CN108831627B - Method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode - Google Patents

Method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode Download PDF

Info

Publication number
CN108831627B
CN108831627B CN201810601581.2A CN201810601581A CN108831627B CN 108831627 B CN108831627 B CN 108831627B CN 201810601581 A CN201810601581 A CN 201810601581A CN 108831627 B CN108831627 B CN 108831627B
Authority
CN
China
Prior art keywords
printing
transparent electrode
mold
conductive ink
liquid bridge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810601581.2A
Other languages
Chinese (zh)
Other versions
CN108831627A (en
Inventor
兰红波
许权
赵佳伟
杨昆
朱晓阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao University of Technology
Original Assignee
Qingdao University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao University of Technology filed Critical Qingdao University of Technology
Priority to CN201810601581.2A priority Critical patent/CN108831627B/en
Publication of CN108831627A publication Critical patent/CN108831627A/en
Application granted granted Critical
Publication of CN108831627B publication Critical patent/CN108831627B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal

Abstract

The method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode that the invention discloses a kind of, manufactures master mold using electric field driven melting jet deposition 3D printing;Work mold processed is turned over to master mold casting liquid organic polymer material by vacuum aided;It fills in conductive ink to the groove of work mold;The conductive ink in work mold trench will be filled in be transferred on substrate through sintering curing, and using liquid bridge transfer technique.PDMS soft mold processed (work mold) is turned over to large scale mother matrix casting liquid dimethyl silicone polymer (PDMS) material by vacuum aided;It will be transferred on substrate after the heated solidification of conductive ink being filled in PDMS soft mold groove using liquid bridge transfer technique;Transparent electrode on base material is post-processed.Obtain large area, large ratio of height to width, high-resolution transparent electrode.

