CN108845625A - A kind of casing structure for capableing of fast cooling - Google Patents
A kind of casing structure for capableing of fast cooling Download PDFInfo
- Publication number
- CN108845625A CN108845625A CN201810544505.2A CN201810544505A CN108845625A CN 108845625 A CN108845625 A CN 108845625A CN 201810544505 A CN201810544505 A CN 201810544505A CN 108845625 A CN108845625 A CN 108845625A
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- China
- Prior art keywords
- water
- flowing
- intermediate layer
- refrigeration compressor
- shell body
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses the casing structures that one kind is capable of fast cooling, including chassis shell body and refrigeration compressor, closed loop is formed inside the water route of the refrigeration compressor and chassis shell body, the side of the circuit board is provided with several fans, intermediate layer of water-flowing is provided between the fan and circuit board, the intermediate layer of water-flowing is provided with several through-holes, and the lower end of the intermediate layer of water-flowing and refrigeration compressor send water end (W.E.) to connect, and the upper end of the intermediate layer of water-flowing and the water inlet end of refrigeration compressor connect.The present invention, after water temperature is reduced by refrigeration compressor, intermediate layer of water-flowing is conveyed to by water pump, water circulates from bottom to top in intermediate layer of water-flowing, when cold water enters cabinet inside, can reduce the temperature around intermediate layer of water-flowing, it is dried by fan, cold air around intermediate layer of water-flowing can be blown on circuit board, reduce the temperature of circuit board, it is ensured that circuit board will not high temperature failure.
Description
Technical field
The present invention relates to the casing structures that one kind is capable of fast cooling, belong to cabinet technical field.
Background technique
Inventor retrieves discovery Patent No. 201620085637.X, and patent name is water cooling computer housing, and the patent is public
The cold computer housing of boiled water, including frame and mounting plate, frame are formed by connecting by the more water pipes with hollow cavity and easy heat radiation,
The inner cavity of each water pipe, which is interconnected, forms closure pipeline, is equipped in frame for the radiator liquid of radiating subassembly to be transported to closure
The liquid feeding device of pipeline.When electronic component operational heat makes the radiator liquid of radiating subassembly heat up, liquid feeding device will radiate
Liquid is transported to closure pipeline, and the radiator liquid in frame water pipe inner cavity is driven to circulate in closure pipeline, dissipates at this time
The heat of hot liquid will be constantly dispersed into the external world from the side wall of water pipe, in this way, realizing water cooling computer housing by internal heat
The purpose distributed, compared to more existing cabinet by the way of fan cooling for, above-mentioned water cooling computer housing utilizes heat dissipation
The mode that constantly flows and take away heat of the liquid in frame water pipe avoids causing due to chassis intake because of dust blocking
The problem of poor heat radiation.Although the patent is open to use water cooling, the arrangement in water route and not close to circuit board, and not
It is open to be furnished with dedicated refrigerating plant, so that applying, it is difficult really to realize the effect of cooling cabinet, especially in sweltering heat
In environment, water is difficult directly to reduce temperature.
Inventor retrieves discovery Patent No. 201610520356.7, and patent name is intelligent water-cooled cabinet, and the patent is public
Intelligent water-cooled cabinet, including shell, display screen, water cooled pipeline and cooling chamber have been opened, the display is installed before the shell
Key is provided below in screen, the display screen, and refrigerant addition tank is provided below in the key, and the refrigerant adds under tank
Face is equipped with automatic valve, and the automatic valve is provided below return water storehouse, is equipped with intelligent thermometer inside the return water storehouse,
The bottom in the return water storehouse is provided with automatically-controlled door, and the side of the automatically-controlled door is provided with water storage, installation inside the water storage
There is level switch, water pump is installed on the inside of the water storage, the water cooled pipeline, the water cooling are connected on the water pump
Installation is equipped with temperature sensor above the cooling chamber there are two the cooling chamber on pipeline.Beneficial effect is：Without even
Water pipe and outlet pipe are tapped into, by setting CPU and the temperature upper limit of radiator, automatic cooling can be realized, intelligence degree is high.
The patent needs intelligent control, at high cost, is not easy to promote, and when actually executing, there are inconveniences in the difficult point of realization, and portion
Part is easily damaged, and replacement trouble after damage, is found, it is easy to cabinet inside parts damages are caused, to high accurancy and precision not in time
Circuit board causes to damage.
