CN108843988B - LED packaging substrate and LED packaging structure - Google Patents
LED packaging substrate and LED packaging structure Download PDFInfo
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- CN108843988B CN108843988B CN201810561416.9A CN201810561416A CN108843988B CN 108843988 B CN108843988 B CN 108843988B CN 201810561416 A CN201810561416 A CN 201810561416A CN 108843988 B CN108843988 B CN 108843988B
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- buckle
- groove
- fixed
- led
- packaging
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 51
- 239000000758 substrate Substances 0.000 title claims abstract description 35
- 230000006835 compression Effects 0.000 claims abstract description 58
- 238000007906 compression Methods 0.000 claims abstract description 58
- 238000005538 encapsulation Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention discloses an LED packaging substrate and an LED packaging structure, which comprise a fixed base, a transverse buckle, a vertical buckle, a compression spring, a fixed block and a screw hole, wherein the fixed base is fixed at the bottom of a device substrate, a packaging groove is formed in the middle of the inside of the device substrate, the compression spring is arranged in the compression buckle, pressing blocks are fixedly connected to two ends of the compression buckle, the fixed block is fixed on the upper surface of the device substrate, and the screw hole is formed in the upper surface of the fixed base. This LED encapsulation basement and LED packaging structure have set up logical groove and buckle groove in the encapsulation fluting outside, when pressing down and erectting when putting the buckle, can extrude horizontal buckle right to make horizontal buckle block in the through-hole of LED lamp bottom, when pressing the compression snap-fastener simultaneously, through compression spring's effect, thereby make the compression snap-fastener shrink, and then make the compression snap-fastener fix in the fixed block below, thereby extrude horizontal buckle, can encapsulate well between LED bottom and the device basement.
Description
Technical Field
The invention relates to the technical field of LED lighting devices, in particular to an LED packaging substrate and an LED packaging structure.
Background
In recent years, with the rise of energy-saving concepts in the world, general lighting technologies using white LEDs have been developed rapidly, especially in the field of street lamp application for outdoor lighting, and the general application level in the market has far exceeded the light efficiency of common energy-saving lamps, and with the increasingly wide application of white LED technologies in the general lighting market, the requirements on the light-emitting efficiency and the light-emitting quality of white LED devices are also increasing, so that various LED package substrates and LED package structures are present in the market, but the LED package substrates and LED package structures in the market cannot fix LED lamps better when in use, and at the same time, can not package easily, are inconvenient to operate, and cannot meet the requirements in actual work, so there is an urgent need in the market for technologies capable of improving LED package substrates and LED package structures, to complete the apparatus.
Disclosure of Invention
The invention aims to provide an LED packaging substrate and an LED packaging structure, and aims to solve the problems that the existing LED packaging substrate and the existing LED packaging structure in the background art cannot better fix an LED lamp in use, cannot simply package in packaging and are inconvenient to operate.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a LED encapsulation basement and LED packaging structure, includes unable adjustment base, horizontal buckle, erects to put buckle, compression spring, fixed block and screw, unable adjustment base fixes in device basement bottom, and installs the inside intermediate position of basement and seted up the encapsulation fluting, the inside encapsulation fluting outside position that corresponds of device basement has seted up logical groove, and the inside logical groove outside that corresponds of device basement has seted up the buckle groove, horizontal buckle is violently put and is settled in logical groove, and the inside spring that is provided with of horizontal buckle, erect the vertical setting of buckle horizontal buckle top position in the buckle groove, and erect buckle upper end position and be fixed with the compression snap-fastener, compression spring sets up in the compression snap-fastener, and compression snap-fastener both ends position fixedly connected with presses the briquetting, the fixed block is fixed at device basement upper surface, the screw is seted up at unable adjustment base upper surface.
Preferably, the inside of the packaging slot is of a threaded structure, and the size of the packaging slot is consistent with that of the bottom of the LED lamp.
Preferably, the through groove, the buckling groove and the packaging slot are communicated, and the through groove and the buckling groove are symmetrical about a longitudinal central axis of the packaging slot.
Preferably, the buckling groove is communicated with the packaging open groove and the corresponding through groove.
Preferably, the transverse buckle comprises a first clamping block and a second clamping block, the first clamping block and the second clamping block are respectively fixed at two ends of the transverse buckle, and the surface of the first clamping block is of a smooth structure.
Preferably, the bottom of the vertical buckle is of a semicircular structure, and the size of the bottom of the vertical buckle is matched with that of the first clamping block.