Description

Method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode
Technical field
The invention belongs to transparent electrodes and ultra fine circuit manufacturing technology field, and in particular to one kind is based on 3D printing and liquid The method of bridge transfer manufacture large-area transparent electrode.
Background technique
Transparent electrode or transparent conductive film are touch screen, thin-film solar cells (OSCs), OLED, LCD, transparence display Etc. the important component of many opto-electronic devices and product, there is very extensive application in many fields and product, especially It is in recent years as OLED screen curtain mobile phone, flexible electronic, electronic skin, Internet of Things, wearable device become increasingly popular, it is flexible thoroughly Prescribed electrode shows wider industrial applications prospect.
Transparent conductive film/transparent electrode that industry uses at present be mainly indium tin oxide (Indium tin oxide, ITO) film, but the indium for including in ITO is rare metal, and its manufacture needs high-temperature vacuum to deposit, and leads to manufacturing cost It is high;In addition, ITO flexibility, deposit manufacture need high temperature, be not suitable for the flexible substrates such as PET, be not suitable for the system of flexible transparent electrode It makes, limits its application.
Therefore, academia and industrial circle propose many ITO alternative solutions, such as conducting high polymers object film in recent years (such as PEDTO:PSS), metal (gold, silver, copper) grid transparent conductive film, is based on carbon nanometer at metal nanometer line (silver nanowires) The transparent electrode of new generation such as transparent conductive film of pipe or graphene causes more and more to pay close attention to.
Compared with other technologies and implementation, metal (silver) grid transparent electrode (Silver Grid) not only have with Also there is the translucency and electric conductivity that ITO compares favourably flexibility to have by force, suitable for soft or hard substrate (substrate), at low cost, performance Outstanding advantages of Scalability, at present by academia and industrial circle be considered most industrial applications prospect technology it One.
It has proposed there are many metal grill transparent electrode manufacturing methods both at home and abroad at present, such as optical lithography, nanometer pressure A variety of manufacturing technologies such as print, inkjet printing, aerosol printing, however these existing technologies or solution are in large area, height Resolution ratio, the efficient, inexpensive of large ratio of height to width metal grill, the equal Shortcomings of mass manufacture view and limitation, serious shadow Ring and restrict the more widespread commercial application of metal grill transparent electrode, it would be highly desirable to need to develop new manufacturing method and strategy, with Realize the efficient, inexpensive of the ultra tiny transparent electrode of large area, scale manufacture.
Summary of the invention
The present invention to solve the above-mentioned problems, proposes a kind of based on 3D printing and liquid bridge transfer manufacture large-area transparent electricity The method of pole melts jet deposition 3D printing in conjunction with electric field driven and liquid bridge transfer technique realizes large-area transparent electrode low cost Mass manufacture.
To achieve the goals above, the present invention adopts the following technical scheme:
A method of based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode, comprising the following steps:
(1) master mold is manufactured using electric field driven melting jet deposition 3D printing;
(2) work mold processed is turned over to master mold casting liquid organic polymer material by vacuum aided;
(3) it fills in conductive ink to the groove of work mold;
(4) it will be filled in the heated solidification of the conductive ink in work mold trench, and transferred using liquid bridge transfer technique Onto substrate.
Further, in the step (1), cleaning and dry substrate, and using plasma processor to substrate surface into The processing of row plasma bombardment;According to the structure of the transparent conductive electrode of design, jet deposition 3D printing is melted using electric field driven Technology prints micro-nano feature structure or pattern required for the transparent conductive electrode with printed material on substrate.
Preferably, the substrate includes but is not limited to glass, plastics and silicon wafer.
Preferably, the printed material includes but is not limited to polycaprolactone and polymethyl methacrylate.
Preferably, transparent conductive electrode includes wire grid electrodes, various grid electrodes etc., the connection relationship of certain each electrode It is subject to design.
Further, the method that the step (2) turns over work mold processed includes:
(2-1) uses spin coating or casting process, and the organic polymer material painting after vacuumize process is taped against on master mold;
(2-2) is heating and curing to organic polymer material;
(2-3) adds backing support, and using resin as supporting layer, the coupling agent of layer of transparent is coated first on resin Material carries out surface adhesive processing, is fitted on organic polymer material;
(2-4) integrally heats multi-layer compound structure, and organic polymer material is fully cured, and guarantees backing support Layer and the firm connection of organic polymer material layer;
(2-5) uses open-type release method, and resin and organic polymer material layer are kept completely separate with master mold, completes work Make the manufacture of mold.
Preferably, the organic polymer material is liquid dimethyl silicone polymer, and coating thickness is 500nm-5mm.
Further, it in the step (2-2), is heating and curing at 30 DEG C -45 DEG C 8-12 hours.
Further, using polyethylene terephthalate as supporting layer in the step (2-3), and with a thickness of 0.1-1mm。
Further, it in the step (2-4), is heating and curing at 40 DEG C -60 DEG C 10-18 hours.