Summary of the invention
To solve the above problems, specific the invention discloses the casing structure that one kind is capable of fast cooling
Technical solution is as follows：
A kind of casing structure for capableing of fast cooling, including chassis shell body, the chassis shell body can at least dismantle on one side or
Person's Unscrew, the chassis shell body surface offer air hole, several circuit boards, circuit are provided in the chassis shell body
Plate surface is connected with several circuit modules, further includes refrigeration compressor, in the water route and chassis shell body of the refrigeration compressor
Portion forms closed loop,
The cooling water outlet end of the refrigeration compressor is to send water end (W.E.), the water inlet end of refrigeration compressor with inside chassis shell body
Water pipe is connected；
The side of the circuit board is provided with several fans, and intermediate layer of water-flowing is provided between the fan and circuit board, described
Intermediate layer of water-flowing is provided with several through-holes, and the lower end of the intermediate layer of water-flowing and refrigeration compressor send water end (W.E.) to connect, described logical
The upper end of water interlayer and the water inlet end of refrigeration compressor connect；
Several outlet pipes are provided at the top of the intermediate layer of water-flowing, several outlet pipes are aggregated into a total outlet pipe, always go out
Water pipe is connected to the water inlet end of refrigeration compressor, and the bottom end of intermediate layer of water-flowing is provided with several water inlet pipes, several water inlet manifolds
Piece water inlet manifold of assembly, what water inlet manifold was connected to refrigeration compressor send water end (W.E.).
The intermediate layer of water-flowing is fixed in chassis shell body vertically, the surrounding of the intermediate layer of water-flowing and the chassis shell of corresponding position
Internal wall is fixed.
Water pump is provided in the water inlet manifold, the water pump pumps water towards intermediate layer of water-flowing.
The fan is vertically distributed in a vertical plane of chassis shell body.
The two sides of the circuit board is provided with intermediate layer of water-flowing, and intermediate layer of water-flowing side is provided with what several were vertically distributed
Fan, intermediate layer of water-flowing between fan and circuit board, dry towards intermediate layer of water-flowing by the fan.
The beneficial effects of the invention are as follows：
The present invention after reducing water temperature by refrigeration compressor, is conveyed to intermediate layer of water-flowing by water pump, water in intermediate layer of water-flowing from
Lower circulation upwards, when cold water enters cabinet inside, can reduce the temperature around intermediate layer of water-flowing, is dried by fan, can
Cold air around intermediate layer of water-flowing is blown on circuit board, the temperature of circuit board is reduced, it is ensured that circuit board will not high temperature failure.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention,
Fig. 2 is the A-A of Fig. 1 to section view,
Fig. 3 is intermediate layer of water-flowing structural schematic diagram of the present invention,
Reference signs list：1-chassis shell body, 2-circuit boards, 3-intermediate layer of water-flowing, 4-through-holes, 5-fans, 6-refrigeration pressures
Contracting machine, 7-outlet pipes, 8-water inlet pipes.
Specific embodiment
With reference to the accompanying drawings and detailed description, the present invention is furture elucidated.It should be understood that following specific embodiments are only
For illustrating the present invention rather than limiting the scope of the invention.
Fig. 1 is structural schematic diagram of the invention, and Fig. 2 is the A-A of Fig. 1 to section view, and Fig. 3 is intermediate layer of water-flowing knot of the present invention
Structure schematic diagram, label component names are successively in figure：Chassis shell body 1, circuit board 2, intermediate layer of water-flowing 3, through-hole 4, fan 5, refrigeration pressure
Contracting machine 6, outlet pipe 7, water inlet pipe 8.
In conjunction with attached drawing as it can be seen that this one kind is capable of the casing structure of fast cooling, including chassis shell body, the chassis shell body is extremely
Rare one side can dismantle or Unscrew, and the chassis shell body surface offers air hole, setting in the chassis shell body
There are several circuit boards, it further includes refrigeration compressor that circuit board surface, which is connected with several circuit modules, the refrigeration compressor
Water route and chassis shell body inside formed closed loop.Water is freezed by refrigeration compressor, then, is transported to machine by the present invention
In tank shell, the intracorporal temperature of chassis shell is reduced.