Preferably, a telescopic structure is formed between the compression snap fastener and the compression spring, the maximum extension amount of the compression spring is larger than the distance between the 2 fixed blocks, and the minimum extension amount of the compression spring is smaller than the distance between the 2 fixed blocks.
Preferably, the fixed blocks are provided with four fixed blocks in total, every 2 fixed blocks form a group, and the 2 groups of fixed blocks are uniformly arranged above the compression snap fasteners.
Preferably, the screw holes are uniformly distributed on the fixed base and are distributed in a circular ring shape.
Compared with the prior art, the invention has the beneficial effects that: the LED packaging substrate and the LED packaging structure are as follows:
1. the device is characterized in that the bottom of a base of the device is provided with a fixing base with screw holes, and the screw holes are uniformly distributed on the fixing base in an annular shape, so that screws can be well fixed on a wall surface through the screw holes during installation, and the LED lamp can be better fixed during use;
2. the device is provided with the packaging groove with the threaded structure above the device substrate, and the LED lamp can be well fixed in the packaging groove through the threaded structure;
3. the device has set up logical groove and buckle groove in the encapsulation fluting outside, when pressing down and erectting when putting the buckle, can extrude horizontal buckle right, through the effect of spring, is convenient for make horizontal buckle block in the recess of LED lamp bottom.
4. The device is provided with compression spring in the compression snap-fastener, when pressing the compression snap-fastener, through compression spring's effect to make the compression snap-fastener shrink, and then make the compression snap-fastener fix in the fixed block below, thereby extrude horizontal buckle, can encapsulate well between LED bottom and the device basement.
5. The device sets up to semi-circular structure with erecting the buckle bottom, and erects the size of putting the buckle bottom and coincide with the size of first fixture block, can make first fixture block roll on the semi-circular structure of erecting the buckle bottom well.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is an enlarged view of part A of the present invention;
FIG. 4 is an enlarged view of the part B of the present invention.
In the figure: 1. the device comprises a fixed base, 2, a device substrate, 3, an encapsulation groove, 4, a through groove, 5, a clamping groove, 6, a transverse clamping buckle, 601, a first clamping block, 602, a second clamping block, 7, a spring, 8, a vertical clamping buckle, 9, a compression snap fastener, 10, a compression spring, 11, a pressing block, 12, a fixed block, 13 and a screw hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: an LED packaging substrate and an LED packaging structure comprise a fixed base 1, a transverse buckle 6, a vertical buckle 8, a compression spring 10, a fixed block 12 and a screw hole 13, wherein the fixed base 1 is fixed at the bottom of a device substrate 2, a packaging slot 3 is arranged at the middle position inside the device substrate 2, the inside of the packaging slot 3 is of a threaded structure, the size of the packaging slot 3 is consistent with that of the bottom of an LED lamp, the bottom of the LED lamp can be well fixed in the packaging slot 3 through threaded connection, a through groove 4 is arranged at the position inside the device substrate 2 corresponding to the outer side of the packaging slot 3, a buckling groove 5 is arranged at the position inside the device substrate 2 corresponding to the outer side of the through groove 4, the buckling groove 5 and the packaging slot 3 are communicated, the through groove 4 and the buckling groove 5 are symmetrical relative to the longitudinal central axis of the packaging slot 3, and the buckling groove, the transverse buckle 6 is transversely arranged in the through groove 4, the spring 7 is arranged in the transverse buckle 6, the transverse buckle 6 comprises a first clamping block 601 and a second clamping block 602, the two ends of the transverse buckle 6 are respectively fixed with the first clamping block 601 and the second clamping block 602, the surface of the first clamping block 601 is of a smooth structure, the friction force between the first clamping block 601 and the bottom of the vertical buckle 8 can be reduced, the first clamping block 601 can be conveniently and well extruded, the vertical buckle 8 is vertically arranged in the buckle groove 5 above the transverse buckle 6, the upper end of the vertical buckle 8 is fixed with the compression snap fastener 9, the bottom of the vertical buckle 8 is of a semicircular structure, the size of the bottom of the vertical buckle 8 is matched with that of the first clamping block 601, the first clamping block 601 can well roll on the semicircular structure at the bottom of the vertical buckle 8, the compression spring 10 is arranged in the compression snap fastener 9, and the two end positions of the compression snap fastener 9 are fixedly connected with the blocks 11, an expansion structure is formed between the compression snap fastener 9 and the compression spring 10, the maximum extension amount of the compression spring 10 is larger than the distance between 2 fixed blocks 12, and the minimum extension amount of the compression spring 10 is smaller than the distance between 2 fixed blocks 12, the compression snap fastener 9 can be compressed well under the action of the compression spring 10, the compression snap fastener 9 can be conveniently fixed well through the fixed blocks 12, the vertical buckle 8 can be fixed well, the fixed blocks 12 are fixed on the upper surface of the device substrate 2, the fixed blocks 12 are totally provided with four fixed blocks, each 2 fixed blocks 12 are in a group, 2 groups of the fixed blocks 12 are uniformly arranged above the compression snap fastener 9, the compression spring 10 can be fixed well, the screw holes 13 are arranged on the upper surface of the fixed base 1, the screw holes 13 are uniformly distributed on the fixed base 1, the screw holes 13 are distributed in a circular ring shape, and screws can be fixed well on a wall surface through, the installation is convenient.
