CN108831668A - A kind of inductor can be reduced thermal shock - Google Patents
A kind of inductor can be reduced thermal shock Download PDFInfo
- Publication number
- CN108831668A CN108831668A CN201810565596.8A CN201810565596A CN108831668A CN 108831668 A CN108831668 A CN 108831668A CN 201810565596 A CN201810565596 A CN 201810565596A CN 108831668 A CN108831668 A CN 108831668A
- Authority
- CN
- China
- Prior art keywords
- coil
- thermal shock
- main body
- organic filler
- reduced thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000035939 shock Effects 0.000 title claims abstract description 17
- 239000012766 organic filler Substances 0.000 claims abstract description 19
- 238000004804 winding Methods 0.000 claims abstract description 12
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 25
- 239000000956 alloy Substances 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 239000006247 magnetic powder Substances 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- -1 acyl Imines Chemical class 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910019819 Cr—Si Inorganic materials 0.000 claims description 4
- 229910017082 Fe-Si Inorganic materials 0.000 claims description 4
- 229910017133 Fe—Si Inorganic materials 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229920000515 polycarbonate Polymers 0.000 claims description 4
- 239000004417 polycarbonate Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 239000004677 Nylon Substances 0.000 claims description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- 239000004695 Polyether sulfone Substances 0.000 claims description 3
- 229920002301 cellulose acetate Polymers 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 229920000747 poly(lactic acid) Polymers 0.000 claims description 3
- 229920006393 polyether sulfone Polymers 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- 239000004626 polylactic acid Substances 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 229920006324 polyoxymethylene Polymers 0.000 claims description 3
- 229910000859 α-Fe Inorganic materials 0.000 claims description 3
- 229910017061 Fe Co Inorganic materials 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims 1
- 239000004697 Polyetherimide Substances 0.000 description 3
- 229920001601 polyetherimide Polymers 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- DFGMFVYRMVYRRA-UHFFFAOYSA-N [O].CC Chemical compound [O].CC DFGMFVYRMVYRRA-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000000746 body region Anatomy 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Soft Magnetic Materials (AREA)
Abstract
The present invention relates to a kind of inductors that can be reduced thermal shock, including main body, body interior to be embedded with coil；First external electrode and the second external electrode is provided on body outer surface；Coil is the winding type coil formed using winding method；Coil includes supporting module and first coil, the second coil, and first coil and the second coil are separately positioned in supporting module both side surface；First coil and the second coil are formed as into coating using plating technic in supporting module.In the invention, because having unique organic filler, it can be to avoid not being badly deformed because of thermal shock, and there is the low modulus for being suitable for dispersing and reduce the stress for being applied to the inside of organic filler, so organic filler can also maintain the intensity of main body entirety even if in the raised environment of temperature.When the temperature of the main body of inductor is increased due to extreme thermal shock, there is the organic filler for stablizing modulus can effectively absorb mismatch or the impact repelled caused by the temperature raising due to main body at high temperature.
Description
Technical field
The present invention relates to a kind of inductors that can be reduced thermal shock, belong to inductors technique field.
Background technique
Currently, electronic product becomes increasingly complex, function is more and more diversified, and therefore, it is necessary to compact, high current and high capacity
Electronic building brick.In design of electronic products, when reducing coil dimension so that compact power inductor is made, it is formed with coil
The volume of body region of inner core can also reduce.When the volume of inner core reduces, inductor be can be easy to by outer
The damage of portion's stress or thermal shock.Therefore, it is necessary to be improved using suitable mode.
Summary of the invention
The purpose of the present invention is to provide a kind of inductors that can be reduced thermal shock, preferably to improve the peace of inductor
Fill using effect.
To achieve the goals above, technical scheme is as follows.
A kind of inductor can be reduced thermal shock, including main body, body interior are embedded with coil；It is arranged on body outer surface
There is first external electrode and the second external electrode；Coil is the winding type coil formed using winding method；Coil include supporting module and
First coil, the second coil, first coil and the second coil are separately positioned in supporting module both side surface；Make in supporting module
First coil and the second coil are formed as into coating with plating technic；It is punched out on the thickness direction of supporting module, to be formed
Via hole is formed by the inside of via hole using conductive material filling；Access is by using plating technic to be plated with conductive material
Coating formed or can be formed by the conductive layer being sintered after filling conductive paste.
