CN108834311A - A kind of printed circuit board - Google Patents
A kind of printed circuit board Download PDFInfo
- Publication number
- CN108834311A CN108834311A CN201810851015.7A CN201810851015A CN108834311A CN 108834311 A CN108834311 A CN 108834311A CN 201810851015 A CN201810851015 A CN 201810851015A CN 108834311 A CN108834311 A CN 108834311A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- insulation layers
- electrochemical cell
- external electrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/256—Carrying devices, e.g. belts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10037—Printed or non-printed battery
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Battery Mounting, Suspending (AREA)
Abstract
The invention discloses a kind of printed circuit boards, layer printed circuit board, which stacks, has multiple layers, multiple layers include two external electrical insulation layers, conductive traces are formed on one or two of described two external electrical insulation layers, each of two outer electric insulation layers that wherein layer printed circuit board stacks include the insulating materials being arranged in epoxide resin material, electrochemical cell is inserted into the layer printed circuit board stacking between described two outer electric insulation layers that layer printed circuit board stacks, it includes the spacer between two external electrical insulation layers, it further include the spatial joint clearance limited positioned at least one of the electrochemical cell and two external electrical insulation layers.Its space surface can be saved and preferably be utilized to a kind of printed circuit board of the invention.
Description
Technical field
The field of the invention is a kind of printed circuit board, and comprising solid-state, film is secondary and primary electrochemical device.
Background technique
Typical electrochemical appliance includes for example multiple electroactive layers, such as anode, cathode, electrolyte, substrate and electric current
Collector.Some layers, it may for example comprise the anode layer of lithium is made of the material of very environment sensitive, for example, substrate can not be
Individual cell device, but the conduction for the printed circuit board that can adhere to by semiconductor surface or semiconductor devices or thereon or
Insulation-encapsulated surface provides.This battery needs to encapsulate to protect environment sensitive material, and some schemes encapsulate electrochemical device
Sensitive layer, such as encapsulated with goldleaf.Device is encapsulated in the bag made of metal and plastics by other schemes, for example, close
It is enclosed in device periphery.The rigidity or flexibility of printed circuit board surface are very limited, thus be it is very valuable, therefore, need
Electrochemical cell is more effectively combined with the design of printed circuit board, to save and preferably utilize printed circuit board
Space surface.
Technical solution
The invention mainly solves the technical problem of providing a kind of printed circuit boards, which is characterized in that including：Printed circuit
Plate layer heap is folded, and with multiple layers, the multiple layer includes two external electrical insulation layers, and conductive traces are formed in described two outer
On one or two of portion's electric insulation layer, each of two outer electric insulation layers that wherein layer printed circuit board stacks include
Insulating materials in epoxide resin material is set；Electrochemical cell, described two dispatches from foreign news agency that insertion layer printed circuit board stacks
During the layer printed circuit board between insulating layer stacks, stacked wherein the electrochemical cell is embedded in the layer printed circuit board
Described two outer electric insulation layers between；Spacer between two external electrical insulation layers；Positioned at the electrochemical cell edge
Spatial joint clearance, by spacer, at least one of the electrochemical cell and two external electrical insulation layers limit space between
Gap.
Further, wherein spacer is the material different from the material of two external electrical insulation layers of layer printed circuit board stacking
Material, and be the material different from any material of electrochemical cell.
Further, wherein the interval in gap is stacked by the spacer, the electrochemical cell and layer printed circuit board
Two external electrical insulation layers limit.
Further, wherein a company in described two external electrical insulation layers that the partition stacks layer printed circuit board
It is connected to another in described two external electrical insulation layers that the layer printed circuit board stacks.
It further, further include the embedded conductor being electrically connected with the electrochemical cell.
The beneficial effects of the invention are as follows：
Its space surface can be saved and preferably be utilized to a kind of printed circuit board of the invention.
Detailed description of the invention
Figure 1A shows the top view of exemplary embodiment of the present invention.
Figure 1B shows the extension sectional view of a part of exemplary embodiment of the present invention.