Further, the conductive ink of the step (3), including nano silver conductive ink, nano-copper conductive ink, Yin Na Rice noodles, graphene conductive ink or/and carbon nanotube conducting ink, ink pellet surface free energy is between 30mJ/m2-70mJ/m2It Between.
It is preferred that nano silver conductive ink.
Further, in the step (3), using blade coating or czochralski process, conductive ink is made to pass through work mold table The micro-structure in face, under the effect and capillarity of discontinuous dehumidifying, being filled in the conductive ink inside microstructured groove can be protected It stays, and the conductive ink in groove top can be removed, to realize the filling of conductive ink.
Further, the solidification temperature of the step (4): 100 DEG C -150 DEG C;Curing time: 10-20 minutes.
Further, the specific steps of the step (4), one layer of liquid of building is viscous between work mold and target substrate Layer is closed, with evaporating, capillary force is gradually increased, and pulls the contact of two surfaces, makes to be formed good conformal connect between them Touching.
Preferably, the liquid bridge medium of liquid adhesive layer is polar liquid, such as methanol, ethyl alcohol and isopropanol.
Further, the method also includes step (5), further curing conductive structures, specifically, making the Argent grain of dispersion Silver-colored simple substance is formed in a certain way and forms conductive path.
Further, for heat resistant substrate, the excellent electrode of electric conductivity is obtained using the method for thermal sintering;For soft Property the plastic-substrates that use of electronic product, carried out using low-temperature sintering, electricity sintering or chemically sintered mode.
Compared with prior art, the invention has the benefit that
Present invention incorporates the advantages of electric field driven melting jet deposition 3D printing and liquid bridge transfer technique, realize big face Long-pending and ultra tiny transparent electrode efficient, inexpensive mass manufactures.With following significant advantage:
(1) it can be realized oversize (meter level scale) baseplate transparent electrode high efficiency and low cost scale manufacture.
(2) it can be realized the manufacture of sub-micron scale and the ultra tiny transparent electrode of nanoscale.
(3) manufacture (while having low square resistance and high transparency) that can be realized large ratio of height to width transparent electrode, realizes high property The manufacture of energy transparent electrode solves the problems, such as that the prior art is difficult to realize low square resistance and the manufacture of high light transmittance ratio transparent electrode simultaneously.
(4) it is suitable for the manufacture of soft, hard various substrate (substrate) transparent electrodes, is particularly suitable for non-smooth and frangible substrate The manufacture of transparent electrode.With very extensive application field.
(5) transparent electrode consistency manufactured by is good, high reliablity.
(6) simple process, does not need dedicated equipment, and manufacturing cost is low.
(7) Technological adaptability is strong.
(8) applicable conductive material is extensive, the present invention can be widely used in touch screen, thin-film solar cells, OLED, The numerous areas such as LCD, transparence display, Electronic Paper, flexible electronic, wearable device.
(9) present invention is large scale and broad-area electrode required for the fields such as solar battery, touch screen, OLED, LCD The manufacture of (transparent electrode) and ultra fine circuit provides a kind of brand-new solution with extensive industrial applications prospect, and With precision height, oversize, low cost, efficient unique advantage.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present application, and the application's shows Meaning property embodiment and its explanation are not constituted an undue limitation on the present application for explaining the application.
Fig. 1 is that the present invention combines electric field driven melting jet deposition 3D printing and liquid bridge transfer technique manufacture large-area transparent The process flow diagram of electrode;
Fig. 2 is manufacture transparent electrode method schematic diagram of the embodiment of the present invention;
Fig. 3 is the present invention using electric field driven melting jet deposition 3D printing technique manufacture master mold schematic illustration.
Specific embodiment:
The invention will be further described with embodiment with reference to the accompanying drawing.
It is noted that following detailed description is all illustrative, it is intended to provide further instruction to the application.Unless another It indicates, all technical and scientific terms used herein has usual with the application person of an ordinary skill in the technical field The identical meanings of understanding.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.
In the present invention, term for example "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", " side ", The orientation or positional relationship of the instructions such as "bottom" is to be based on the orientation or positional relationship shown in the drawings, only to facilitate describing this hair Bright each component or component structure relationship and the relative of determination, not refer in particular to either component or element in the present invention, cannot understand For limitation of the present invention.
In the present invention, term such as " affixed ", " connected ", " connection " be shall be understood in a broad sense, and indicate may be a fixed connection, It is also possible to be integrally connected or is detachably connected;It can be directly connected, it can also be indirectly connected through an intermediary.For The related scientific research of this field or technical staff can determine the concrete meaning of above-mentioned term in the present invention as the case may be, It is not considered as limiting the invention.