Further, first coil and the second coil be gold, silver, platinum, copper, nickel, aluminium or at least one of titanium or its
Alloy is formed.
Further, main body includes the magnetic powder particles with magnetic characteristic, matrix resin and organic filler, wherein
Magnetic powder particles are that Fe, Fe-Ni based alloy, Fe-Si based alloy, Fe-Cr-Si based alloy, Fe base noncrystal alloy, Co base are non-
At least one of peritectic alloy, Fe-Co based alloy, Fe-N based alloy or MnZn based ferrite；Matrix resin is as thermosetting
The epoxy resin or polyimide resin of property resin are formed；Organic filler is cellulose acetate, nylon, poly-methyl methacrylate
Ester, polycarbonate, polyether sulfone, polyether-ether-ketone, polyetherimide, polyethylene, polylactic acid, polyformaldehyde or polyethylene oxide.
Further, the magnetic powder particles in main body containing 80~90wt%, the matrix resin of 5~10wt% and 3
The organic filler of~5wt%.
Invention has the beneficial effects that：It, can be to avoid not because heat be rushed because having unique organic filler in the invention
It hits and is badly deformed, and there is the low modulus for being suitable for dispersing and reduce the stress for being applied to the inside of organic filler, so having
Machine filler can also maintain the intensity of main body entirety even if in the raised environment of temperature.When inductor main body temperature due to outer
Portion's thermal shock and when increasing, there is the organic filler for stablizing modulus can effectively absorb the temperature raising due to main body at high temperature
Caused by mismatch or repel impact.
Specific embodiment
A specific embodiment of the invention is described below with reference to embodiment, to better understand the present invention.
Embodiment 1
The inductor that can be reduced thermal shock in the present embodiment, including main body, body interior are embedded with coil；Main body appearance
First external electrode and the second external electrode is provided on face；Coil is the winding type coil formed using winding method；Coil includes branch
Hold mode block and first coil, the second coil, first coil and the second coil are separately positioned in supporting module both side surface；Support
First coil and the second coil are formed as into coating using plating technic in module；It is rushed on the thickness direction of supporting module
Hole is formed by the inside of via hole using conductive material filling to form via hole；Access is by using plating technic to be plated with
The coating of conductive material is formed or can be formed by the conductive layer being sintered after filling conductive paste.
First coil and the second coil are gold, silver or are formed at least one of titanium or its alloy.Contain in main body
The organic filler of the magnetic powder particles of 90wt%, the matrix resin of 6wt% and 4wt%, wherein magnetic powder particles are
At least one of Fe, Fe-Ni based alloy, Fe-Si based alloy；Matrix resin is the epoxy resin as thermosetting resin；
Organic filler is cellulose acetate, nylon, polymethyl methacrylate or polycarbonate.
Embodiment 2
The inductor that can be reduced thermal shock in the present embodiment, including main body, body interior are embedded with coil；Main body appearance
First external electrode and the second external electrode is provided on face；Coil is the winding type coil formed using winding method；Coil includes branch
Hold mode block and first coil, the second coil, first coil and the second coil are separately positioned in supporting module both side surface；Support
First coil and the second coil are formed as into coating using plating technic in module；It is rushed on the thickness direction of supporting module
Hole is formed by the inside of via hole using conductive material filling to form via hole；Access is by using plating technic to be plated with
The coating of conductive material is formed or can be formed by the conductive layer being sintered after filling conductive paste.
First coil and the second coil are gold, silver, platinum, copper, nickel, aluminium or are formed at least one of titanium or its alloy.
The organic filler of the matrix resin and 5wt% of magnetic powder particles, 10wt% in main body containing 85wt%, wherein magnetic
Powder particle is at least one of Fe-Cr-Si based alloy, Fe base noncrystal alloy or MnZn based ferrite；Matrix resin is
Polyimide resin；Organic filler is polyetherimide, polyethylene, polylactic acid, polyformaldehyde or polyethylene oxide.
Embodiment 3
The inductor that can be reduced thermal shock in the present embodiment, including main body, body interior are embedded with coil；Main body appearance
First external electrode and the second external electrode is provided on face；Coil is the winding type coil formed using winding method；Coil includes branch
Hold mode block and first coil, the second coil, first coil and the second coil are separately positioned in supporting module both side surface；Support
First coil and the second coil are formed as into coating using plating technic in module；It is rushed on the thickness direction of supporting module
Hole is formed by the inside of via hole using conductive material filling to form via hole；Access is by using plating technic to be plated with
The coating of conductive material is formed or can be formed by the conductive layer being sintered after filling conductive paste.