The working principle is as follows: before the LED packaging substrate and the LED packaging structure are used, firstly, the whole LED packaging substrate and the whole LED packaging structure need to be simply understood structurally, when the device is used, firstly, the device substrate 2 fixed with the fixed base 1 is placed on a wall surface, then, screws are fixed through screw holes 13, then, the bottom of an LED lamp is screwed in the packaging open grooves 3, meanwhile, the groove at the bottom of the LED lamp is opposite to the through groove 4, then, the vertical buckle 8 is pressed downwards, the pressure of the vertical buckle 8 acts on the first clamping block 601, so that the second clamping block 602 on the horizontal buckle 6 is clamped in the groove at the bottom of the LED lamp, meanwhile, the pressing block 11 is pressed, the compression snap-fastener 9 penetrates through the fixed block 12 and is fixed below the fixed block 12 through the action of the compression spring 10, when the pressing block 11 is pressed, the compression snap-fastener 9 is separated from the fixed block 12 through the action of the compression spring 10, the vertical buckle 8 is pulled upwards, the second fixture block 602 on the horizontal buckle 6 is separated from the groove at the bottom of the LED lamp through the action of the spring 7, and then the bottom of the LED lamp is screwed in the opposite direction to be separated from the packaging slot 3, so that the vertical buckle can be easily disassembled.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a LED encapsulation basement and LED packaging structure, includes unable adjustment base (1), horizontal buckle (6), erects to put buckle (8), compression spring (10), fixed block (12) and screw (13), its characterized in that: the fixing base (1) is fixed at the bottom of the device substrate (2), the middle position inside the device substrate (2) is provided with a packaging groove (3), the inside of the device substrate (2) is provided with a through groove (4) corresponding to the outer side position of the packaging groove (3), the inside of the device substrate (2) is provided with a buckle groove (5) corresponding to the outer side of the through groove (4), the transverse buckle (6) is transversely arranged in the through groove (4), a spring (7) is arranged inside the transverse buckle (6), the vertical buckle (8) is vertically arranged in the buckle groove (5) and above the transverse buckle (6), the upper end position of the vertical buckle (8) is fixed with a compression snap fastener (9), the compression spring (10) is arranged in the compression snap fastener (9), two end positions of the compression snap fastener (9) are fixedly connected with blocks (11), and the fixing block (12) is fixed on the upper surface of the device substrate (2), the screw hole (13) is formed in the upper surface of the fixing base (1), the transverse buckle (6) comprises a first clamping block (601) and a second clamping block (602), the first clamping block (601) and the second clamping block (602) are respectively fixed to two ends of the transverse buckle (6), the surface of the first clamping block (601) is of a smooth structure, the bottom of the vertical buckle (8) is of a semicircular structure, the size of the bottom of the vertical buckle (8) is matched with that of the first clamping block (601), a telescopic structure is formed between the compression snap fastener (9) and the compression spring (10), the maximum extension amount of the compression spring (10) is larger than the distance between 2 fixing blocks (12), the minimum extension amount of the compression spring (10) is smaller than the distance between 2 fixing blocks (12), the four fixing blocks (12) are arranged, and each 2 fixing blocks (12) form a group, and 2 groups of fixing blocks (12) are uniformly arranged above the compression snap fasteners (9).
2. The LED package substrate and the LED package structure of claim 1, wherein: the inside of the packaging slot (3) is of a threaded structure, and the size of the packaging slot (3) is consistent with that of the bottom of the LED lamp.
3. The LED package substrate and the LED package structure of claim 1, wherein: the through groove (4), the buckling groove (5) and the packaging open groove (3) are communicated, and the through groove (4) and the buckling groove (5) are symmetrical about a longitudinal central axis of the packaging open groove (3).
4. The LED package substrate and the LED package structure of claim 1, wherein: the clamping groove (5) is communicated with the packaging open groove (3) and the corresponding through groove (4).
5. The LED package substrate and the LED package structure of claim 1, wherein: the screw holes (13) are uniformly distributed on the fixed base (1), and the screw holes (13) are distributed in a circular ring shape.
6. The method for packaging the LED package substrate and the LED package structure according to claim 1, wherein: when the device is used, firstly, the device substrate 2 fixed with the fixed base 1 is placed on the wall surface, then screws are fixed through the screw holes 13, then the bottom of the LED lamp is screwed in the packaging groove 3, meanwhile, the groove at the bottom of the LED lamp is opposite to the through groove 4, then the vertical buckle 8 is pressed downwards, the pressure of the vertical buckle 8 is acted on the first clamping block 601, so that the second clamping block 602 on the horizontal buckle 6 is clamped in the groove at the bottom of the LED lamp, simultaneously, the pressing block 11 is pressed, the compression snap fastener 9 is fixed below the fixing block 12 through the fixing block 12 under the action of the compression spring 10, when the pressing block 11 is pressed, the compression snap fastener 9 is separated from the fixing block 12 under the action of the compression spring 10, the vertical buckle 8 is pulled upwards, and the second clamping block 602 on the horizontal buckle 6 is separated from the groove at the bottom of the LED lamp under the action of the spring 7, then, the bottom of the LED lamp is screwed in the opposite direction to be separated from the packaging slot 3, so that the LED lamp can be easily disassembled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810561416.9A CN108843988B (en) | 2018-06-04 | 2018-06-04 | LED packaging substrate and LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810561416.9A CN108843988B (en) | 2018-06-04 | 2018-06-04 | LED packaging substrate and LED packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108843988A CN108843988A (en) | 2018-11-20 |
| CN108843988B true CN108843988B (en) | 2020-11-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810561416.9A Active CN108843988B (en) | 2018-06-04 | 2018-06-04 | LED packaging substrate and LED packaging structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN108843988B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4507718A (en) * | 1984-03-16 | 1985-03-26 | Illinois Tool Works Inc. | LED Holder |
| WO2016089017A1 (en) * | 2014-12-05 | 2016-06-09 | 서울바이오시스 주식회사 | Ultraviolet ray emitting diode lighting device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5590952A (en) * | 1995-11-15 | 1997-01-07 | Cheng; You-Jen | Lamp assembly for Christmas tree light sets |
| EP2672177A1 (en) * | 2012-06-07 | 2013-12-11 | Koninklijke Philips N.V. | LED lighting device and LED lighting arrangement |
| CN103904191B (en) * | 2012-12-26 | 2016-09-28 | 中微光电子(潍坊)有限公司 | A kind of LED package substrates and LED encapsulation structure |
| DE102014000741B4 (en) * | 2014-01-21 | 2016-06-09 | Bjb Gmbh & Co. Kg | Lamp for holding two-sided lamps and a lamp for it |
| CN205535652U (en) * | 2016-03-23 | 2016-08-31 | 嵊州德庆机械有限公司 | Novel fixing base that LED lawn lamp was used |
| CN206352750U (en) * | 2017-01-17 | 2017-07-25 | 中山市五安光电科技有限公司 | A kind of LED ball bubble being conveniently replaceable |
| CN207034846U (en) * | 2017-08-23 | 2018-02-23 | 惠州雷士光电科技有限公司 | A kind of recessed lighting fitting lamps structure of simple-mounting-dismounting |
| CN107701958A (en) * | 2017-10-19 | 2018-02-16 | 无锡匡威变压器有限公司 | It is a kind of to be easy to the outdoor illuminating lamp used |
-
2018
- 2018-06-04 CN CN201810561416.9A patent/CN108843988B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4507718A (en) * | 1984-03-16 | 1985-03-26 | Illinois Tool Works Inc. | LED Holder |
| WO2016089017A1 (en) * | 2014-12-05 | 2016-06-09 | 서울바이오시스 주식회사 | Ultraviolet ray emitting diode lighting device |
Non-Patent Citations (1)
| Title |
|---|
| Ying Ding .An investigation of MWIR, AlInSb LEDs based on double heterostructures and multiple quantum wells.《2014 Conference on Optoelectronic and Microelectronic Materials & DevicesYear》.2014, * |
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| CN108843988A (en) | 2018-11-20 |
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