As background technique is introduced, optical lithography, nano impression, inkjet printing, aerosol printing in the prior art Many insufficient and limitations, such as processing cost, manufacture are faced in terms of realizing large-area transparent electrode etc. a variety of manufacturing technologies Period, maximum graphical area etc..In order to solve technical problem as above, present applicant proposes one kind to be melted based on electric field driven The method of the transparent electrode of jet deposition and liquid bridge transfer technique preparation large area.
The operation principle of the present invention is that using electric field driven melting jet deposition 3D printing manufacture large scale mother matrix (master mold); PDMS soft mold (Working mould processed is turned over to large scale mother matrix casting liquid dimethyl silicone polymer (PDMS) material by vacuum aided Tool);The conductive ink being filled in PDMS soft mold groove is transferred to substrate after sintering curing using liquid bridge transfer technique On;Transparent electrode on base material is post-processed.Obtain large area, large ratio of height to width, high-resolution transparent electrode.
In the present invention, large area, large ratio of height to width, high-resolution are the usually signified meter level rulers of those skilled in the art Degree has low square resistance and high transparency and higher resolution ratio simultaneously, and certainly, technical solution of the present invention can be used for one As require or index transparent electrode preparation on.
Below in conjunction with attached drawing, the manufacturing method of the present invention is further described.
Embodiment 1
The present embodiment manufactures large area master structure with electric field driven melting spray deposition technique, then passes through graph copying Master structure is transferred on PDMS work mold by technique, is filled later using silver ink to PDMS work mold, Finally silver wire is transferred in target substrate (hard substrates) using liquid bridge transfer, manufactured graphic structure is wiregrating knot Structure.Manufacturing process is as shown in Fig. 2, specific preparation step includes:
(1) it manufactures master mold: utilizing electric field driven melting jet deposition 3D printing manufacture large scale master mold (mother matrix)
Using simple glass as substrate (substrate).Glass substrate is cleaned first, deionized water ultrasonic treatment Then 10min is dried with nitrogen, then carry out plasma bombardment processing to glass surface using plasma processor, improves printing material Adhesion strength between material and glass substrate.Using PMMA as printed material, according to the micro-nano mold graph structure to be manufactured, adopt PMMA structure is produced on the glass substrate with electric field driven melting jet deposition, as shown in Figure 3.
It is arranged with heater outside the storage vat of printing device, to preheat to the printed material in storage vat.Printing Having heaters also can be set at the printing syringe needle in generator terminal portion.
Since printing device etc. is existing equipment, its structure is no longer repeated herein.
Print PMMA structure graph are as follows: 5 μm of line width, 150 μm of the period, the wire grid construction of 2 μm of height, active graphical area surface Product is 200mm X 200mm.
(2) it turns over work mold processed: figure being shifted using PDMS material
One layer of PDMS polymer of paving is applied in master tool surface obtained, the canned glue of appropriate DOW CORNING 184 is selected, by using scraping Film machine scratches the PDMS of one layer of about 0.5-2mm thickness in master mold upper surface, is heating and curing under vacuum conditions to PDMS, heats Temperature is set as 30-40 DEG C, and heating time is set as 8-12h.Then one layer of coupling agent is coated on the PET with a thickness of 0.3mm (such as KH550, KH560, KH570, KH792, DL602, DL171) or adhesive, fit on PMDS, then by master mold, PDMS Replicated architecture, PET backing are integrally placed into heating in vacuum case, are heating and curing under the conditions of 30-40 DEG C 10 hours.It is complete to PDMS " open-type " release method is used after solidification, and the compound soft mold of PET and PDMS (work mold) is kept completely separate with master mold, is completed The manufacture of work mold.
(3) it fills silver ink: filling silver ink in PDMS work mold trench interiors
Silver ink is filled in the groove of PDMS work mold, using Best-Effort request technique, passes through silver ink The micro-structure for crossing PDMS work die surface, silver ink will be filled into PDMS work mold under the action of discontinuous dehumidifying Groove in, and do not end up at template top surface.
(4) it is heating and curing: the ink being filled up completely in work mold is heating and curing
The solvent in silver ink is set to volatilize by way of heating, to realize solidification.Due to different nano silvers Ink cured performance is different, according to the silver ink that the present embodiment uses, using the 10min that is heating and curing at 100 DEG C.
(5) liquid bridge transfers silver wire
Selection simple glass is different in one layer of glass surface spraying after the pretreatments such as cleaned drying as target substrate Propyl alcohol comes into full contact with as liquid bridge medium, by the template for filling silver wire with substrate, the relative position of both appropriate adjustments, and really It protects between PDMS work mold and substrate of glass without bubble.Under the conditions of 60 DEG C, due to isopropanol volatility with higher, meeting It is penetrated into atmosphere from the edge of PDMS or PDMS itself quickly.With the reduction of isopropanol, liquid layer isopropanol in the trench Curvature of curved surface can constantly reduce and then increase capillary force constantly, and finally cured silver wire is drawn to substrate surface, Realize solidification silver wire from the PDMS work based transfer of mold.
Embodiment more preferably further includes step (6) last handling process.
