is 1200-1300 DEG C.
Further, pressurization pressure described in S4 is 5-6MPa.
Further, it is 1.5-2L/min that nitrogen flow rate in nitrogen procedure is filled with described in S4.
Further, second of warming temperature described in S4 is 1800-1850 DEG C.
Compared with prior art, the present invention having the advantages that:
1, disclosed a kind of technique for preparing SiN ceramic with high heat conductivity crucible according to the present invention has high-purity and highly thermally conductive Rate;
2, prepared SiN ceramic with high heat conductivity crucible according to the present invention, can be repeated as many times and use;
3, prepared SiN ceramic with high heat conductivity crucible according to the present invention, substitutes silica crucible and graphite crucible, greatly mentions High Silicon Wafer product yield, quality and reduction production cost.
Specific embodiment
Embodiment one
A kind of technique preparing SiN ceramic with high heat conductivity crucible, includes the following steps:
S1, composite powder grinding:By 65-80 parts of high-purity a phase silicon nitride powder, 14-18 parts of magnesia and 3-5 parts of adhesive mixing, add Enter 10-18 parts of alcohol and make solvent, slurry is ground by sand mill after being sufficiently mixed, by mist projection granulating, obtains pelletizing;
S2, crucible molding:The pelletizing that will be obtained is formed crucible with cold isostatic compaction equipment;
S3, surface treatment:Crucible biscuit carries out the surface treatment of biscuit, formin embryo after degumming tech;
Ripe base is made in S4:Biscuit in S3 is placed in the crucible of gas pressure sintering furnace, with 50 DEG C/15min progress after vacuumizing Gas pressure sintering is filled with nitrogen after heating up for the first time and pressurizes, and is continued after being persistently sintered 3 hours with the heating rate of 30 DEG C/15min Second of heating, sintering are begun to cool after 2 hours, until ripe base is completed.
Further, solids in pulp amount described in S1 is 30%-45%.
Further, grinding meso-position radius described in S1 is 0.5-1.5um.
Further, first time warming temperature described in S4 is 1200-1300 DEG C.
Further, pressurization pressure described in S4 is 5-6MPa.
Further, it is 1.5-2L/min that nitrogen flow rate in nitrogen procedure is filled with described in S4.
Further, second of warming temperature described in S4 is 1800-1850 DEG C.
Embodiment two:By the method that the specified synthesis meal component of table 1, table 2 and each variable repeat embodiment one, in table 3 List test result;
Embodiment three:By the method that the specified synthesis meal component of table 1, table 2 and each variable repeat embodiment one, listed in table 3 Test result;
Example IV:By the method that the specified synthesis meal component of table 1, table 2 and each variable repeat embodiment one, listed in table 3 Test result;
Embodiment five:By the method that the specified synthesis meal component of table 1, table 2 and each variable repeat embodiment one, listed in table 3 Test result;
Comparative example:By the method that the specified synthesis meal component of table 1, table 2 and each variable repeat embodiment one, survey is listed in table 3 Test result;
Table 1:Composite powder component list
Synthesize meal component Embodiment one Embodiment two Embodiment three Example IV Embodiment five Comparative example
High-purity a phase silicon nitride powder 65 68 70 75 80 60
Magnesia 14 15 16 17 18 10
Adhesive 3 3.5 4 4.5 5 8
Alcohol 10 12 14 16 18 20
Table 2:Each variable component list
Each variable Embodiment one Embodiment two Embodiment three Example IV Embodiment five Comparative example
Solids in pulp amount (%) 30 34 38 42 45 20
It grinds meso-position radius (um) 0.5 0.8 1 1.2 1.5 2
First time warming temperature (DEG C) 1200 1230 1250 1280 1300 1500
It pressurizes pressure (MPa) 5 5.2 5.5 5.8 6 7
Nitrogen flow rate (L/min) 1.5 1.6 1.7 1.8 2 1
Second of warming temperature (DEG C) 1800 1820 1830 1840 1850 1900
Table 3:Performance detection table
Performance Embodiment one Embodiment two Embodiment three Example IV Embodiment five Comparative example
Impurity content (ppm) 100 98 90 85 73 105
Thermal conductivity (W/m.k) 50 58 67 72 86 42
Reuse number 50 53 57 66 72 38
It will be seen that making pottery according to highly thermally conductive silicon nitride made of step described in embodiment one to embodiment five from table 3 Porcelain crucible, compared with comparative example, impurity content, thermal conductivity and reuse number are significantly improved, and in embodiment five The ceramic crucible effect of preparation is best.
It should be understood that above description is to illustrate rather than to be limited.By reading foregoing description, Many embodiments and many applications except provided example all will be apparent for a person skilled in the art. Therefore, the scope of the present invention should not be determined referring to foregoing description, but should be referring to preceding claims and these power Benefit requires the full scope of possessed equivalent to determine.For comprehensive purpose, all articles and with reference to including patent Shen The disclosure that please and announce is all by reference to being incorporated herein.Any of theme disclosed herein is omitted in preceding claims Aspect is not intended to abandon the body matter, also should not be considered as applicant and the theme is not thought of as to disclosed application A part of theme.
The series of detailed descriptions listed above only for the application feasible embodiment specifically Bright, they are not the protection scope to limit the application, all without departing from equivalent implementations made by the application skill spirit Or change should be included within the scope of protection of this application.

Claims (7)

1. a kind of technique for preparing SiN ceramic with high heat conductivity crucible, it is characterised in that:Include the following steps:
S1, composite powder grinding:By 65-80 parts of high-purity a phase silicon nitride powder, 14-18 parts of magnesia and 3-5 parts of adhesive mixing, add Enter 10-18 parts of alcohol and make solvent, slurry is ground by sand mill after being sufficiently mixed, by mist projection granulating, obtains pelletizing;
S2, crucible molding:The pelletizing that will be obtained is formed crucible with cold isostatic compaction equipment;
S3, surface treatment:Crucible biscuit carries out the surface treatment of biscuit, formin embryo after degumming tech;
Ripe base is made in S4:Biscuit in S3 is placed in the crucible of gas pressure sintering furnace, with 40-50 DEG C/15min after vacuumizing Gas pressure sintering is carried out, nitrogen is filled with after heating up for the first time and pressurizes, with the liter of 20-30 DEG C/15min after being persistently sintered 2-3 hours Warm speed continues second and heats up, and sintering is begun to cool after 1-2 hours, until ripe base is completed.
2. a kind of technique for preparing SiN ceramic with high heat conductivity crucible according to claim 1, it is characterised in that:Described in S1 Solids in pulp amount is 30%-45%.
3. a kind of technique for preparing SiN ceramic with high heat conductivity crucible according to claim 1, it is characterised in that:Described in S1 Grinding meso-position radius is 0.5-1.5um.
4. a kind of technique for preparing SiN ceramic with high heat conductivity crucible according to claim 1, it is characterised in that:Described in S4 First time warming temperature is 1200-1300 DEG C.
5. a kind of technique for preparing SiN ceramic with high heat conductivity crucible according to claim 1, it is characterised in that:Described in S4 Pressurization pressure is 5-6MPa.
6. a kind of technique for preparing SiN ceramic with high heat conductivity crucible according to claim 1, it is characterised in that:Described in S4 Being filled with nitrogen flow rate in nitrogen procedure is 1.5-2L/min.
7. a kind of technique for preparing SiN ceramic with high heat conductivity crucible according to claim 1, it is characterised in that:Described in S4 Second of warming temperature is 1800-1850 DEG C.
CN201810768009.5A 2018-07-13 2018-07-13 A kind of technique preparing SiN ceramic with high heat conductivity crucible Pending CN108863397A (en)

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
CN112159236A (en) * 2020-10-19 2021-01-01 江苏贝色新材料有限公司 High-thermal-conductivity silicon nitride ceramic substrate and preparation method thereof
CN115784752A (en) * 2023-01-09 2023-03-14 上海维安电子股份有限公司 Method for preparing high-thermal-conductivity silicon nitride ceramic
CN116589284A (en) * 2023-05-20 2023-08-15 西北工业大学 High-strength high-purity silicon nitride crucible, and preparation method and application thereof

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杨亮亮: "气压烧结氮化硅陶瓷的研究与应用进展", 《陶瓷学报》 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112159236A (en) * 2020-10-19 2021-01-01 江苏贝色新材料有限公司 High-thermal-conductivity silicon nitride ceramic substrate and preparation method thereof
CN115784752A (en) * 2023-01-09 2023-03-14 上海维安电子股份有限公司 Method for preparing high-thermal-conductivity silicon nitride ceramic
CN116589284A (en) * 2023-05-20 2023-08-15 西北工业大学 High-strength high-purity silicon nitride crucible, and preparation method and application thereof

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Application publication date: 20181123