First coil and the second coil are gold, silver, platinum, copper, nickel, aluminium or are formed at least one of titanium or its alloy.
The organic filler of the matrix resin and 5wt% of magnetic powder particles, 7wt% in main body containing 88wt%, wherein magnetic powder
Last particle is Fe-Si based alloy or Fe-Cr-Si based alloy；Matrix resin be as thermosetting resin epoxy resin or
Polyimide resin is formed；Organic filler is polycarbonate, polyether sulfone, polyether-ether-ketone, polyetherimide, polyethylene or polycyclic oxygen
Ethane.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (4)
1. a kind of inductor that can be reduced thermal shock, it is characterised in that：Including main body, the body interior is embedded with coil；Institute
It states and is provided with first external electrode and the second external electrode on body outer surface；The coil is the winding molded line formed using winding method
Circle；The coil includes supporting module and first coil, the second coil, and the first coil and the second coil are separately positioned on branch
In hold mode block both side surface；First coil and the second coil are formed as into coating using plating technic in the supporting module；Branch
It is punched out on the thickness direction of hold mode block, to form via hole, the inside of via hole is formed by using conductive material filling；
Access is formed or can be by the conductive layer that is sintered after filling conductive paste by the coating for using plating technic to be plated with conductive material
It is formed.
2. the inductor according to claim 1 that can be reduced thermal shock, it is characterised in that：The first coil and the second line
Circle is gold, silver, platinum, copper, nickel, aluminium or is formed at least one of titanium or its alloy.
3. the inductor according to claim 1 that can be reduced thermal shock, it is characterised in that：The main body includes having magnetic special
Magnetic powder particles, matrix resin and the organic filler of property, wherein magnetic powder particles Fe, Fe-Ni based alloy, Fe-Si
Based alloy, Fe-Cr-Si based alloy, Fe base noncrystal alloy, Co base noncrystal alloy, Fe-Co based alloy, Fe-N based alloy or
At least one of MnZn based ferrite；Matrix resin is the epoxy resin or polyimide resin shape as thermosetting resin
At；Organic filler is cellulose acetate, nylon, polymethyl methacrylate, polycarbonate, polyether sulfone, polyether-ether-ketone, polyethers acyl
Imines, polyethylene, polylactic acid, polyformaldehyde or polyethylene oxide.
4. the inductor according to claim 1 that can be reduced thermal shock, it is characterised in that：In the main body containing 80~
The organic filler of the magnetic powder particles of 90wt%, the matrix resin of 5~10wt% and 3~5wt%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810565596.8A CN108831668A (en) | 2018-06-04 | 2018-06-04 | A kind of inductor can be reduced thermal shock |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810565596.8A CN108831668A (en) | 2018-06-04 | 2018-06-04 | A kind of inductor can be reduced thermal shock |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108831668A true CN108831668A (en) | 2018-11-16 |
Family
ID=64144083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810565596.8A Pending CN108831668A (en) | 2018-06-04 | 2018-06-04 | A kind of inductor can be reduced thermal shock |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108831668A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102915826A (en) * | 2011-08-04 | 2013-02-06 | 阿尔卑斯绿色器件株式会社 | Inductor and its manufacturing method |
| CN107871591A (en) * | 2016-09-26 | 2018-04-03 | 三星电机株式会社 | Inductor |
-
2018
- 2018-06-04 CN CN201810565596.8A patent/CN108831668A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102915826A (en) * | 2011-08-04 | 2013-02-06 | 阿尔卑斯绿色器件株式会社 | Inductor and its manufacturing method |
| CN107871591A (en) * | 2016-09-26 | 2018-04-03 | 三星电机株式会社 | Inductor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190510 Address after: 638600 Guang'an City, Sichuan Province, Huaying City Industrial New Town Leads the Way Applicant after: Guang'an Pioneer Chuanghua Finance Electronic Technology Co., Ltd. Address before: 638600 Guanghua Avenue Mechanical and Electrical Industrial Park, Huaying City, Guang'an City, Sichuan Province Applicant before: Sichuan Ling Chuanbao rock Electronic Science and Technology Co., Ltd. |
|
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181116 |