To improve silver wire electric conductivity, the Argent grain of dispersion need to be made to form silver-colored simple substance in a certain way and form conductive lead to Silver wire after transfer is placed on heating platform and carries out high temperature sintering by road, and sintering temperature is 250 DEG C -350 DEG C, sintering time No less than 30min.
Embodiment 2
The present embodiment manufactures large area master structure with electric field driven melting spray deposition technique, then passes through graph copying Master structure is transferred on PDMS by technique, is filled using silver ink to PDMS work mold, is finally used later Silver wire is transferred in target substrate PET (flexible substrate) by liquid bridge transfer, and manufactured graphic structure is network.Manufacture Process is as shown in Fig. 2, specific preparation step includes:
(1) it manufactures master mold: utilizing electric field driven melting jet deposition 3D printing manufacture large scale master mold (mother matrix)
Using simple glass as substrate (substrate).Glass substrate is cleaned first, deionized water ultrasonic treatment Then 10min is dried with nitrogen.Using polycaprolactone (PCL) as printed material, according to the micro-nano mold graph knot to be manufactured Structure produces PCL structure using electric field driven melting jet deposition, as shown in Figure 3 on the glass substrate.
Print PCL structure graph are as follows: 2 μm of line width, 200 μm of the period, the network of 0.8 μm of height, active graphical region Area is 80mm X80mm.
(2) it turns over work mold processed: figure being shifted using PDMS material
One layer of PDMS polymer of paving is applied in master tool surface obtained, the canned glue of appropriate DOW CORNING 184 is selected, by using scraping Film machine scratches the PDMS of one layer of about 0.5-2mm thickness in master mold upper surface, is heating and curing under vacuum conditions to PDMS, heats Temperature is set as 40 DEG C, and heating time is set as 8-12h.Then one layer of coupling agent is coated (such as on the PET with a thickness of 0.3mm KH550, KH560, KH570, KH792, DL602, DL171) or adhesive, it fits on PMDS, then master mold, PDMS are replicated Structure, PET backing are integrally placed into heating in vacuum case, are heating and curing under the conditions of 40 DEG C 10 hours.After PDMS is fully cured Using " open-type " release method, the compound soft mold of PET and PDMS (work mold) is kept completely separate with master mold, completes Working mould The manufacture of tool.
(3) it fills silver ink: filling silver ink in work mold trench interiors
Silver ink is filled in the groove of PDMS work mold, using Best-Effort request technique, passes through silver ink The micro-structure for crossing PDMS work die surface, silver ink will be filled into PDMS work mold under the action of discontinuous dehumidifying Groove in, and do not end up at template top surface.
(4) it is heating and curing: the ink being filled up completely in work mold is heating and curing
The solvent in silver ink is set to volatilize by way of heating, to realize solidification.Due to different nano silvers Ink cured performance is different, according to the silver ink that the present embodiment uses, using the 10min that is heating and curing at 100 DEG C.
(5) liquid bridge transfers silver wire
PET is chosen as target substrate, after the pretreatments such as cleaned drying, sprays one layer of ethyl alcohol conduct in glass surface Work mold and the substrate of filling silver wire are come into full contact with, the relative position of both appropriate adjustments, and ensured by liquid bridge medium PDMS works between mold and substrate of glass without bubble.It, can quickly due to ethyl alcohol volatility with higher under the conditions of 80 DEG C It is penetrated into atmosphere from the edge of PDMS or PDMS itself.With the reduction of ethyl alcohol, the curved surface curved of liquid layer ethyl alcohol in the trench Rate can constantly reduce and then increase capillary force constantly, and finally draw cured silver wire to substrate surface, realize solidification Silver wire from PDMS work the based transfer of mold.
As more preferred embodiment, step (6), i.e. post-processing step are further comprised.
The step is to improve silver wire electric conductivity, and the Argent grain of dispersion need to be made to form silver-colored simple substance formation in a certain way and led Electric pathway generallys use the modes such as low-temperature sintering, electricity sintering, chemically sintered and carries out since PET material heat resistance is poor.It will turn Silver wire after print is placed in progress 3min sintering in electric sintering machine, to obtain the good silver wire of electric conductivity.
Certain above-mentioned two embodiment is used for the purpose of so that those skilled in the art are more clearly understood that technical solution enumerated Two exemplary embodiments, the selection or specific parameter of above-mentioned specific material, such as temperature, time and thickness are all Can be in the range of the present invention provide, according to the material of specific printing environment and selection, and the requirement etc. of printing is specific Situation is changed, and specific material and parameter that above-mentioned two embodiment provides are not limited in.
The foregoing is merely preferred embodiment of the present application, are not intended to limit this application, for the skill of this field For art personnel, various changes and changes are possible in this application.Within the spirit and principles of this application, made any to repair Change, equivalent replacement, improvement etc., should be included within the scope of protection of this application.
Above-mentioned, although the foregoing specific embodiments of the present invention is described with reference to the accompanying drawings, not protects model to the present invention The limitation enclosed, those skilled in the art should understand that, based on the technical solutions of the present invention, those skilled in the art are not Need to make the creative labor the various modifications or changes that can be made still within protection scope of the present invention.