The cooling water outlet end of the refrigeration compressor is to send water end (W.E.), the water inlet end of refrigeration compressor in chassis shell body
The water pipe in portion is connected.Cold water after refrigerant compression mechanism cold is conveyed to cabinet inside, uses for cooling, comes out from cabinet
Water, then be transported in refrigeration compressor, for freezing again, form circulation.
The side of the circuit board is provided with several fans, is provided with intermediate layer of water-flowing between the fan and circuit board,
The intermediate layer of water-flowing is provided with several through-holes, and the lower end of the intermediate layer of water-flowing and refrigeration compressor send water end (W.E.) to connect, institute
The water inlet end of the upper end and refrigeration compressor of stating intermediate layer of water-flowing connects.Fan is dried towards intermediate layer of water-flowing, and wind is from intermediate layer of water-flowing
It is blown in through-hole, the cold air around intermediate layer of water-flowing is blown on circuit board, reduce circuit board surface temperature, it is ensured that circuit board
Temperature maintains within the scope of safe working temperature.
The intermediate layer of water-flowing is fixed in chassis shell body vertically, the surrounding of the intermediate layer of water-flowing and the chassis shell of corresponding position
Internal wall is fixed.Intermediate layer of water-flowing position in regard to chassis shell body keeps stablizing.
Several outlet pipes are provided at the top of the intermediate layer of water-flowing, several outlet pipes are aggregated into a total outlet pipe,
Total outlet pipe is connected to the water inlet end of refrigeration compressor, and the bottom end of intermediate layer of water-flowing is provided with several water inlet pipes, several water inlets
Piece water inlet manifold of manifold assembly, what water inlet manifold was connected to refrigeration compressor send water end (W.E.).In order to improve the patency of water flow,
In the width direction of intermediate layer of water-flowing, multiple outlet pipes are uniformly provided with, convenient for improving water velocity.
Water pump is provided in the water inlet manifold, the water pump pumps water towards intermediate layer of water-flowing.Water pump controls entire water and follows
Water velocity and direction in loop system.
The fan is vertically distributed in a vertical plane of chassis shell body.The two sides of the circuit board is provided with intermediate layer of water-flowing,
And intermediate layer of water-flowing side is provided with several fans being vertically distributed, intermediate layer of water-flowing is between fan and circuit board, the wind
Fan is evenly distributed on a complete vertical surface of intermediate layer of water-flowing towards intermediate layer of water-flowing fan blowing, dries towards intermediate layer of water-flowing,
Cold air is blown on circuit board.
The technical means disclosed in the embodiments of the present invention is not limited to the technical means disclosed in the above technical means, and further includes
Technical solution consisting of any combination of the above technical features.
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property range is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (5)
1. one kind is capable of the casing structure of fast cooling, including chassis shell body, the chassis shell body can at least be dismantled on one side
Or Unscrew, the chassis shell body surface offer air hole, several circuit boards are provided in the chassis shell body, electricity
Road plate surface is connected with several circuit modules, it is characterised in that and it further include refrigeration compressor, the water route of the refrigeration compressor
Closed loop is formed with chassis shell body inside,
The cooling water outlet end of the refrigeration compressor is to send water end (W.E.), the water inlet end of refrigeration compressor with inside chassis shell body
Water pipe is connected；
The side of the circuit board is provided with several fans, and intermediate layer of water-flowing is provided between the fan and circuit board, described
Intermediate layer of water-flowing is provided with several through-holes, and the lower end of the intermediate layer of water-flowing and refrigeration compressor send water end (W.E.) to connect, described logical
The upper end of water interlayer and the water inlet end of refrigeration compressor connect；
Several outlet pipes are provided at the top of the intermediate layer of water-flowing, several outlet pipes are aggregated into a total outlet pipe, always go out
Water pipe is connected to the water inlet end of refrigeration compressor, and the bottom end of intermediate layer of water-flowing is provided with several water inlet pipes, several water inlet manifolds
Piece water inlet manifold of assembly, what water inlet manifold was connected to refrigeration compressor send water end (W.E.).
2. the casing structure that one kind according to claim 1 is capable of fast cooling, it is characterised in that the intermediate layer of water-flowing is perpendicular
It is directly fixed in chassis shell body, the surrounding of the intermediate layer of water-flowing and the chassis shell body inner wall of corresponding position are fixed.