Fig. 1 C shows the extension sectional view of a part of exemplary embodiment of the present invention.
Fig. 1 D shows the extension sectional view of a part of exemplary embodiment of the present invention.
Fig. 2 depicts a side sectional view of one embodiment of the present of invention.
Fig. 3 describes another side sectional view of exemplary embodiment of the present invention.
Fig. 4 shows another side sectional view of exemplary embodiment of the present invention.
Embodiment
The preferred embodiments of the present invention will be described in detail below so that advantages and features of the invention can be easier to by
It will be appreciated by those skilled in the art that so as to make a clearer definition of the protection scope of the present invention.
Figure 1A, 1B, 1C and 1D show various alternative exemplary embodiments of the invention, and Figure 1A is shown including being embedded in
The top view of the example devices 100 of electrochemical cell 102 in printed circuit board (printed circuit board) 101, wherein battery list
The edge of member 102 extends beyond the edge of printed circuit board 101, printed circuit board 101 or other exemplary implementations of the invention
Example may include multiple stackings, such as two, three, four, five, six, seven, eight or more layers.For example, as schemed
Shown in 1A, printed circuit board 101 includes two layers, and electrochemical cell 102 also can have multiple layers.For example, as shown in Figure 1A, electricity
Chemical cell 102 includes two layers, i.e. top layer 102a and bottom 102b, top layer 102a can be for example that electrochemical cell 102 is being just
Pole, and bottom 102b can be the cathode of such as electrochemical cell 102.In another exemplary embodiment of the invention, top layer
102a, which can be such as negative terminal of electrochemical cell 102 and bottom 102b, can be the anode of such as electrochemical cell 102
Terminal.Figure 1B shows the extension side view of equipment 100, including the unit 102 extended to except 101 edge of printed circuit board,
Printed circuit board 101 can be at least partly made of fire retardant 4 known in the art or other printed circuit board layer materials, example
Such as, polytetrafluoroethylene (PTFE), FR-1, CEM-1 (cotton paper and epoxy resin), CEM-2 (cotton paper and epoxy resin), CEM-3 (Woven glass
And epoxy resin), CEM-4 (Woven glass and epoxy resin), CEM-5 (Woven glass and polyester), FR-2 (phenolic aldehyde cotton paper),
FR-3 (cotton paper and epoxy resin), FR-5 (Woven glass and epoxy resin), FR-6 (dumb light glass and polyester), G-10 are (woven
Glass and epoxy resin) and/or polyimides.Printed circuit board 101 may include one or two appearance of printed circuit board
Conductive trace 103 on face, conductive trace 103 is it is so structured that such as copper foil.As shown in Figure 1A, conductive trace 103 can wrap
It includes on surface mount package, such as single surface mount package.Fig. 1 C shows another exemplary extended side view of device 100
Figure, including removing a part of printed circuit board 101 to form gap 114 in printed circuit board 101.Fig. 1 D show including
The expansion view of the equipment 100 of printed circuit board 101, wherein removing part to expose a part of unit 102.Figure 1B, 1C
It is also shown with 1D with multiple, such as two layers of electrochemical cell 102, however, exemplary embodiment of the present invention can also wrap
It includes with more than two electrochemical cells, such as three, four, five, six, seven, eight or more layers.
Fig. 2 shows device 200, the side sectional views of exemplary embodiment of the present invention, including three with gap 206
Layer printed circuit board 101, in the side gap Shang You of electrochemical cell 102, which can be embedded in insulating layer in gap 206
In, on the one or more sides for the electrochemical cell 102 that gap 206 can be located at insertion, printed circuit board 101 may include
Trace and/or component on one or two outside of printed circuit board 101, spacer 205 constitute the one of printed circuit board 101
Part, and the top layer of printed circuit board 101 is connected to the bottom of printed circuit board 101.Spacer 205 can be defined further
And/or provide and provide buffer area for example, gap 206 can reduce the stress in component to the support and stability of equipment 200,
Position is provided for other assemblies or design feature, and/or the capacity of thermal control is provided.
Fig. 3 shows the exemplary embodiment of the present invention including alternately printed circuit board 101 and 206 structure of gap, print
Printed circuit board 101 may include two layers for surrounding electrochemical cell 102, and therefore, the inside of two layers of printed circuit board 101 has
There is warp architecture, so that gap 206 includes similar curved outer shape.In addition, as shown in figure 3, electrochemical cell 102 can be with
The combination of multilayer thinner than the layer of printed circuit board 101 or than printed circuit board 101 is thin, however, substitution according to the present invention is shown
Example property embodiment, electrochemical cell 102 can be than the thickness of printed circuit board 101, than multiple combinations (such as two, three, four
A, five, six, seven, eight or more), the combination of the layer of printed circuit board 101 or about the same thickness it is thicker.
Fig. 4 shows the equipment 400 of exemplary embodiment of the present invention, which includes for example with conduction
Conductive surface, conducting wire, conductive through hole or another conductive layer of engagement pad, conductive surface can also with insulating surface (such as
Printed circuit board) it is formed together, wherein conductive surface can be formed on the internal layer of printed circuit board.For example, Fig. 4 shows insertion
In internal insulating layer or internal embedded conductor 407.Embedded conductor 407 can be visited in the outside edges of printed circuit board 101
It asks, embedded conductor 407 can not extend to the edge of printed circuit board 101, thus, for example, as in printed circuit board
Portion is electrically interconnected.Embedded conductor 407 can play the role of such as selective conductivity adhesive layer, for example, selective conductivity bonding layer
It can permit through bonding layer and to be transmitted to battery contact from battery 102 or in one or more traces of specified point (not shown),
Selective conductivity bonding layer can also provide insulation between battery contact and printed circuit board 101.
The sequencing of above embodiments is not only for ease of description, represent the advantages or disadvantages of the embodiments.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that：It still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (5)
1. a kind of printed circuit board, which is characterized in that including：Layer printed circuit board stacks, with multiple layers, the multiple layer
Including two external electrical insulation layers, conductive traces are formed on one or two of described two external electrical insulation layers, wherein
Each of two outer electric insulation layers that layer printed circuit board stacks include the insulating materials being arranged in epoxide resin material；
Electrochemical cell, the layer printed circuit board between described two outer electric insulation layers that insertion layer printed circuit board stacks
In stacking, wherein the electrochemical cell is embedded between described two outer electric insulation layers that the layer printed circuit board stacks；
Spacer between two external electrical insulation layers；
The spatial joint clearance limited positioned at least one of the electrochemical cell and two external electrical insulation layers.
2. a kind of printed circuit board according to claim 1, it is characterised in that：Wherein spacer is and layer printed circuit board
The different material of the material of the two external electrical insulation layers stacked, and be the material different from any material of electrochemical cell
Material.
3. a kind of printed circuit board according to claim 1, it is characterised in that：Wherein the interval in gap is by the interval
Two external electrical insulation layers that device, the electrochemical cell and layer printed circuit board stack limit.
4. a kind of printed circuit board according to claim 1, it is characterised in that：Wherein the partition is by layer printed circuit board
One in described two external electrical insulation layers stacked is connected to described two external electricals that the layer printed circuit board stacks
Another in insulating layer.
5. a kind of printed circuit board according to claim 1, it is characterised in that：It further include being electrically connected with the electrochemical cell
The embedded conductor connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810851015.7A CN108834311A (en) | 2018-07-29 | 2018-07-29 | A kind of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810851015.7A CN108834311A (en) | 2018-07-29 | 2018-07-29 | A kind of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108834311A true CN108834311A (en) | 2018-11-16 |
Family
ID=64152184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810851015.7A Withdrawn CN108834311A (en) | 2018-07-29 | 2018-07-29 | A kind of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108834311A (en) |
-
2018
- 2018-07-29 CN CN201810851015.7A patent/CN108834311A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181116 |