Claims (8)

1. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode, it is characterized in that: the following steps are included:
(1) using polymethyl methacrylate as printed material, master mold is manufactured using electric field driven melting jet deposition 3D printing;
(2) work mold processed is turned over to master mold casting liquid organic polymer material by vacuum aided;
(3) it fills in nanometer conductive ink to the groove of work mold;
(4) it will be filled in the heated solidification of the conductive ink in work mold trench, and is transferred to base using liquid bridge transfer technique On material;
The method that the step (2) turns over work mold processed includes:
(2-1) uses spin coating or casting process, and the organic polymer material painting after vacuumize process is taped against on master mold;
(2-2) is heating and curing to organic polymer material;
(2-3) adds backing support, and using resin as supporting layer, the coupling agent material of layer of transparent is coated first on resin Or surface adhesive processing is carried out, it is fitted on organic polymer material;
(2-4) integrally heats multi-layer compound structure, and organic polymer material is fully cured, guarantee backing support and The firm connection of organic polymer material layer;
(2-5) uses open-type release method, and resin and organic polymer material layer are kept completely separate with master mold, completes Working mould The manufacture of tool;
In the step (3), using blade coating or czochralski process, conductive ink is made to pass through the micro-structure of work die surface, Under the effect and capillarity of discontinuous dehumidifying, being filled in the conductive ink inside microstructured groove can be remained, and be in The conductive ink of groove top can be removed, to realize the filling of conductive ink.
2. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: in the step (1), cleaning and dry substrate, and plasma bombardment is carried out to substrate surface using plasma processor Processing;According to the structure of the transparent conductive electrode of design, jet deposition 3D printing technique is melted using electric field driven, to print material Material prints micro-nano feature structure or pattern required for the transparent conductive electrode on substrate.
3. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: the organic polymer material is liquid dimethyl silicone polymer, and coating thickness is 500nm-5mm.
4. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: in the step (2-2), being heating and curing at 30 DEG C -45 DEG C 8-12 hours;
Or, using polyethylene terephthalate as supporting layer in the step (2-3), and with a thickness of 0.1-1mm;
Or, being heating and curing at 40 DEG C -60 DEG C 10-18 hours in the step (2-4).
5. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: the conductive ink of the step (3), including nano silver conductive ink, nano-copper conductive ink, silver nanowires, graphene Conductive ink or/and carbon nanotube conducting ink, ink pellet surface free energy is between 30mJ/m2-70mJ/m2Between.
6. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: the solidification temperature of the step (4): 100 DEG C -150 DEG C;Curing time: 10-20 minutes.
7. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: the specific steps of the step (4), one layer of liquid adhesive layer is constructed between work mold and target substrate, with liquid Body volatilization, capillary force gradually increase, and pull two surface contacts, make to form good bringing into conformal contact between them;
Further, the liquid bridge medium of liquid adhesive layer is polar liquid.
8. a kind of method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode as described in claim 1, special Sign is: the method also includes step (5), further curing conductive structure is specific: making the Argent grain of dispersion in a certain way It forms silver-colored simple substance and forms conductive path;
For heat resistant substrate, the excellent electrode of electric conductivity is obtained using the method for thermal sintering;Flexible electronic product is used Plastic-substrates, using low-temperature sintering, electricity sintering or chemically sintered mode carry out.
CN201810601581.2A 2018-06-12 2018-06-12 Method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode Active CN108831627B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810601581.2A CN108831627B (en) 2018-06-12 2018-06-12 Method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810601581.2A CN108831627B (en) 2018-06-12 2018-06-12 Method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode

Publications (2)

Publication Number Publication Date
CN108831627A CN108831627A (en) 2018-11-16
CN108831627B true CN108831627B (en) 2019-10-25

Family

ID=64144885

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810601581.2A Active CN108831627B (en) 2018-06-12 2018-06-12 Method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode

Country Status (1)

Country Link
CN (1) CN108831627B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109616418B (en) 2018-12-06 2021-11-09 合肥鑫晟光电科技有限公司 Thin film transistor, display substrate, manufacturing method of display substrate and display device
CN109445248B (en) * 2018-12-29 2021-09-21 吉林大学 Method for imprinting metal nanowires by using capillary action and application
CN110021462B (en) * 2019-05-17 2020-05-05 青岛五维智造科技有限公司 Manufacturing method and application of embedded metal grid flexible transparent electrode
CN110752145B (en) * 2019-10-28 2022-03-01 清华大学 Transfer method and transfer head based on liquid capillary force and surface tension
CN113394555A (en) * 2020-03-13 2021-09-14 昆山哈勃电波电子科技有限公司 Method for preparing antenna by adopting TDP silver paste transfer printing process
CN111588372A (en) * 2020-04-20 2020-08-28 北京邮电大学 Method for preparing flexible Electrocardiogram (ECG) electrode
CN112811386A (en) * 2020-12-30 2021-05-18 哈尔滨工业大学(深圳) Preparation method of 3d microelectrode
CN112768141B (en) * 2020-12-31 2021-12-28 西安交通大学 Method for preparing flexible transparent conductive film based on micro-stereolithography technology
CN112599714B (en) * 2021-01-07 2022-08-05 福州大学 Method for preparing nano LED by transfer printing patterned quantum dots
CN112927862B (en) * 2021-01-26 2022-08-02 青岛理工大学 High-performance large-area flexible transparent electrode and preparation method and application thereof
CN112951485B (en) * 2021-01-26 2022-10-18 青岛理工大学 Metal grid stretchable transparent electrode with shell-core structure, and preparation method and application thereof
CN113252757B (en) * 2021-06-08 2022-12-06 北京印刷学院 Multi-channel electrochemical sensor and construction method and application thereof
CN113421778B (en) * 2021-06-21 2022-10-21 青岛理工大学 Flexible micro super capacitor and manufacturing method thereof
CN113986051B (en) * 2021-10-26 2023-04-07 盈天实业(深圳)有限公司 Preparation method of touch device, touch device and touch screen
CN114013026B (en) * 2021-11-02 2022-11-29 之江实验室 Continuous photocuring 3D printing equipment and method based on liquid bridge assistance
CN114156349A (en) * 2021-11-08 2022-03-08 苏州诺菲纳米科技有限公司 Solar cell and manufacturing method thereof
CN116918079A (en) * 2022-01-27 2023-10-20 凯盛科技集团有限公司 Method for forming cross wires of thin film solar cell module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104752530A (en) * 2013-12-30 2015-07-01 上海神舟新能源发展有限公司 Solar cell electrode manufactured by virtue of 3D printing
CN104835555A (en) * 2015-05-13 2015-08-12 南京邮电大学 Preparation method of patterned metal transparent conductive film
CN107932898A (en) * 2017-12-22 2018-04-20 青岛理工大学 A kind of electric field driven melting jet deposition 3D printer and its method of work