3. the casing structure that one kind according to claim 2 is capable of fast cooling, it is characterised in that in the water inlet manifold
It is provided with water pump, the water pump pumps water towards intermediate layer of water-flowing.
4. the casing structure that one kind according to claim 1 is capable of fast cooling, it is characterised in that the fan vertically divides
A vertical plane of the cloth in chassis shell body.
5. the casing structure that one kind according to claim 1 is capable of fast cooling, it is characterised in that the two of the circuit board
Face is provided with intermediate layer of water-flowing, and intermediate layer of water-flowing side is provided with several fans being vertically distributed, and intermediate layer of water-flowing is located at fan
Between circuit board, the fan is dried towards intermediate layer of water-flowing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810544505.2A CN108845625A (en) | 2018-05-31 | 2018-05-31 | A kind of casing structure for capableing of fast cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810544505.2A CN108845625A (en) | 2018-05-31 | 2018-05-31 | A kind of casing structure for capableing of fast cooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108845625A true CN108845625A (en) | 2018-11-20 |
Family
ID=64211159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810544505.2A Pending CN108845625A (en) | 2018-05-31 | 2018-05-31 | A kind of casing structure for capableing of fast cooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108845625A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080017355A1 (en) * | 2006-05-16 | 2008-01-24 | Hardcore Computer, Inc. | Case for a liquid submersion cooled electronic device |
| CN102194529A (en) * | 2010-03-19 | 2011-09-21 | 上海微电子装备有限公司 | Patch type heat-radiating device with active cooling |
| CN202771347U (en) * | 2011-12-02 | 2013-03-06 | 潘亚辉 | Liquid cooling radiating device of computer host |
| CN103885557A (en) * | 2014-04-15 | 2014-06-25 | 吴江市赛纳电子科技有限公司 | Self-cooling-type computer case |
| CN205139817U (en) * | 2015-11-18 | 2016-04-06 | 郑州工业应用技术学院 | Liquid cooling machine case |
| CN105739564A (en) * | 2016-02-21 | 2016-07-06 | 洛阳理工学院 | Chassis temperature control system |
| CN106445014A (en) * | 2016-10-18 | 2017-02-22 | 郑州航空工业管理学院 | Cooling device of mathematical computer |
| CN206946409U (en) * | 2017-04-17 | 2018-01-30 | 芜湖昌泰网络科技有限公司 | A kind of ceiling mounting type computer cooling mechanism |
| CN107656587A (en) * | 2017-09-27 | 2018-02-02 | 淄博职业学院 | Computer circulator bath cooling-down type cabinet |
| CN107908239A (en) * | 2017-12-29 | 2018-04-13 | 常州信息职业技术学院 | A kind of Multi-functional computer host box |
-
2018
- 2018-05-31 CN CN201810544505.2A patent/CN108845625A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080017355A1 (en) * | 2006-05-16 | 2008-01-24 | Hardcore Computer, Inc. | Case for a liquid submersion cooled electronic device |
| CN102194529A (en) * | 2010-03-19 | 2011-09-21 | 上海微电子装备有限公司 | Patch type heat-radiating device with active cooling |
| CN202771347U (en) * | 2011-12-02 | 2013-03-06 | 潘亚辉 | Liquid cooling radiating device of computer host |
| CN103885557A (en) * | 2014-04-15 | 2014-06-25 | 吴江市赛纳电子科技有限公司 | Self-cooling-type computer case |
| CN205139817U (en) * | 2015-11-18 | 2016-04-06 | 郑州工业应用技术学院 | Liquid cooling machine case |
| CN105739564A (en) * | 2016-02-21 | 2016-07-06 | 洛阳理工学院 | Chassis temperature control system |
| CN106445014A (en) * | 2016-10-18 | 2017-02-22 | 郑州航空工业管理学院 | Cooling device of mathematical computer |
| CN206946409U (en) * | 2017-04-17 | 2018-01-30 | 芜湖昌泰网络科技有限公司 | A kind of ceiling mounting type computer cooling mechanism |
| CN107656587A (en) * | 2017-09-27 | 2018-02-02 | 淄博职业学院 | Computer circulator bath cooling-down type cabinet |
| CN107908239A (en) * | 2017-12-29 | 2018-04-13 | 常州信息职业技术学院 | A kind of Multi-functional computer host box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181120 |