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104752530A (en) * 2013-12-30 2015-07-01 上海神舟新能源发展有限公司 Solar cell electrode manufactured by virtue of 3D printing
CN104835555A (en) * 2015-05-13 2015-08-12 南京邮电大学 Preparation method of patterned metal transparent conductive film
CN107932898A (en) * 2017-12-22 2018-04-20 青岛理工大学 A kind of electric field driven melting jet deposition 3D printer and its method of work

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
基于PDMS模板微纳米转印技术的研究;李鑫;《中国优秀硕士学位论文全文数据库》;20140630;B020-337 *
电场驱动喷射沉积3D打印技术研究;钱垒;《中国优秀硕士学位论文全文数据库》;20180515;I138-516 *
纳米银墨水的液桥转印技术研究;王时飞等;《真空》;20140930;第51卷(第5期);64-67 *

Also Published As

Publication number Publication date
CN108831627A (en) 2018-11-16

Similar Documents

Publication Publication Date Title
CN108831627B (en) Method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode
CN109532067B (en) Manufacturing method of high-performance flexible electric heating film
Li et al. Directly printed embedded metal mesh for flexible transparent electrode via liquid substrate electric‐field‐driven jet
WO2020233160A1 (en) Manufacturing method for embedded metal grid-based flexible transparent electrode and application thereof
CN109483780A (en) A kind of large ratio of height to width microstructure transfer printing method
CN104835555B (en) A kind of preparation method of pattern metal transparent conductive film
CN104681645B (en) A kind of method preparing composite transparent conductive electrode based on metal grill and metal nanometer line
CN104134484A (en) Flexible transparent conductive film based on silver nanowires and preparation method
CN112927862B (en) High-performance large-area flexible transparent electrode and preparation method and application thereof
CN109080281B (en) Method for preparing flexible transparent conductive film based on wetting substrate fine ink-jet printing
CN109219174A (en) A kind of manufacturing method of high transparency, the transparent electrically heated glass of low square resistance
CN112331381B (en) Manufacturing method of high-performance metal grid transparent electrode, transparent electrode obtained by manufacturing method and application of transparent electrode
CN112951486B (en) Embedded polymer/metal grid flexible transparent electrode and preparation method and application thereof
WO2022110423A1 (en) Method and system for manufacturing flexible transparent conductive film having embedded metallic material
Meng et al. Silver mesh electrodes via electroless deposition-coupled inkjet-printing mask technology for flexible polymer solar cells
CN105280840A (en) Flexible transparent electrode and manufacturing method thereof
CN112509747B (en) Manufacturing method of flexible transparent conductive film based on low-voltage-driven liquid film embedded electrospray 3D printing
CN108882661A (en) A kind of stretchable electromagnetic wave shield film of transparent flexible and preparation method thereof
CN105355675A (en) Preparation method for high-haze composite transparent conductive electrode
Yang et al. Printed flexible transparent electrodes for harsh environments
CN106601337A (en) Silver nano-wire flexible transparent conductive film and preparation method thereof
Sun et al. Low Cost and Facile Fabrication of a Micro‐Mold with High Aspect Ratio for Transparent Electrodes with Metal Mesh Using Micro‐Scale 3D Printing
Wang et al. Fabrication of metal mesh flexible transparent electrodes and heaters by a cost-effective method based on ultrafast laser direct writing
Zhang et al. Bio‐Inspired Differential Capillary Migration of Aqueous Liquid Metal Ink for Rapid Fabrication of High‐Precision Monolayer and Multilayer Circuits
Zhang et al. Microscale Hybrid Additive Manufacturing of Ultra‐Fine, Embedded Cu/Ag (shell)–P4VP (core) Grid for Flexible Transparent Electrodes

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant